WO2011137756A2 - 复合材料以及电子设备 - Google Patents

复合材料以及电子设备 Download PDF

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Publication number
WO2011137756A2
WO2011137756A2 PCT/CN2011/073751 CN2011073751W WO2011137756A2 WO 2011137756 A2 WO2011137756 A2 WO 2011137756A2 CN 2011073751 W CN2011073751 W CN 2011073751W WO 2011137756 A2 WO2011137756 A2 WO 2011137756A2
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WO
WIPO (PCT)
Prior art keywords
composite material
layer
adhesive layer
conductive
insulating layer
Prior art date
Application number
PCT/CN2011/073751
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English (en)
French (fr)
Other versions
WO2011137756A3 (zh
Inventor
阳军
周列春
李华林
伍锡杰
Original Assignee
华为终端有限公司
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Publication date
Application filed by 华为终端有限公司 filed Critical 华为终端有限公司
Priority to EP11777176.6A priority Critical patent/EP2685797B1/en
Priority to PCT/CN2011/073751 priority patent/WO2011137756A2/zh
Priority to CN2011800003273A priority patent/CN102187751A/zh
Priority to JP2014508670A priority patent/JP5743251B2/ja
Publication of WO2011137756A2 publication Critical patent/WO2011137756A2/zh
Publication of WO2011137756A3 publication Critical patent/WO2011137756A3/zh
Priority to US14/072,199 priority patent/US9363884B2/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/003—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields made from non-conductive materials comprising an electro-conductive coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0031—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields combining different shielding materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D30/00—Reducing energy consumption in communication networks
    • Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
    • Y10T428/264—Up to 3 mils
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/30—Self-sustaining carbon mass or layer with impregnant or other layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

Definitions

  • the invention belongs to the technical field of electronic assembly, and particularly relates to a composite material and an electronic device.
  • the existing electronic equipment generally adopts a combination of a thermal pad 6 and a shield cover 7.
  • the electronic component 2 is mounted on the circuit board 1, and the heat generated by the electronic component 2 is transferred to the outer casing 8 by the heat conductive material 5, and the thermal pad 6 is filled between the electronic component 2, the heat conductive material 5 and the outer casing 8. , to achieve heat dissipation.
  • the function of the heat conductive material 5 is mainly to uniformly disperse heat to prevent the local temperature of the electronic device from being excessively high; some electronic devices do not have the heat conductive material 5, and the heat generated by the electronic component 2 is directly transmitted to the outer casing 8 by the thermal pad 6. .
  • electromagnetic shielding of the electronic component 2 is achieved by the shield case 7 which is attached to the shield frame 3.
  • the existing electronic device realizes heat dissipation and electromagnetic shielding by the thermal pad and the shield cover, respectively, resulting in an excessively complicated internal structure of the electronic device.
  • Embodiments of the present invention provide a composite material and an electronic device that achieve heat dissipation and electromagnetic shielding in a simpler structure.
  • the composite material includes a conductive heat conductive layer, an adhesive layer and an insulating layer which are adhered to each other, and the conductive heat conductive layer and the insulating layer are respectively attached to both sides of the adhesive layer;
  • the adhesive layer is electrically conductive.
  • the electronic device includes a circuit board and a composite material; the circuit board has an electronic component and a shielding frame; the composite material comprises an electrically conductive layer, an adhesive layer and an insulating layer which are adhered to each other, and the conductive and heat conducting layer
  • the insulating layer is respectively attached to both sides of the adhesive layer; the adhesive layer has electrical conductivity; the insulating layer forms a gap at a position corresponding to the electronic component and/or the shielding frame, and is exposed The adhesive layer is adhered to the electronic component and/or the shielding frame through the adhesive layer.
  • the above technical solution provided by the present invention has the following advantages: the composite material is adhered to the electronic component through the adhesive layer, and the contact between the conductive heat conductive layer and the electronic component can be made stronger; the adhesive layer is further It can fill the gap between its contact faces, reduce the thermal resistance, and achieve heat dissipation.
