JP2004537165A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2004537165A5 JP2004537165A5 JP2003512995A JP2003512995A JP2004537165A5 JP 2004537165 A5 JP2004537165 A5 JP 2004537165A5 JP 2003512995 A JP2003512995 A JP 2003512995A JP 2003512995 A JP2003512995 A JP 2003512995A JP 2004537165 A5 JP2004537165 A5 JP 2004537165A5
- Authority
- JP
- Japan
- Prior art keywords
- independently selected
- epoxy resin
- halogen
- phenyl
- carbon atoms
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000003822 epoxy resin Substances 0.000 claims 3
- 229920000647 polyepoxide Polymers 0.000 claims 3
- 125000000217 alkyl group Chemical group 0.000 claims 2
- 125000004432 carbon atom Chemical group C* 0.000 claims 2
- 229910052736 halogen Inorganic materials 0.000 claims 2
- 150000002367 halogens Chemical class 0.000 claims 2
- 239000000203 mixture Substances 0.000 claims 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims 2
- 239000003795 chemical substances by application Substances 0.000 claims 1
- -1 nitro, acetyl Chemical group 0.000 claims 1
- 125000000026 trimethylsilyl group Chemical group [H]C([H])([H])[Si]([*])(C([H])([H])[H])C([H])([H])[H] 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/902,302 US6577492B2 (en) | 2001-07-10 | 2001-07-10 | Capacitor having epoxy dielectric layer cured with aminophenylfluorenes |
| PCT/US2002/017897 WO2003007319A2 (en) | 2001-07-10 | 2002-06-06 | Capacitor having epoxy dielectric layer cured with aminophenylfluorenes |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009176651A Division JP5016005B2 (ja) | 2001-07-10 | 2009-07-29 | アミノフェニルフルオレンで硬化したエポキシ誘導体層を有するコンデンサ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004537165A JP2004537165A (ja) | 2004-12-09 |
| JP2004537165A5 true JP2004537165A5 (enExample) | 2006-01-05 |
Family
ID=25415643
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003512995A Withdrawn JP2004537165A (ja) | 2001-07-10 | 2002-06-06 | アミノフェニルフルオレンで硬化したエポキシ誘電体層を有するコンデンサ |
| JP2009176651A Expired - Lifetime JP5016005B2 (ja) | 2001-07-10 | 2009-07-29 | アミノフェニルフルオレンで硬化したエポキシ誘導体層を有するコンデンサ |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009176651A Expired - Lifetime JP5016005B2 (ja) | 2001-07-10 | 2009-07-29 | アミノフェニルフルオレンで硬化したエポキシ誘導体層を有するコンデンサ |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US6577492B2 (enExample) |
| EP (1) | EP1407463B1 (enExample) |
| JP (2) | JP2004537165A (enExample) |
| KR (1) | KR100898091B1 (enExample) |
| AT (1) | ATE355598T1 (enExample) |
| AU (1) | AU2002314943A1 (enExample) |
| CA (1) | CA2453107A1 (enExample) |
| DE (1) | DE60218475T2 (enExample) |
| MY (1) | MY122881A (enExample) |
| WO (1) | WO2003007319A2 (enExample) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100586963B1 (ko) * | 2004-05-04 | 2006-06-08 | 삼성전기주식회사 | 유전체 형성용 조성물, 이로 제조된 캐패시터층 및 이를포함하는 인쇄회로기판 |
| US7495887B2 (en) * | 2004-12-21 | 2009-02-24 | E.I. Du Pont De Nemours And Company | Capacitive devices, organic dielectric laminates, and printed wiring boards incorporating such devices, and methods of making thereof |
| US7025607B1 (en) | 2005-01-10 | 2006-04-11 | Endicott Interconnect Technologies, Inc. | Capacitor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate |
| US7541265B2 (en) * | 2005-01-10 | 2009-06-02 | Endicott Interconnect Technologies, Inc. | Capacitor material for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate |
| KR101347486B1 (ko) * | 2006-01-31 | 2014-01-02 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 유연성 포일 구조를 구비한 ｌｅｄ 조명 조립체 |
| US7710045B2 (en) * | 2006-03-17 | 2010-05-04 | 3M Innovative Properties Company | Illumination assembly with enhanced thermal conductivity |
