WO2017020419A1 - 一种移动终端 - Google Patents

一种移动终端 Download PDF

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Publication number
WO2017020419A1
WO2017020419A1 PCT/CN2015/091342 CN2015091342W WO2017020419A1 WO 2017020419 A1 WO2017020419 A1 WO 2017020419A1 CN 2015091342 W CN2015091342 W CN 2015091342W WO 2017020419 A1 WO2017020419 A1 WO 2017020419A1
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Prior art keywords
plate
middle frame
frame bracket
mobile terminal
board
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PCT/CN2015/091342
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English (en)
French (fr)
Inventor
伏坚
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宇龙计算机通信科技(深圳)有限公司
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Publication of WO2017020419A1 publication Critical patent/WO2017020419A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present invention relates to electronic products, and more particularly to a mobile terminal.
  • the technical problem to be solved by the present invention is to provide a mobile terminal capable of effectively improving heat dissipation performance.
  • an embodiment of the present invention provides a mobile terminal, including a casing, a middle frame bracket, and a main board provided with electronic components; the middle frame bracket is fixed in the outer casing, and the main board is fixed in the Medium frame bracket
  • the middle frame bracket includes a first plate and a second plate which are arranged in a stack, and the first plate and the second plate are both metal plates, and the peripheral edges of the two are fixedly connected with each other a vacuum chamber; the vacuum chamber is provided with a two-phase fluid, and the inner wall of the vacuum chamber is provided with a capillary structure;
  • the main board is connected to the first board to transfer heat generated by the electronic component to the first board and to dissipate heat through the middle frame bracket.
  • the main board has a mounting board surface
  • the electronic component is disposed on the mounting board surface
  • the mounting board surface is opposite to the outer surface of the first board
  • a receiving groove is formed at a position corresponding to the electronic component on an outer surface of the first board; the electronic component is located in the receiving slot, and the electronic component and the receiving slot are Groove bottom Connected.
  • the accommodating groove is filled with thermal grease.
  • a space is provided between an inner surface of the second plate and an inner surface of the first plate, and an inner surface of both the first plate and the second plate
  • the capillary structures are connected.
  • the second plate is in the shape of a flat plate.
  • a connecting ear is disposed at a peripheral edge of the middle frame bracket, and the connecting ear is fixedly connected to the outer casing.
  • the vacuum chamber is provided with a support column, the support column is supported between the first plate and the second plate; the middle frame bracket is provided with a mounting hole, and the mounting hole is disposed at the The position of the support column.
  • the middle frame bracket extends outside the edge of the main board.
  • the electronic component is located at a side of the main board away from the middle frame bracket.
  • the mobile terminal further includes the display screen assembly, and a back surface of the display screen assembly is connected to the second board.
  • the middle frame bracket can play structural support and fix on the main board and other components on the terminal, and facilitate assembly and connection of components in the terminal; gasification and liquefaction of the two-phase liquid in the vacuum chamber Cycling can transfer the heat generated by the electronic components to the lower temperature of the middle frame bracket, so that the middle frame bracket can be used for heat dissipation to improve the heat dissipation effect; one component of the middle frame bracket can be used for structural support and heat dissipation. Function, simplify the terminal structure, and completely rely on the hardware cooling solution to solve the heat.
  • the temperature control is within the range acceptable to the user.
  • the frequency and charging current of the electronic components are not controlled by software, so that the terminal performance is fully exerted, resulting in better user experience.
  • FIG. 1 is a schematic structural diagram of a mobile terminal according to a first embodiment of the present invention.
  • Figure 2 is a cross-sectional view taken along line A-A of Figure 1;
  • FIG. 3 is a schematic structural diagram of a mobile terminal according to a second embodiment of the present invention.
  • FIG. 4 is a schematic structural diagram of a mobile terminal according to a third embodiment of the present invention.
  • FIG. 5 is a heat distribution diagram of the mobile terminal of Figure 4.
  • Fig. 6 is a heat distribution diagram of a mobile terminal in the prior art.
