WO2015074447A1 - 一种移动终端散热装置和屏蔽罩架 - Google Patents

一种移动终端散热装置和屏蔽罩架 Download PDF

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Publication number
WO2015074447A1
WO2015074447A1 PCT/CN2014/084863 CN2014084863W WO2015074447A1 WO 2015074447 A1 WO2015074447 A1 WO 2015074447A1 CN 2014084863 W CN2014084863 W CN 2014084863W WO 2015074447 A1 WO2015074447 A1 WO 2015074447A1
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Prior art keywords
frame
circuit board
printed circuit
shield frame
heat dissipation
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PCT/CN2014/084863
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English (en)
French (fr)
Inventor
赵凯
侯方西
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中兴通讯股份有限公司
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Priority to US15/036,815 priority Critical patent/US20160266622A1/en
Publication of WO2015074447A1 publication Critical patent/WO2015074447A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories

Definitions

  • the present invention relates to the field of heat dissipation and shielding of mobile terminals, and in particular, to a heat sink for a mobile terminal and a shield cover.
  • the heat conduction mode for the heat dissipation of the mobile terminal is mainly added to a large area of the copper foil bonding area or the graphite sheet area inside the casing surface of the mobile terminal (such as inside the battery back cover and the battery compartment casing).
  • the heat dissipation surface area of the casing is increased to lower the temperature.
  • the key issue in the way of heat conduction is to transfer the heat inside the heat source chip to the outer surface of the casing quickly and with low thermal resistance, so as to facilitate the transfer of heat from the high temperature region inside the machine to the low temperature region of the outer surface.
  • the conventional heat conduction method is to divide and shield the main chip and surrounding related circuits in the form of a shield frame on the PCB, but it is limited by the device layout and the processing technology of the shield frame.
  • Traditional discrete shield frames are relatively small in size. Due to the small cavity inside the shield frame, the air convection effect inside the heat source chip is poor, and the common material of the shield frame is steel sheet, and the thermal conductivity is relatively low, so the heat cannot be from the high temperature region of the heat source chip. Effectively transmitted to the low temperature area outside the casing, the heat dissipation effect is not good.
  • the technical problem to be solved in this embodiment is to provide a heat sink and a shield frame of the mobile terminal, so that the heat generated by the heat source chip on the PCB is quickly and widely transmitted to the outside of the casing for heat dissipation.
  • an embodiment of the present invention provides a heat sink for a mobile terminal, including: a printed circuit board and a shield frame disposed on the printed circuit board, the printed circuit board including a plurality of heat source chips ;
  • a cavity structure for accommodating a plurality of heat source chips is formed between the shield frame and the printed circuit board.
  • the shield frame includes a sealing edge, and the shield frame is pressed against the printed circuit board by the sealing edge.
  • the shield frame is a magnesium alloy shield frame.
  • the sealing edge of the shield frame is a contact spring.
  • the contact spring is a serrated contact spring.
  • the sealing edge of the shield frame is a conductive foam or a buckle.
  • the heat source chip is a main chip cpu, a power management chip, a memory chip or an LCD backlight chip.
  • an embodiment of the present invention further provides a shield frame, which is a cavity structure that is open at one end, and the cavity structure is configured to accommodate a plurality of heat source chips.
  • the shield frame includes a sealing edge.
  • the sealing edge is a contact spring or a conductive foam or a buckle.
  • the shield frame of the embodiment of the present invention uses an integrated heat dissipation scheme, and the large frame of the metal bracket is used to form a large sub-chamber shield frame, so that the main heat source device live load chip such as the main chip CPU, each power management chip
  • the memory chip and the LCD backlight chip are all located in a large shielding cavity, which enhances the air flow in the cavity, increases the heat conduction planarization area, is conducive to heat dissipation, and improves the heat dissipation effect.
  • BRIEF abstract 1 is a schematic structural view of a conventional mobile terminal shield frame
  • FIG. 2 is a schematic structural diagram of a heat sink of a mobile terminal according to an embodiment of the present invention.
  • Figure 3 is a side elevational view of the sealing edge of the shield frame of one embodiment of the present invention.
