CN102573417B - 壳体结构及具有其的电子装置 - Google Patents
壳体结构及具有其的电子装置 Download PDFInfo
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- 239000000463 material Substances 0.000 claims abstract description 136
- 238000009413 insulation Methods 0.000 claims description 51
- 238000004026 adhesive bonding Methods 0.000 claims description 39
- 238000009434 installation Methods 0.000 claims description 37
- 238000012546 transfer Methods 0.000 claims description 10
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- 229910002804 graphite Inorganic materials 0.000 claims description 5
- 239000010439 graphite Substances 0.000 claims description 5
- 229920000742 Cotton Polymers 0.000 claims description 4
- 239000006260 foam Substances 0.000 claims description 4
- 239000010410 layer Substances 0.000 abstract description 175
- 239000012792 core layer Substances 0.000 abstract description 4
- 230000017525 heat dissipation Effects 0.000 abstract description 2
- 239000002131 composite material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 1
- 235000017491 Bambusa tulda Nutrition 0.000 description 1
- 241001330002 Bambuseae Species 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000005041 Mylar™ Substances 0.000 description 1
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000011425 bamboo Substances 0.000 description 1
- 239000011469 building brick Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000007770 graphite material Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 230000021715 photosynthesis, light harvesting Effects 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14311—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles using means for bonding the coating to the articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/10—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material
- B32B3/12—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material characterised by a layer of regularly- arranged cells, e.g. a honeycomb structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/10—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material
- B32B3/18—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material characterised by an internal layer formed of separate pieces of material which are juxtaposed side-by-side