  • a mobile terminal includes a casing 1, a middle frame bracket 2, and a main board 3 provided with an electronic component 4; the middle frame bracket 2 is fixedly connected to the outer casing 1, and the main board 3 is fixedly connected to the middle frame bracket 2.
  • the middle frame bracket 2 can structurally support and fix the main board 3 and other components on the terminal, and facilitate assembly and connection of components in the terminal.
  • the electronic component 4 is an element that generates heat on the main board 3, such as a CPU or the like.
  • the electronic component 4 may be one or plural.
  • the middle frame bracket 2 includes a first plate 21 and a second plate which are arranged in a stacked manner.
  • the first plate 21 and the second plate 22 are both metal plates.
  • the first plate 21 and the second plate 22 are both copper plates.
  • the peripheral edges of both the first plate 21 and the second plate 22 are fixedly connected with a vacuum chamber 20 formed therebetween.
  • the vacuum chamber 20 is provided with a two-phase fluid (not shown), and the inner wall of the vacuum chamber 20 is provided with a capillary structure 23.
  • the capillary structure 23 may be any one of a wire mesh capillary structure, a porous metal foam structure, and a capillary structure formed by sintering loose powder.
  • the main board 3 is connected to the first board 21 to transfer the heat generated by the electronic component 4 to the first board 21 and to dissipate heat through the middle frame bracket 2.
  • the heat of the electronic component 4 is transferred to the first plate 21, the vaporization of the two-phase fluid in the vacuum chamber 20 begins to be heated, and the two-phase fluid absorbs thermal energy and rapidly expands in volume, and the gas in the gas phase fills the entire body.
  • the vacuum chamber 20 liquefies when the fluid in the gas phase contacts a lower temperature region and releases heat, and the liquefied fluid passes through the capillary structure 23 to return to the position of the heat source, that is, the electronic component 4.
  • the vaporization and liquefaction of the two-phase liquid is circulated in the vacuum chamber 20, and the heat generated by the electronic component 4 can be transmitted to the lower temperature position of the middle frame bracket 2, so that the heat can be dissipated by the middle frame bracket 2 to improve heat dissipation. effect.
  • the use of a component of the middle frame bracket 2 can serve both structural support and heat dissipation, simplifying the terminal structure.
  • the heat is completely solved by the hardware cooling solution, and the temperature control can be connected to the user. Within the scope of the control, the frequency of the electronic components such as the CPU and the charging current are not controlled by software, so that the performance of the terminal is fully exerted, resulting in a better user experience.
  • the main board 3 has a mounting board surface 30 on which the electronic component 4 is disposed; the mounting board surface 30 is disposed opposite the outer surface of the first board 21.
  • the accommodating groove 24 is formed in the outer surface of the first plate 21 at a position corresponding to the electronic component 4; the electronic component 4 is located in the accommodating groove 24, and the electronic component 4 is connected to the bottom surface of the accommodating groove 24.
  • the accommodating groove 24 is filled with a thermal grease (not shown), and the electronic component 4 can be covered by the thermal grease, so that the groove wall of the accommodating groove 24 can also absorb the heat of the electronic component 4, thereby Improve heat transfer performance.
  • the thermal grease can also fill a small gap between the electronic component 4 and the bottom surface of the receiving groove 24, thereby improving the degree of bonding between the two, and facilitating heat transfer to improve the heat dissipation effect.
  • a heat conductive silicon pad may be disposed in the accommodating groove 24, and the heat conductive silicon pad may be disposed between the electronic component 4 and the first plate 21, and may also fill the gap to improve heat transfer performance.
  • a space is provided between the inner surface of the second plate 22 and the inner surface of the first plate 21, so that a certain space exists at a corresponding position of the accommodating groove 24 and a two-phase fluid can be disposed.
  • the capillary structure 23 facilitates the two-phase fluid to sufficiently absorb the heat of the electronic component 4 to improve the heat dissipation capability.
