WO2020078178A1 - 终端设备 - Google Patents

终端设备 Download PDF

Info

Publication number
WO2020078178A1
WO2020078178A1 PCT/CN2019/107624 CN2019107624W WO2020078178A1 WO 2020078178 A1 WO2020078178 A1 WO 2020078178A1 CN 2019107624 W CN2019107624 W CN 2019107624W WO 2020078178 A1 WO2020078178 A1 WO 2020078178A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat dissipation
middle frame
heat
dissipation component
terminal device
Prior art date
Application number
PCT/CN2019/107624
Other languages
English (en)
French (fr)
Inventor
肖永旺
靳林芳
李华林
徐乃祥
王国平
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to EP19874044.1A priority Critical patent/EP3843366B1/en
Priority to US17/284,381 priority patent/US20210392782A1/en
Publication of WO2020078178A1 publication Critical patent/WO2020078178A1/zh
Priority to US18/505,673 priority patent/US20240081026A1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components

Definitions

  • This application relates to the field of electronic technology, in particular to a terminal device.
  • processing modules eg, processors, etc.
  • the heat generated by the processing module not only affects the performance of the processing module and other components in the electronic device, but also makes the user's experience poor.
  • a multilayer graphite film is usually provided in an electronic device, and the heat generated by the processing module is dissipated through the multilayer graphite film.
  • Multi-layer graphite films are usually pasted with double-sided tape. Due to the poor thermal conductivity of the double-sided tape, the thermal conductivity of the multi-layer graphite films is poor, which in turn leads to poor heat dissipation effects of the multi-layer graphite films on terminal equipment.
  • the present application provides a terminal device, which improves the heat dissipation efficiency of the terminal device.
  • An embodiment of the present application provides a terminal device including: a middle frame, a heat source device, a first heat dissipation component, and a second heat dissipation component, wherein the first heat dissipation component is disposed on one side of the middle frame, and the heat source device and the second heat dissipation component are disposed on The other side of the middle frame; at least one of the first heat dissipation component or the second heat dissipation component is a graphene heat dissipation component.
  • the graphene heat dissipation component has good heat transfer performance, so that the graphene heat dissipation component can quickly transfer the heat generated by the heat source device, which not only improves the heat dissipation efficiency of the terminal equipment, It can also make the heat distribution in the terminal equipment more uniform. Since the thickness of the graphene heat dissipation component is small, the first heat dissipation component or the second heat dissipation component occupies less space in the terminal device, thereby making the thickness of the terminal device smaller.
  • the projection of the heat source device on the middle frame and the projection of the first heat dissipation component on the middle frame have coincident portions.
  • the projection of the heat source device on the middle frame is within the projection of the first heat dissipation component on the middle frame.
  • the heat source device quickly transfers the heat to the area opposite the heat source device in the middle frame (hereinafter referred to as the first area).
  • the first area the area opposite the heat source device in the middle frame.
  • the projection of the heat source device on the middle frame and the projection of the second heat dissipation component on the middle frame have coincident portions.
  • the projection of the heat source device on the middle frame is within the projection of the second heat dissipation component on the middle frame.
  • the heat generated by the heat source device can be quickly transferred Two heat dissipation components, thereby improving heat dissipation efficiency.
  • the graphene heat dissipation component is a single-layer graphene film.
  • the single-layer graphene film has a small thickness, so that the first heat dissipation component or the second heat dissipation component occupies less space in the terminal device, which in turn makes the thickness of the terminal device smaller.
  • the single-layer graphene film is compounded with at least one of the following thermally conductive materials: copper and carbon fiber.
  • the graphene heat dissipation component is provided with an escape hole. In this way, it is easy to install the internal components of the terminal equipment.
  • the terminal device further includes: a liquid-cooled tube, and the liquid-cooled tube is attached and disposed on the middle frame.
  • the liquid cooling tube can quickly transfer heat, thereby improving the heat dissipation efficiency. Further, through the temperature transfer of the liquid cooling tube, the temperature distribution in the terminal device can be made more uniform.
  • the projection of the liquid cooling tube on the middle frame and the projection of the heat source device on the middle frame have a coincident portion.
  • the heat source device quickly transfers the heat to the area opposite the heat source device in the middle frame (hereinafter referred to as the first area), when the projection of the liquid cooling tube on the middle frame and the heat source
  • the first area is also directly opposite to the liquid cooling tube, so that the heat in the first area is quickly transferred to the liquid cooling tube, thereby improving the heat dissipation efficiency.
  • the projection of the liquid cooling tube on the middle frame is within the projection of the first heat dissipation component on the middle frame.
  • the liquid cooling tube can quickly transfer heat to the first heat dissipation component, so that the first heat dissipation component can quickly heat Divergence, thereby improving the heat dissipation efficiency.
  • the liquid cooling tube is disposed on a side of the middle frame facing the first heat dissipation component, and the liquid cooling tube is also provided in close contact with the first heat dissipation component.
  • the liquid cooling tube and the first heat dissipation component are provided in close contact with each other, so that the liquid cooling tube can quickly transfer heat to the first heat dissipation component, thereby improving heat dissipation efficiency.
  • the liquid cooling tube is disposed on a side of the middle frame facing the second heat dissipation assembly.
  • the liquid cooling tube includes any one of an ultra-thin heat pipe, an ultra-thin uniform heat pipe, or a loop heat pipe.
  • the liquid cooling tube is accommodated in a slot provided on the middle frame and matching the shape of the liquid cooling tube. In this way, not only can the contact area of the hot cooling tube and the middle frame be increased, the liquid cooling tube quickly transfers heat to the middle frame, but also the liquid cooling tube can be more firmly fixed.
  • a part of the liquid cooling tube is close to the heat source device, and another part of the liquid cooling tube is far from the heat source device, wherein the part of the liquid cooling tube close to the heat source device is smaller than the other part of the liquid cooling tube far from the heat source device.
  • the first heat dissipation component and the second heat dissipation component have different thicknesses.
  • the thickness of the first heat dissipation component or the second heat dissipation component is 42 ⁇ m. Since the thickness of the first heat dissipation component or the second heat dissipation component is small, the first heat dissipation component or the second heat dissipation component occupies less space of the terminal device, thereby making the thickness of the terminal device smaller.
  • the terminal device further includes a display screen, and the display screen is disposed on the middle frame.
  • the display screen covers the first heat dissipation component.
  • the terminal device further includes a housing, the housing is disposed on the middle frame, and the housing covers the second heat dissipation component.
  • the casing can protect the terminal device.
  • the display screen covers the first heat dissipation component and the second heat dissipation component.
  • the heat source device is surrounded by metal shields on both sides.
  • the metal shield can reduce the electromagnetic interference of other components to the heat source device.
  • the terminal equipment middle frame, heat source device, first heat dissipation component and second heat dissipation component provided in the embodiments of the present application, wherein the first heat dissipation component is provided on one side of the middle frame, and the heat source device and the second heat dissipation component are provided on On the other side; at least one of the first heat dissipation component or the second heat dissipation component is a graphene heat dissipation component.
  • the graphene heat dissipation component has good heat transfer performance, so that the graphene heat dissipation component can quickly transfer the heat generated by the heat source device, which not only improves the heat dissipation efficiency of the terminal equipment, It can also make the heat distribution in the terminal equipment more uniform. Since the thickness of the graphene heat dissipation component is small, the first heat dissipation component or the second heat dissipation component occupies less space in the terminal device, thereby making the thickness of the terminal device smaller.
  • FIG. 1 is a schematic structural diagram of a terminal device according to an embodiment of this application.
  • FIG. 2A is a schematic diagram of projection provided by an embodiment of the present application.
  • 2B is another schematic diagram of projection provided by an embodiment of the present application.
  • FIG. 3 is a schematic structural diagram of another terminal device according to an embodiment of the present application.
  • FIG. 4 is a schematic structural diagram of yet another terminal device provided by an embodiment of this application.
  • FIG. 5 is a schematic structural diagram of another terminal device according to an embodiment of the present application.
  • FIG. 6 is a schematic structural diagram of yet another terminal device provided by an embodiment of the present application.
  • graphite is an allotrope of elemental carbon, and graphite has good electrical and thermal conductivity.
  • the common graphite is formed by stacking layers of planar carbon atoms arranged in a honeycomb order.
  • the interlayer force of graphite is weak, and it is easy to peel off each other to form a thin graphite sheet.
  • graphene When the graphite sheet is peeled into a single layer, this single layer with only one carbon atom thickness is graphene. Studies have shown that graphene has ultra-high thermal conductivity. Under ideal conditions, the thermal conductivity of graphene is as high as 5300W / m ⁇ K, which is more than ten times that of copper.
  • Embodiments of the present application provide a terminal device that uses graphene to dissipate heat.
  • the terminal device may be: a mobile phone, a tablet computer, an e-reader, a notebook computer, a vehicle-mounted device, a wearable device, and the like.
  • Graphene heat dissipation components are provided in the terminal equipment. Due to the better heat transfer performance of the graphene heat dissipation components, the graphene heat dissipation components can quickly transfer the heat generated by the heat source device, which not only improves the heat dissipation efficiency of the terminal equipment, but also It can make the heat distribution in the terminal equipment more uniform. Since the thickness of the graphene heat dissipation component is small, the first heat dissipation component or the second heat dissipation component occupies less space in the terminal device, thereby making the thickness of the terminal device smaller.
  • FIG. 1 is a schematic structural diagram of a terminal device according to an embodiment of the present application.
  • the terminal device may include a middle frame 11, a heat source device 12, a first heat dissipation component 13, and a second heat dissipation component 14, wherein the first heat dissipation group 13 is disposed on one side of the middle frame 11, and the heat source device 12 and The second heat dissipation group 14 is disposed on the other side of the middle frame 11; at least one of the first heat dissipation component 13 or the second heat dissipation component 14 is a graphene heat dissipation component.
  • the middle frame 11 may be a frame structure of a terminal device, and other parts or all components of the terminal device may be directly or indirectly disposed on the middle frame 11 to form a terminal device.
  • the middle frame 11 may be provided inside the terminal device, and the edge of the middle frame 11 may be designed as a part of the casing of the terminal device.
  • the edge of the middle frame 11 is used as a casing of the terminal device, it can play a role in protecting the terminal device.
  • the middle frame 11 may have a planar or plane-like structure, and therefore, the two sides of the middle frame 11 may be visually distinguished, and the two sides may be referred to as the front and back of the middle frame 11, or, The two side surfaces may also be referred to as one side and the other side of the middle frame 11. Inside the middle frame 11, partial hollowing can be performed as needed to set other components in the terminal device.