| JP5261896B2 (ja) * | 2006-07-27 | 2013-08-14 | ダイキン工業株式会社 | コーティング組成物 |
| US7806560B2 (en) * | 2007-01-31 | 2010-10-05 | 3M Innovative Properties Company | LED illumination assembly with compliant foil construction |
| WO2010048297A2 (en) * | 2008-10-24 | 2010-04-29 | 3M Innovative Properties Company | Passive electrical article |
| KR101095136B1 (ko) * | 2009-04-23 | 2011-12-16 | 삼성전기주식회사 | 인쇄회로기판용 수지 조성물 및 이를 이용한 인쇄회로기판 |
| SG175763A1 (en) | 2009-05-01 | 2011-12-29 | 3M Innovative Properties Co | Passive electrical article |
| US9247645B2 (en) * | 2009-11-06 | 2016-01-26 | 3M Innovative Properties Company | Dielectric material with non-halogenated curing agent |
| US9455088B2 (en) | 2011-12-21 | 2016-09-27 | 3M Innovative Properties Company | Resin composition and dielectric layer and capacitor produced therefrom |
| KR20150142682A (ko) * | 2013-04-10 | 2015-12-22 | 오사카 가스 케미칼 가부시키가이샤 | 플루오렌 화합물을 포함하는 수지 조성물 및 성형체 및 파장 분산 조정제 및 수지의 파장 분산 조정 방법 |
| JP6278650B2 (ja) * | 2013-09-27 | 2018-02-14 | 京セラ株式会社 | サーミスタセンサ注形用樹脂組成物及びサーミスタセンサ |
| GB201421373D0 (en) | 2014-12-02 | 2015-01-14 | Cytec Ind Inc | Modified amine curing agents, their preparation and use in curable compositions |
| JP2016162904A (ja) * | 2015-03-03 | 2016-09-05 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
| FR3033941B1 (fr) * | 2015-03-18 | 2017-04-21 | Commissariat Energie Atomique | Cellule de test d'appareillage de caracterisation de cellule de pile a combustible et procede de fabrication d'une telle cellule de test |
| CN111363122B (zh) * | 2020-02-17 | 2022-05-17 | 西南科技大学 | 一种三重交联高性能聚合物及其制备方法 |
Family Cites Families (43)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2160095A5 (enExample) * | 1971-11-10 | 1973-06-22 | Omron Tateisi Electronics Co | |
| DE2834906C2 (de) | 1978-08-09 | 1983-01-05 | Siemens AG, 1000 Berlin und 8000 München | Elektrische Hochfrequenz-Folienschaltung und Verfahren zu ihrer Herstellung |
| JPS5844789A (ja) | 1981-09-10 | 1983-03-15 | 株式会社アサヒ化学研究所 | プリント配線板に誘電体を形成する方法 |
| CA1264476A (en) * | 1985-05-30 | 1990-01-16 | William J. Schultz | Epoxy resin curing agent, process, and composition |
| US4684678A (en) | 1985-05-30 | 1987-08-04 | Minnesota Mining And Manufacturing Company | Epoxy resin curing agent, process, and composition |
| JPS62163387A (ja) | 1986-01-14 | 1987-07-20 | 株式会社 アサヒ化学研究所 | 基板に蓄電回路を形成する方法 |
| JPH0791365B2 (ja) * | 1987-03-06 | 1995-10-04 | 新日鐵化学株式会社 | エポキシ樹脂組成物 |
| SE458004C (sv) | 1987-10-09 | 1991-10-07 | Carmis Enterprises Sa | Anordning foer elektrisk avkoppling av integrerade kretsar |
| JPH01100998A (ja) | 1987-10-14 | 1989-04-19 | Seiko Epson Corp | 多層配線基板 |
| JP2621342B2 (ja) | 1988-05-20 | 1997-06-18 | 日本電気株式会社 | 多層配線基板 |
| JPH0241312A (ja) | 1988-07-29 | 1990-02-09 | Dainippon Ink & Chem Inc | エポキシ樹脂組成物 |
| JPH0265194A (ja) | 1988-08-30 | 1990-03-05 | Ibiden Co Ltd | 厚膜素子を有するプリント配線板の製造方法 |
| US5010641A (en) | 1989-06-30 | 1991-04-30 | Unisys Corp. | Method of making multilayer printed circuit board |
| US5079069A (en) | 1989-08-23 | 1992-01-07 | Zycon Corporation | Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture |
| US5155655A (en) | 1989-08-23 | 1992-10-13 | Zycon Corporation | Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture |
| JPH03136396A (ja) | 1989-10-23 | 1991-06-11 | Matsushita Electric Ind Co Ltd | 電子回路部品とその製造方法及び電子回路装置 |
| US5051275A (en) * | 1989-11-09 | 1991-09-24 | At&T Bell Laboratories | Silicone resin electronic device encapsulant |
| US5027253A (en) | 1990-04-09 | 1991-06-25 | Ibm Corporation | Printed circuit boards and cards having buried thin film capacitors and processing techniques for fabricating said boards and cards |