  • the capillary structures 23 on the inner surfaces of both the first plate 21 and the second plate 22 are connected so that the fluid on the second plate 22 can enter the inner surface of the first plate 21 correspondingly At the position of the accommodating groove 24, the heat transfer performance is improved.
  • a gap is provided between the mounting plate surface 30 and the outer surface of the first plate 21.
  • the fastener can be used for fastening and the distance between the mounting plate surface 30 and the outer surface of the first plate 21 is reduced, so that the electronic component 4 is closely abutted against the groove of the accommodating groove 24.
  • the bottom surface enhances heat transfer performance between the electronic component 4 and the first board 21.
  • the second plate 22 has a flat shape, and is also in the shape of a flat plate at a position corresponding to the accommodating groove 24, so that the outer surface of the second plate 22 is entirely flat, which facilitates the mating connection of the second plate 22 with other components.
  • the mobile terminal further includes a display screen assembly 5, and the back surface of the display screen assembly 5 is connected to the second board 22.
  • the middle frame bracket 2 can facilitate the assembly of the display assembly 5, and can dissipate heat generated by the display assembly 5.
  • the display panel assembly 5 and the main board 3 are respectively disposed on both sides of the middle frame bracket 2, which can be easily assembled.
  • a connecting lug 25 is provided at the peripheral edge of the middle frame bracket 2, and the connecting lug 25 is fixedly connected to the outer casing 1.
  • the housing 1 can be conveniently connected to the middle frame bracket 2 by means of the connecting lug 25, for example, the connecting lug 25 can be fixedly connected to the outer casing 1 by means of screws.
  • the connecting lug 25 is formed by extending the edges of the first plate 21 and the second plate 22, that is, the connecting lug 25 has a two-layer structure, which can improve the structural strength of the connecting lug 25.
  • the connecting lug 25 may also be formed only by the edge of the first plate 21 or only by the edge of the second plate 22.
  • the outer casing 1 is a frame of the terminal, and the inner side surface thereof is provided with a positioning portion 11 which is stepped in the thickness direction of the middle frame bracket 2, and the connecting ear 25 at the edge of the middle frame bracket 2 Abutting against the step surface of the positioning portion 11, the edge of the main board 3 is fixedly connected to the outer casing 1 so as to press the middle frame bracket 2 between the positioning portion 11 and the main plate 3 to facilitate the assembly and connection of the middle frame bracket 2, and It is not necessary to provide other connection structures at the center of the middle frame bracket 2 to avoid damage to the vacuum chamber 20.
  • the connecting bracket 25 may not be provided at the edge of the middle frame bracket 2, and the edge of the middle frame bracket 2 may directly abut against the stepped surface of the positioning portion 11.
  • the middle frame bracket 2 extends beyond the edge of the main board 3, so that the size of the middle frame bracket 2 is larger than that of the main board 3.
  • the outer surface of the first board 21 is larger than the mounting board surface 30 of the main board 3, so that heat can be conducted to be relatively far away from the main board. At the position of 3, heat is prevented from being concentrated at the position of the main board 3, thereby improving heat dissipation performance.
  • the overall structure of the mobile terminal is substantially the same as that of the first embodiment, and the difference is that the connection structure between the middle frame bracket 2a and the outer casing 1a, and A connection structure between the middle frame bracket 2a and the main plate 3a.
  • middle frame bracket 2a and the outer casing 1a are directly fixedly connected to the outer casing 1a by screws using the connecting lugs 25a of the middle frame bracket 2a.
  • a support post 27a is disposed in the vacuum chamber 20a, and the support post 27a is supported between the first plate 21a and the second plate 22a; the middle frame bracket 2a is provided with a mounting hole, and the mounting hole 26a It is disposed at the position of the support column 27a.
  • the mounting hole 26a is a threaded hole, and the opening is located on the outer surface of the first plate 21a, and the main plate 3a is threaded through the screw and is screwed to the mounting hole 26a to connect the middle frame bracket 2a with the main plate 3a.
  • other components in the mobile terminal can be fixed to the middle frame bracket 2a by the mounting holes 26a.