  • part or all of the middle frame 11 may be made of metal or alloy material (for example, aluminum alloy).
  • the material of the middle frame 11 may also be other, which is not specifically limited in the embodiment of the present application.
  • the heat source device 12 refers to a device that radiates more heat in the terminal equipment.
  • the heat radiated by the component is usually positively related to the power consumption of the component.
  • the greater the power consumption of the component the greater the heat radiated by the component.
  • the heat source device 12 in this application may be a device in the terminal device whose power consumption exceeds M% of the overall power consumption, M may be 30, 40, etc.
  • the heat source device 12 may include a processor, a processing device that integrates processing and storage functions, a power supply component (such as a battery), and so on.
  • a power supply component such as a battery
  • the heat source device 12 may also be other, which is not specifically limited in the embodiment of the present application.
  • first heat dissipation component 13 and the second heat dissipation component 14 may both be graphene heat dissipation components.
  • first heat dissipation component 13 is a graphene heat dissipation component
  • second heat dissipation component 14 is a multilayer graphite heat dissipation component.
  • first heat dissipation component 13 is a multilayer graphite heat dissipation component
  • the second heat dissipation component 14 is a graphene heat dissipation component.
  • the graphene heat dissipation component may have a sheet structure.
  • the thickness of the first heat dissipation component 13 and the second heat dissipation component 14 are different.
  • the thickness of the first heat dissipation component 13 or the second heat dissipation component 14 is greater than or equal to 40 microns, and optionally, is 42 microns.
  • an escape hole may be provided on the graphene heat dissipation component according to actual needs to facilitate the installation of other components in the terminal device.
  • the first heat dissipation component 13 or the second heat dissipation component 14 can be bent arbitrarily according to the space requirement inside the terminal device.
  • the graphene heat dissipation component may be a single-layer graphene film.
  • the single-layer graphene film can also be compounded with at least one of the following thermally conductive materials: copper and carbon fiber.
  • thermally conductive materials copper and carbon fiber.
  • other thermally conductive materials can also be compounded in the single-layer graphene film.
  • one side of the middle frame 11 is opposite to the other side of the middle frame 11.
  • one side of the middle frame 11 may be the front side of the middle frame 11, and the other side of the middle frame 11 may be the back side of the middle frame 11.
  • the heat source device 12 and the middle frame 11 are partly or completely attached.
  • the heat source device 12 may be fixedly arranged on the middle frame 11; or, the heat source device 12 may be arranged on other components (for example, a circuit board, etc.), and the other components are arranged on the middle frame 11, so that the heat source device 12 and The middle frame 11 fits in part or in whole.
  • the heat source device 12 is disposed between the middle frame 11 and the second heat dissipation assembly 14.
  • the heat source device 12 and the second heat dissipation assembly 14 may be partially or fully bonded.
  • the first heat dissipation component 13 may be partially or completely attached to the middle frame 11.
  • the heat source device 12 of the terminal device generates heat.
  • the heat generated by the heat source device 12 is centered on the heat source device 12 and diffuses along each radius of the ball. Since the distance between the middle frame 11 and the heat source device 12 is relatively short, the heat generated by the heat source device 12 can be quickly transferred to a portion of the middle frame 11 that is close to the heat source device 12 (for example, a portion where the heat source device 12 is bonded).
  • the middle frame 11 transfers the received heat inside the middle frame 11, and at the same time, the middle frame 11 also transfers the heat to the first heat dissipation assembly 13.
  • the first heat dissipation component 13 After the first heat dissipation component 13 receives the heat transferred by the middle frame 11, the first heat dissipation component 13 transfers the received heat inside the first heat dissipation component 13, and at the same time, the first heat dissipation component 13 also transfers the heat to the middle frame 11 Or other components (such as display screen, housing, etc.). Among them, when heat is transferred inside a component (the middle frame 11 or the first heat dissipation assembly 13), the heat is transferred from the part with high temperature to the part with low temperature. When heat is transferred between the first heat dissipation component and the middle frame 11, the first heat dissipation component 13 may transfer heat to the middle frame 11, and the middle frame 11 may also transfer heat to the first heat dissipation component 13.
  • the heat generated by the heat source device 12 can also be transferred to the second heat dissipation component 14.
  • the second heat dissipation component 14 receives the heat transferred by the heat source device 12, the second heat dissipation component 14 transfers the received heat inside the second heat dissipation component 14 At the same time, the second heat dissipation assembly 14 also transfers heat to the middle frame 11 or other components (such as a display screen, a housing, etc.).
  • the second heat dissipation component 14 may transfer heat to the middle frame 11, and the middle frame 11 may also transfer heat to the second heat dissipation component 14.
  • the terminal device includes at least one graphene heat dissipation component
  • the graphene heat dissipation component has good heat transfer performance, so that the graphene heat dissipation component can quickly transfer the heat generated by the heat source device 12, which not only improves the heat dissipation efficiency of the terminal device , Can also make the heat distribution in the terminal equipment more uniform. Since the thickness of the graphene heat dissipation component is small, the first heat dissipation component 13 or the second heat dissipation component 14 occupies less space in the terminal device, thereby making the thickness of the terminal device smaller.
  • the projection of the heat source device 12 on the middle frame 11 and the projection of the first heat dissipation assembly 13 on the middle frame 11 have overlapping portions.
  • FIG. 2A is a schematic diagram of projection provided by an embodiment of the present application.
  • FIG. 2B is another schematic diagram of projection provided by an embodiment of the present application.
  • the projection of the first heat dissipation component on the middle frame 11 is A1
  • the projection of the heat source device 12 on the middle frame 11 is A2.
  • a part of the projection A2 of the heat source device 12 on the middle frame 11 coincides with a part of the projection A1 of the first heat dissipation assembly 13 on the middle frame 11.
  • the projection of the first heat dissipation component on the middle frame 11 is B1
  • the projection of the heat source device 12 on the middle frame 11 is B2.
  • the projection B2 of the heat source device 12 on the middle frame 11 is located within the projection B1 of the first heat dissipation assembly 13 on the middle frame 11.
  • the heat source device 12 quickly transfers the heat to the area of the middle frame 11 directly opposite the heat source device 12 (hereinafter referred to as the first area), when the heat source device 12 is in the middle frame 11
  • the first area the area of the middle frame 11 directly opposite the heat source device 12
  • the projection above and the projection of the first heat dissipation component 13 on the middle frame 11 have overlapping parts, part or all of the first area is also directly opposite to the first heat dissipation component 13 so that the heat in the first area is quickly transferred to
  • the first heat dissipation component further improves the heat dissipation efficiency.
  • the projection of the heat source device 12 on the middle frame 11 and the projection of the second heat dissipation assembly 14 on the middle frame 11 have overlapping portions.
  • the projection of the heat source device 12 on the middle frame 11 is within the projection of the second heat dissipation assembly 14 on the middle frame 11.
  • FIGS. 2A and 2B the projection of the heat source device 12 on the middle frame 11 and the projection of the second heat dissipation assembly 14 on the middle frame 11 can be referred to FIGS. 2A and 2B, and details are not repeated here.
  • the heat source device 12 After the heat source device 12 generates heat, when the projection of the heat source device 12 on the middle frame 11 and the projection of the second heat dissipation assembly 14 on the middle frame 11 have overlapping parts, the heat source device 12 can be generated The heat is quickly transferred to the second heat dissipation component 14, thereby improving the heat dissipation efficiency.
  • a liquid cooling tube 15 may also be provided in the terminal device.
  • the liquid cooling tube 15 includes any one of an ultra-thin heat pipe, an ultra-thin uniform heat pipe, or a loop heat pipe.
  • liquid cooling tube 15 may be fitted on the middle frame 11.
  • liquid cooling tube 15 may be attached to the middle frame 11 by means of gluing or welding.
  • a slot matching the shape of the liquid cooling tube 15 may be provided on the middle frame 11 and the liquid cooling tube 15 may be placed in the slot.
  • the slot may be a groove.
  • the liquid cooling tube 15 may be provided on one side of the middle frame 11 or on the other side of the middle frame 11.
  • FIGS. 3-4 the structure of the terminal device provided with the liquid cooling tube 15 Be explained.
  • FIG. 3 is a schematic structural diagram of another terminal device according to an embodiment of the present application.
  • 4 is a schematic structural diagram of yet another terminal device provided by an embodiment of the present application.
  • the liquid cooling tube 15 is disposed on the side of the middle frame 11 facing the first heat dissipation assembly 13.
  • the liquid cooling tube 15 may also be provided in close contact with the first heat dissipation component 13.
  • the heat source device 12 of the terminal device generates heat, and the heat source device 12 first transfers the heat to a portion of the middle frame 11 that is closer to the heat source device 12 (for example, a portion that is attached to the heat source device 12).
  • the middle frame 11 transfers the received heat inside the middle frame 11, and at the same time, the middle frame 11 also transfers the heat to one end of the first heat dissipation assembly 13 and the liquid cooling tube 15.
  • the liquid cooling tube 15 can quickly transfer the heat to the entire liquid cooling tube 15, so that the temperature is more evenly distributed throughout the liquid cooling tube 15.
  • the liquid cooling tube 15 can transfer heat to the part of the middle frame 11 that is attached to the liquid cooling tube 15, and the heat is transferred from this part to other parts of the middle frame 11 To make the temperature of each part in the terminal more uniform.
  • the liquid cooling tube 15 also transfers heat to the first heat dissipation assembly 13.
  • the first heat dissipation component 13 transfers the received heat inside the first heat dissipation component 13, and at the same time, the first heat dissipation component 13 also Transfer heat to the middle frame 11 or other components (such as display screen, housing, etc.).
  • the heat generated by the heat source device 12 can also be transferred to the second heat dissipation component 14.
  • the second heat dissipation component 14 receives the heat transferred by the heat source device 12, the second heat dissipation component 14 transfers the received heat inside the second heat dissipation component 14 At the same time, the second heat dissipation assembly 14 also transfers heat to the middle frame 11 or other components (such as a display screen, a housing, etc.).
  • the second heat dissipation component 14 may transfer heat to the middle frame 11, and the middle frame 11 may also transfer heat to the second heat dissipation component 14.
  • the projection of the liquid cooling tube 15 on the middle frame 11 and the projection of the heat source device 12 on the middle frame 11 have overlapping parts.
  • the heat source device 12 quickly transfers the heat to the area of the middle frame 11 directly opposite the heat source device 12 (hereinafter referred to as the first area), when the liquid cooling tube 15 is in the middle frame
  • the first area the area of the middle frame 11 directly opposite the heat source device 12
  • the projection on 11 and the projection of the heat source device 12 on the middle frame 11 have overlapping parts, part or all of the first area is also directly opposite to the liquid cooling tube 15, so that the heat in the first area is quickly transferred to the liquid cooling
