WO2017067219A1 - 一种移动终端的散热装置和移动终端 - Google Patents

一种移动终端的散热装置和移动终端 Download PDF

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WO2017067219A1
WO2017067219A1 PCT/CN2016/088386 CN2016088386W WO2017067219A1 WO 2017067219 A1 WO2017067219 A1 WO 2017067219A1 CN 2016088386 W CN2016088386 W CN 2016088386W WO 2017067219 A1 WO2017067219 A1 WO 2017067219A1
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Prior art keywords
heat
processor
mobile terminal
electronic component
shield
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PCT/CN2016/088386
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English (en)
French (fr)
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常继增
纪成举
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乐视控股（北京）有限公司
乐视移动智能信息技术（北京）有限公司
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Priority to US15/236,258 priority Critical patent/US20170118865A1/en
Publication of WO2017067219A1 publication Critical patent/WO2017067219A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/04—Constructions of heat-exchange apparatus characterised by the selection of particular materials of ceramic; of concrete; of natural stone
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F2013/001—Particular heat conductive materials, e.g. superconductive elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F2013/005—Thermal joints

Definitions

  • the present invention relates to the field of electronic devices, and in particular, to a heat sink and a mobile terminal of a mobile terminal.
  • the mobile terminal In order to meet the demand for portability, the mobile terminal has a trend of thinning and thinning, and the distance between the CPU and other electronic components is getting smaller and smaller. As a result, the CPU's cooling space is getting smaller and smaller, and the performance of the processor will be reduced due to the increase in temperature. And because of the size of the mobile terminal, there is no way to add a powerful air-cooling system like the desktop CPU, and the huge liquid nitrogen system is even more impossible. CPU cooling capacity not only affects its performance, but also affects the user's grip. No one wants to hold a hand warmer every moment.
  • the embodiments of the present invention provide a heat dissipation device and a mobile terminal of a mobile terminal, which are used to solve the technical problem that the CPU heats down slowly without increasing the thickness of the mobile terminal in the prior art.
  • a heat dissipating device for a mobile terminal includes: a first heat transfer medium, a second heat transfer medium, and a third heat transfer medium;
  • the first heat transfer medium is filled in a gap between the processor and the processor shield, and the processor is disposed on a side of the printed circuit board facing the rear case; the heat emitted by the processor passes through the first a heat dissipation medium, the processor shield and the first heat dissipation channel formed by the rear case perform heat dissipation;
  • the second heat conductive medium is filled in a space between the electronic component and the electronic component shielding cover, and the electronic component is disposed on the other side of the printed circuit board opposite to the processor;
  • the third heat conductive medium is filled in a gap between the electronic component shielding cover and the middle frame, and the heat emitted by the processor passes through the printed circuit board, the second heat conductive medium, and the electronic component shielding cover
  • the third heat conduction medium and the second heat dissipation channel formed by the metal middle frame perform heat dissipation.
  • the present invention also provides a mobile terminal, comprising: the heat sink of the mobile terminal according to any one of the above items.
  • the heat dissipation device and the mobile terminal of the mobile terminal provided by the embodiment of the present invention can heat the processor by filling the heat conduction medium without filling the heat conduction medium to ensure heat dissipation of the processor.
  • the processor operates at normal temperatures to prevent the mobile terminal from overheating.
  • FIG. 1 is a schematic structural diagram of a heat dissipation device of a mobile terminal according to an embodiment of the present invention
  • FIG. 2 is a schematic structural diagram of a mobile terminal according to an embodiment of the present invention.
  • 1 is the first heat transfer medium
  • 2 is the second heat transfer medium
  • 3 is the third heat transfer medium
  • 4 is the processor
  • 5 is the processor shield
  • 6 is the printed circuit board
  • 7 is the back shell
  • 8 is the electronic component
  • 9 It is an electronic component shield
  • 10 is a metal middle frame
  • 11 is an LCD (Liquid Crystal Display).
  • FIG. 1 a schematic structural diagram of a heat dissipation device of a mobile terminal according to an embodiment of the present invention is shown.
  • the embodiment of the present invention provides a heat dissipation device for the mobile terminal, as shown in FIG. include:
  • the first heat transfer medium 1 is filled in a gap between the processor 4 and the processor shield 5, and the processor 4 is disposed on a side of the PCB (Printed Circuit Board) 6 facing the rear case 7;
  • PCB Print Circuit Board
  • the heat dissipated by the processor 4 is dissipated through the first heat dissipation medium, the first heat dissipation channel composed of the processor cover 5 and the rear case 7;
  • the second heat transfer medium 2 is filled in a space between the electronic component 8 and the electronic component shield 9, and the electronic component 8 is disposed on the other side of the printed circuit board 6 opposite to the processor 4;
  • the third heat transfer medium 3 is filled in the gap between the electronic component shielding cover 9 and the middle frame 10, and the heat radiated by the processor 4 passes through the printed circuit board 6, the second heat transfer medium 2, the electronic component shield 9, and the third heat transfer medium. 3 and the second heat dissipation channel formed by the metal middle frame 10 performs heat dissipation.
  • the first heat transfer medium 1 and the third heat transfer medium 3 may be thermally conductive silicone.
  • the thermal conductive silica gel has certain flexibility, excellent insulation, compressibility, and natural viscosity of the surface, and can not only fill the gap between the processor 4 and the processor shield 5, but also between the electronic component 8 and the electronic component shield 9.
  • the gap, and the thermal resistance of the thermal silica gel is low, the heat transfer of the processor 4 to the processor shield 5 can be completed, and the processor 4 can be completed through the printed circuit board 6,
  • the second heat transfer medium 2 and the electronic component shield 9 are thermally transferred to the metal intermediate frame 10. At the same time, it can also function as insulation and shock absorption between the processor 4 and the processor shield 5, between the electronic component shield 9 and the metal middle frame 10, and can meet the design requirements of ultra-thinness of the mobile terminal.
  • the first heat transfer medium 1 and the third heat transfer medium 3 may also be other filler materials having a lower thermal resistance, such as thermal grease.
  • Thermal grease is a high thermal conductivity insulating silicone material that hardly cures forever. It can be used for a long time at a temperature of -50 ° C to +230 ° C. It has excellent electrical insulation and excellent thermal conductivity.
  • the electronic component 8 may be a capacitor and/or a resistor; of course, the electronic component 8 may also be other electronic components having a lower heat generation and disposed on the printed circuit board 6 at a position corresponding to the processor 4.
  • both sides of the processor shield 5 may be coated with a thermal conductive paste to reduce the thermal resistance between the first heat transfer medium 1 and the rear case 7.
  • a thermal conductive paste may be applied to both sides of the electronic component shield to reduce the thermal resistance between the second heat transfer medium 2 and the third heat transfer medium 3, thereby improving heat dissipation efficiency.
  • a graphite sheet may be disposed between the processor shield 5 and the rear case 7.
  • the graphite sheet uniformly conducts heat in two directions, has high heat dissipation efficiency, small occupied space, and light weight, and uniformly conducts heat in two directions, thereby eliminating the overheated area between the processor shield 5 and the rear case 7.
  • the electronic component shielding cover 5 and the processor shielding cover 9 are made of an aluminum substrate, and the aluminum substrate can quickly transfer heat to the metal base layer through the insulating layer, and then the heat is transferred by the metal base layer, thereby realizing The heat dissipation of the processor 4.
  • the first heat dissipation channel and the second heat dissipation channel are configured to heat the processor by filling the heat conduction medium without increasing the thickness of the mobile terminal, and the processor is guaranteed. Work at normal temperatures to prevent the mobile terminal from overheating.
  • FIG. 2 is a schematic structural diagram of a mobile terminal according to an embodiment of the present invention.
  • the embodiment of the present invention further provides a mobile terminal.
  • the present invention includes not only the heat dissipating device but also an LCD (Liquid Crystal Display) 11 as an interface for interacting with a user.
  • the mobile terminal is a computer device used in mobile communication, and may be a mobile phone and a tablet computer having various application functions.
  • the mobile terminal is prevented from overheating due to overheating of the processor.
  • the device embodiments described above are merely illustrative, wherein the units described as separate components may or may not be physically separate, and the components displayed as units may or may not be physical units, ie may be located A place, or it can be distributed to multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of the embodiment. Those of ordinary skill in the art can understand and implement without deliberate labor.