  • Providing the mounting hole 26a at the position of the support post 27a can prevent the mounting hole 26a from affecting the structural strength of the middle frame bracket 2a while avoiding damage to the vacuum chamber 20a inside the middle frame bracket 2a.
  • the mounting hole may also be a through hole, and the main board 3a and the middle frame bracket 2a are sequentially threaded through the screw and screwed to the outer casing 1a, so that the main board 3a, the middle frame bracket 2a and the outer casing 1a can be realized. Assembly connection.
  • the mounting surface of the main board is disposed toward the middle frame bracket.
  • the other side of the main board may be disposed toward the middle frame bracket.
  • the main board 3b is connected to the first board of the middle frame bracket 2b, and the electronic component 4b is located at the side of the main board 3b away from the middle frame bracket 2b. The heat generated by the electronic component 4b can be transmitted to the middle frame bracket 2b through the main board 3b, and then radiated by the middle frame bracket 2b.
  • a thermal silicon pad can be disposed between the main board 3b and the middle frame bracket 2b, which can fill the gap between the main board 3b and the middle frame bracket 2b, thereby improving the heat transfer performance between the two, and can avoid the main board 3b and the middle frame bracket 2b.
  • the connection caused a short circuit.
  • FIG. 5 is a heat distribution diagram of a middle frame bracket on a mobile terminal according to a third embodiment of the present invention
  • FIG. 6 is a heat distribution of a common middle frame bracket structure in the same assembly mode in the prior art.
  • the heat distribution of the provided mobile terminal is relatively uniform, and is not concentrated at a certain point, which can effectively improve the heat dissipation performance and reduce the temperature of the mobile terminal.