  • the composite material is adhered to the shield frame by the adhesive layer, and the adhesive layer also has electrical conductivity, so that the conductive heat conductive layer and the shield frame can be formed into a more stable electrical connection to achieve electromagnetic shielding.
  • the technical solution provided by the invention can realize heat dissipation and electromagnetic shielding at the same time by only one composite material, and solves the problem that the existing electronic equipment realizes heat dissipation and electromagnetic shielding by the thermal pad and the shield cover respectively, and the internal structure of the electronic device is too complicated. technical problem.
  • 1 is a schematic view showing the internal structure of an existing electronic device
  • FIG. 2 is a schematic structural view of a composite material according to Embodiment 1 of the present invention
  • FIG. 3 is a schematic view showing an embodiment of a composite material provided by Embodiment 1 of the present invention
  • Figure 4 is a schematic view showing an embodiment of a composite material provided in Example 2 of the present invention.
  • Figure 5 is a schematic structural view of a composite material according to Embodiment 3 of the present invention
  • 6 is a schematic structural diagram of an electronic device according to Embodiment 4 of the present invention
  • FIG. 7 is a schematic structural diagram of an electronic device according to Embodiment 5 of the present invention
  • FIG. 8 is an electronic device according to Embodiment 6 of the present invention
  • Embodiments of the present invention provide a composite material and an electronic device.
  • the composite material provided by the embodiment of the present invention includes a conductive heat conductive layer 41, an adhesive layer 42 and an insulating layer 43 which are adhered to each other, and the conductive heat conductive layer 41 and the insulating layer 43 are respectively adhered.
  • the adhesive layer 42 On both sides of the adhesive layer 42; the adhesive layer 42 has electrical conductivity.
  • the composite material has a bendable property, and is similar in appearance to paper, and is also light, thin, soft, and can be stretched and stretched in a small amount.
  • the conductive and thermally conductive layer 4 1 is one or more of copper, graphite, aluminum, ceramics, etc., and the conductive and thermally conductive layer 4 1 is formed in the form of a thin layer, and the thermal conductivity thereof can reach 50 W/m ⁇ K or more. If graphite is used, its thermal conductivity is related to the direction, the thermal conductivity in the plane direction is 5 OW/m ⁇ K or more, and the thermal conductivity in the normal direction is 5 W/m ⁇ K or more.
  • the adhesive layer 42 is preferably a single layer structure formed of one or more of a propylene-based adhesive, a polyester film, or a multilayer structure.
  • the insulating layer 43 forms a gap at a position corresponding to the electronic component 2 and/or the shield frame 3, exposing the adhesive layer 42, and sticking the composite material to the electronic component 2 through the adhesive layer 42.
  • the contact between the conductive and thermally conductive layer 4 1 and the electronic component 2 can be made stronger; although the thermal conductivity of the adhesive layer 42 is lower than that of the conductive and thermally conductive layer 41, the adhesive layer 42 can fill the composite material and the electronic component 2
  • the gap of the contact surface can reduce the thermal resistance and achieve heat dissipation.
  • the composite material is adhered to the shield frame 3 through the adhesive layer 42, and the adhesive layer 42 is also electrically conductive, so that the conductive heat conductive layer can be made 41 forms a more stable electrical connection with the shield frame 3 to achieve electromagnetic shielding.
  • the composite material only needs to be electrically connected to the shield frame 3. Since the insulating layer 43 forms a notch only at a position corresponding to the electronic component 2 and/or the shield frame 3, the other portions of the composite material are still covered with the insulating layer 43, which does not form an unreasonable electrical connection with these pins, resulting in Short circuit and other conditions.
  • This embodiment is basically the same as the first embodiment, and the difference is that: in this embodiment, as shown in FIG. 4, some pins 21 are sometimes exposed on the electronic component 2 to form on the insulating layer 43. In the case of the notch, the insulating layer 43 is left only in the corresponding position, and after the composite material is adhered to the electronic component 2 through the adhesive layer 42, the pin 21 on the electronic component 2 can be prevented from being electrically conductive and thermally conductive by the insulating layer 43. Layer 41 forms an electrical connection.
  • the thickness of the electrically and thermally conductive layer 41 is less than or equal to 2 mm.