Abstract

一种移动终端的散热装置和移动终端，该装置包括：第一导热介质（1）、第二导热介质（2）和第三导热介质（3）；第一导热介质（1）填充于处理器（4）与处理器屏蔽罩（5）之间的空隙中，处理器（4）设置于印刷电路板（6）朝向后壳（7）的一侧上；处理器（4）散发的热量经第一导热介质（1）、处理器屏蔽罩（5）和后壳（7）组成的第一散热通道进行散热；第二导热介质（2）填充于电子元件（8）和电子元件屏蔽罩（9）之间的空隙中，第三导热介质（3）填充于电子元件屏蔽罩（9）和金属中框（10）之间的空隙中，处理器（4）散发的热量经印刷电路板（6）、第二导热介质（2）、电子元件屏蔽罩（9）、第三导热介质（3）和金属中框（10）组成的第二散热通道进行散热。该散热装置和移动终端通过构建第一散热通道和第二散热通道对处理器（4）进行散热。

Description

一种移动终端的散热装置和移动终端
本申请要求在2015年10月22日提交中国专利局、申请号为201520827631.0、发明名称为“一种移动终端的散热装置和移动终端”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本发明涉及电子设备领域，特别是涉及一种移动终端的散热装置和移动终端。
背景技术
随着电子技术的发展，手机、平板电脑等移动终端应用越来越广泛，使用频率也越来越高。为了满足用户对功能和性能上的需求，移动终端的硬件不断升级，其所执行的计算处理也更加繁杂。CPU(Central Processing Unit，中央处理器)核心数不断提高，主频也越来越高，为了使得移动终端正常运行，CPU的散热变的尤为重要。
为了满足携带轻便的需求，移动终端呈现轻薄化的发展趋势，CPU与其他电子元件之间的距离越来越小。随之造成CPU的散热空间越来越小，处理器的性能会因为温度升高而有所降低。而且由于移动终端体积的限制，无办法像台式机的CPU一样，为其加上强大的风冷系统，庞大的液氮系统更加无可能。CPU散热能力不但影响其性能，也会对用户的握持有影响，谁也不希望每时每刻拿着一个暖手宝。
因此，目前需要本领域技术人员迫切解决的一个技术问题就是：如何在不增加移动终端厚度的情况下，提高对CPU的散热效率，防止CPU过热。
发明内容
本发明实施例提供一种移动终端的散热装置和移动终端，用以解决现有技术中在不增加移动终端厚度的情况下，CPU散热较慢的技术问题。
根据本发明的一个方面，本发明公开了一种移动终端的散热装置，包括：第一导热介质、第二导热介质和第三导热介质；
所述第一导热介质填充于处理器与处理器屏蔽罩之间的空隙中，所述处理器设置于印刷电路板朝向后壳的一侧上；所述处理器散发的热量经所述第一导热介质、所述处理器屏蔽罩和所述后壳组成的第一散热通道进行散热；
所述第二导热介质填充于电子元件和电子元件屏蔽罩之间的空隙中，所述电子元件设置于所述印刷电路板的另一侧上，与所述处理器相对设置；
所述第三导热介质填充于所述电子元件屏蔽罩和中框之间的空隙中，所述处理器散发的热量经所述印刷电路板、所述第二导热介质、所述电子元件屏蔽罩、所述第三导热介质和金属中框组成的第二散热通道进行散热。
根据本发明的另一个方面，本发明还公开了一种移动终端，包括：上述任意一项所述的移动终端的散热装置。
本发明实施例提供的一种移动终端的散热装置和移动终端，可以在不增加移动终端厚度的情况下，通过填充导热介质，构建第一散热通道和第二散热通道对处理器进行散热，保障处理器工作在正常的温度下，防止移动终端过热。
上述说明仅是本发明技术方案的概述，为了能够更清楚了解本发明的技术手段，而可依照说明书的内容予以实施，并且为了让本发明的上述和其它目的、特征和优点能够更明显易懂，以下特举本发明的具体实施方式。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作一简单地介绍，显而易见地，下面描述中的附图是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本发明实施例提供的一种移动终端的散热装置的结构示意图；
图2为本发明实施例提供的一种移动终端的结构示意图。
为清楚起见，附图中各个标识如下所示：
1为第一导热介质，2为第二导热介质，3为第三导热介质，4为处理器，5为处理器屏蔽罩，6为印刷电路板，7为后壳，8为电子元件，9为电子元件屏蔽罩，10为金属中框，11为LCD(Liquid Crystal Display，薄膜晶体管液晶显示器件)。