Abstract

本发明公开了一种移动终端，包括外壳、中框支架及设置有电子元件的主板；中框支架包括层叠排布的第一板和第二板，第一板与第二板均为金属板，二者的四周边缘固定连接，且在二者之间形成有真空腔体；真空腔体设置有双相流体，真空腔体的内壁上设置有毛细结构；主板与第一板相连，以将电子元件产生的热量传递到第一板上，双相液体的气化、液化在真空腔体内循环进行，可以将热量传递到中框支架温度较低的位置处，实现散热；利用中框支架一个部件可以起到结构支撑及散热两个作用，简化终端结构，并将发热完全依靠硬件散热方案解决，温度控制在用户能接受的范围内，不通过软件控制电子元件的频率与充电电流大小，使终端性能充分发挥。

Description

一种移动终端 技术领域
本发明涉及电子产品，尤其涉及一种移动终端。
背景技术
伴随智能机的发展，CPU单核、双核提升到四核、八核，频率也越来高，移动终端发热过高越来越成为体验瓶颈，目前的解决方案为使用天然、人工石墨膜贴附于手机后盖内侧增强热扩散性能，降低机身表面温度，提高热体验感受。但该技术方案中，散热膜材料的使用改善一般会在3～8℃，温度降低有限，更多的改善需要软件对CPU降频或充电限流等散热管理措施实现，但这些措施都会降低手机的性能，影响用户体验。
发明内容
本发明所要解决的技术问题在于，提供一种移动终端，能够有效提高散热性能。
为了解决上述技术问题，本发明的实施例提供了一种移动终端，包括外壳、中框支架及设置有电子元件的主板；所述中框支架固定于所述外壳中，所述主板固定于所述中框支架；
所述中框支架包括层叠排布的第一板和第二板，所述第一板与所述第二板均为金属板，二者的四周边缘固定连接，且在二者之间形成有真空腔体；所述真空腔体设置有双相流体，所述真空腔体的内壁上设置有毛细结构；
所述主板与所述第一板相连，以将所述电子元件产生的热量传递到所述第一板上，并通过所述中框支架散热。
其中，所述主板具有安装板面，所述电子元件设置在所述安装板面上；所述安装板面与所述第一板的外表面相对设置；
所述第一板的外表面上与所述电子元件相对应的位置处凹陷形成有容置槽；所述电子元件位于所述容置槽中，且所述电子元件与所述容置槽的槽底面 相连。
其中，所述容置槽内填充有导热硅脂。
其中，在所述容置槽处，所述第二板的内表面与所述第一板的内表面之间设有间距，所述第一板和所述第二板二者的内表面上的所述毛细结构相连。
其中，所述第二板为平板状。
其中，所述中框支架的四周边缘处设置有连接耳，所述连接耳与所述外壳固定连接。
其中，所述真空腔体中设置有支撑柱，所述支撑柱支撑在所述第一板与所述第二板之间；所述中框支架设置有安装孔，所述安装孔设置在所述支撑柱的位置处。
其中，所述中框支架延伸至所述主板的边缘外。
其中，所述电子元件位于主板上远离所述中框支架的一侧处。
其中，所述移动终端还包括所述显示屏组件，所述显示屏组件的背面与所述第二板相连。
本发明实施例提供的移动终端，中框支架可以对终端上的主板及其他部件起到结构支撑及固定作用，便于终端中各元件的装配连接；双相液体的气化、液化在真空腔体内循环进行，可以将电子元件产生的热量传递到中框支架温度较低的位置处，从而可以利用中框支架进行散热，提高散热效果；利用中框支架一个部件可以起到结构支撑及散热两个作用，简化终端结构，并将发热完全依靠硬件散热方案解决，温度控制在用户能接受的范围内，不通过软件控制电子元件的频率与充电电流大小，使终端性能充分发挥，带来更好的用户体验。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1是本发明第一实施例提供的移动终端的结构示意图；
图2是图1中的A-A处剖面图；
图3是本发明第二实施例提供的移动终端的结构示意图；
图4是本发明第三实施例提供的移动终端的结构示意图；
图5是图4中的移动终端的热量分布图；
图6是现有技术中的移动终端的热量分布图。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述。
参见图1及图2，为本发明第一实施例提供的一种移动终端，包括外壳1、中框支架2及设置有电子元件4的主板3；中框支架2与外壳1固定连接，主板3与中框支架2固定连接。
中框支架2可以对终端上的主板3及其他部件起到结构支撑及固定作用，便于终端中各元件的装配连接。电子元件4为主板3上产生热量的元件，例如CPU等。电子元件4可以为一个，也可以为多个。