  • the conductive and thermally conductive layer requires only 2 mm to achieve good electrical conductivity and thermal conductivity.
  • the conductive and thermally conductive layer 41 can be made thinner in order to take up as little space as possible.
  • the thickness of the adhesive layer 42 is less than or equal to 0.2 mm.
  • the adhesive layer 42 mainly serves as a fixing function and reduces the thermal resistance, but its resistivity is large, so the thinner the better.
  • the insulating layer 43 has a thickness of 0.5 mm or less. Since the gap is formed on the insulating layer 43 at the time of use and the insulating effect is ensured, the thickness of the insulating layer 43 should be moderate.
  • This embodiment is basically the same as the second embodiment, and the difference is that, as shown in FIG. 5, in the embodiment, the opposite side of the conductive and thermally conductive layer 41 and the adhesive layer 42 is also provided with an insulating layer 44.
  • one side of the composite material is bonded to the electronic component and/or the shielding frame, and the other side is exposed to the conductive and heat conducting layer 41, in order to prevent other parts from being
  • the electrically and thermally conductive layer 41 forms an unreasonable electrical connection, so in this embodiment, this face is also covered with an insulating layer 44.
  • an electronic device includes a circuit board 1 and a composite material 4; the circuit board 1 has an electronic component 2 and a shielding frame 3; and the composite material 4 includes a mutual bonding.
  • the conductive and heat conducting layer, the adhesive layer and the insulating layer, the conductive heat conducting layer and the insulating layer are respectively adhered to both sides of the adhesive layer; the adhesive layer has electrical conductivity; the insulating layer is in contact with the electronic component 2 and/or the shielding frame 3, the corresponding position forms a gap, exposing the adhesive layer, and the composite material 4 is adhered to the electronic component 2 and/or the shield frame 3 through the adhesive layer.
  • a composite material 4 can satisfy the heat dissipation and/or electromagnetic shielding of the plurality of electronic components 2.
  • Some electronic components 2 require both heat dissipation and electromagnetic shielding, so the composite material 4 should be adhered to the shielded frame 3 on the electronic component 2 and around it (as shown in Figure 8, the left electronic component 2);
  • the electronic component 2 only needs electromagnetic shielding without heat dissipation, so the composite material 4 only needs to be adhered to the shielding frame 3 around the electronic component 2 (as shown in Fig. 8, the middle electronic component 2); 2 Only need to dissipate heat without electromagnetic shielding, so the composite material 4 only needs to be glued to the electronic component 2 (as shown in Figure 8, the right electronic component 2).
  • the embodiment of the present invention has the same technical features as the composite material provided in the first embodiment of the present invention, the same technical effects can be produced to solve the same technical problem.
  • the embodiment is basically the same as the embodiment 4, and the difference is as follows: as shown in FIG. 7, in this embodiment, the electronic component 2 and the shielding frame 3 are provided on both sides of the circuit board 1; the electrons on both sides of the circuit board 1 The component 2 and/or the frame 3 are adhered to the composite material 4, and the composite material 4 is a single piece, and the composite material 4 is bent and wrapped on both sides of the circuit board 1.
  • the composite material 4 is light, thin, soft, bendable and bendable, and can be stretched and stretched at a small extent, an electronic element bonded to both sides of the circuit board 1 by a composite material 4 is used.
  • the electromagnetic shielding effect can be improved, and the heat on both sides of the circuit board 1 can be evenly distributed to improve the heat dissipation effect.
  • This embodiment is basically the same as the embodiment 4, and the difference is that, as shown in Fig. 8, in the present embodiment, the composite material 4 extends to other heat generating portions other than the circuit board 1. Use a larger composite material 4 and extend it beyond the board 1. For example, the battery in the phone 9 1 , display 92.
  • the composite material 4 is adhered to the electronic component 2 and/or the shield frame 3 on the circuit board 1, and is also in contact with the battery 9 1 and the display screen 92 to enable the circuit board 1, the battery 9 1 and the display screen 9 2
  • the heat is evenly distributed, which makes the overall heat dissipation effect of the mobile phone better.