具体实施例
为使本发明实施例的目的、技术方案和优点更加清楚，下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
参照图1，示出了本发明实施例提供的一种移动终端的散热装置的结构示意图。
在为了能够在不增加移动终端厚度的前提下，提高CPU(Central Processing Unit，中央处理器)的散热速度，本发明实施例提供了一种移动终端的散热装置，如图1所示，该装置包括：
第一导热介质1、第二导热介质2和第三导热介质3；
第一导热介质1填充于处理器4与处理器屏蔽罩5之间的空隙中，处理器4设置于PCB(Printed Circuit Board，印刷电路板)6朝向后壳7的一侧上；
处理器4散发的热量经第一导热介质1、处理器屏蔽罩5和后壳7组成的第一散热通道进行散热；
第二导热介质2填充于电子元件8和电子元件屏蔽罩9之间的空隙中，电子元件8设置于印刷电路板6的另一侧上，与处理器4相对设置；
第三导热介质3填充于电子元件屏蔽罩9和中框10之间的空隙中，处理器4散发的热量经印刷电路板6、第二导热介质2、电子元件屏蔽罩9、第三导热介质3和金属中框10组成的第二散热通道进行散热。
为了降低处理器4与处理器屏蔽罩5之间的缝隙和填充电子元件8和电子元件屏蔽罩9之间的缝隙的热阻，第一导热介质1和第三导热介质3可以为导热硅胶。导热硅胶具有一定的柔韧性、优良的绝缘性、压缩性、表面天然的粘性，不但能够填充处理器4与处理器屏蔽罩5之间的缝隙，填充电子元件8和电子元件屏蔽罩9之间的缝隙，而且导热硅胶的热阻低，可以完成处理器4向处理器屏蔽罩5的热传递，也能完成处理器4经过印刷电路板6、 第二导热介质2和电子元件屏蔽罩9向金属中框10热传递。同时还起到还能起到处理器4和处理器屏蔽罩5之间、电子元件屏蔽罩9和金属中框10之间绝缘、减震等作用，能够满足移动终端超薄化的设计要求。
当然，第一导热介质1和第三导热介质3也可以是其他热阻较低的填充材料，例如导热硅脂。导热硅脂是一种高导热绝缘有机硅材料，几乎永远不固化，可在-50℃-+230℃的温度下长期保持使用时的脂膏状态。既具有优异的电绝缘性，又有优异的导热性。
在本发明实施例中，电子元件8可以为电容和/或电阻；当然，电子元件8还可以是其他发热量较低并且设置印刷电路板6上，与处理器4相对应位置的电子元件。
为了进一步提高热传导速度，提高处理器4的散热效果，处理器屏蔽罩5的两侧可以涂抹有导热凝浆，以降低第一导热介质1和后壳7之间的热阻。同样，也可以在电子元件屏蔽罩两侧涂抹有导热凝浆，以降低第二导热介质2和第三导热介质3之间的热阻，加快散热效率。
为了增加处理器屏蔽罩5和后壳7之间导热效率，处理器屏蔽5与后壳7之间还可以设置有石墨片。石墨片沿两个方向均匀导热，散热效率高、占用空间小、重量轻，沿两个方向均匀导热，可以消除处理器屏蔽罩5和后壳7之间的过热区域。
在本发明实施例中，电子元件屏蔽罩5和处理器屏蔽罩9的材质为铝基板，铝基板可以将热量通过绝缘层快速传导到金属基层，然后由金属基层将热量传递出去，从而实现对处理器4的散热。
通过本发明实施例提供的一种移动终端的散热装置，可以在不增加移动终端厚度的情况下，通过填充导热介质，构建第一散热通道和第二散热通道对处理器进行散热，保障处理器工作在正常的温度下，防止移动终端过热。
图2为本发明实施例提供的一种移动终端的结构示意图。
本发明实施例还提供了一种移动终端，如图2所示，不仅包括上述散热装置，还包括：LCD(Liquid Crystal Display，薄膜晶体管液晶显示器件)11作为与用户交互的界面。该移动终端是在移动通信中使用的计算机设备，可以是具有多种应用功能的手机和平板电脑。在第一散热通道和第二散热通道 共同对处理器的散热作用下，防止由于处理器过热造成移动终端过热。
以上所描述的装置实施例仅仅是示意性的，其中所述作为分离部件说明的单元可以是或者也可以不是物理上分开的，作为单元显示的部件可以是或者也可以不是物理单元，即可以位于一个地方，或者也可以分布到多个网络单元上。可以根据实际的需要选择其中的部分或者全部模块来实现本实施例方案的目的。本领域普通技术人员在不付出创造性的劳动的情况下，即可以理解并实施。
最后应说明的是：以上实施例仅用以说明本发明的技术方案，而非对其限制；尽管参照前述实施例对本发明进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本发明各实施例技术方案的精神和范围。