  • FIG. 4 is a schematic structural view of a sealing edge of a shield frame according to an embodiment of the present invention.
  • a heat sink for a mobile terminal includes: a printed circuit board PCB 101 (Printed Circuit Board) and a shield frame 102 disposed on the printed circuit board, the printing
  • the circuit board includes a plurality of heat source chips 106, 107, 108, 109;
  • a cavity structure for accommodating the plurality of heat source chips 106, 107, 108, 109 is formed between the shield frame 102 and the printed circuit board 101.
  • a metal bracket is generally used as a fixing bracket of the structural casing.
  • the shield frame 102 can be processed into a cavity structure with an open end on the basis of the original metal bracket.
  • the body structure can accommodate a plurality of heat source chips 106, 107, 108, 109, and the shield frame 102 is pressed against the printed circuit board 101 to form a shielded area against external electromagnetic interference.
  • the shield frame 102 greatly increases the wall portion, so that the heat convection capability of the entire large cavity is greatly enhanced, and the heat generated by the heat source chips 106, 107, 108, 109 can be quickly increased.
  • the flattening is passed on.
  • the shield frame 102 includes a sealing edge, and the shield frame is pressed against the printed circuit board 101 by the sealing edge.
  • the shield frame includes a sealing edge through which a reliable grounding treatment is performed.
  • the shield frame is a metal cover frame, and the magnesium alloy shield frame is preferred in the embodiment of the invention.
  • the thermal conductivity of magnesium-aluminum alloy is much higher than that of traditional steel sheets, so the heat in the chamber can be low.
  • the thermal resistance is quickly transmitted to the outside of the shield frame until it is transmitted to the outside of the casing of the terminal, which has a good heat dissipation effect.
  • the sealing edge of the shield frame 102 is a contact spring 202 or a conductive foam or a snap 201.
  • the embodiment of the invention preferably has a serrated contact spring
  • the heat source chips 106, 107, 108, 109 include, but are not limited to, a main chip cpu, a power management chip, a memory chip, or an LCD (Liquid Crystal Display) backlight chip.
  • FIG. 3 is a side elevational view of the seal side of the shield frame of one embodiment of the present invention.
  • the sealing edge is a serrated contact spring 202
  • the serrated contact spring 202 is fixed to the edge of the shield frame 102.
  • the reed is usually made of copper.
  • the serrated contact springs 202 are fully in contact with the main board, which provides a good sealing grounding effect. Since the copper material of the serrated contact spring 202 has a high thermal conductivity, the reed helps the heat transfer of the main board to the shield frame cover 102, thereby achieving a good heat dissipation effect;
  • the shield frame 102 has a length and a width depending on the layout of the main board and the device, and may be any size and shape, and is not limited to a rectangular parallelepiped.
  • the general shield frame 102 cavity thickness is between 1.2mm ⁇ 2.0mm.
  • FIG. 4 is a schematic structural view of a sealing edge of a shield frame according to an embodiment of the present invention.
  • a conductive foam or a metal buckle 201 is designed on the track of the shield frame 102 in contact with the motherboard of the PCB 101, so that when the shield frame 102 is pressed against the motherboard of the PCB 101, the conductive foam 201 can be better. Enhance the grounding effect of both to ensure the shielding effect. Or when the shield frame 102 and the PCB 101 main board are pressed together, the shield frame and the main board are connected by the metal buckle 201, which also enhances the grounding effect and the assembly fastness.
  • the electromagnetic interference can be well prevented, and the ground structure of the serrated contact spring 202 enhances the shielding effect of the ground.
  • the cavity of the shield frame 102 of the embodiment of the invention has no space limitation, and the device layout on the motherboard The degree of freedom is very high, and the space heat convection ability is strong, so it can achieve a very good terminal heat dissipation effect.
  • a mobile terminal heat sink and a shield cover frame relate to the heat dissipation and shielding field of the mobile terminal, so that the heat generated by the heat source chip on the PCB board is quickly and widely transmitted to the outside of the casing for heat dissipation.
  • a printed circuit board and a shield frame disposed on the printed circuit board, the printed circuit board comprising a plurality of heat source chips, the shield frame and the printed circuit board forming a plurality of heat source chips
  • the cavity structure can enhance the air flow in the cavity, increase the heat conduction planarization area, and improve the heat dissipation effect.