  • This embodiment is basically the same as the embodiment 4, and the difference is that: in this embodiment, the opposite side of the conductive heat conductive layer and the adhesive layer is also provided with an insulating layer.
  • one side of the composite material is bonded to the electronic component and/or the shielding frame, and the other surface is exposed to the conductive heat conductive layer. In order to prevent other parts from forming an unreasonable electrical connection with the conductive heat conductive layer from the surface, Therefore, in this embodiment, this face is also covered with an insulating layer.

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  • Microelectronics & Electronic Packaging (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Electromagnetism (AREA)
  • Thermal Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Elimination Of Static Electricity (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

一种复合材料和电子设备，复合材料包括导电导热层（41）、粘胶层（42）和绝缘层（43），导电导热层（41）和绝缘层（43）帖在粘胶层（42）的两面；粘胶层（42）具有导电性；电子设备包括电子元器件（2）和屏蔽框（3），绝缘层（43）在与电子元器件（2）和/或屏蔽框（3）相应的位置形成缺口，露出粘胶层，通过粘胶层将复合材料粘在电子设备和/或屏蔽框上。复合材料能同时实现散热和电磁屏蔽，简化电子设备的结构。

Description

复合材料以及电子设备 技术领域
本发明属于电子装配技术领域， 具体涉及一种复合材料以及电 子设备。
背景技术
随着电子技术的不断发展， 手元器件的集成度也在不断提高， 这些元器件在工作中产生热量的密度呈明显的上升趋势。 另一方面， 由于越来越多的电子设备集成无线通信模块， 使产品对电磁屏蔽性 能的要求越来越高。 因此， 手机和 MP 3 等电子设备中， 很多元器件 有散热和电磁屏蔽的双重需求。
如图 1 所示， 现有的电子设备一般采用导热垫 6和屏蔽罩 7组 合的方案。 在电路板 1 上安装有电子元器件 2 , 由导热材料 5 将电 子元器件 2产生的热量传递至外壳上 8 , 并且在电子元器件 2、 导热 材料 5 和外壳 8 之间填充有导热垫 6 , 实现散热。 其中导热材料 5 的功能主要是将热量均匀分散， 防止电子设备局部的温度过高； 也 有一些电子设备没有导热材料 5 , 而直接由导热垫 6将电子元器件 2 产生的热量传递至外壳 8 上。 另外， 由搭接在屏蔽框 3 上的屏蔽罩 7 实现电子元器件 2 的电磁屏蔽。
本发明人在实现本发明的过程中发现， 现有技术至少存在以下 问题： 现有的电子设备由导热垫和屏蔽罩分别实现散热和电磁屏蔽， 导致电子设备的内部结构过于复杂。
发明内容
本发明实施例提供了一种复合材料以及电子设备， 以更为简单 的结构实现散热和电磁屏蔽。