  • the tube 15 further improves the heat dissipation efficiency.
  • the projection of the liquid cooling tube 15 on the middle frame 11 is within the projection of the first heat dissipation assembly 13 on the middle frame 11. That is, the length and width of the first graphene film in the horizontal direction are larger than the length and width of the liquid cooling tube 15.
  • the liquid cooling tube 15 can quickly transfer heat to the first heat dissipation component 13, so that the first The heat dissipation component 13 can quickly dissipate heat, thereby improving heat dissipation efficiency.
  • a part of the liquid cooling tube 15 is close to the heat source device 12, and another part of the liquid cooling tube 15 is far from the heat source device 12, wherein the part of the liquid cooling tube 15 near the heat source device 12 is smaller than the other part of the liquid cooling tube 15 away from the heat source device 12 portion.
  • a part of the liquid cooling tube 15 near the heat source device 12 may be an upper part of the liquid cooling tube 15, and another part of the liquid cooling tube 15 away from the heat source device 12 may be a lower part of the liquid cooling tube 15.
  • a part of the liquid cooling tube 15 close to the heat source device 12 may be a third of the upper part of the liquid cooling tube 15, and another part of the liquid cooling tube 15 far from the heat source device 12 may be a third of the lower part of the liquid cooling tube 15 The second part.
  • the liquid cooling tube 15 is disposed on the side of the middle frame 11 facing the second heat dissipation assembly 14.
  • the heat source device 12 of the terminal device generates heat, and the heat source device 12 first transfers the heat to a portion of the middle frame 11 that is closer to the heat source device 12 (for example, a portion that is attached to the heat source device 12).
  • the heat source device 12 can also transfer heat to one end of the liquid cooling tube 15.
  • the middle frame 11 transfers the received heat inside the middle frame 11, and at the same time, the middle frame 11 also transfers the heat to one end of the first heat dissipation assembly 13 and the liquid cooling tube 15.
  • the liquid cooling tube 15 After receiving heat at one end of the liquid cooling tube 15, the liquid cooling tube 15 can quickly transfer the heat to the entire liquid cooling tube 15, so that the temperature is more evenly distributed throughout the liquid cooling tube 15. Since the liquid cooling tube 15 is attached to the middle frame 11, the liquid cooling tube 15 can transfer heat to the portion of the middle frame 11 that is attached to the liquid cooling tube 15, and the heat is transferred from this location to other parts of the middle frame 11 , So that the temperature is more evenly distributed in the middle frame 11, and the middle frame 11 can also transfer the heat of various parts to the first heat dissipation component 13.
  • the first heat dissipation component 13 After the first heat dissipation component 13 receives the heat transferred by the middle frame 11, the first heat dissipation component 13 transfers the received heat inside the first heat dissipation component 13, and at the same time, the first heat dissipation component 13 also transfers the heat to the middle frame 11 Or other components (such as display screen, housing, etc.).
  • the middle frame 11 When heat is transferred inside a component (the middle frame 11, the first heat dissipation assembly 13, or the liquid cooling tube 15), the heat is transferred from the part with high temperature to the part with low temperature.
  • the first heat dissipation component 13 may transfer heat to the middle frame 11, and the middle frame 11 may also transfer heat to the first heat dissipation component 13.
  • the heat generated by the heat source device 12 can also be transferred to the second heat dissipation assembly 14, and at the same time, the heat in the liquid cooling tube 15 and the middle frame 11 can also be transferred to the second heat dissipation assembly 14.
  • the second heat dissipation component 14 transfers the received heat inside the second heat dissipation component 14, and at the same time, the second heat dissipation component 14 also transfers the heat to the middle frame 11 and the liquid cooling tube 15 Or other components (such as display screen, housing, etc.).
  • the middle frame 11 and the liquid cooling tube 15 heat can be transferred between the three.
  • the terminal device further includes a display screen, and the display screen is provided on the middle frame 11.
  • the display screen covers the first heat dissipation component 13.
  • the terminal device further includes a housing, which is disposed on the middle frame 11 and covers the second heat dissipation assembly 14.
  • the display screen covers the first heat dissipation component 13 and the second heat dissipation component 14.
  • a metal shield is wrapped on both sides of the heat source device 12.
  • the material of the metal shield can be copper alloy.
  • the metal shield can protect the heat source device 12.
  • the metal shield can reduce electromagnetic interference to the heat source device 12.
  • FIG. 5 is a schematic structural diagram of another terminal device according to an embodiment of the present application.
  • 6 is a schematic structural diagram of yet another terminal device provided by an embodiment of the present application.
  • the terminal device includes a display screen 16, a first heat dissipation component 13, a liquid cooling tube 15, a middle frame 11, a printed circuit board (Printed Circuit Board, PCB) board 19, a heat source device 12, a metal shield 18, Second heat dissipation component 14 and rear case 17.
  • a groove is provided on the front surface (one side) of the middle frame 11, and the shape of the groove is consistent with the shape of the liquid cooling tube 15.
  • the liquid cooling tube 15 is provided in this groove.
  • the first heat dissipation component 13 is disposed on the front surface of the middle frame 11, the liquid cooling tube 15 is disposed between the first heat dissipation component 13 and the middle frame 11, and the first heat dissipation component 13 covers the liquid cooling tube 15.
  • the display screen 16 is disposed on the front of the middle frame 11, the first heat dissipation component 13 is disposed between the middle frame 11 and the display screen 16, and the display screen 16 covers the first heat dissipation component 13.
  • the back side (the other side) of the middle frame 11 is provided with a PCB board 19, and a heat source device 12 is provided on the PCB board 19, and the heat source device 12 may be a device such as a processor.
  • Metal shields 18 are provided on both sides of the PCB 19 respectively.
  • the second heat dissipation component 14 is disposed on the back of the middle frame 11, and the second heat dissipation component 14 is provided with an escape hole to facilitate the installation of each device in the PCB board 19.
  • the rear case 17 is provided on the back of the middle frame 11, the second heat dissipation assembly 14 is provided between the middle frame 11 and the rear case 17, and the rear case 17 covers the second heat dissipation assembly 14.
  • a battery may be provided on the lower side of the PCB board 19, a battery may be provided.
  • the PCB board 19 may also be called a printed circuit board.
  • the circuit board may be a hard board, a flexible circuit board, or a combination of both.
  • the circuit board is a single-layer circuit board or a multi-layer circuit board. Traces and pad patterns are usually provided on the circuit board, so that electronic components are arranged on the circuit board.
  • the heat source device 12 when the terminal device is running, the heat source device 12 generates heat, and the heat is transferred to the middle frame 11.
  • the middle frame 11 transfers heat to the liquid cooling tube 15 and the first heat dissipation assembly 13.
  • the first heat dissipation component 13 can also transfer heat to the display screen 16, and the display screen 16 can radiate the heat to the air.
  • the middle frame 11 and / or the heat source device 12 transfer heat to the second heat dissipation assembly 14, and the second heat dissipation assembly 14 transfers the heat to the rear case 17, and the heat is dissipated to the air by the rear case 17 in.
  • At least one of the first heat dissipation component 13 and the second heat dissipation component 14 is a graphene heat dissipation component. Since the heat transfer performance of the graphene heat dissipation component and the liquid cooling tube 15 is good, the graphene heat dissipation component and the liquid The cold pipe 15 can quickly transfer the heat generated by the heat source device 12, which not only improves the heat dissipation efficiency of the terminal equipment, but also makes the heat distribution in the terminal equipment more uniform.
  • heat transfer direction can refer to the direction indicated by the arrow in FIG. 5.
  • the terminal device includes a display screen 16, a first heat dissipation component 13, a middle frame 11, a hot and cold tube, a PCB board 19, a heat source device 12, a second heat dissipation component 14, and a rear case 17.
  • the front side (one side) of the middle frame 11 is provided with a first heat dissipation component 13 and a display screen 16, the first heat dissipation component 13 is provided between the display screen 16 and the middle frame 11, and the display screen 16 covers the middle frame 11.
  • a groove is provided on the back (the other side) of the middle frame 11, and the shape of the groove is consistent with the shape of the liquid cooling tube 15.
  • the liquid cooling tube 15 is provided in this groove.
  • the PCB board 19 is provided on the back of the middle frame 11, the liquid cooling tube 15 is provided between the middle frame 11 and the PCB board 19, and the PCB board 19 covers the liquid cooling tube 15.
  • the second heat dissipation component 14 is disposed on the back of the middle frame 11, and the PCB board 19 is disposed between the middle frame 11 and the second heat dissipation component 14.
  • the second heat dissipation component 14 is provided with an escape hole to facilitate the device of the PCB board 19 installation.
  • the rear case 17 is provided on the back of the middle frame 11, the second heat dissipation assembly 14 is provided between the rear case 17 and the middle frame 11, and the rear case 17 covers the second heat dissipation assembly 14.
  • a battery may be provided on one side of the PCB board 19 in the width direction.
  • the heat source device 12 when the terminal device is running, the heat source device 12 generates heat, and the heat is transferred to the middle frame 11.
  • the middle frame 11 transfers heat to the first heat dissipation component 13.
  • the first heat dissipation component 13 can also transfer heat to the display screen 16, and the display screen 16 can radiate the heat to the air.
  • the heat source device 12 can transfer heat to the liquid cooling tube 15 and the second heat dissipation assembly 14, the second heat dissipation assembly 14 transfers the heat to the rear case 17, and the heat is dissipated to the air by the rear case 17 in.
  • At least one of the first heat dissipation component 13 and the second heat dissipation component 14 is a graphene heat dissipation component. Since the heat transfer performance of the graphene heat dissipation component and the liquid cooling tube 15 is good, the graphene heat dissipation component and the liquid The cold pipe 15 can quickly transfer the heat generated by the heat source device 12, which not only improves the heat dissipation efficiency of the terminal equipment, but also makes the heat distribution in the terminal equipment more uniform.
  • the terminal device may have a rectangular parallelepiped structure or a sliding structure, for example, including a fixed part and a sliding part, or the terminal device adopts a foldable structure, for example, including a fixed part and a foldable part, then ,
  • the whole of the above-mentioned middle frame 11, the first heat dissipation component 13, the second heat dissipation component 14, the heat source device 12, the circuit board, etc. may be provided in a part of the terminal device, or may be provided in multiple parts separately. Do restrictions.
  • the heat of the heat source device 12 can be quickly transferred through the liquid cooling tube 15 in the height direction of the terminal device Open, and then spread through the middle frame 11, the first heat dissipation component 13 and the second heat dissipation component 14 in the horizontal direction, so that the heat distribution in the terminal device is more uniform, and the speed of temperature rise is slowed.
  • the user experience is better.
  • first heat dissipation component or the second heat dissipation component is a graphene heat dissipation component
  • first heat dissipation component is a graphene heat dissipation component and the second heat dissipation component Among them, the graphene heat dissipation component, or both the first heat dissipation component and the second heat dissipation component are graphene heat dissipation components.
  • graphite film mentioned in this article can also be called graphite thermal conductive sheet, graphite heat dissipating film, and thermal conductive graphite sheet.