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Telephone Set Structure (AREA)

Abstract

一种移动终端散热装置和屏蔽罩架（102），涉及移动终端散热和屏蔽领域，使得印刷电路板（101）上的热源芯片（106，107，108，109）产生的热量快速大面积的传递到机壳外面进行散热。所述移动终端散热装置包括印刷电路板（101）和设置在所述印刷电路板（101）上的屏蔽罩架（102），所述印刷电路板（101）包括多个热源芯片（106，107，108，109）；所述屏蔽罩架（102）与印刷电路板（101）之间形成容纳多个热源芯片（106，107，108，109）的腔体结构。所述屏蔽罩架（102），为一端开口的腔体结构，所述腔体结构设置为容纳多个热源芯片（106，107，108，109）。本发明实施例增强了腔体内的空气流动，加大了热传导平面化面积，有利于散热，提高了散热效果。

Description

一种移动终端散热装置和屏蔽罩架
技术领域
本发明涉及移动终端散热和屏蔽领域， 尤其涉及一种移动终端散热装置 和展蔽罩架。
背景技术
随着移动电子设备技术和移动互联网的发展， 移动式终端的功能和性能 已逐步向电脑接近或趋同， 特别是智能手机行业的快速发展， 终端内主芯片 CPU的频率越来越高，并且 CPU的内核数量逐渐由单核向双核、 四核甚至八 核演变， 终端手机与网络的数据交换量也急剧增大， 极大的增加了终端设备 各芯片的功耗情况。 功耗的增大带来的终端设备发热问题， 目前移动终端上 还不能像电脑一样在 CPU上增加风扇来降温，发热与终端的正常使用形成矛 盾。
目前对移动终端散热的导热方式主要在移动终端的机壳表面内部 （如电 池后盖内、 电池仓机壳内）增加一个大面积的铜箔贴合区域或者石墨片区域。 利用铜箔及石墨片横向导热率高的特性， 增大机壳的散热表面积， 从而降温。 导热的方式关键问题在于将热源芯片内部的热量迅速且低热阻的传递到机壳 外表面，这样才能利于热量从机器内部的高温区域传递到外表面的低温区域。
如图 1所示，传统的导热方式是在 PCB板上将主要芯片及周围相关电路 釆用屏蔽罩架的形式分腔分割屏蔽开来， 但是受限于器件布局及屏蔽罩架加 工工艺因素， 传统分立式屏蔽罩架尺寸都比较小。 由于较小的屏蔽罩架内分 腔， 造成了热源芯片内部的空气对流效果^ L差， 且屏蔽罩架通常的材料为钢 片， 其导热率比较低， 因此热量从热源芯片的高温区域不能有效传递到机壳 外面的低温区域， 散热效果不好。
发明内容 本实施例要解决的技术问题是提供一种移动终端散热装置和屏蔽罩架， 使得 PCB板上的热源芯片产生的热量快速大面积的传递到机壳外面进行散 热。
为了解决上述问题， 本发明实施例提供了一种移动终端散热装置， 包括： 印制电路板和设置在所述印制电路板上的屏蔽罩架， 所述印制电路板包括多 个热源芯片；
所述屏蔽罩架与印制电路板之间形成容纳多个热源芯片的腔体结构。 可选地， 所述屏蔽罩架包括密封边， 所述屏蔽罩架通过所述密封边扣压 在印制电路板上。
可选地， 所述屏蔽罩架为镁铝合金屏蔽罩架。
可选地， 所述屏蔽罩架的密封边为接触簧片。
可选地， 所述接触簧片为锯齿状接触簧片。
可选地， 所述屏蔽罩架的密封边为导电泡棉或者卡扣。
可选地， 热源芯片为主芯片 cpu、 电源管理芯片、 存储器芯片或者 LCD 背光芯片。
为了解决上述问题， 本发明实施例还提供了一种屏蔽罩架， 为一端开口 的腔体结构， 所述腔体结构设置为容纳多个热源芯片。
可选地， 所述屏蔽罩架包括密封边。
可选地， 所述密封边为接触簧片或者导电泡棉或者卡扣。
综上所述， 本发明实施例的屏蔽罩架釆用一体式散热方案， 釆用金属支 架大框架制成大分腔屏蔽罩架，使得主要热源器件活荷载芯片如主芯片 CPU, 各电源管理芯片， 存储器芯片， LCD背光芯片等统统处在一个较大屏蔽腔体 内， 增强了腔体内的空气流动， 加大了热传导平面化面积， 有利于散热， 提 高了散热效果。
附图概述 图 1是现有的移动终端屏蔽罩架的结构示意图；
图 2是本发明实施例的移动终端散热装置的结构示意图；
图 3为本发明一个实施例的屏蔽罩架密封边的侧视图；
图 4为本发明一个实施例的屏蔽罩架密封边的结构示意图。
本发明的较佳实施方式
为使本发明的目的、 技术方案和优点更加清楚明白， 下文中将结合附图 对本发明的实施例进行详细说明。 需要说明的是， 在不冲突的情况下， 本申 请中的实施例及实施例中的特征可以相互任意组合。
