KR100898091B1 - 아미노페닐플루오렌으로 경화된 에폭시 유전층을 보유하는축전기 - Google Patents

아미노페닐플루오렌으로 경화된 에폭시 유전층을 보유하는축전기 Download PDF

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Publication number
KR100898091B1
KR100898091B1 KR1020047000334A KR20047000334A KR100898091B1 KR 100898091 B1 KR100898091 B1 KR 100898091B1 KR 1020047000334 A KR1020047000334 A KR 1020047000334A KR 20047000334 A KR20047000334 A KR 20047000334A KR 100898091 B1 KR100898091 B1 KR 100898091B1
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KR
South Korea
Prior art keywords
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epoxy resin
substrate
dielectric layer
electrical
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Expired - Lifetime
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KR1020047000334A
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English (en)
Korean (ko)
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KR20040030801A (ko
Inventor
오브라이언넬슨비쥬니어
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 캄파니
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/14—Organic dielectrics
    • H01G4/18—Organic dielectrics of synthetic material, e.g. derivatives of cellulose
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Organic Insulating Materials (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Epoxy Resins (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020047000334A 2001-07-10 2002-06-06 아미노페닐플루오렌으로 경화된 에폭시 유전층을 보유하는축전기 Expired - Lifetime KR100898091B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/902,302 2001-07-10
US09/902,302 US6577492B2 (en) 2001-07-10 2001-07-10 Capacitor having epoxy dielectric layer cured with aminophenylfluorenes
PCT/US2002/017897 WO2003007319A2 (en) 2001-07-10 2002-06-06 Capacitor having epoxy dielectric layer cured with aminophenylfluorenes

Publications (2)

Publication Number Publication Date
KR20040030801A KR20040030801A (ko) 2004-04-09
KR100898091B1 true KR100898091B1 (ko) 2009-05-18

Family

ID=25415643

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020047000334A Expired - Lifetime KR100898091B1 (ko) 2001-07-10 2002-06-06 아미노페닐플루오렌으로 경화된 에폭시 유전층을 보유하는축전기

Country Status (10)

Country Link
US (1) US6577492B2 (enExample)
EP (1) EP1407463B1 (enExample)
JP (2) JP2004537165A (enExample)
KR (1) KR100898091B1 (enExample)
AT (1) ATE355598T1 (enExample)
AU (1) AU2002314943A1 (enExample)
CA (1) CA2453107A1 (enExample)
DE (1) DE60218475T2 (enExample)
MY (1) MY122881A (enExample)
WO (1) WO2003007319A2 (enExample)

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US7495887B2 (en) * 2004-12-21 2009-02-24 E.I. Du Pont De Nemours And Company Capacitive devices, organic dielectric laminates, and printed wiring boards incorporating such devices, and methods of making thereof
US7541265B2 (en) * 2005-01-10 2009-06-02 Endicott Interconnect Technologies, Inc. Capacitor material for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate
US7025607B1 (en) 2005-01-10 2006-04-11 Endicott Interconnect Technologies, Inc. Capacitor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate
KR101347486B1 (ko) * 2006-01-31 2014-01-02 쓰리엠 이노베이티브 프로퍼티즈 컴파니 유연성 포일 구조를 구비한 ｌｅｄ 조명 조립체
US7710045B2 (en) * 2006-03-17 2010-05-04 3M Innovative Properties Company Illumination assembly with enhanced thermal conductivity
JP5261896B2 (ja) * 2006-07-27 2013-08-14 ダイキン工業株式会社 コーティング組成物
US7806560B2 (en) * 2007-01-31 2010-10-05 3M Innovative Properties Company LED illumination assembly with compliant foil construction
US20100105806A1 (en) * 2008-10-24 2010-04-29 3M Innovative Properties Company Passive electrical article
KR101095136B1 (ko) * 2009-04-23 2011-12-16 삼성전기주식회사 인쇄회로기판용 수지 조성물 및 이를 이용한 인쇄회로기판
KR101679896B1 (ko) 2009-05-01 2016-11-25 쓰리엠 이노베이티브 프로퍼티즈 컴파니 수동 전기 물품
JP5716033B2 (ja) * 2009-11-06 2015-05-13 スリーエム イノベイティブ プロパティズ カンパニー 非ハロゲン化硬化剤を有する誘電体材料
CN103999558B (zh) 2011-12-21 2017-07-14 3M创新有限公司 树脂组合物，由其制备的介电层和电容器
WO2014168108A1 (ja) * 2013-04-10 2014-10-16 大阪ガスケミカル株式会社 フルオレン化合物を含む樹脂組成物および成形体並びに波長分散調整剤および樹脂の波長分散調整方法
JP6278650B2 (ja) * 2013-09-27 2018-02-14 京セラ株式会社 サーミスタセンサ注形用樹脂組成物及びサーミスタセンサ
GB201421373D0 (en) 2014-12-02 2015-01-14 Cytec Ind Inc Modified amine curing agents, their preparation and use in curable compositions
JP2016162904A (ja) * 2015-03-03 2016-09-05 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
FR3033941B1 (fr) * 2015-03-18 2017-04-21 Commissariat Energie Atomique Cellule de test d'appareillage de caracterisation de cellule de pile a combustible et procede de fabrication d'une telle cellule de test
CN111363122B (zh) * 2020-02-17 2022-05-17 西南科技大学 一种三重交联高性能聚合物及其制备方法

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Also Published As

Publication number Publication date
AU2002314943A1 (en) 2003-01-29
HK1065162A1 (en) 2005-02-08
US20030030966A1 (en) 2003-02-13
JP2004537165A (ja) 2004-12-09
CA2453107A1 (en) 2003-01-23
ATE355598T1 (de) 2006-03-15
MY122881A (en) 2006-05-31
EP1407463A2 (en) 2004-04-14
KR20040030801A (ko) 2004-04-09
EP1407463B1 (en) 2007-02-28
WO2003007319A3 (en) 2003-04-24
JP2010004055A (ja) 2010-01-07
WO2003007319A2 (en) 2003-01-23
DE60218475T2 (de) 2007-11-29
US6577492B2 (en) 2003-06-10
JP5016005B2 (ja) 2012-09-05
DE60218475D1 (de) 2007-04-12

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