Claims (9)

  1. 一种移动终端的散热装置，其特征在于，包括：第一导热介质、第二导热介质和第三导热介质；
    所述第一导热介质填充于处理器与处理器屏蔽罩之间的空隙中，所述处理器设置于印刷电路板朝向后壳的一侧上；所述处理器散发的热量经所述第一导热介质、所述处理器屏蔽罩和所述后壳组成的第一散热通道进行散热；
    所述第二导热介质填充于电子元件和电子元件屏蔽罩之间的空隙中，所述电子元件设置于所述印刷电路板的另一侧上，与所述处理器相对设置；
    所述第三导热介质填充于所述电子元件屏蔽罩和中框之间的空隙中，所述处理器散发的热量经所述印刷电路板、所述第二导热介质、所述电子元件屏蔽罩、所述第三导热介质和金属中框组成的第二散热通道进行散热。
  2. 根据权利要求1所述的装置，其特征在于，所述第一导热介质和第三导热介质为导热硅胶。
  3. 根据权利要求1所述的装置，其特征在于，所述第二导热介质为导热胶。
  4. 根据权利要求1所述的装置，其特征在于，所述电子元件为电容和/或电阻。
  5. 根据权利要求1所述的装置，其特征在于，所述处理器屏蔽罩两侧涂抹有导热凝浆。
  6. 根据权利要求1所述的装置，其特征在于，所述处理器屏蔽罩与所述后壳之间设置有石墨片。
  7. 根据权利要求1所述的装置，其特征在于，所述电子元件屏蔽罩两侧涂抹有导热凝浆。
  8. 根据权利要求1所述的装置，其特征在于，所述电子元件屏蔽罩和所述处理器屏蔽罩的材质为铝基板。
  9. 一种移动终端，其特征在于，包括：上述权利要求1-8任意一项所述的移动终端的散热装置。
PCT/CN2016/088386 2015-10-22 2016-07-04 一种移动终端的散热装置和移动终端 WO2017067219A1 (zh)