图 2是本发明实施例的移动终端散热装置的结构示意图。 如图 2所示， 本发明实施例的一种移动终端散热装置， 包括： 印制电路板 PCB101 ( Printed Circuit Board )和设置在所述印制电路板上的屏蔽罩架 102, 所述印制电路板 包括多个热源芯片 106、 107、 108、 109;
所述屏蔽罩架 102与印制电路板 101之间形成容纳多个热源芯片 106、 107、 108、 109的腔体结构。
对于手机等移动终端中， 通常釆用金属支架作为结构机壳的固定支架， 本发明实施例可以在原有金属支架的基础上， 将屏蔽罩架 102处理成一端开 口的腔体结构， 所述腔体结构可以容纳多个热源芯片 106、 107、 108、 109, 将屏蔽罩架 102扣压在印制电路板 101上，形成防外界电磁干扰的屏蔽区域。 所述屏蔽罩架 102相比传统的分立式屏蔽罩架， 墙体部分大大增大， 使得整 个大腔体内空气热对流能力大大增强， 热源芯片 106、 107、 108、 109产生的 热量可以迅速的平面化传递开来。
优选地， 所述屏蔽罩架 102包括密封边， 所述屏蔽罩架通过所述密封边 扣压在印制电路板 101上。
为增强屏蔽罩架 102的抗电磁干扰密封屏蔽性， 屏蔽罩架包括密封边， 通过所述密封边做可靠接地处理。
屏蔽罩架为金属罩架， 本发明实施例优选镁铝合金屏蔽罩架。
镁铝合金的热传导率远高于传统的钢片材质， 因此腔体内的热量能够低 热阻地迅速传递到屏蔽罩架外面直至传递到终端的机壳外面， 起到了很好的 散热效果。
如图 3-4所示， 所述屏蔽罩架 102的密封边为接触簧片 202或者导电泡 棉或者卡扣 201。
当所述密封边为接触簧片 202 时， 本发明实施例优选锯齿状接触簧片
202。
热源芯片 106、 107、 108、 109包括但不限于主芯片 cpu、 电源管理芯片、 存储芯片或者 LCD ( Liquid Crystal Display, 液晶显示器） 背光芯片。
实施例 1
图 3为本发明一个实施例的屏蔽罩架密封边的侧视图。 如图 3所示， 密 封边为锯齿状接触簧片 202, 锯齿状接触簧片 202结构固定在屏蔽罩架 102 的边沿上， 簧片通常为铜制材质。 当屏蔽罩架 102固定压接到 PCB101主板 上时， 锯齿状接触簧片 202充分与主板接触， 起到了很好的密封接地效果。 由于锯齿状接触簧片 202的铜制材质导热率很高， 因此该簧片有助于主板热 量热传导到屏蔽架罩 102上去， 起到很好的散热效果；
其中， 屏蔽罩架 102长宽视主板及器件布局结构而定， 可以是任意的尺 寸和形状， 不局限长方体。 一般屏蔽罩架 102腔体的厚度在 1.2mm ~ 2.0mm 之间。
实施例 2
图 4为本发明一个实施例的屏蔽罩架密封边的结构示意图。如图 4所示， 屏蔽罩架 102 与 PCB101 主板接触的轨迹上设计有导电泡棉或者金属卡扣 201 , 这样当屏蔽罩架 102扣压在 PCB101主板上时， 通过导电泡棉 201能更 好的增强两者的接地效果， 从而保证屏蔽效果。 或者当屏蔽罩架 102 与 PCB101主板扣压在一起时， 通过金属卡扣 201把屏蔽罩架和主板连接起来， 同样增强接地效果和装配牢固度。
本发明实施例中由于屏蔽罩架 102本身的金属特性， 可以起到很好的防 止电磁干扰的特性， 锯齿状接触簧片 202接地结构增强了接地的屏蔽效果。 另外本发明实施例的屏蔽罩架 102腔体无空间局限性， 对于主板上器件布局 自由度非常高， 空间热对流能力强， 因此能够起到非常理想的终端散热效果。 以上实施例仅用以说明本发明的技术方案而非限制， 仅仅参照较佳实施 例对本发明进行了详细说明。 本领域的普通技术人员应当理解， 可以对本发 明实施例的技术方案进行修改或者等同替换， 而不脱离本发明技术方案的精 神和范围， 均应涵盖在本发明的权利要求范围当中。
工业实用性
一种移动终端散热装置和屏蔽罩架， 涉及移动终端散热和屏蔽领域， 使 得 PCB板上的热源芯片产生的热量快速大面积的传递到机壳外面进行散热。 印制电路板和设置在所述印制电路板上的屏蔽罩架， 所述印制电路板包括多 个热源芯片， 所述屏蔽罩架与印制电路板之间形成容纳多个热源芯片的腔体 结构， 可以增强腔体内的空气流动， 加大热传导平面化面积， 提高散热效果。

