WO2017206682A1 - 移动显示设备 - Google Patents

移动显示设备 Download PDF

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Publication number
WO2017206682A1
WO2017206682A1 PCT/CN2017/083744 CN2017083744W WO2017206682A1 WO 2017206682 A1 WO2017206682 A1 WO 2017206682A1 CN 2017083744 W CN2017083744 W CN 2017083744W WO 2017206682 A1 WO2017206682 A1 WO 2017206682A1
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WO
WIPO (PCT)
Prior art keywords
thermally conductive
display device
mobile display
circuit board
battery
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Application number
PCT/CN2017/083744
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English (en)
French (fr)
Inventor
马永达
乔勇
先建波
Original Assignee
京东方科技集团股份有限公司
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Application filed by 京东方科技集团股份有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US15/572,465 priority Critical patent/US10945331B2/en
Publication of WO2017206682A1 publication Critical patent/WO2017206682A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0262—Details of the structure or mounting of specific components for a battery compartment
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10037—Printed or non-printed battery

Definitions

  • Embodiments of the present disclosure relate to the field of displays, and in particular, to a mobile display device.
  • the heat dissipating components of mobile devices mainly include the outer casing, the battery, the circuit board, the chip, and the external environment.
  • the average temperature of each device in the mobile device and the distribution of heat in the mobile device have great reliability and safety for the mobile device.
  • the heat generated by the battery in the existing mobile device is mainly transmitted to the outer casing of the mobile device through heat radiation and heat transfer, and the heat is dissipated through the outer casing.
  • the embodiments of the present disclosure provide a mobile display device for reducing the occurrence of a phenomenon in which the local temperature of the battery is high, and improving the balance of heat dissipation of the mobile display device. To extend the life of the battery.
  • the present disclosure provides a mobile display device, including: a housing, further comprising:
  • a battery and a circuit board located in the housing, and the battery is located between the circuit board and the housing or the battery is disposed side by side with the circuit board;
  • a heat dissipation unit located on the circuit board to dissipate heat from the chip
  • the first thermal conductive connector is a thermal conductive adhesive or a metal thermal conductive sheet provided with an insulating and thermally conductive layer.
  • the first thermally conductive connector and the battery at least partially overlap in a direction perpendicular to the display side.
  • the mobile display device further includes: a second thermal connection connecting the circuit board and the housing.
  • the second thermal conductive connector is a thermal conductive adhesive or a metal thermal conductive sheet provided with an insulating and thermally conductive layer.
  • the mobile display device further includes: a third thermal connection between the chip and the heat dissipation unit.
  • the third thermal conductive connector is a thermal conductive adhesive or a thermally conductive ceramic or a metal thermal conductive sheet provided with an insulating and thermally conductive structure.
  • FIG. 1 is a cross-sectional view showing a first structure of a mobile display device according to an embodiment of the present disclosure
  • FIG. 2 is a cross-sectional view showing a second structure of a mobile display device according to an embodiment of the present disclosure
  • FIG. 3 is a cross-sectional view showing a third structure of a mobile display device according to an embodiment of the present disclosure
  • FIG. 4 is a schematic diagram of a fourth structure of a mobile display device according to an embodiment of the present disclosure.
  • FIG. 5 is a cross-sectional view along the line A-A of the fourth structural schematic diagram of the mobile display device according to the embodiment of the present disclosure.
  • FIG. 6 is a cross-sectional view showing a fifth structure of a mobile display device according to an embodiment of the present disclosure
  • FIG. 1 is a first schematic structural diagram of a mobile display device according to an embodiment of the present disclosure; the present disclosure provides a mobile display device, including a housing 1; and the mobile display device further includes:
  • a heat dissipation unit 4 disposed on the circuit board 6 and configured to dissipate heat of the chip 3;
  • the heat radiating unit 4 and the first heat conducting connector 51 of the housing 1 are connected.
  • FIG. 4 is a fourth structural diagram of a mobile display device according to an embodiment of the present disclosure
  • FIG. 5 is a fourth structure of the mobile display device according to the embodiment of the present disclosure shown in FIG. A cross-sectional view of the AA of the schematic diagram
  • another mobile display device provided by the embodiment of the present disclosure includes: the housing 1 further comprising:
  • a heat dissipation unit 4 located on the circuit board 6 for dissipating heat from the chip 3;
  • the heat radiating unit 4 and the first heat conducting connector 51 of the housing 1 are connected.
  • the battery 2 transfers power to the chip 3 through the circuit board 6. Since the battery and the chip generate heat during the process of generating electric energy, the heat dissipating unit 4 and the casing 1 are connected, for example, by providing the first heat conduction connecting member 51, so that the heat generated by the battery 2 and the chip 3 can pass the first heat conduction.
  • the arrangement of the connecting member 51 realizes that the respective heats of the housing 1 and the heat radiating unit 4 are balanced after the neutralization; that is, when the temperature of the battery 2 is too high, heat can be dissipated through the housing 1 and can also be along the first
  • the heat conducting connector 51 is transmitted to the heat dissipating unit 4 and is discharged, which improves the heat dissipation efficiency of the mobile display device.
  • the mobile display device provided by the embodiment of the present disclosure can reduce the occurrence of a phenomenon in which the local temperature of the battery 2 is high, improve the balance of heat dissipation of the mobile display device, and prolong the service life of the battery 2.
  • the mobile display device generally further includes a display module 7 and a cover 8 and the like covering the display side of the display module 7.
  • the first heat conducting connector 51 has a plurality of specific materials.
  • the first heat conducting connector 51 is a heat conductive adhesive or a metal heat conducting sheet provided with an insulating heat conductive layer.
  • the specific materials of the first heat-conducting connecting member are not limited to those listed, and will not be further described herein.
  • the first thermally conductive connector 51 and the battery 2 are at least partially overlapped in a direction perpendicular to the display side.
  • FIG. 2 is a schematic diagram of a second structure of a mobile display device according to an embodiment of the present disclosure.
  • the mobile display device further includes a second thermal connection connector 52 connecting the circuit board 6 and the housing 1. Since a part of the heat generated by the chip 3 is transmitted to the heat radiating unit 4 and a part is transmitted to the circuit board 6, the heat received by the circuit board 6 can be transmitted to the casing 1 through the arrangement of the second heat conducting connecting member 52. This is because when heat is transferred from the high temperature portion to the low temperature portion, when the temperature of the battery 2 is low, the heat on the casing 1 is also partially transferred to the battery 2, so that the battery 2 is rapidly warmed up to the operating temperature. The power conversion efficiency of the battery 2 is improved.
  • the second thermally conductive connector 52 is a thermally conductive paste or a metal thermally conductive sheet provided with an insulating thermally conductive layer.
  • the specific materials of the second heat-conducting connecting member are not limited to those listed, and will not be further described herein.
  • FIG. 3 is a schematic diagram of a third structure of a mobile display device according to an embodiment of the present disclosure.
  • the above mobile display device further includes: a third heat conduction connection member 53 located between the chip 3 and the heat dissipation unit 4.
  • the arrangement of the third heat conducting connector can speed up the transfer of heat of the chip 3 to the heat radiating unit 4.
  • the third thermally conductive connector 53 is a thermally conductive paste or a thermally conductive ceramic or a metal thermally conductive sheet provided with an insulative thermally conductive structure.
  • the specific material of the third heat conducting connector is not limited to the ones listed, and will not be repeated here.
  • the mobile display device further includes: a fourth heat conducting connecting member 54 that connects the battery and the circuit board to heat conduction.
  • the above mobile display device may be a mobile display device such as a mobile phone or a notebook computer.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Signal Processing (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Telephone Set Structure (AREA)