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Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN205005427U (zh) * 2015-10-22 2016-01-27 乐视致新电子科技（天津）有限公司 一种移动终端的散热装置和移动终端
CN105979749A (zh) * 2015-10-22 2016-09-28 乐视移动智能信息技术（北京）有限公司 一种移动终端的散热装置和移动终端
KR102583890B1 (ko) 2016-02-18 2023-10-05 삼성전자주식회사 열 수집/확산 구조를 가진 전자 장치
CN105611812A (zh) * 2016-03-11 2016-05-25 广东欧珀移动通信有限公司 一种移动终端
CN105744724B (zh) * 2016-03-17 2018-09-21 广东小天才科技有限公司 电子器件的散热结构、穿戴式电子设备及其散热方法
CN106357847A (zh) * 2016-09-29 2017-01-25 努比亚技术有限公司 一种移动终端
CN207780431U (zh) * 2018-01-02 2018-08-28 京东方科技集团股份有限公司 一种遮光胶带、背光源及显示装置
CN108777255B (zh) * 2018-06-11 2020-07-31 Oppo广东移动通信有限公司 一种散热组件及电子设备
CN110621141A (zh) * 2019-09-23 2019-12-27 Oppo广东移动通信有限公司 复合膜及电子设备
CN112911028A (zh) * 2019-11-19 2021-06-04 北京小米移动软件有限公司 均温板、终端设备及均温板的制造方法
WO2023102694A1 (zh) * 2021-12-06 2023-06-15 华为数字能源技术有限公司 一种导热绝缘壳和电子设备

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101415316A (zh) * 2008-08-21 2009-04-22 深圳华为通信技术有限公司 一种电子设备及其制造方法
CN103209574A (zh) * 2013-04-24 2013-07-17 惠州Tcl移动通信有限公司 一种移动终端的散热装置、方法及移动终端
US20140254101A1 (en) * 2013-03-05 2014-09-11 Qualcomm Incorporated Smart phone on a chip and method making same
CN205005427U (zh) * 2015-10-22 2016-01-27 乐视致新电子科技（天津）有限公司 一种移动终端的散热装置和移动终端
CN105611812A (zh) * 2016-03-11 2016-05-25 广东欧珀移动通信有限公司 一种移动终端

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5060114A (en) * 1990-06-06 1991-10-22 Zenith Electronics Corporation Conformable pad with thermally conductive additive for heat dissipation
US20120061135A1 (en) * 2010-09-14 2012-03-15 Laird Technologies, Inc. Compliant multilayered thermally-conductive interface assemblies having emi shielding properties
EP2685797B1 (en) * 2011-05-06 2017-12-13 Huawei Device Co., Ltd. Composite material and electron device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101415316A (zh) * 2008-08-21 2009-04-22 深圳华为通信技术有限公司 一种电子设备及其制造方法
US20140254101A1 (en) * 2013-03-05 2014-09-11 Qualcomm Incorporated Smart phone on a chip and method making same
CN103209574A (zh) * 2013-04-24 2013-07-17 惠州Tcl移动通信有限公司 一种移动终端的散热装置、方法及移动终端
CN205005427U (zh) * 2015-10-22 2016-01-27 乐视致新电子科技（天津）有限公司 一种移动终端的散热装置和移动终端
CN105611812A (zh) * 2016-03-11 2016-05-25 广东欧珀移动通信有限公司 一种移动终端

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