Abstract

本申请实施例提供一种终端设备，包括：中框、热源器件、第一散热组件和第二散热组件，其中，第一散热组件设置在中框的一侧，热源器件和第二散热组件设置在中框的另一侧；第一散热组件或第二散热组件中的至少一个为石墨烯散热组件。提高了终端设备的散热效率。

Description

终端设备 技术领域
本申请涉及电子技术领域，尤其涉及一种终端设备。
背景技术
目前，很多终端设备(例如，手机、平板电脑等)中设置有高运算性能的处理模块(例如，处理器等)，在处理模块工作过程中，产生大量热量。
处理模块产生的热量不但影响处理模块以及电子设备中其它部件的性能，还使得用户的使用体验差。在现有技术中，通常在电子设备中设置多层石墨膜，通过多层石墨膜散发处理模块产生的热量。多层石墨膜之间通常采用双面胶黏贴，由于双面胶的导热性能差，使得多层石墨膜的导热性能差，进而导致多层石墨膜对终端设备的散热效果差。
发明内容
本申请提供一种终端设备，提高了终端设备的散热效率。
本申请实施例提供一种终端设备包括：中框、热源器件、第一散热组件和第二散热组件，其中，第一散热组件设置在中框的一侧，热源器件和第二散热组件设置在中框的另一侧；第一散热组件或第二散热组件中的至少一个为石墨烯散热组件。
由于终端设备中包括至少一个石墨烯散热组件，由于石墨烯散热组件的热传递性能较好，使得石墨烯散热组件可以快速的对热源器件产生的热量进行传递，不但提高了终端设备的散热效率，还可以使得热量在终端设备中的分布更加均匀。由于石墨烯散热组件的厚度较小，使得第一散热组件或者第二散热组件占用终端设备中较少的空间，进而使得终端设备的厚度较小。
在一种可能的实施方式中，热源器件在中框上的投影与第一散热组件在中框上的投影具有重合部分。
在一种可能的实施方式中，热源器件在中框上的投影位于第一散热组件在中框上的投影之内。
在实际应用过程中，在热源器件产生热量之后，热源器件快速将热量传递至中框中与热源器件正对的区域(下文简称第一区域)，当热源器件在中框上的投影与第一散热组件在中框上的投影具有重合部分时，第一区域中的部分或全部还与第一散热组件正对，以使第一区域中的热量快速传递至第一散热部件，进而提高了散热效率。
在一种可能的实施方式中，热源器件在中框上的投影与第二散热组件在中框上的投影具有重合部分。
在一种可能的实施方式中，热源器件在中框上的投影位于第二散热组件在中框上的投影之内。
在实际应用过程中，在热源器件产生热量之后，当热源器件在中框上的投影与第二散 热组件在中框上的投影具有重合部分时，则可以使得热源器件产生的热量快速传递至第二散热组件，进而提高了散热效率。
在一种可能的实施方式中，石墨烯散热组件为单层石墨烯膜。单层石墨烯膜的厚度较小，使得第一散热组件或第二散热组件占用终端设备较少的空间，进而使得终端设备的厚度较小。
在一种可能的实施方式中，单层石墨烯膜中至少复合如下一种导热材料：铜、碳纤维。
在一种可能的实施方式中，石墨烯散热组件上设置有避让孔。这样，便于终端设备内部元器件的安装。
在一种可能的实施方式中，终端设备还包括：液冷管，液冷管贴合设置在中框上。液冷管可以对热量进行快速传递，进而提高散热效率。进一步的，通过液冷管的温度传递，可以使得终端设备中的温度分布更加均匀。
在一种可能的实施方式中，液冷管在中框上的投影与热源器件在中框上的投影具有重合部分。
在实际应用过程中，在热源器件产生热量之后，热源器件快速将热量传递至中框中与热源器件正对的区域(下文简称第一区域)，当液冷管在中框上的投影与热源器件在中框上的投影具有重合部分时，第一区域中的部分或全部还与液冷管正对，以使第一区域中的热量快速传递至液冷管，进而提高了散热效率。
在一种可能的实施方式中，液冷管在中框上的投影位于第一散热组件在中框上的投影之内。
在液冷管在中框上的投影位于第一散热组件在中框上的投影之内时，可以使得液冷管快速将热量传递至第一散热组件，以使第一散热组件可以快速对热量进行发散，进而提高了散热效率。
在一种可能的实施方式中，液冷管设置在中框朝向第一散热组件的一侧上，液冷管还与第一散热组件贴合设置。
液冷管与第一散热组件贴合设置，可以使得液冷管快速将热量传递至第一散热组件，提高了散热效率。
在一种可能的实施方式中，液冷管设置在中框朝向第二散热组件的一侧上。
在一种可能的实施方式中，液冷管包括超薄热管、超薄均热管或者环路热管中任意一种。
在一种可能的实施方式中，液冷管容纳在中框上设置的与液冷管形状相匹配的开槽中。这样，不但可以提高热冷管与中框的接触面积，使得液冷管快速将热量传递至中框，还可以更加牢固的固定液冷管。
在一种可能的实施方式中，液冷管的一部分靠近热源器件，液冷管的另一部分远离热源器件，其中，液冷管靠近热源器件的部分小于液冷管远离热源器件的另一部分。
在一种可能的实施方式中，第一散热组件和第二散热组件的厚度不相同。
在一种可能的实施方式中，第一散热组件或第二散热组件的厚度为42微米。由于第一散热组件或者第二散热组件的厚度较小，使得第一散热组件或第二散热组件占用终端设备较少的空间，进而使得终端设备的厚度较小。
在一种可能的实施方式中，终端设备还包括显示屏，显示屏设置在中框上。
在一种可能的实施方式中，显示屏覆盖第一散热组件。
在一种可能的实施方式中，终端设备还包括壳体，壳体设置在中框上，壳体覆盖第二散热组件。壳体可以对终端设备进行保护。
在一种可能的实施方式中，显示屏覆盖第一散热组件和第二散热组件。
在一种可能的实施方式中，热源器件的两侧包裹有金属蔽罩。金属屏蔽罩可以减少其它部件对热源器件的电磁干扰。
本申请实施例提供的终端设备中框、热源器件、第一散热组件和第二散热组件，其中，第一散热组件设置在中框的一侧，热源器件和第二散热组件设置在中框的另一侧；第一散热组件或第二散热组件中的至少一个为石墨烯散热组件。由于终端设备中包括至少一个石墨烯散热组件，由于石墨烯散热组件的热传递性能较好，使得石墨烯散热组件可以快速的对热源器件产生的热量进行传递，不但提高了终端设备的散热效率，还可以使得热量在终端设备中的分布更加均匀。由于石墨烯散热组件的厚度较小，使得第一散热组件或者第二散热组件占用终端设备中较少的空间，进而使得终端设备的厚度较小。
附图说明
图1为本申请实施例提供的一种终端设备的结构示意图；
图2A为本申请实施例提供的一种投影示意图；
图2B为本申请实施例提供的另一种投影示意图；
图3为本申请实施例提供的另一种终端设备的结构示意图；
图4为本申请实施例提供的又一种终端设备的结构示意图；
图5为本申请实施例提供的另一种终端设备的结构示意图；
图6为本申请实施例提供的再一种终端设备的结构示意图。
具体实施方式
下面结合本申请实施例中的附图对本申请实施例进行描述。
从本领域技术人员的理解来说，石墨是元素碳的一种同素异形体，石墨具有良好的导电导热性。人们常见的石墨是由一层层以蜂窝状有序排列的平面碳原子堆叠而形成，石墨的层间作用力较弱，很容易互相剥离，形成薄薄的石墨片。
当把石墨片剥成单层之后，这种只有一个碳原子厚度的单层就是石墨烯。研究表明，石墨烯具有超高的导热性能。在理想的条件下，石墨烯的导热系数高达5300W/m·K，是铜的十几倍。
本申请实施例提供了一种利用石墨烯散热的终端设备，该终端设备可以是：手机、平板电脑、电子阅读器、笔记本电脑、车载设备、可穿戴设备等。在终端设备中设置有石墨烯散热组件，由于石墨烯散热组件的热传递性能较好，使得石墨烯散热组件可以快速的对热源器件产生的热量进行传递，不但提高了终端设备的散热效率，还可以使得热量在终端设备中的分布更加均匀。由于石墨烯散热组件的厚度较小，使得第一散热组件或者第二散热组件占用终端设备中较少的空间，进而使得终端设备的厚度较小。
下面，通过具体实施例对本申请所示的终端设备的结构进行详细说明。需要说明的是，下面几个实施例可以单独存在，也可以相互结合，对于相同或相似的内容，在不同的实施例中不再进行重复说明。
图1为本申请实施例提供的一种终端设备的结构示意图。请参见图1，终端设备可以包括中框11、热源器件12、第一散热组件13和第二散热组件14，其中，第一散热组13件设置在中框11的一侧，热源器件12和第二散热组14件设置在中框11的另一侧；第一散热组件13或第二散热组件14中的至少一个为石墨烯散热组件。
中框11可以为终端设备的框架结构，终端设备的其它部分或全部元器件可以直接或间接设置在该中框11上，以形成终端设备。
可选的，中框11可以设置在终端设备的内部，中框11的边缘可以设计成为终端设备的外壳的一部分。中框11的边缘作为终端设备的外壳时，可以起到保护终端设备的作用。
可选的，中框11可以具有平面或类似于平面的结构，因此，可以从视觉上区分出中框11的两个侧面，该两个侧面可以称为中框11的正面和背面，或者，该两个侧面也可以称为中框11一侧和另一侧。在中框11的内部，可以根据需要进行部分镂空，以便设置所述终端设备中的其它元器件。
可选的，中框11的部分或全部可以采用金属或合金材料(例如，铝合金)制成。当然，中框11的材质还可以为其它，本申请实施例对此不作具体限定。
在本申请实施例中，热源器件12是指终端设备中辐射热量较多的器件。