Abstract

本公开实施例涉及显示器技术领域，公开了一种移动显示设备，包括：壳体，还包括：位于壳体内的电池和电路板，且电池位于电路板与壳体之间或电池与电路板并排设置；位于电路板上的芯片；位于电路板上、为芯片散热的散热单元；连接散热单元和壳体的第一导热连接件。

Description

移动显示设备
相关申请的交叉引用
本申请要求于2016年5月31日递交中国专利局的、申请号为201620518681.5的中国专利申请的权益，该申请的全部内容以引用方式并入本文。
技术领域
本公开实施例涉及显示器领域，特别涉及一种移动显示设备。
背景技术
随着移动设备如智能手机、手提电脑等的不断发展，移动设备的功能越来越齐全，导致用户使用移动设备的运行时间越来越长。
移动设备的散热部件主要包括外壳、电池、电路板、芯片以及外界环境，移动设备中的各器件的平均温度以及移动设备中的热量的分布状况，对移动设备的可靠性和安全性具有很大的影响，现有移动设备中的电池产生的热量主要通过热辐射和热传递作用而传递给移动设备的外壳，再通过外壳将热量散出。
但是，就现有技术中的移动设备而言，若移动设备的外壳具有的导热系数低，则容易导致移动设备散热不均衡，电池的局部温度容易是相对高的，最终导致移动设备的使用寿命缩较短。
发明内容
为至少部分地克服上述现有技术中的缺陷和/或不足，本公开实施例提供了一种移动显示设备，用以减少电池局部温度较高的现象的发生，提高移动显示设备散热的均衡性，延长电池的使用寿命。
为达到上述目的，本公开提供以下技术方案：
根据本公开实施例的一方面，本公开提供了一种移动显示设备，包括：壳体，还包括：
位于所述壳体内的电池和电路板，且所述电池位于电路板与壳体之间或所述电池与所述电路板并排设置；
位于所述电路板上的芯片；
位于所述电路板上、为所述芯片散热的散热单元；
连接所述散热单元和所述壳体的第一导热连接件。
在一些可选的实施方式中，所述第一导热连接件为导热胶或设置绝缘导热层的金属导热片。
在一些可选的实施方式中，所述第一导热连接件与电池在垂直于显示侧的方向上至少部分地有交叠。
在一些可选的实施方式中，上述移动显示设备还包括：连接所述电路板和所述壳体的第二导热连接件。
在一些可选的实施方式中，所述第二导热连接件为导热胶或设置绝缘导热层的金属导热片。
在一些可选的实施方式中，上述移动显示设备还包括：位于所述芯片和所述散热单元之间的第三导热连接件。
在一些可选的实施方式中，所述第三导热连接件为导热胶或导热陶瓷或设置绝缘导热结构的金属导热片。
附图说明
为使本申请的目的、技术方案和优点更加清楚明白，以下结合具体实施例，并参照附图，对本申请作进一步的详细说明。在附图中：
图1为本公开实施例提供的移动显示设备的第一种结构剖示图；
图2为本公开实施例提供的移动显示设备的第二种结构剖示图；
图3为本公开实施例提供的移动显示设备的第三种结构剖示图；
图4为本公开实施例提供的移动显示设备的第四种结构示意图；
图5为图4所示的本公开实施例提供的移动显示设备的第四种结构示意图的A-A向剖视图；
图6为本公开实施例提供的移动显示设备的第五种结构剖示图；
具体实施方式
下面通过实施例，并结合附图，对本申请的技术方案作进一步具体的说明。在说明书中，相同或相似的附图标号指示相同或相似的部件。下述参照附图对本申请实施 方式的说明旨在对本申请的实施例的总体构思进行解释，而不应当理解为对本申请的一种限制。
另外，在下面的详细描述中，为便于解释，阐述了许多具体的细节以提供对本披露实施例的全面理解。然而明显地，一个或多个实施例在没有这些具体细节的情况下也可以被实施。在其他情况下，公知的结构和装置以图示的方式体现以简化附图。
