WO2023116592A1 - 电路板组件和电子设备 - Google Patents

电路板组件和电子设备 Download PDF

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Publication number
WO2023116592A1
WO2023116592A1 PCT/CN2022/139839 CN2022139839W WO2023116592A1 WO 2023116592 A1 WO2023116592 A1 WO 2023116592A1 CN 2022139839 W CN2022139839 W CN 2022139839W WO 2023116592 A1 WO2023116592 A1 WO 2023116592A1
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WIPO (PCT)
Prior art keywords
board
circuit board
electronic device
layer
rigid
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Application number
PCT/CN2022/139839
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English (en)
French (fr)
Inventor
江志成
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维沃移动通信有限公司
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Application filed by 维沃移动通信有限公司 filed Critical 维沃移动通信有限公司
Publication of WO2023116592A1 publication Critical patent/WO2023116592A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards

Definitions

  • the present application relates to the technical field of electronic products, in particular to a circuit board assembly and electronic equipment.
  • the application provides a circuit board assembly and electronic equipment, which can improve the heat dissipation effect of the electronic equipment.
  • circuit board assembly including:
  • the first rigid-flex board includes a stacked hard board layer and a soft board layer, the hard board layer covers the surface of the soft board layer, and the soft board layer includes a flexible substrate and a heat conduction layer, the heat conduction layer covers the surface of the flexible substrate, the first rigid-flex board is provided with a first electronic device, the heat conduction layer has a heat dissipation area, and the heat dissipation area does not cover the hard board layer;
  • the first circuit board, the first cavity is enclosed between the first circuit board and the first rigid-flex board, the heat dissipation area is located outside the first cavity, and the first electronic device located in the first cavity.
  • an embodiment of the present application provides an electronic device, including the circuit board assembly described in the first aspect above.
  • the rigid-flex board includes a heat conduction layer
  • the heat conduction layer includes a heat dissipation area outside the first cavity.
  • the heat generated by the first electronic device located in the first cavity during operation can be conducted to the heat dissipation area through the heat conduction layer for heat dissipation, thereby improving the heat dissipation effect of the electronic equipment including the circuit board assembly.
  • the thickness of the stack and the amount of board-to-board connectors used in the multi-layer circuit board can also be reduced, thereby reducing the size of the electronic device.
  • Fig. 1 is one of the result schematic diagrams of the circuit board assembly provided by the embodiment of the present application.
  • Fig. 2 is the second schematic diagram of the result of the circuit board assembly provided by the embodiment of the present application.
  • Fig. 3 is the third schematic diagram of the result of the circuit board assembly provided by the embodiment of the present application.
  • Fig. 4 is the fourth schematic diagram of the result of the circuit board assembly provided by the embodiment of the present application.
  • Fig. 5 is the fifth schematic diagram of the result of the circuit board assembly provided by the embodiment of the present application.
  • Fig. 6 is the sixth schematic diagram of the result of the circuit board assembly provided by the embodiment of the present application.
  • Fig. 7 is a schematic diagram of the expansion of the first rigid-flex board in the embodiment of the present application.
  • Fig. 8 is one of the structural schematic diagrams of a connecting end of the first rigid-flex board in the embodiment of the present application.
  • Fig. 9 is the second structural schematic diagram of a connecting end of the first rigid-flex board in the embodiment of the present application.
  • Fig. 10 is one of the structural schematic diagrams of the second rigid-flex board in the embodiment of the present application.
  • Fig. 11 is the second structural schematic diagram of the second rigid-flex board in the embodiment of the present application.
  • Fig. 12 is a schematic diagram of the connection between the first circuit board assembly and the second circuit board assembly in the embodiment of the present application.
  • first, second and the like in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific sequence or sequence. It should be understood that the terms so used are interchangeable under appropriate circumstances such that the embodiments of the application can be practiced in sequences other than those illustrated or described herein, and that references to "first,” “second,” etc. distinguish Objects are generally of one type, and the number of objects is not limited. For example, there may be one or more first objects.
  • “and/or” in the specification and claims indicates at least one of the connected objects, and the character “shows that it generally indicates that the related objects before and after are an "or” relationship.
  • the embodiments of the present application provide a circuit board assembly and an electronic device to solve the problem of poor heat dissipation effect of existing multi-layer stacked circuit boards.
  • FIG. 1-11 is a schematic structural diagram of the circuit board assembly provided by the embodiment of the present application.