在实际应用过程中，元器件辐射的热量通常与元器件的功率消耗正相关，元器件的功率消耗越大，元器件辐射的热量越大。相应的，本申请中的热源器件12可以为终端设备中功率消耗超过整机功耗M％的器件，M可以为30，40等。
可选的，热源器件12可以包括处理器、集成了处理与存储功能的处理器件、供电部件(例如电池)等。当然，热源器件12还可以为其它，本申请实施例对此不作具体限定。
可选的，第一散热组件13和第二散热组件14可以均为石墨烯散热组件。或者，第一散热组件13为石墨烯散热组件，第二散热组件14为多层石墨散热组件。或者，第一散热组件13为多层石墨散热组件，第二散热组件14为石墨烯散热组件。
可选的，石墨烯散热组件可以为片状结构。
可选的，第一散热组件13和第二散热组件14的厚度不相同。
可选的，第一散热组件13或第二散热组件14的厚度大于等于40微米，可选的，为42微米。
在实际应用过程中，可以根据实际需要在石墨烯散热组件上设置有避让孔，以便于终端设备中其它元器件的安装。可选的，根据终端设备内部的空间需要，第一散热组件13或第二散热组件14可以任意弯曲。
可选的，石墨烯散热组件可以为单层石墨烯膜。该单层石墨烯膜中还可以至少复合如下一种导热材料：铜、碳纤维。当然，在实际应用过程中，单层石墨烯膜中还可以复合其它导热材料。
在本申请实施例中，中框11的一侧和中框11的另一侧正对。可选的，中框11的一侧可以为中框11的正面，中框11的另一侧可以为中框11的背面。
可选的，热源器件12与中框11部件或全部贴合设置。例如，热源器件12可以固定设置在中框11上；或者，热源器件12可以设置在其它部件(例如，电路板等)上，并将其它部件设置在中框11上，以使热源器件12和中框11部分或全部贴合。
可选的，热源器件12设置在中框11和第二散热组件14之间。热源器件12与第二散热组件14可以部分或者全部贴合。
可选的，第一散热组件13可以与中框11部分或全部贴合设置。
下面，对图1实施例所示的终端设备的散热过程进行说明。
在终端设备运行的过程中，终端设备的热源器件12产生热量，热源器件12产生的热量以热源器件12为球心，沿球的各个半径进行扩散。由于中框11与热源器件12的距离较近，因此，热源器件12产生的热量可以快速传递至中框11中与热源器件12距离较近的部位(例如与热源器件12贴合的部位)。中框11对接收到的热量在中框11内部传递，同时，中框11还将热量传递至第一散热组件13。在第一散热组件13接收到中框11传递的热量后，第一散热组件13对接收到的热量在第一散热组件13内部传递，同时，第一散热组件13还将热量传递至中框11或其它部件(例如显示屏、壳体等)。其中，热量在一个部件(中框11或者第一散热组件13)内部传递时，热量从部件中温度高的部位传递至温度低的部位。在热量在第一散热部件和中框11中进行传递时，第一散热组件13可能将热量传递至中框11，中框11也可能将热量传递至第一散热组件13。
热源器件12产生的热量还可以传递至第二散热组件14，在第二散热组件14接收到热源器件12传递的热量时，第二散热组件14对接收到的热量在第二散热组件14内部传递，同时，第二散热组件14还将热量传递至中框11或其它部件(例如显示屏、壳体等)。可选的，在热量在第二散热部件和中框11中进行传递时，第二散热组件14可能将热量传递至中框11，中框11也可能将热量传递至第二散热组件14。
本申请实施例提供的终端设备中框11、热源器件12、第一散热组件13和第二散热组件14，其中，第一散热组件13设置在中框11的一侧，热源器件12和第二散热组件14设置在中框11的另一侧；第一散热组件13或第二散热组件14中的至少一个为石墨烯散热组件。由于终端设备中包括至少一个石墨烯散热组件，由于石墨烯散热组件的热传递性能较好，使得石墨烯散热组件可以快速的对热源器件12产生的热量进行传递，不但提高了终端设备的散热效率，还可以使得热量在终端设备中的分布更加均匀。由于石墨烯散热组件的厚度较小，使得第一散热组件13或者第二散热组件14占用终端设备中较少的空间，进而使得终端设备的厚度较小。
在上述任意一个实施例的基础上，可选的，热源器件12在中框11上的投影与第一散热组件13在中框11上的投影具有重合部分。
下面，结合图2A-图2B，对热源器件12在中框11上的投影，以及第一散热组件13在中框11上的投影进行详细说明。
图2A为本申请实施例提供的一种投影示意图。图2B为本申请实施例提供的另一种投影示意图。
请参见图2A，第一散热部件在中框11上的投影为A1，热源器件12在中框11上的投影为A2。其中，热源器件12在中框11上的投影A2的一部分与第一散热组件13在中框 11上的投影A1的一部分重合。
请参见图2B，第一散热部件在中框11上的投影为B1，热源器件12在中框11上的投影为B2。其中，热源器件12在中框11上的投影B2位于第一散热组件13在中框11上的投影B1之内。
在实际应用过程中，在热源器件12产生热量之后，热源器件12快速将热量传递至中框11中与热源器件12正对的区域(下文简称第一区域)，当热源器件12在中框11上的投影与第一散热组件13在中框11上的投影具有重合部分时，第一区域中的部分或全部还与第一散热组件13正对，以使第一区域中的热量快速传递至第一散热部件，进而提高了散热效率。
在上述任意一个实施例的基础上，可选的，热源器件12在中框11上的投影与第二散热组件14在中框11上的投影具有重合部分。
可选的，热源器件12在中框11上的投影位于第二散热组件14在中框11上的投影之内。
需要说明的是，热源器件12在中框11上的投影，以及第二散热组件14在中框11上的投影可以参见图2A和图2B，此处不再进行赘述。
在实际应用过程中，在热源器件12产生热量之后，当热源器件12在中框11上的投影与第二散热组件14在中框11上的投影具有重合部分时，则可以使得热源器件12产生的热量快速传递至第二散热组件14，进而提高了散热效率。
在上述任意一个实施例的基础上，可选的，为了提高散热效率以及使得终端设备中温度分布更加均匀，还可以在终端设备中设置液冷管15。
可选的，液冷管15包括超薄热管、超薄均热管或者环路热管中任意一种。
可选的，液冷管15可以贴合设置在中框11上。
可选的，可以通过胶粘或者焊接等方式，将液冷管15贴合设置在中框11上。
例如，可以在中框11上设置与液冷管15形状相匹配的开槽中，并将液冷管15设置在该开槽中。该开槽可以为凹槽。
可选的，液冷管15可以设置在中框11的一侧，也可以设置在中框11的另一侧，下面，结合图3-图4，对设置液冷管15的终端设备的结构进行说明。
图3为本申请实施例提供的另一种终端设备的结构示意图。图4为本申请实施例提供的又一种终端设备的结构示意图。
请参见图3，液冷管15设置在中框11朝向第一散热组件13的一侧上。可选的，液冷管15还可以与第一散热组件13贴合设置。
下面，对图3实施例所示的终端设备的散热过程进行说明。
在终端设备运行的过程中，终端设备的热源器件12产生热量，热源器件12首先将热量传递至中框11中与热源器件12距离较近的部位(例如与热源器件12贴合的部位)。中框11对接收到的热量在中框11内部传递，同时，中框11还将热量传递至第一散热组件13和液冷管15的一端。在液冷管15的一端接收到热量后，液冷管15可以迅速将热量传递至整个液冷管15，使得温度在整个液冷管15中较为均匀的分布。由于液冷管15与中框11贴合，因此，液冷管15可以将热量传递至中框11中与液冷管15贴合的部位，热量并从该 部位传递至中框11的其它部位，使得终端中各部位的温度较为均匀。同时，液冷管15还将热量传递至第一散热组件13。在第一散热组件13接收到中框11和/或液冷管15传递的热量之后，第一散热组件13对接收到的热量在第一散热组件13内部传递，同时，第一散热组件13还将热量传递至中框11或其它部件(例如显示屏、壳体等)。其中，热量在一个部件(中框11、第一散热组件13或液冷管15)内部传递时，热量从部件中温度高的部位传递至温度低的部位。在热量在第一散热部件、中框11和液冷管15中进行传递时，热量可以在该三者之间进行传递。
热源器件12产生的热量还可以传递至第二散热组件14，在第二散热组件14接收到热源器件12传递的热量时，第二散热组件14对接收到的热量在第二散热组件14内部传递，同时，第二散热组件14还将热量传递至中框11或其它部件(例如显示屏、壳体等)。可选的，在热量在第二散热部件和中框11中进行传递时，第二散热组件14可能将热量传递至中框11，中框11也可能将热量传递至第二散热组件14。
可选的，液冷管15在中框11上的投影与热源器件12在中框11上的投影具有重合部分。
在实际应用过程中，在热源器件12产生热量之后，热源器件12快速将热量传递至中框11中与热源器件12正对的区域(下文简称第一区域)，当液冷管15在中框11上的投影与热源器件12在中框11上的投影具有重合部分时，第一区域中的部分或全部还与液冷管15正对，以使第一区域中的热量快速传递至液冷管15，进而提高了散热效率。
可选的，液冷管15在中框11上的投影位于第一散热组件13在中框11上的投影之内。即，第一石墨烯膜在水平方向的长度和宽度均大于所述液冷管15的长度和宽度。