中框支架2包括层叠排布的第一板21和第二板。第一板21与第二板22均为金属板，作为优选，第一板21与第二板22均为铜板。第一板21与第二板22二者的四周边缘固定连接，且在二者之间形成有真空腔体20。真空腔体20设置有双相流体(图中未示出)，真空腔体20的内壁上设置有毛细结构23。毛细结构23可以为丝网毛细结构、多孔泡沫金属毛细结构、松散粉末烧结形成的毛细结构等中的任一种。
主板3与第一板21相连，以将电子元件4产生的热量传递到第一板21上，并通过中框支架2散热。当电子元件4的热量传递到第一板21上后，真空腔体20里的双相流体受热后开始产生的气化现象，此时双相流体吸收热能并且体积迅速膨胀，气相的流体充满整个真空腔体20，当气相的流体接触到一个温度较低的区域时液化，并释放热量，液化的流体会通过毛细结构23回到热源即电子元件4的位置处。
双相液体的气化、液化在真空腔体20内循环进行，可以将电子元件4产生的热量传递到中框支架2温度较低的位置处，从而可以利用中框支架2进行散热，提高散热效果。利用中框支架2一个部件可以起到结构支撑及散热两个作用，简化终端结构。将发热完全依靠硬件散热方案解决，温度控制在用户能接 受的范围内，不通过软件控制电子元件如CPU的频率与充电电流大小，使终端性能充分发挥，带来更好的用户体验。
主板3具有安装板面30，电子元件4设置在安装板面30上；安装板面30与第一板21的外表面相对设置。第一板21的外表面上与电子元件4相对应的位置处凹陷形成有容置槽24；电子元件4位于容置槽24中，且电子元件4与容置槽24的槽底面相连。利用容置槽24可以使得中框支架2对电子元件4形成包围，可以增强吸热能力，提高散热效果，同时可以充分利用电子元件4周围的空间，使得结构紧凑，利于终端的小型化。
进一步，容置槽24内填充有导热硅脂(图中未示出)，利用导热硅脂可以将电子元件4包覆，使得容置槽24的槽壁也可以吸收电子元件4的热量，从而提高热传递性能。导热硅脂还可以填充电子元件4与容置槽24的槽底面之间的微小空隙，提高二者的结合度，便于热量传递，以提高散热效果。此处，在其他实施方式中，也可以在容置槽24中设置导热硅垫，利用导热硅垫设置在电子元件4与第一板21之间，亦可以填充空隙，提高热传递性能。
在容置槽24处，第二板22的内表面与第一板21的内表面之间设有间距，可以使得在容置槽24的对应位置处存在一定空间并可以设置有双相流体及毛细结构23，利于双相流体充分吸收电子元件4的热量，以提高散热能力。在容置槽24的对应位置处，第一板21和第二板22二者的内表面上的毛细结构23相连，使得第二板22上的流体能够进入到第一板21内表面上对应容置槽24的位置处，提高热传递性能。
安装板面30与第一板21的外表面之间设有间隙。在进行装配紧固时，可以利用紧固件进行紧固并减小安装板面30与第一板21的外表面之间的距离，从而使得电子元件4紧密抵靠于容置槽24的槽底面，提高电子元件4与第一板21之间的热传递性能。
第二板22为平板状，使其在对应容置槽24的位置处亦为平板状，可使得第二板22的外表面整体为平面，利于第二板22与其他部件的配合连接。
进一步，移动终端还包括显示屏组件5，显示屏组件5的背面与第二板22相连，利用中框支架2可以便于显示屏组件5的装配，同时可以对显示屏组件5产生的热量进行散热。显示屏组件5与主板3分别设置在中框支架2的两侧，可以方便装配。
中框支架2的四周边缘处设置有连接耳25，连接耳25与外壳1固定连接。通过连接耳25可以方便的实现外壳1与中框支架2装配连接，例如可以利用螺钉将连接耳25与外壳1进行固定连接。连接耳25由第一板21和第二板22的边缘延伸形成，即连接耳25为双层结构，可以提高连接耳25的结构强度。此处，在其他实施方式中，连接耳25也可以仅由第一板21的边缘延伸形成，或者仅由第二板22的边缘延伸形成。
在本实施例中，外壳1为终端的边框，其内侧表面上设置有定位部11，定位部11在中框支架2的厚度方向上为阶梯形，中框支架2的边缘处的连接耳25抵靠于定位部11的阶梯面上，主板3的边缘与外壳1固定连接，从而将中框支架2压紧在定位部11与主板3之间，以方便中框支架2的装配连接，且无需在中框支架2的中心部位设置其他连接结构，以避免对真空腔体20造成破坏。此处，在其他的实施方式中，中框支架2的边缘处也可以不设置连接耳25，而直接将中框支架2的边缘处抵靠于定位部11的阶梯面上。