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
- B32B5/024—Woven fabric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14311—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles using means for bonding the coating to the articles
- B29C2045/14327—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles using means for bonding the coating to the articles anchoring by forcing the material to pass through a hole in the article
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14336—Coating a portion of the article, e.g. the edge of the article
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/03—3 layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/106—Carbon fibres, e.g. graphite fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2305/00—Condition, form or state of the layers or laminate
- B32B2305/10—Fibres of continuous length
- B32B2305/18—Fabrics, textiles
- B32B2305/188—Woven fabrics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/302—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/304—Insulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
- Y10T428/1348—Cellular material derived from plant or animal source [e.g., wood, cotton, wool, leather, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
- Y10T428/1352—Polymer or resin containing [i.e., natural or synthetic]
- Y10T428/1362—Textile, fabric, cloth, or pile containing [e.g., web, net, woven, knitted, mesh, nonwoven, matted, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24149—Honeycomb-like
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Materials Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Textile Engineering (AREA)
- Laminated Bodies (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
一种壳体结构,适用于一电子装置。电子装置具有一发热组件。壳体结构包括一心层、一第一材料层、及一第二材料层,其中心层包含一隔热区与一导热区。心层具有一第一表面及相对于第一表面的一第二表面。第一材料层配置于第一表面。第二材料层配置于第二表面。隔热区对位于发热组件且壳体结构遮蔽发热组件以将发热组件所产生的一热能通过第二材料层及导热区传递至第一材料层进行散热并避免第一材料层对位于发热组件处的位置产生热点的缺陷。
Description
技术领域
本发明是有关于一种壳体结构及具有其的电子装置,且特别是有关于一种包含心层且心层具有隔热区与导热区的壳体结构及具有其的电子装置。
背景技术
近年来,可携式电子装置的功能越来越多元化,体积越来越小,加上无线通讯及无线网络的便利性,让人们得以透过可携式电子装置获取网络信息,使得可携式电子装置日益普及。可携式电子装置是人们到处携带的工作平台,储存大量的数据及应用程序,若结构强度不合安全保护标准、不耐压、不耐撞,将造成携带上的困扰。为了增加可移植性,可携式电子装置不断地缩小厚度、重量,但降低厚度、重量在某些设计的特点上是与结构强度的维持相互抵触的。因此,增加可携式电子装置本身结构上的强度,并设法减少整体结构的厚度、重量,一直是可携式电子装置在设计上的重点。