在液冷管15在中框11上的投影位于第一散热组件13在中框11上的投影之内时，可以使得液冷管15快速将热量传递至第一散热组件13，以使第一散热组件13可以快速对热量进行发散，进而提高了散热效率。
可选的，液冷管15的一部分靠近热源器件12，液冷管15的另一部分远离热源器件12，其中，液冷管15靠近热源器件12的部分小于液冷管15远离热源器件12的另一部分。
例如，请参见图3，液冷管15靠近热源器件12的一部分可以为液冷管15的上部分，液冷管15远离热源器件12的另一部分可以为液冷管15的下部分。
例如，液冷管15靠近热源器件12的一部分可以为液冷管15上边的三分之一的部分，液冷管15远离热源器件12的另一部分可以为液冷管15的下边的三分之二的部分。
请参见图4，液冷管15设置在中框11朝向第二散热组件14的一侧上。
下面，对图4实施例所示的终端设备的散热过程进行说明。
在终端设备运行的过程中，终端设备的热源器件12产生热量，热源器件12首先将热量传递至中框11中与热源器件12距离较近的部位(例如与热源器件12贴合的部位)。可选的，若热源器件12的一端与液冷管15的一端贴合，则热源器件12还可以将热量传递至液冷管15的一端。中框11对接收到的热量在中框11内部传递，同时，中框11还将热量传递至第一散热组件13和液冷管15的一端。在液冷管15的一端接收到热量后，液冷管15可以迅速将热量传递至整个液冷管15，使得温度在整个液冷管15中较为均匀的分布。由于液冷管15与中框11贴合，因此，液冷管15可以将热量传递至中框11中与液冷管15 贴合的部位，热量并从该部位传递至中框11的其它部位，使得温度在中框11中较为均匀的分布，中框11还可以将各个部位的热量传递至第一散热组件13。在第一散热组件13接收到中框11传递的热量之后，第一散热组件13对接收到的热量在第一散热组件13内部传递，同时，第一散热组件13还将热量传递至中框11或其它部件(例如显示屏、壳体等)。其中，热量在一个部件(中框11、第一散热组件13或液冷管15)内部传递时，热量从部件中温度高的部位传递至温度低的部位。在热量在第一散热部件和中框11中进行传递时，第一散热组件13可能将热量传递至中框11，中框11也可能将热量传递至第一散热组件13。
热源器件12产生的热量还可以传递至第二散热组件14，同时，液冷管15和中框11中的热量也可以传递至第二散热组件14。在第二散热组件14接收到热量后，第二散热组件14对接收到的热量在第二散热组件14内部传递，同时，第二散热组件14还将热量传递至中框11、液冷管15或其它部件(例如显示屏、壳体等)。在热量在第二散热部件、中框11和液冷管15中进行传递时，热量可以在该三者之间进行传递。
在上述任意一个实施例的基础上，可选的，终端设备还包括显示屏，显示屏设置在中框11上。
可选的，显示屏覆盖第一散热组件13。终端设备还包括壳体，壳体设置在中框11上，壳体覆盖第二散热组件14。
可选的，显示屏覆盖第一散热组件13和第二散热组件14。
在上述任意一个实施例的基础上，可选的，热源器件12的两侧包裹有金属屏蔽罩。例如，金属屏蔽罩的材质可以为铜合金。
金属屏蔽罩可以对热源器件12起到保护作用。例如，金属屏蔽罩可以减小对热源器件12的电磁干扰。
在上述任意一个实施例的基础上，下面，结合图5-图6，对终端设备的结构进行详细说明。
图5为本申请实施例提供的另一种终端设备的结构示意图。图6为本申请实施例提供的再一种终端设备的结构示意图。
请参见图5，终端设备包括显示屏16、第一散热组件13、液冷管15、中框11、印制电路板(Printed Circuit Board，PCB)板19、热源器件12、金属屏蔽罩18、第二散热组件14和后壳17。
在中框11的正面(一侧)设置有凹槽，凹槽的形状与液冷管15的形状一致。液冷管15设置在该凹槽中。第一散热组件13设置在中框11的正面，液冷管15设置在第一散热组件13和中框11之间，且第一散热组件13覆盖液冷管15。显示屏16设置在中框11的正面，第一散热组件13设置在中框11和显示屏16之间，且显示屏16覆盖第一散热组件13。
中框11的背面(另一侧)设置有PCB板19，PCB板19上设置有热源器件12，热源器件12可以为处理器等器件。PCB板19的两侧分别设置有金属屏蔽罩18。第二散热组件14设置在中框11的背面，第二散热组件14上设置有避让孔，以便于PCB板19中各器件的安装。后壳17设置在中框11的背面，第二散热组件14设置在中框11和后壳17之间，且后壳17覆盖第二散热组件14。可选的，在PCB板19的下侧，可以设置有电池。
可选的，PCB板19也可以称为印刷线路板。电路板可以是硬板，柔性电路板，或者两 者的组合。电路板为单层电路板或多层电路板。在电路板上通常设置有走线和焊盘图案，以便将电子元件设置到电路板上。
在实际应用过程中，在终端设备运行时，热源器件12产生热量，热量传递至中框11。沿着中框11的正面，中框11将热量传递至液冷管15和第一散热组件13。第一散热组件13还可以将热量传递至显示屏16，并由显示屏16将热量散发至空气中。沿着中框11的背面，中框11和/或热源器件12将热量传递至第二散热组件14，第二散热组件14将热量传递至后壳17，并由后壳17将热量发散至空气中。在上述过程中，第一散热组件13和第二散热组件14中的至少一个为石墨烯散热组件，由于石墨烯散热组件和液冷管15的热传递性能较好，使得石墨烯散热组件和液冷管15可以快速的对热源器件12产生的热量进行传递，不但提高了终端设备的散热效率，还可以使得热量在终端设备中的分布更加均匀。
需要说明的是，热量的传递方向可以参照图5中箭头所示的方向。
请参见图6，终端设备包括显示屏16、第一散热组件13、中框11、热冷管、PCB板19、热源器件12、第二散热组件14和后壳17。
中框11的正面(一侧)设置有第一散热组件13和显示屏16，第一散热组件13设置在显示屏16和中框11之间，且显示屏16覆盖中框11。
在中框11的背面(另一侧)设置有凹槽，凹槽的形状与液冷管15的形状一致。液冷管15设置在该凹槽中。PCB板19设置在中框11的背面，液冷管15设置在中框11和PCB板19之间，且PCB板19覆盖液冷管15。第二散热组件14设置在中框11的背面，PCB板19设置在中框11和第二散热组件14之间，第二散热组件14上设置有避让孔，以便于PCB板19中各器件的安装。后壳17设置在中框11的背面，第二散热组件14设置在后壳17和中框11之间，后壳17覆盖第二散热组件14。可选的，在PCB板19的宽度方向的一侧还可以设置电池。
在实际应用过程中，在终端设备运行时，热源器件12产生热量，热量传递至中框11。沿着中框11的正面，中框11将热量传递至第一散热组件13。第一散热组件13还可以将热量传递至显示屏16，并由显示屏16将热量散发至空气中。沿着中框11的背面，热源器件12可以将热量传递至液冷管15和第二散热组件14，第二散热组件14将热量传递至后壳17，并由后壳17将热量发散至空气中。在上述过程中，第一散热组件13和第二散热组件14中的至少一个为石墨烯散热组件，由于石墨烯散热组件和液冷管15的热传递性能较好，使得石墨烯散热组件和液冷管15可以快速的对热源器件12产生的热量进行传递，不但提高了终端设备的散热效率，还可以使得热量在终端设备中的分布更加均匀。
本申请实施例中，终端设备可以为长方体的结构，也可以采用滑动的结构，例如，包括固定部分和滑动部分，或者终端设备采用可折叠结构，例如，包括固定部分和可折叠的部分，那么，上述中框11，第一散热组件13，第二散热组件14，热源器件12，电路板等构成的整体可以设置在所述终端设备的一部分，或者在多个部分中分别设置，对此不做限制。
采用本发明实施例的终端设备，利用第一散热组件13、第二散热组件14和液冷管15的组合，热源器件12的热量可以快速地通过液冷管15沿这终端设备的高度方向传递开，然后通过中框11、第一散热组件13和第二散热组件14向水平方向扩散开，从而使得热量在终端设备内的分布更均匀，温度上升的速度减慢。对于高耗能的场景使用，例如游戏等，用户 体验更好。
需要说明的是，本文中“所述第一散热组件或所述第二散热组件中的至少一个为石墨烯散热组件”包括所述第一散热组件为石墨烯散热组件、所述第二散热组件中为石墨烯散热组件、或所述第一散热组件和所述第二散热组件中均为石墨烯散热组件。
需要说明的是，本文中的“第一”、“第二”仅用于区分，不限定先后顺序。
需要说明的是，本文中提到的“石墨膜”又可以称为石墨导热片，石墨散热膜，导热石墨片。
以上所述，仅为本发明的具体实施方式，但本发明的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本发明揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本发明的保护范围之内；在不冲突的情况下，本申请的实施方式及实施方式中的特征可以相互组合。因此，本发明的保护范围应以所述权利要求的保护范围为准。