附图中各部件尺寸和形状不反映移动显示设备的部件的真实比例，目的只是示意说明本发明内容。
如图1所示，图1为本公开实施例提供的移动显示设备的第一种结构示意图；本公开提供了一种移动显示设备，包括壳体1；并且所述移动显示设备还包括：
位于壳体1内的电池2和电路板6，且电池2位于电路板6与壳体1之间；
位于电路板6上的芯片3；
位于电路板6上、被配置成用于芯片3的散热的散热单元4；
连接散热单元4和壳体1的第一导热连接件51。
如图4和图5所示，图4为本公开实施例提供的移动显示设备的第四种结构示意图；图5为图4所示的本公开实施例提供的移动显示设备的第四种结构示意图的A-A向剖视图；本公开实施例提供的另一种移动显示设备，包括：壳体1，还包括：
位于壳体1内的电池2和电路板6，且电池2与电路板6并排设置；
位于电路板6上的芯片3；
位于电路板6上、为芯片3散热的散热单元4；
连接散热单元4和壳体1的第一导热连接件51。
本公开实施例提供的上述任一种移动显示设备，电池2通过电路板6将电能传递给芯片3。因为在产生电能的过程中，电池和芯片会产生热量，则例如通过设置第一导热连接件51，将散热单元4和壳体1连接，使得电池2和芯片3产生的热量可以通过第一导热连接件51的设置实现壳体1和散热单元4各自的热量在中和之后被平衡；也就是说，当电池2温度过高时，热量可以通过壳体1散出同时也可以沿着第一导热连接件51传给散热单元4后散出，提高了移动显示设备的散热效率。
如此，本公开实施例提供的移动显示设备，可以减少电池2局部温度较高的现象的发生，提高移动显示设备散热的均衡性，延长电池2的使用寿命。
如图1所示，上述移动显示设备一般还包括显示模组7和覆盖在显示模组7的显示侧的盖板8等。
上述第一导热连接件51的具体材料有多种，例如，第一导热连接件51为导热胶或设置有绝缘导热层的金属导热片。当然，第一导热连接件的具体材料不限于所列举的，这里就不再一一赘述。
如图5和图1所示，在垂直于显示侧的方向上，第一导热连接件51与电池2之间至少部分地有交叠。
如图2所示，图2为本公开实施例提供的移动显示设备的第二种结构示意图；上述移动显示设备还包括：连接电路板6和壳体1的第二导热连接件52。因为芯片3产生的热量一部分会传给散热单元4，一部分会传给电路板6，则通过第二导热连接件52的设置，可以将电路板6接收到的热量传递给壳体1。这是因为，热量传递时会从高温部分传递到低温部分，则当电池2的温度较低时，壳体1上的热量也会一部分传递给电池2，这样使得电池2迅速升温达到工作温度，提高电池2的电能转化效率。
在本公开的实施例中，作为示例，第二导热连接件52为导热胶或设置有绝缘导热层的金属导热片。当然，第二导热连接件的具体材料不限于所列举的，这里就不再一一赘述。
如图3所示，图3为本公开实施例提供的移动显示设备的第三种结构示意图。上述移动显示设备还包括：位于芯片3和散热单元4之间的第三导热连接件53。第三导热连接件的设置，可以加快芯片3的热量传递到散热单元4的速度。
在本公开的实施例中，作为示例，第三导热连接件53为导热胶或导热陶瓷或设置有绝缘导热结构的金属导热片。当然，第三导热连接件的具体材料不限于所列举的，这里就不再一一赘述。
如图6所示，为了便于在低温环境下使得电池迅速达到工作温度，当电池和电路板并排设置时，移动显示设备还包括：将电池和电路板连接导热的第四导热连接件54。
上述移动显示设备可以为手机，笔记本电脑等移动显示设备。
显然，本领域的技术人员可以对本公开实施例进行各种改动和变型而不脱离本公开的精神和范围。这样，倘若本公开实施例的这些修改和变型属于本公开权利要求及其等同技术的范围之内，则本公开也意图包含这些改动和变型在内

