JP2002335094A - 基板レベルのｅｍｉシールド - Google Patents

基板レベルのｅｍｉシールド

Info

Publication number
JP2002335094A
JP2002335094A JP2002060233A JP2002060233A JP2002335094A JP 2002335094 A JP2002335094 A JP 2002335094A JP 2002060233 A JP2002060233 A JP 2002060233A JP 2002060233 A JP2002060233 A JP 2002060233A JP 2002335094 A JP2002335094 A JP 2002335094A
Authority
JP
Japan
Prior art keywords
printed circuit
circuit board
coating
component
shield
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2002060233A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002335094A5 (https=
Inventor
Samuel M Babb
サミュエル・エム・バブ
Lowell E Kolb
ロウェル・イー・コルブ
Brian Davis
ブライアン・デイビス
Jonathan P Mankin
ジョナサン・ピー・マンキン
Kristina L Mann
クリスティナ・エル・マン
Paul H Mazurkiewicz
ポール・エイチ・マズキーウィック
Marvin Wahlen
マービン・ウォーレン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HP Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of JP2002335094A publication Critical patent/JP2002335094A/ja
Publication of JP2002335094A5 publication Critical patent/JP2002335094A5/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H10W42/261—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their shapes or dispositions
    • H10W42/276—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their shapes or dispositions the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
JP2002060233A 2001-03-19 2002-03-06 基板レベルのｅｍｉシールド Withdrawn JP2002335094A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/812274 2001-03-19
US09/812,274 US6900383B2 (en) 2001-03-19 2001-03-19 Board-level EMI shield that adheres to and conforms with printed circuit board component and board surfaces

Publications (2)

Publication Number Publication Date
JP2002335094A true JP2002335094A (ja) 2002-11-22
JP2002335094A5 JP2002335094A5 (https=) 2005-09-02

Family

ID=25209082

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002060233A Withdrawn JP2002335094A (ja) 2001-03-19 2002-03-06 基板レベルのｅｍｉシールド

Country Status (2)

Country Link
US (7) US6900383B2 (https=)
JP (1) JP2002335094A (https=)

Cited By (7)

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JP2006064697A (ja) * 2004-08-25 2006-03-09 Agilent Technol Inc 誘電体プレートを備えたシステム及び誘電体を有する製造品及び誘電体プレートの使用法
JP2012160572A (ja) * 2011-01-31 2012-08-23 Tdk Corp 電子回路モジュール部品及び電子回路モジュール部品の製造方法
JP2012248848A (ja) * 2011-05-30 2012-12-13 Samsung Electronics Co Ltd 半導体素子、半導体パッケージ、及び電子装置
JP2013513247A (ja) * 2009-12-08 2013-04-18 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング 回路モジュールおよび当該回路モジュールを製造する方法
KR20160094336A (ko) * 2015-01-30 2016-08-09 라이르드 테크놀로지스, 아이엔씨 증가된 언더실드 공간을 가진 보드 레벨 전자 방해 잡음 실드
WO2020153068A1 (ja) * 2019-01-23 2020-07-30 株式会社村田製作所 アンテナモジュール及び通信装置
JP2022553207A (ja) * 2019-10-16 2022-12-22 アドバンスト・マイクロ・ディバイシズ・インコーポレイテッド リッドレスｂｇａパッケージにおける複数列の表面実装コンポーネントのコンフォーマルコーティングプロセス及びそれによって製造された製品

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US7214889B2 (en) 2007-05-08
US20020166680A1 (en) 2002-11-14
US7196275B2 (en) 2007-03-27
US20040055770A1 (en) 2004-03-25
US8156644B2 (en) 2012-04-17
US20070071886A1 (en) 2007-03-29
US6900383B2 (en) 2005-05-31
US20040022003A1 (en) 2004-02-05
US6600101B2 (en) 2003-07-29
US20020129951A1 (en) 2002-09-19

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