Claims (20)

  1. 一种终端设备，其特征在于，包括：中框、热源器件、第一散热组件和第二散热组件，液冷管，其中，
    所述第一散热组件设置在所述中框的一侧，所述热源器件和所述第二散热组件设置在所述中框的另一侧；
    所述第一散热组件或所述第二散热组件中的至少一个为石墨烯散热组件；
    所述液冷管贴合设置在所述中框上，所述液冷管在所述中框上的投影与所述热源器件在所述中框上的投影具有重合部分，所述液冷管在所述中框上的投影位于所述第一散热组件在所述中框上的投影之内。
  2. 根据权利要求1所述的终端设备，其特征在于，所述热源器件在所述中框上的投影与所述第一散热组件在所述中框上的投影具有重合部分。
  3. 根据权利要求1或2所述的终端设备，其特征在于，所述热源器件在所述中框上的投影位于所述第一散热组件在所述中框上的投影之内。
  4. 根据权利要求1至3任一项所述的终端设备，其特征在于，所述热源器件在所述中框上的投影与所述第二散热组件在所述中框上的投影具有重合部分。
  5. 根据权利要求1至4任一项所述的终端设备，其特征在于，所述热源器件在所述中框上的投影位于所述第二散热组件在所述中框上的投影之内。
  6. 根据权利要求1至5任一项所述的终端设备，其特征在于，所述石墨烯散热组件为单层石墨烯膜。
  7. 根据权利要求6所述的终端设备，其特征在于，所述单层石墨烯膜中至少复合如下一种导热材料：铜、碳纤维。
  8. 根据权利要求1至7任一项所述的终端设备，其特征在于，所述石墨烯散热组件上设置有避让孔。
  9. 根据权利要求1所述的终端设备，其特征在于，所述液冷管设置在所述中框朝向所述第一散热组件的一侧上，所述液冷管还与所述第一散热组件贴合设置。
  10. 根据权利要求1所述的终端设备，其特征在于，所述液冷管设置在所述中框朝向所述第二散热组件的一侧上。
  11. 根据权利要求1所述的终端设备，其特征在于，所述液冷管包括超薄热管、超薄均热管或者环路热管中任意一种。
  12. 根据权利要求1所述的终端设备，其特征在于，所述液冷管容纳在所述中框上设置的与所述液冷管形状相匹配的开槽中。
  13. 根据权利要求1所述的终端设备，其特征在于，所述液冷管的一部分靠近所述热源器件，所述液冷管的另一部分远离所述热源器件，其中，所述液冷管靠近热源器件的部分小于所述液冷管远离所述热源器件的另一部分。
  14. 根据权利要求1至13任一项所述的终端设备，其特征在于，所述第一散热组件和所述第二散热组件的厚度不相同。
  15. 根据权利要求1至13任一项所述的终端设备，其特征在于，所述第一散热组件或所述第二散热组件的厚度为42微米。
  16. 根据权利要求1-15任一项所述的终端设备，其特征在于，所述终端设备还包括显示屏，所述显示屏设置在所述中框上。
  17. 根据权利要求16所述的终端设备，其特征在于，所述显示屏覆盖所述第一散热组件。
  18. 根据权利要求17所述的终端设备，其特征在于，所述终端设备还包括壳体，所述壳体设置在所述中框上，所述壳体覆盖所述第二散热组件。
  19. 根据权利要求16所述的终端设备，其特征在于，所述显示屏覆盖所述第一散热组件和所述第二散热组件。
  20. 根据权利要求1所述的终端设备，其特征在于，所述热源器件的两侧包裹有金属蔽罩。
PCT/CN2019/107624 2018-10-15 2019-09-25 终端设备 WO2020078178A1 (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP19874044.1A EP3843366B1 (en) 2018-10-15 2019-09-25 Terminal device
US17/284,381 US20210392782A1 (en) 2018-10-15 2019-09-25 Terminal Device
US18/505,673 US20240081026A1 (en) 2018-10-15 2023-11-09 Terminal device