Claims (13)

  1. 一种移动显示设备，其中，所述移动显示设备包括：
    壳体；
    位于所述壳体内的电池和电路板，且所述电池位于电路板与壳体之间或所述电池与所述电路板并排设置；
    位于所述电路板上的芯片；
    位于所述电路板上、且被配置成用于所述芯片的散热的散热单元；和
    连接所述散热单元和所述壳体的第一导热连接件。
  2. 根据权利要求1所述的移动显示设备，其中，所述第一导热连接件为导热胶或设置有绝缘导热层的金属导热片。
  3. 如权利要求1所述的移动显示设备，其中，所述第一导热连接件与电池在垂直于显示侧的方向上至少部分地有交叠。
  4. 根据权利要求1所述的移动显示设备，其中，还包括：连接所述电路板和所述壳体的第二导热连接件。
  5. 根据权利要求4所述的移动显示设备，其中，所述第二导热连接件为导热胶或设置有绝缘导热层的金属导热片。
  6. 根据权利要求1所述的移动显示设备，其中，还包括：位于所述芯片和所述散热单元之间的第三导热连接件。
  7. 根据权利要求2所述的移动显示设备，其中，还包括：位于所述芯片和所述散热单元之间的第三导热连接件。
  8. 根据权利要求3所述的移动显示设备，其中，还包括：位于所述芯片和所述散热单元之间的第三导热连接件。
  9. 根据权利要求4所述的移动显示设备，其中，还包括：位于所述芯片和所述散热单元之间的第三导热连接件。
  10. 根据权利要求5所述的移动显示设备，其中，还包括：位于所述芯片和所述散热单元之间的第三导热连接件。
  11. 根据权利要求6所述的移动显示设备，其中，所述第三导热连接件为导热胶或导热陶瓷或设置绝缘导热结构的金属导热片。
  12. 根据权利要求1所述的移动显示设备，其中，还包括：将所述电池和所述电路板连接导热的第四导热连接件。
  13. 根据权利要求1所述的移动显示设备，其中，所述第四导热连接件经由所述第一导热连接件而间接地在所述电池和所述电路板之间连接导热。
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