  • the circuit board assembly includes:
  • the first rigid-flex board 110, the first rigid-flex board 110 includes a stacked hard board layer 111 and a soft board layer 112, the hard board layer 111 covers the surface of the soft board layer 112, the The soft board layer 112 includes a flexible substrate 1122 and a heat conduction layer 1121, the heat conduction layer 1121 covers the surface of the flexible substrate 1122, the first rigid-flex board 110 is provided with a first electronic device 130, and the electronic The device is electrically connected to the heat conduction layer 1121, the heat conduction layer 1121 has a heat dissipation area 113, and the heat dissipation area 113 does not cover the hard board layer 111;
  • the first circuit board 140, the first cavity is enclosed between the first circuit board 140 and the first rigid-flex board 110, the heat dissipation area 113 is located outside the first cavity, the The first electronic device 130 is located in the first cavity.
  • the first rigid-flex board 110 may be various types of rigid-flex boards in the related art.
  • the hard board layer 111 can be covered on both sides of the soft board layer 112 respectively.
  • the above-mentioned thermal conduction layer 1121 can be a flexible conductive and thermally conductive etched metal layer, generally a copper layer, or a mixed metal laminate such as gold-plated, nickel-plated, etc.
  • Different electronic devices can be electrically connected through the heat conduction layer 1121, and at the same time, the heat generated by the electronic devices disposed on the first rigid-flex board 110 during operation can also be conducted to the heat dissipation area through the heat conduction layer 1121 for heat dissipation .
  • the first rigid-flex board 110 and the first circuit board 140 can form a multi-layer stacked circuit board, and the first rigid-flex board 110 and the first circuit board 140 can be respectively It is used to install various devices in electronic equipment, and the first rigid-flex board 110 and the first circuit board 140 can be electrically connected.
  • the circuit board assembly may further include a ring-shaped connection board 200, the first rigid-flex board 110 is electrically connected to the first circuit board 140 through the connection board 200, and the The first rigid-flex board 110 , the connection board 200 and the first circuit board 140 together form the first cavity, wherein the connection board 200 may be an interposer.
  • first rigid-flex board 110 may also be directly electrically connected to the first circuit board 140, for example, referring to FIG. A groove is formed on one side, and the first circuit board 140 is directly welded to the first rigid-flex board 110 to enclose and form the first cavity, wherein the first circuit board 140 can be a Cavity Connection board 200 .
  • the heat in the first cavity can be conducted to the heat dissipation device 120 through the flexible layer 112 of the first rigid-flex board 110, that is, the heat generated by the electronic device in the first cavity can be
  • the flexible layer 112 of the first rigid-flex board 110 conducts to the heat dissipation device 120 , so as to realize the heat dissipation of the electronic device in the first cavity.
  • the electronic devices in the first cavity may include the first electronic devices 130 mounted on the first rigid-flex board 110 , or various electronic devices mounted on the first circuit board 140 . electronic devices.
  • the above-mentioned first circuit board 140 may be various types of circuit boards commonly used in the prior art.
  • the first circuit board 140 may also be a rigid-flex board.
  • the number of the above-mentioned first electronic devices 130 may be multiple, and the multiple first electronic devices 130 may include various types of electrical components in electronic equipment.
  • the above-mentioned first electronic device 130 may be various electronic components in electronic equipment. It can be understood that different electronic components in electronic equipment may be connected through the first rigid-flex board 110 to form various circuits . Wherein, the first electronic device 130 may be directly electrically connected to the soft board layer 112. In addition, the first electronic device 130 may also be connected to the soft board layer 112 through the hard board layer 111 covering the surface of the soft board layer 112. electrical connection. In this way, different electronic components can be electrically connected through the flexible layer 112 of the first rigid-flex board 110 .
  • the soft board layer 112 may include a flexible substrate 1122 and a heat conduction layer 1121 covering both sides of the flexible substrate 1122 .
  • the heat dissipation area 113 may be an area where the soft board layer 112 does not cover the hard board layer 111 .
  • the rigid-flex board 110 since the rigid-flex board 110 includes a heat conduction layer 1121 , and the heat conduction layer 1121 includes a heat dissipation area 113 outside the first cavity. In this way, the heat generated by the first electronic device 130 in the first cavity during operation can be conducted to the heat dissipation area 113 through the heat conduction layer 1121 for heat dissipation, thereby improving the heat dissipation effect of the electronic equipment including the circuit board assembly . That is, the heat dissipation effect of the multilayer stacked circuit board can be improved.