将聚酯薄膜(mylar)、石墨、竹纤维或碳纤维等轻量化材料结合于金属材料而构成的复合材料兼具了结构强度佳及轻薄的特性,因此被应用于电子装置的壳体。当上述复合材料包含了石墨等高导热材质时,电子装置的壳体表面对应于其内发热组件的位置可能会具有较高的温度,而让使用者感到不适。
发明内容
本发明提供一种壳体结构,其表面对应于发热组件的位置的温度可被降低。
本发明提供一种电子装置,其壳体结构的表面对应于发热组件的位置的温度可被降低。
本发明提出一种壳体结构,适用于一电子装置。电子装置具有一发热组件。壳体结构包括一心层、一第一材料层及一第二材料层。心层具有一导热区、一隔热区、一第一表面及相对于第一表面的一第二表面,其中导热区相邻于隔热区。第一材料层配置于第一表面并接触导热区与隔热区。第二材料层配置于第二表面并接触导热区与隔热区。发热组件对位于隔热区且将发热组件所产生的一热能通过第二材料层及导热区传递至第一材料层。
本发明提出一种电子装置,包括一壳体结构及一发热组件。壳体结构包括一心层、一第一材料层及一第二材料层。心层具有一导热区、一隔热区、一第一表面及相对于第一表面的一第二表面,其中导热区相邻于隔热区。第一材料层配置于第一表面并接触导热区与隔热区。第二材料层配置于第二表面并接触导热区与隔热区。发热组件设置于一电路板上且对位于隔热区,其中发热组件所产生的一热能通过第二材料层及导热区传递至第一材料层。
在本发明的一实施例中,上述的隔热区的材质包括保丽龙、棉花、木材或植物纤维。
在本发明的一实施例中,上述的导热区在一第一方向的导热速度大于一第二方向的导热速度,其中第二方向为心层平面的法线向量且第一方向垂直于第二方向。
在本发明的一实施例中,上述的核导热区的材质包括石墨。
在本发明的一实施例中,上述的壳体结构,更包括一第一黏结层及一第二黏结层。第一黏结层位于心层与第一材料层之间,用以使心层与第一材料层相互黏结。第二黏结层位于心层与第二材料层之间,用以使心层与第一材料层相互黏结。
在本发明的一实施例中,上述的位于导热区与第一材料层间的第一黏结层及位于导热区与第二材料层之间的第二黏结层为高热传导系数的黏结层。
在本发明的一实施例中,上述的发热组件接触第二材料层。
在本发明的一实施例中,上述的心层为一编织物层且第一材料层及第二材料层可为一金属板。
基于上述,本发明的壳体结构在心层中配置了隔热区且隔热区对位于电子装置内的发热组件。通过隔热区的阻隔,发热组件所产生的热不会直接传导至壳体结构的表面对应于发热组件的位置,而会透过第一材料层、心层的导热区、及第二材料层的传导而较为均匀地分散至壳体结构的其它部分。藉此,可避免使用者接触壳体结构的表面对应于发热组件的位置时因高温而产生不适,以增加电子装置使用上的舒适度。
为让本发明的上述特征和优点能更明显易懂,下文特举实施例,并配合所附图作详细说明如下。
附图说明
图1为本发明一实施例的电子装置的局部剖视图。
图2为图1的壳体结构的局部放大图。
图3为本发明另一实施例的电子装置的局部剖视图。
符号说明
100、200:电子装置 110、210:壳体结构
110a:位置 111:第一黏结层
113:第二黏结层 112、212:心层
112a:开口 112b:第一表面
112c:第二表面 114、214:第一材料层
116、216:第二材料层 118、218:隔热区
119、219:导热区 120、220:发热组件
230:电路板 H、H’:热能
具体实施方式
图1为本发明一实施例的电子装置的局部剖视图。请参考图1,本实施例的电子装置100包括一壳体结构110及一发热组件120。壳体结构110包括一心层112、一第一材料层114、及一第二材料层116,其中心层112区分为隔热区118与导热区119。心层112的导热区119具有一开口112a、一第一表面112b及相对于第一表面112b的一第二表面112c。第一材料层114配置于第一表面112b,且第二材料层116配置于第二表面112c。隔热区118配置于开口112a且用以相邻于导热区119。心层112位于第一材料层114与第二材料层116之间且可为一编织物层,其中第一材料层114与第二材料层116的材质为高热传导系数的材质且第一材料层114与第二材料层116可为金属板。第一材料层114与第二材料层116的材质可为铝、铜、铁等具有高热传导系数的材质,但是在本发明中的实施例中,为了兼顾电子装置的壳体的强度及重量,通常会采用铝作为第一材料层114及第二材料层116的材质,但是并不限制本发明的范围。壳体结构110遮蔽发热组件120,且发热组件120对位于隔热区118。随着制程的不同,若心层112为一编织物层,则心层的隔热区118与导热区119可直接编织在一起,但并不限制本发明的范围。
在上述配置方式之下,壳体结构110在心层112的开口112a中配置了隔热区118,且隔热区118对位于电子装置100内的发热组件120,其中发热组件120装设在一电路板上。通过隔热区118的阻隔,发热组件120所产生的热能H不会直接传导至壳体结构110的表面对应于发热组件120的位置110a而产生热点的缺陷。发热组件120的热能H会透过第二材料层116直接将热传递至心层112的导热区119中并通过导热区119的传导而较为均匀地将热能H分散至壳体结构110的其它部分。藉此,可避免使用者接触壳体结构110的表面对应于发热组件120的位置110a时因高温而产生不适,以增加电子装置100使用上的舒适度。在本发明中,心层112的导热区119可为一具有高热传导系数的编织层且心层的导热区119可为一具有石墨材质的编织层。