中框支架2延伸至主板3的边缘外，使得中框支架2的尺寸相对主板3较大，第一板21的外表面大于主板3的安装板面30，从而可以将热量传导到相对远离主板3的位置处，避免热量集中在主板3的位置处进行散热，进而提高散热性能。
如图3所示，在本发明提供的第二实施例中，移动终端的整体结构与第一实施例大致相同，其不同之处在于，中框支架2a与外壳1a之间的连接结构，及中框支架2a与主板3a之间的连接结构。
具体地，中框支架2a与外壳1a之间，利用中框支架2a的连接耳25a通过螺钉与外壳1a直接固定连接。
中框支架2a与主板3a之间，真空腔体20a中设置有支撑柱27a，支撑柱27a支撑在第一板21a与第二板22a之间；中框支架2a设置有安装孔，安装孔26a设置在支撑柱27a的位置处。本实施例中，安装孔26a为螺纹孔，其开口位于第一板21a的外表面上，通过螺钉穿设主板3a并与安装孔26a螺纹连接，以将中框支架2a与主板3a连接。同时，利用安装孔26a可以将移动终端中的其他部件固定至中框支架2a上。
将安装孔26a设置在支撑柱27a的位置处，可以避免安装孔26a对中框支架2a的结构强度造成影响，同时避免对中框支架2a内部的真空腔体20a造成破坏。
此处，在其他实施方式中，安装孔也可以为通孔，通过螺钉依次穿设主板3a、中框支架2a并与外壳1a螺纹连接，可以实现主板3a、中框支架2a与外壳1a之间的装配连接。
在上述两个实施例中，主板的安装面朝向中框支架设置，当然，在其他实施例中，也可以是主板的另一面朝向中框支架设置。如图4所示，在本发明提供的第三实施方式中，主板3b与中框支架2b的第一板相连，电子元件4b位于主板3b上远离中框支架2b的一侧处。电子元件4b产生的热量可以通过主板3b传递到中框支架2b上，再通过中框支架2b进行散热。主板3b与中框支架2b之间可以设置导热硅垫，可填充主板3b与中框支架2b之间的空隙，提高二者之间的热传递性能，同时可以避免主板3b与中框支架2b电连接造成短路。
如图5所示，为本发明第三实施方式提供的移动终端上中框支架的热量分布图，图6为现有技术中相同装配方式下普通中框支架结构的热量分布，可见，本发明提供的移动终端的热量分布相对较为均匀，不会集中在某一点上，可以有效提高散热性能，降低移动终端的温度。
以上所述的实施方式，并不构成对该技术方案保护范围的限定。任何在上述实施方式的精神和原则之内所作的修改、等同替换和改进等，均应包含在该技术方案的保护范围之内。

Claims (10)

  1. 一种移动终端，其特征在于，包括外壳、中框支架及设置有电子元件的主板；所述中框支架固定于所述外壳中，所述主板固定于所述中框支架；
    所述中框支架包括层叠排布的第一板和第二板，所述第一板与所述第二板均为金属板，二者的四周边缘固定连接，且在二者之间形成有真空腔体；所述真空腔体设置有双相流体，所述真空腔体的内壁上设置有毛细结构；
    所述主板与所述第一板相连，以将所述电子元件产生的热量传递到所述第一板上，并通过所述中框支架散热。
  2. 根据权利要求1所述的移动终端，其特征在于，所述主板具有安装板面，所述电子元件设置在所述安装板面上；所述安装板面与所述第一板的外表面相对设置；
    所述第一板的外表面上与所述电子元件相对应的位置处凹陷形成有容置槽；所述电子元件位于所述容置槽中，且所述电子元件与所述容置槽的槽底面相连。
  3. 根据权利要求2所述的移动终端，其特征在于，所述容置槽内填充有导热硅脂。
  4. 根据权利要求2所述的移动终端，其特征在于，在所述容置槽处，所述第二板的内表面与所述第一板的内表面之间设有间距，所述第一板和所述第二板二者的内表面上的所述毛细结构相连。
  5. 根据权利要求2所述的移动终端，其特征在于，所述第二板为平板状。
  6. 根据权利要求1所述的移动终端，其特征在于，所述中框支架的四周边缘处设置有连接耳，所述连接耳与所述外壳固定连接。
  7. 根据权利要求1所述的移动终端，其特征在于，所述真空腔体中设置有支撑柱，所述支撑柱支撑在所述第一板与所述第二板之间；所述中框支架设置有安装孔，所述安装孔设置在所述支撑柱的位置处。
  8. 根据权利要求7所述的移动终端，其特征在于，所述中框支架延伸至所述主板的边缘外。
  9. 根据权利要求1所述的移动终端，其特征在于，所述电子元件位于主板 上远离所述中框支架的一侧处。
  10. 根据权利要求1-9任一项所述的移动终端，其特征在于，所述移动终端还包括所述显示屏组件，所述显示屏组件的背面与所述第二板相连。
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