为达到上述目 的， 本发明的实施例采用如下技术方案：
该复合材料， 包括相互贴合的导电导热层、 粘胶层和绝缘层， 所述导电导热层与所述绝缘层分别贴合于所述粘胶层的两面； 所述 粘胶层具有导电性。
该电子设备， 包括电路板和复合材料； 所述电路板上有电子元 器件和屏蔽框； 所述复合材料包括相互贴合的导电导热层、 粘胶层 和绝缘层， 所述导电导热层与所述绝缘层分别贴合于所述粘胶层的 两面； 所述粘胶层具有导电性； 所述绝缘层在与所述电子元器件和 / 或所述屏蔽框相应的位置形成缺口， 露出所述粘胶层， 所述复合材 料通过所述粘胶层粘在所述电子元器件和 /或所述屏蔽框上。
与现有技术相比， 本发明所提供上述技术方案具有如下优点： 通过粘胶层将复合材料粘在电子元器件上， 能够使导电导热层与电 子元器件的接触更加牢固； 粘胶层还能够填充其接触面之间的缝隙， 减小热阻， 实现散热。 另一方面， 通过粘胶层将复合材料粘在屏蔽 框上， 而且粘胶层也具有导电性， 所以能够使导电导热层与屏蔽框 形成更加稳定的电连接， 实现电磁屏蔽。
本发明提供的技术方案， 只需要一块复合材料就能够同时实现 散热和电磁屏蔽， 解决了现有的电子设备由导热垫和屏蔽罩分别实 现散热和电磁屏蔽， 导致电子设备的内部结构过于复杂的技术问题。 附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案， 下 面将对实施例或现有技术描述中所需要使用的附图作简单地介绍， 显而易见地， 下面描述中的附图仅仅是本发明的一些实施例， 对于 本领域普通技术人员来讲， 在不付出创造性劳动的前提下， 还可以 根据这些附图获得其他的附图。
图 1 为现有的电子设备的内部结构的示意图；
图 2为本发明的实施例 1 所提供的复合材料的结构示意图； 图 3为本发明的实施例 1 所提供的复合材料的一种实施方式的 示意图；
图 4 为本发明的实施例 2所提供的复合材料的一种实施方式的 示意图；
图 5为本发明的实施例 3所提供的复合材料的结构示意图； 图 6为本发明的实施例 4所提供的电子设备的结构示意图； 图 7为本发明的实施例 5所提供的电子设备的结构示意图； 图 8为本发明的实施例 6所提供的电子设备的结构示意图。 具体实施方式
下面将结合本发明实施例中的附图， 对本发明实施例中的技术 方案进行清楚、 完整地描述， 显然， 所描述的实施例仅仅是本发明 一部分实施例， 而不是全部的实施例。 基于本发明中的实施例， 本 领域普通技术人员在没有付出创造性劳动的前提下所获得的所有其 他实施例， 都属于本发明保护的范围。
本发明实施例提供了一种复合材料以及电子设备。
实施例 1 :
如图 2 所示， 本发明实施例所提供的复合材料， 包括相互贴合 的导电导热层 4 1、 粘胶层 42和绝缘层 4 3 , 导电导热层 4 1与绝缘层 4 3分别贴合于粘胶层 42 的两面； 所述粘胶层 42具有导电性。 作为 一个优选方案， 该复合材料具有可弯折的特性， 从外观上来看， 类 似于纸张， 还具有轻、 薄、 柔软、 可小幅度拉伸延展等特点。 其中， 导电导热层 4 1 为铜、 石墨、 铝、 陶瓷等材料中的一种或多种， 以薄 层的形式形成导电导热层 4 1 , 其导热系数可达到 5 0W/ m . K 以上。 如 果采用石墨， 由于其分子结构比较特殊， 导热系数与方向有关， 平 面方向的导热系数为 5 OW/ m · K 以上， 法向的导热系数为 5W/ m · K 以 上。 粘胶层 42优选为丙烯系黏着剂、 聚酯膜中的一种或几种形成的 单层结构， 或者多层结构。
如图 3所示， 绝缘层 4 3在与电子元器件 2和 /或屏蔽框 3相应 的位置形成缺口， 露出粘胶层 42 , 通过粘胶层 42 将复合材料粘在 电子元器件 2上， 能够使导电导热层 4 1 与电子元器件 2 的接触更加 牢固； 虽然粘胶层 42 的导热系数要比导电导热层 4 1 低， 但是粘胶 层 42 能够填充复合材料与电子元器件 2之间接触面的缝隙， 反而更 能减小热阻， 实现散热。 另一方面， 通过粘胶层 42将复合材料粘在 屏蔽框 3上， 而且粘胶层 4 2也具有导电性， 所以能够使导电导热层 41与屏蔽框 3形成更加稳定的电连接， 实现电磁屏蔽。