隔热区118通常为具有低热传导系数的隔热组件且为了同时增加壳体结构的强度及降低壳体结构的重量,隔热区通常也可为一具有低热传导系数的编织物。在本实施例中,隔热区118的材质例如为保丽龙、棉花、或植物纤维等具有较低热传导系数的材料。在其它实施例中,隔热区118、心层112、第一材料层114及第二材料层116可选用其它适当材质,本发明不对此加以限制。
在本发明的实施例中,虽然第一材料层114、心层112的导热区119、及第二材料层116的材质均为高热传导系数的材质,但是其功用略微不同。第二材料层116主要是通过其高热传导系数的特性吸收发热组件120所产生的热后快速地将热传递至心层112导热区119上。心层112导热区119虽然同样为高热传导系数的材质,但是心层112导热区119在进行热传递的过程中,在第一方向的热传递速度远大于在第二方向的热传递速度,其中第二方向为心层112平面的法线向量且第一方向为垂直于第二方向的方向。由于心层112在平面方向的热传递速度较快,因此当接收由第二材料层116所传递而来的热能H时,此热能H将会迅速地分散至心层112导热区119的其它部分并将分散后的热能H通过第一材料层114传递至电子装置的壳体结构110外以使电子装置的壳体结构110在具有散热效能的同时不会在第一材料层114表面对位于发热组件120的位置产生热点的缺陷。
图2为图1的壳体结构的局部放大图。请参考图2,在本实施例中,壳体结构110更包括一第一黏结层111及一第二黏结层113。第一黏结层111位于心层112与第一材料层114之间用以使第一材料层114与心层112相互黏结。第二黏结层113位于心层112与第二材料层116之间,用以使第二材料层114与心层112相互黏结。心层112、第一材料层114及第二材料层116通过第一黏结111及第二黏结层113而稳固地相互结合并构成复合材料层。利用此复合材料层作为壳体将有助于提高电子装置的壳体的强度。本发明更进一步地将具有高热传导系数的编织层作为心层,以在提高壳体强度的同时提升电子装置的散热效率。随着产品设计的不同,位于第一材料层114与心层112的导热区119之间的第一黏结层111可为一高热传导系数的黏结层以迅速将分散后的热能由心层112的导热区119传递至第一材料层114进行散热。位于第二材料层116与心层112的导热区119之间的第二黏结层113可为一高热传导系数的黏结层以迅速将由发热组件120所发出的热能迅速传递至心层112的导热区119进行热能分散的程序。在本发明的实施例中所使用的高热传导系数的黏结层为一导热胶且高热传导系数黏结层的热传导率约大于0.2W/mk,但是并不限制本发明的范围。位于第一材料层114与心层112的隔热区119之间的第一黏结层111可为一高耐热性的黏结层以使隔热区119与第一材料层之间的黏结力不会因高温的影响而降低。位于第二材料层116与心层112的隔热区119之间的第二黏结层113可为一高耐热性的黏结层以使隔热区119与第二材料层116之间的黏结力不会因高温的影响而降低。随着制程需求的不同,心层112的隔热区119与第一材料层114之间的第一黏结层111及隔热区与第二材料层之间的第二黏结层113也可同样为高热传导系数的黏结层,但是并不限制本发明的范围。
在制作壳体结构110的过程中,例如是在结合心层112、第一黏结层114及第二黏结层116之前,先在心层112会对位于发热组件120的位置形成开口112a。接着,将心层112的一侧黏结至第一材料层114及第二材料层116其中之一,并将隔热组件118配置于开口112a中。最后,将核心层112的另一侧黏结至第一材料层114及第二材料层116其中的另一,使隔热组件118位于第一材料层114及第二材料层116之间,以完成壳体结构110的制作。
随着产品设计的不同,当隔热组件118与心层112为同一层且隔热组件118成为心层112上的隔热区时,则心层112区分为隔热区及导热区,其中隔热区对位于电子装置100内的发热组件120用以使发热组件120的热能够经由导热区均匀地将热分散至壳体结构110的其它部分,避免壳体结构的表面产生热点的缺陷。
图3为本发明另一实施例的电子装置的局部剖视图。请参考图3,本实施例的壳体结构210的心层212、第一材料层214、及第二材料层216的配置方式,与图1所示的壳体结构110的心层112、第一材料层114、第二材料层116及隔热组件118的配置方式相同,于此不加以赘述。电子装置200的发热组件220除了对位于隔热区218之外,更接触第二材料层216,以使发热组件220产生的热能H’能够更快速地通过第二材料层216的传导传递至心层212的导热区219以将热分散至壳体结构210的其它部分。
在图3的实施例中,发热组件220例如是配置于电路板230上的中央处理器(Central Processing Unit,CPU)或其它电子组件,本发明不对发热组件的种类加以限制。