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CN201811205613.3 2018-10-15
CN201811205613 2018-10-15
CN201811609350.2A CN109640588B (zh) 2018-10-15 2018-12-27 终端设备
CN201811609350.2 2018-12-27

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US17/284,381 A-371-Of-International US20210392782A1 (en) 2018-10-15 2019-09-25 Terminal Device
US18/505,673 Continuation US20240081026A1 (en) 2018-10-15 2023-11-09 Terminal device

Publications (1)

Publication Number Publication Date
WO2020078178A1 true WO2020078178A1 (zh) 2020-04-23

Family

ID=66078288

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/107624 WO2020078178A1 (zh) 2018-10-15 2019-09-25 终端设备

Country Status (4)

Country Link
US (2) US20210392782A1 (zh)
EP (1) EP3843366B1 (zh)
CN (2) CN111654996B (zh)
WO (1) WO2020078178A1 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112467272B (zh) * 2019-08-21 2023-01-06 华为技术有限公司 一种散热组件和电子设备
CN110636746B (zh) * 2019-09-17 2021-02-26 华为技术有限公司 一种散热装置及终端设备
CN113225971B (zh) * 2020-01-21 2022-07-22 华为技术有限公司 一种终端设备
CN113724594A (zh) * 2021-08-27 2021-11-30 京东方科技集团股份有限公司 显示装置和可穿戴显示设备
CN113929074B (zh) * 2021-10-30 2022-08-23 华为技术有限公司 碳材及其应用
CN114760809B (zh) * 2021-12-27 2023-04-18 华为技术有限公司 碳材及其应用
CN116847621A (zh) * 2022-03-24 2023-10-03 华为技术有限公司 散热模组和电子设备

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140240926A1 (en) * 2013-02-26 2014-08-28 Jong Hyun Choi Window member and display apparatus having the same
CN104869184A (zh) * 2014-02-21 2015-08-26 三星电子株式会社 具有散热片的移动通信终端
CN204633838U (zh) * 2015-05-13 2015-09-09 苏州环明电子科技有限公司 手机散热结构及带有手机散热结构的手机
CN107592386A (zh) * 2017-10-23 2018-01-16 南京旭羽睿材料科技有限公司 一种石墨烯手机散热片
CN206962867U (zh) * 2017-01-20 2018-02-02 惠州普元数码电子有限公司 高效散热型智能移动通信设备

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8202765B2 (en) * 2009-01-22 2012-06-19 International Business Machines Corporation Achieving mechanical and thermal stability in a multi-chip package
TW201136502A (en) * 2010-04-07 2011-10-16 Ascend Top Entpr Co Ltd Thin type heat dissipation device
CN203233631U (zh) * 2013-04-22 2013-10-09 江苏悦达墨特瑞新材料科技有限公司 石墨烯材料的手机散热片
CN103235436B (zh) * 2013-04-25 2016-04-27 深圳市华星光电技术有限公司 液晶显示装置及其前框和中框的组合结构
KR102071921B1 (ko) * 2013-08-27 2020-01-31 엘지전자 주식회사 높은 방열 성능을 갖는 방열 프레임
JP2016201580A (ja) * 2013-10-01 2016-12-01 古河電気工業株式会社 モバイル電子機器ケース
JP5665948B1 (ja) * 2013-11-14 2015-02-04 株式会社フジクラ 携帯型電子機器の冷却構造
CN203882256U (zh) * 2014-02-28 2014-10-15 深圳垒石热管理技术有限公司 一种智能手机的石墨散热结构
JP6337547B2 (ja) * 2014-03-20 2018-06-06 富士通株式会社 電子機器筐体
US9535470B2 (en) * 2014-07-02 2017-01-03 Asia Vital Components Co., Ltd. Electronic substrate with heat dissipation structure
US9431319B2 (en) * 2014-08-01 2016-08-30 Linear Technology Corporation Exposed, solderable heat spreader for integrated circuit packages
CN105472940B (zh) * 2014-08-20 2018-08-17 南京中兴新软件有限责任公司 终端散热装置及移动终端
CN106304817B (zh) * 2015-06-04 2019-01-18 宏碁股份有限公司 电子装置
CN105228413B (zh) * 2015-08-26 2018-07-03 联想(北京)有限公司 一种电子设备
CN205546375U (zh) * 2016-02-19 2016-08-31 东莞钱锋特殊胶粘制品有限公司 电子装置的均温散热复合膜结构
US9733680B1 (en) * 2016-03-16 2017-08-15 Microsoft Technology Licensing, Llc Thermal management system including an elastically deformable phase change device
CN107660099A (zh) * 2016-07-26 2018-02-02 东莞爵士先进电子应用材料有限公司 平板薄膜式散热装置
KR102483238B1 (ko) * 2016-08-01 2022-12-30 삼성전자 주식회사 방열 장치 및 이를 구비하는 전자 장치
CN206181696U (zh) * 2016-10-28 2017-05-17 中科创达软件科技（深圳）有限公司 一种低热阻的手机屏蔽散热结构及具有该结构的手机
CN106790797B (zh) * 2016-12-13 2019-11-19 奇酷互联网络科技（深圳）有限公司 终端设备的中框及其制备方法和移动终端
CN107168464A (zh) * 2017-05-11 2017-09-15 努比亚技术有限公司 终端设备
CN107249283B (zh) * 2017-07-12 2019-07-12 普联技术有限公司 一种移动终端
CN207219261U (zh) * 2017-08-01 2018-04-10 东莞市普威玛精密工业有限公司 移动电子装置的热管与金属壳体的连结构造
CN107509365B (zh) * 2017-08-25 2020-07-10 北京无线电测量研究所 一种超薄微波组件及热管散热装置
CN207368170U (zh) * 2017-10-26 2018-05-15 李雪梅 高寿命锂电池
CN207817623U (zh) * 2017-12-13 2018-09-04 成都强思科技有限公司 用于计算机主机中央处理器的降温散热板
CN108617082B (zh) * 2018-06-11 2020-01-24 Oppo广东移动通信有限公司 一种散热组件以及电子装置
CN108513519A (zh) * 2018-06-29 2018-09-07 上海与德通讯技术有限公司 终端设备及其散热结构

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140240926A1 (en) * 2013-02-26 2014-08-28 Jong Hyun Choi Window member and display apparatus having the same
CN104869184A (zh) * 2014-02-21 2015-08-26 三星电子株式会社 具有散热片的移动通信终端
CN204633838U (zh) * 2015-05-13 2015-09-09 苏州环明电子科技有限公司 手机散热结构及带有手机散热结构的手机
CN206962867U (zh) * 2017-01-20 2018-02-02 惠州普元数码电子有限公司 高效散热型智能移动通信设备
CN107592386A (zh) * 2017-10-23 2018-01-16 南京旭羽睿材料科技有限公司 一种石墨烯手机散热片

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP3843366A4 *

Also Published As

Publication number Publication date
EP3843366B1 (en) 2023-03-29
CN111654996B (zh) 2021-12-17
CN111654996A (zh) 2020-09-11
CN109640588B (zh) 2020-05-29
US20210392782A1 (en) 2021-12-16
CN109640588A (zh) 2019-04-16
EP3843366A4 (en) 2021-12-01
EP3843366A1 (en) 2021-06-30
US20240081026A1 (en) 2024-03-07

Similar Documents

Publication Publication Date Title
WO2020078178A1 (zh) 终端设备
KR102591735B1 (ko) 손목 밴드를 히트 싱크로서 사용하는 것에 의한 웨어러블 디바이스들을 위한 열 솔루션
US7480145B2 (en) Thin, passive cooling system
US10551886B1 (en) Display with integrated graphite heat spreader and printed circuit board insulator
US9301429B2 (en) Thermal blocker for mobile device skin hot spot management
JP2018531441A6 (ja) ヒートシンクとしてリストバンドを使用することによるウェアラブルデバイスのための熱に関する解決策
WO2017067219A1 (zh) 一种移动终端的散热装置和移动终端
WO2017067202A1 (zh) 一种移动终端的散热装置和移动终端
KR20080011392A (ko) 써멀 라미네이션 모듈
WO2015074447A1 (zh) 一种移动终端散热装置和屏蔽罩架
US20140069622A1 (en) Heat dissipation composite and the use thereof
CN107643806B (zh) 电子设备
TWI552672B (zh) 中央處理器外殼、電子設備、可攜式電子裝置及其降低電磁干擾及散熱的方法
JP2009094196A (ja) 携帯通信機の放熱構造
CN106413335B (zh) 移动电子装置的散热缓冲屏蔽复合结构
TWM430819U (en) Electronic device and heat sink device thereof
WO2023093211A1 (zh) 芯片散热结构和电子设备
WO2023098751A1 (zh) 芯片散热结构和电子设备
US20210259137A1 (en) Electronic device
US8363398B2 (en) Electronic device with heat dissipation casing
JP2016066119A (ja) 電子機器
US20210298212A1 (en) Conductive shield for an electronic device
TWM522552U (zh) 手持通訊裝置及其薄型化散熱器
TWM500284U (zh) 可攜式電子裝置
TWI799339B (zh) 手持式電子裝置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19874044

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2019874044

Country of ref document: EP

Effective date: 20210323

NENP Non-entry into the national phase

Ref country code: DE