SG111042A1 - Thermosetting resin composition and semiconductor device using the same - Google Patents

Thermosetting resin composition and semiconductor device using the same

Info

Publication number
SG111042A1
SG111042A1 SG200200743A SG200200743A SG111042A1 SG 111042 A1 SG111042 A1 SG 111042A1 SG 200200743 A SG200200743 A SG 200200743A SG 200200743 A SG200200743 A SG 200200743A SG 111042 A1 SG111042 A1 SG 111042A1
Authority
SG
Singapore
Prior art keywords
same
semiconductor device
resin composition
thermosetting resin
thermosetting
Prior art date
Application number
SG200200743A
Other languages
English (en)
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2001037726A external-priority patent/JP4721309B2/ja
Priority claimed from JP2001037725A external-priority patent/JP4753329B2/ja
Priority claimed from JP2001037728A external-priority patent/JP2002241469A/ja
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of SG111042A1 publication Critical patent/SG111042A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C08K5/11—Esters; Ether-esters of acyclic polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/188—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using encapsulated compounds
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  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
SG200200743A 2001-02-14 2002-02-08 Thermosetting resin composition and semiconductor device using the same SG111042A1 (en)

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JP2001037726A JP4721309B2 (ja) 2001-02-14 2001-02-14 熱硬化性樹脂組成物および半導体装置
JP2001037725A JP4753329B2 (ja) 2001-02-14 2001-02-14 熱硬化性樹脂組成物および半導体装置
JP2001037728A JP2002241469A (ja) 2001-02-14 2001-02-14 熱硬化性樹脂組成物および半導体装置
JP2001301054 2001-09-28

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JP5133598B2 (ja) * 2007-05-17 2013-01-30 日東電工株式会社 封止用熱硬化型接着シート
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CN1375521A (zh) 2002-10-23
US6617046B2 (en) 2003-09-09
EP1233446A2 (de) 2002-08-21
DE60200455T2 (de) 2005-05-12
MY122912A (en) 2006-05-31
CN1239607C (zh) 2006-02-01
TW574739B (en) 2004-02-01
EP1233446B1 (de) 2004-05-12
KR20020067436A (ko) 2002-08-22
US20020151106A1 (en) 2002-10-17
DE60200455D1 (de) 2004-06-17
KR100592204B1 (ko) 2006-06-23
EP1233446A3 (de) 2003-02-05

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