综上所述,本发明的壳体结构在心层中配置了隔热区且隔热区对位于电子装置内的发热组件。通过隔热区的阻隔,发热组件所产生的热不会直接传导至壳体结构的表面对应于发热组件的位置,而会透过第一材料层、心层的导热区、及第二材料层的传导而较为均匀地分散至壳体结构的其它部分。藉此,可避免使用者接触壳体结构的表面对应于发热组件的位置时因高温而产生不适,以增加电子装置使用上的舒适度。
虽然本发明已以实施例揭露如上,然其并非用以限定本发明,任何所属技术领域中具有通常知识者,在不脱离本发明的精神和范围内,当可作些许的更动与润饰,故本发明的保护范围当根据权利要求所界定的内容为准。
Claims (14)
1.一种壳体结构,适用于一电子装置,该电子装置具有一发热组件,其特征在于,该壳体结构包括:
一心层,具有一导热区、一隔热区、一第一表面及相对于该第一表面的一第二表面,其中该导热区具有一开口,该隔热区配置于该开口且用以相邻于该导热区;该导热区在一第一方向的导热速度大于一第二方向的导热速度,其中该第二方向为该心层平面的法线向量且该第一方向垂直于该第二方向;
一第一材料层,配置于该第一表面并接触该导热区与该隔热区;
一第二材料层,配置于该第二表面并接触该导热区与该隔热区;
其中该第一材料层及该第二材料层的材质为高热传导系数的材质;以及
其中该发热组件对位于该隔热区且将该发热组件所产生的一热能通过该第二材料层及该导热区传递至该第一材料层。
2.如权利要求1所述的壳体结构,其特征在于,该隔热区的材质包括保丽龙、棉花、木材或植物纤维。
3.如权利要求1所述的壳体结构,其特征在于,该导热区的材质包括石墨。
4.如权利要求1所述的壳体结构,其特征在于,还包括:
一第一黏结层,位于该心层与该第一材料层之间,用以使该心层与该第一材料层相互黏结;以及
一第二黏结层,位于该心层与该第二材料层之间,用以使该心层与该第二材料层相互黏结。
5.如权利要求4所述的壳体结构,其特征在于,位于该导热区与该第一材料层间的该第一黏结层及位于该导热区与该第二材料层之间的该第二黏结层为高热传导系数的黏结层。
6.如权利要求1所述的壳体结构,其特征在于,该发热组件接触该第二材料层。
7.如权利要求1所述的壳体结构,其特征在于,该心层为一编织物层且该第一材料层及该第二材料层为一金属板。
8.一种电子装置,其特征在于,包括:
一壳体结构,包括:
一心层,具有一导热区、一隔热区、一第一表面及相对于该第一表面的一 第二表面,其中该导热区具有一开口,该隔热区配置于该开口且用以相邻于该导热区;该导热区在一第一方向的导热速度大于一第二方向的导热速度,其中该第二方向为该心层平面的法线向量且该第一方向垂直于该第二方向;
一第一材料层,配置于该第一表面并接触该导热区与该隔热区;
一第二材料层,配置于该第二表面并接触该导热区与该隔热区;
其中该第一材料层及该第二材料层的材质为高热传导系数的材质;以及
一发热组件,设置于一电路板上且对位于该隔热区,其中该发热组件所产生的一热能通过该第二材料层及该导热区传递至该第一材料层。
9.如权利要求8所述的电子装置,其特征在于,该隔热组件的材质包括保丽龙、棉花、或植物纤维。
10.如权利要求8所述的电子装置,其特征在于,该心层的材质包括石墨。
11.如权利要求8所述的电子装置,其特征在于,该壳体结构更包括:
一第一黏结层,位于该心层与该第一材料层之间,用以使该心层与该第一材料层相互黏结;以及
一第二黏结层,位于该心层与该第二材料层之间,用以使该心层与该第二材料层相互黏结。
12.如权利要求11所述的电子装置,其特征在于,位于该导热区与该第一材料层间的该第一黏结层及位于该导热区与该第二材料层之间的该第二黏结层为高热传导系数的黏结层。
13.如权利要求8所述的电子装置,其特征在于,该发热组件接触该第二材料层。
14.如权利要求8所述的电子装置,其特征在于,该心层为一编织物层且该第一材料层及该第二材料层为一金属板。
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Also Published As
Publication number | Publication date |
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TWI472423B (zh) | 2015-02-11 |
CN102573417A (zh) | 2012-07-11 |
TWI445483B (zh) | 2014-07-11 |
TW201226168A (en) | 2012-07-01 |
US20120162921A1 (en) | 2012-06-28 |
US20120164360A1 (en) | 2012-06-28 |
DE102011121899A1 (de) | 2012-06-28 |
CN102548283A (zh) | 2012-07-04 |
CN102548283B (zh) | 2014-12-10 |
TW201236539A (en) | 2012-09-01 |
US8574702B2 (en) | 2013-11-05 |
US8681502B2 (en) | 2014-03-25 |
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