电路板 1 上除电子元器件 2和屏蔽框 3之外， 还可能有一些引 脚露在外面， 而复合材料只需与屏蔽框 3 形成电连接。 因为绝缘层 43 只在与电子元器件 2 和 /或屏蔽框 3 相应的位置形成缺口， 所以 复合材料的其他部分仍然覆盖有绝缘层 43, 不会与这些引脚形成不 合理的电连接， 导致短路等状况。
所以只需要一块本发明提供的复合材料， 就能够同时实现散热 和电磁屏蔽， 解决了现有的电子设备由导热垫和屏蔽罩分别实现散 热和电磁屏蔽， 导致电子设备的内部结构过于复杂的技术问题。
实施例 2:
本实施例与实施例 1基本相同， 其不同点在于： 本实施例中， 如图 4所示， 在电子元器件 2上有时也会有一些引脚 21 露在外面， 在绝缘层 43 上形成缺口时， 只需将相应的位置保留绝缘层 43, 则 复合材料通过粘胶层 42粘在电子元器件 2上之后， 仍然能由绝缘层 43 阻止电子元器件 2上的引脚 21 与导电导热层 41形成电连接。
本发明的一个实施例中， 导电导热层 41 的厚度小于等于 2mm。 导电导热层只需要 2mm 就能够实现良好的导电性和导热性； 同时为 了尽量少占用空间， 导电导热层 41还可以更薄一些。
本发明的一个实施例中， 粘胶层 42 的厚度小于等于 0.2mm。 粘 胶层 42 的主要起固定作用， 并减小热阻， 但是其电阻率较大， 所以 越薄越好。
本发明的一个实施例中， 绝缘层 43的厚度小于等于 0.5mm。 因 为在使用时要在绝缘层 43上形成缺口， 同时又要保证绝缘效果， 所 以绝缘层 43的厚度应当适中。
实施例 3:
本实施例与实施例 2基本相同， 其不同点在于： 如图 5所示， 本实施例中， 导电导热层 41 与粘胶层 42相反的一面也设有绝缘层 44。 在实施例 2 中， 复合材料的一面粘接在电子元器件和 /或屏蔽框 上， 另一面则棵露出导电导热层 41, 为了防止其他部分从这一面与 导电导热层 4 1形成不合理的电连接， 所以在本实施例中， 这一面也 覆盖有绝缘层 44。
实施例 4 :
如图 6 所示， 本发明实施例所提供的电子设备， 包括电路板 1 和复合材料 4 ; 所述电路板 1上有电子元器件 2和屏蔽框 3 ; 所述复 合材料 4 包括相互贴合的导电导热层、 粘胶层和绝缘层， 导电导热 层与绝缘层分别贴合于粘胶层的两面； 所述粘胶层具有导电性； 绝 缘层在与电子元器件 2和 /或屏蔽框 3相应的位置形成缺口， 露出粘 胶层， 所述复合材料 4 通过所述粘胶层粘在所述电子元器件 2 和 / 或屏蔽框 3上。
由于复合材料 4具有轻、 薄、 柔软、 可卷曲弯折、 可小幅度拉 伸延展等特点， 所以一块复合材料 4 能够满足多个电子元器件 2 的 散热和 /或电磁屏蔽。 有的电子元器件 2 既需要散热又需要电磁屏 蔽， 所以复合材料 4 要粘在该电子元器件 2 上及其四周的屏蔽框 3 上 （如图 8 , 左边的电子元器件 2 ) ; 有的电子元器件 2 只需要电磁 屏蔽而不需要散热， 所以复合材料 4 只需粘在该电子元器件 2 四周 的屏蔽框 3 上 （如图 8 , 中间的电子元器件 2 ); 有的电子元器件 2 只需要散热而不需要电磁屏蔽， 所以复合材料 4 只需粘在该电子元 器件 2上 （如图 8 , 右边的电子元器件 2 )。
由于本发明实施例与上述本发明实施例 1 所提供的复合材料具 有相同的技术特征， 所以也能产生相同的技术效果， 解决相同的技 术问题。
实施例 5 :
本实施例与实施例 4基本相同， 其不同点在于： 如图 7所示， 本实施例中， 电路板 1 的两面都有电子元器件 2 和屏蔽框 3 ; 电路 板 1 的两面上的电子元器件 2和 /或所蔽框 3都粘有复合材料 4 , 且 该复合材料 4为一整块， 复合材料 4经弯折包裹在电路板 1 的两面。
由于复合材料 4具有轻、 薄、 柔软、 可卷曲弯折、 可小幅度拉 伸延展等特点， 所以用一块复合材料 4 粘在电路板 1 两面的电子元 器件 2和 /或所蔽框 3上， 既能提高防电磁屏蔽的效果， 又能使电路 板 1 两面的热量均摊， 提高散热效果。