| JP3019541B2 (ja) | 1990-11-22 | 2000-03-13 | 株式会社村田製作所 | コンデンサ内蔵型配線基板およびその製造方法 |
| US5183972A (en) | 1991-02-04 | 1993-02-02 | Microelectronics And Computer Technology Corporation | Copper/epoxy structures |
| JPH04361565A (ja) | 1991-06-10 | 1992-12-15 | Fujitsu Ltd | 半導体装置の製造方法 |
| US5162977A (en) | 1991-08-27 | 1992-11-10 | Storage Technology Corporation | Printed circuit board having an integrated decoupling capacitive element |
| US5161083A (en) | 1991-09-09 | 1992-11-03 | Lucas Ledex Inc. | Solenoid actuator with position feedback system |
| US5261153A (en) | 1992-04-06 | 1993-11-16 | Zycon Corporation | In situ method for forming a capacitive PCB |
| JPH0637256A (ja) | 1992-07-15 | 1994-02-10 | Fuji Electric Co Ltd | 半導体装置の製造方法 |
| JPH0690086A (ja) | 1992-08-31 | 1994-03-29 | Teijin Ltd | 電子部品の接続方法 |
| JPH06104578A (ja) | 1992-09-22 | 1994-04-15 | Ngk Spark Plug Co Ltd | 多層配線基板及びその製造方法 |
| JPH06125180A (ja) | 1992-10-09 | 1994-05-06 | Ngk Spark Plug Co Ltd | キャパシタ内蔵多層配線基板 |
| JP2901451B2 (ja) | 1993-02-26 | 1999-06-07 | 京セラ株式会社 | ジョセフソン素子搭載用回路基板 |
| US5571970A (en) * | 1993-03-30 | 1996-11-05 | Honda Motor Co., Ltd. | Pressure sensor |
| JPH06297634A (ja) | 1993-04-19 | 1994-10-25 | Toshiba Chem Corp | 銅張積層板及び多層銅張積層板 |
| JPH06318597A (ja) | 1993-05-07 | 1994-11-15 | Nec Kyushu Ltd | 半導体装置 |
| JP3154594B2 (ja) | 1993-07-13 | 2001-04-09 | 日本特殊陶業株式会社 | キャパシタ内蔵多層配線基板とその製造方法 |
| JPH0730257A (ja) | 1993-07-13 | 1995-01-31 | Fujitsu Ltd | コンデンサ内蔵薄膜多層配線板 |
| JP3821870B2 (ja) * | 1994-10-07 | 2006-09-13 | スリーエム カンパニー | 難燃性熱硬化性樹脂組成物 |
| US5469324A (en) | 1994-10-07 | 1995-11-21 | Storage Technology Corporation | Integrated decoupling capacitive core for a printed circuit board and method of making same |
| US5701032A (en) | 1994-10-17 | 1997-12-23 | W. L. Gore & Associates, Inc. | Integrated circuit package |
| JPH08148321A (ja) | 1994-11-21 | 1996-06-07 | Minnesota Mining & Mfg Co <3M> | 磁性組成物および樹脂結合型磁石 |
| JPH08198952A (ja) | 1995-01-19 | 1996-08-06 | Hodogaya Chem Co Ltd | 可撓性を有するエポキシ樹脂組成物 |
| US5796587A (en) | 1996-06-12 | 1998-08-18 | International Business Machines Corporation | Printed circut board with embedded decoupling capacitance and method for producing same |
| US5745335A (en) | 1996-06-27 | 1998-04-28 | Gennum Corporation | Multi-layer film capacitor structures and method |
| EP0902048B1 (en) | 1997-09-11 | 2005-11-23 | E.I. Du Pont De Nemours And Company | High dielectric constant flexible polyimide film and process of preparation |
| US6274224B1 (en) | 1999-02-01 | 2001-08-14 | 3M Innovative Properties Company | Passive electrical article, circuit articles thereof, and circuit articles comprising a passive electrical article |
-
2001
- 2001-07-10 US US09/902,302 patent/US6577492B2/en not_active Expired - Lifetime
-
2002
- 2002-06-06 KR KR1020047000334A patent/KR100898091B1/ko not_active Expired - Lifetime
- 2002-06-06 CA CA002453107A patent/CA2453107A1/en not_active Abandoned
- 2002-06-06 AT AT02741872T patent/ATE355598T1/de not_active IP Right Cessation
- 2002-06-06 EP EP02741872A patent/EP1407463B1/en not_active Expired - Lifetime
- 2002-06-06 AU AU2002314943A patent/AU2002314943A1/en not_active Abandoned
- 2002-06-06 WO PCT/US2002/017897 patent/WO2003007319A2/en not_active Ceased
- 2002-06-06 JP JP2003512995A patent/JP2004537165A/ja not_active Withdrawn
- 2002-06-06 DE DE60218475T patent/DE60218475T2/de not_active Expired - Lifetime
- 2002-06-18 MY MYPI20022275A patent/MY122881A/en unknown
-
2009
- 2009-07-29 JP JP2009176651A patent/JP5016005B2/ja not_active Expired - Lifetime