Claims

权 利 要 求 书
1、 一种移动终端散热装置， 包括： 印制电路板和设置在所述印制电路板 上的屏蔽罩架， 所述印制电路板包括多个热源芯片；
所述屏蔽罩架与印制电路板之间形成容纳多个热源芯片的腔体结构。
2、 如权利要求 1所述的装置， 其中， 所述屏蔽罩架包括密封边， 所述屏 蔽罩架通过所述密封边扣压在印制电路板上。
3、如权利要求 1所述的装置，其中，所述屏蔽罩架为镁铝合金屏蔽罩架。
4、如权利要求 2所述的装置，其中，所述屏蔽罩架的密封边为接触簧片。
5、 如权利要求 4所述的装置， 其中， 所述接触簧片为锯齿状接触簧片。
6、 如权利要求 2所述的装置， 其中， 所述屏蔽罩架的密封边为导电泡棉 或者卡扣。
7、 如权利要求 1所述的装置， 其中， 所述热源芯片为主芯片 CPU、 电源 管理芯片、 存储器芯片或者 LCD背光芯片。
8、 一种屏蔽罩架， 其特征在于： 所述屏蔽罩架为一端开口的腔体结构， 所述腔体结构设置为容纳多个热源芯片。
9、 如权利要求 8所述的屏蔽罩架， 其中， 所述屏蔽罩架包括密封边。
10、 如权利要求 9所述的屏蔽罩架， 其中， 所述密封边为接触簧片或者 导电泡棉或者卡扣。
11、 如权利要求 8所述的屏蔽罩架， 其中， 所述屏蔽罩架为镁铝合金。
12、 如权利要求 9所述的屏蔽罩架， 其中， 所述屏蔽罩架的密封边为接 触簧片。
13、 如权利要求 12所述的屏蔽罩架， 其中， 所述接触簧片为锯齿状接触 簧片。
PCT/CN2014/084863 2013-11-19 2014-08-20 一种移动终端散热装置和屏蔽罩架 WO2015074447A1 (zh)

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