实施例 6 :
本实施例与实施例 4基本相同， 其不同点在于： 如图 8所示， 本实施例中， 复合材料 4延伸至电路板 1 以外其他的发热部分。 使 用面积更大的复合材料 4 , 并将其延伸至电路板 1 以外的部分， 例 如手机中的电池 9 1、 显示屏 9 2。 复合材料 4粘在电路板 1上的电子 元器件 2和 /或屏蔽框 3上， 同时还与电池 9 1、 显示屏 9 2相接触， 能够使电路板 1、 电池 9 1 和显示屏 9 2 上的热量均摊， 使手机整体 的散热效果更好。
实施例 7 :
本实施例与实施例 4基本相同， 其不同点在于： 本实施例中， 导电导热层与粘胶层相反的一面也设有绝缘层。 在实施例 4 中， 复 合材料的一面粘接在电子元器件和 /或屏蔽框上， 另一面则棵露出导 电导热层， 为了防止其他部分从这一面与导电导热层形成不合理的 电连接， 所以在本实施例中， 这一面也覆盖有绝缘层。
以上所述， 仅为本发明的具体实施方式， 但本发明的保护范围 并不局限于此， 任何熟悉本技术领域的技术人员在本发明揭露的技 术范围内， 可轻易想到的变化或替换， 都应涵盖在本发明的保护范 围之内。 因此， 本发明的保护范围应以权利要求的保护范围为准。

Claims

权 利 要 求 书
1、 一种复合材料， 其特征在于： 包括相互贴合的导电导热层、 粘胶层和绝缘层， 所述导电导热层与所述绝缘层分别贴合于所述粘胶 层的两面；
所述粘胶层具有导电性。
2、 根据权利要求 1 所述的复合材料， 其特征在于： 所述复合材 料具有可弯折的特性。
3、 根据权利要求 1 所述的复合材料 其特征在于： 所述导电导 热层为铜、 石墨、 铝、 陶瓷中的一种或多种
4、 根据权利要求 1 所述的复合材料 其特征在于： 所述导电导 热层的厚度小于等于 2 mm。
5、 根据权利要求 4 所述的复合材料 其特征在于： 所述粘胶层 的厚度小于等于 0. 2mm。
6、 根据权利要求 5 所述的复合材料 其特征在于： 所述绝缘层 的厚度小于等于 0. 5mm。
7、 根据权利要求 1 所述的复合材料 其特征在于： 所述导电导 热层与所述粘胶层相反的一面也设有绝缘层。
8、 一种电子设备， 其特征在于： 包括电路板和复合材料； 所述电路板上有电子元器件和屏蔽框；
所述复合材料包括相互贴合的导电导热层、 粘胶层和绝缘层， 所 述导电导热层与所述绝缘层分别贴合于所述粘胶层的两面；
所述粘胶层具有导电性；
所述绝缘层在与所述电子元器件和 /或所述屏蔽框相应的位置形 成缺口， 露出所述粘胶层， 所述复合材料通过所述粘胶层粘在所述电 子元器件和 /或所述屏蔽框上。
9、 根据权利要求 8 所述的电子设备， 其特征在于： 所述电路板 的两面都有电子元器件和屏蔽框；
所述电路板的两面上的所述电子元器件和 /或所述屏蔽框都粘有 所述复合材料， 且所述复合材料为一整块， 所述复合材料经弯折包裹 在所述电路板的两面。
1 0、 根据权利要求 8所述的电子设备， 其特征在于： 所述复合材 料延伸至所述电路板以外其他的发热部分。
1 1、 根据权利要求 8至 1 0任一项所述的电子设备， 其特征在于： 所述复合材料中， 所述导电导热层与所述粘胶层相反的一面也设有绝 缘层。
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US9363884B2 (en) 2016-06-07
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EP2685797B1 (en) 2017-12-13
US20140055957A1 (en) 2014-02-27
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JP5743251B2 (ja) 2015-07-01
JP2014514771A (ja) 2014-06-19

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