  • the circuit board assembly further includes a heat dissipation device 120 disposed on the heat dissipation area 113 .
  • the above-mentioned heat dissipation device 120 may be various components used for heat dissipation in electronic equipment, for example, it may be a housing, a bracket, a vapor chamber, etc. in an electronic equipment. In this way, the heat generated during the operation of the electronic device can be conducted to the heat dissipation component for heat dissipation.
  • the heat dissipation device 120 may also be an electronic device that generates less heat during operation, for example, a battery 310 , a speaker, and the like. In this way, the heat of various parts in the electronic device can be balanced, and the problem of local high temperature can be avoided.
  • the heat dissipation device 120 when the heat dissipation device 120 is an electronic device, while the heat dissipation device 120 is thermally connected to the heat dissipation region 113 , it can also be electrically connected to the first rigid-flex board 110 based on its own terminals. In order to realize conduction between the heat dissipation device 120 and other electronic devices in the electronic equipment through the first rigid-flex board 110 .
  • the heat dissipation device 120 may be directly bonded to the heat dissipation area 113 , or may be connected through a heat conducting component.
  • the heat generated by the electronic devices connected to the first rigid-flex board 110 during operation can be directly conducted to the heat dissipation area 113 through the heat conduction layer 1121 of the flexible board layer 112, and the heat conducted to the heat dissipation area 113 can be further conducted to the heat dissipation device 120, so as to dissipate the heat generated during the operation of the electronic device.
  • the heat conduction layer 1121 has a heat conduction area 114, the heat conduction area 114 does not cover the hard board layer 111, and the heat conduction area 114 is located in the first cavity;
  • the first cavity is filled with a first insulating and heat-conducting medium 150 .
  • the first insulating and heat-conducting medium 150 may be various types of insulating and heat-conducting medium in the prior art, for example, may be heat-conducting silicone grease.
  • the electronic device in the first cavity may be connected to the heat conduction region 114 through the first insulating and heat conducting medium 150 , for example, the first cavity may be filled with the first insulating and heat conducting medium 150 .
  • the heat generated during the operation of the electronic device in the first cavity can be conducted to the heat conduction area 114 through the first insulating heat conduction medium 150, and the heat conducted to the heat conduction area 114 can be conducted to the heat sink through the soft board layer 112. area 113 , and then, the heat in the heat dissipation area 113 can be further conducted to the heat dissipation device 120 for heat dissipation.
  • the above-mentioned first rigid-flex board 110 or the first circuit board 140 may be provided with an injection hole 141 and an exhaust hole 142 for filling the first insulating and heat-conducting medium 150, for example, please refer to FIG. 1 , in this application
  • the surface of the first circuit board 140 is respectively provided with an injection hole 141 and an exhaust hole 142 for communicating with the first cavity, so that the first insulator can be insulated through the injection hole 141.
  • the heat conducting medium 150 is injected into the first cavity, so that the air in the first cavity can be discharged through the exhaust hole 142 during the injection process.
  • the heat generated by the electronic device inside the first cavity can be quickly conducted to the heat-conducting region 114 through the first insulating and heat-conducting medium 150, Therefore, it is beneficial to further improve the heat dissipation effect on the electronic devices in the first cavity.
  • a shielding cover is usually provided inside the existing electronic device to isolate components that may have mutual influence through the shielding cover.
  • the shielding case usually needs to be sealed at a specific position of the circuit board to isolate the electronic devices installed at the specific position, a closed space is usually formed between the shielding case and the circuit board. Heat generated by electronic components inside a shield is often difficult to dissipate. As a result, the problem of poor heat dissipation inside the shielding case is caused.
  • the circuit board assembly further includes a first shielding case 180, and the first shielding case 180 is located on the first rigid-flex board 110 facing away from the first One side of the circuit board 140, and the first shielding case 180 is connected to the first rigid-flex board 110, and the first shielding case 180 and the first rigid-flex board 110 are enclosed to form a second Two chambers;
  • the first rigid-flex board 110 is provided with a second electronic device 160 , the second electronic device 160 is located in the second cavity, and a second insulating and heat-conducting medium 170 is provided in the second cavity.
  • the number of the second electronic devices 160 may be multiple, and the multiple second electronic devices 160 may include various types of electrical components in electronic equipment.
  • the above-mentioned second insulating and heat-conducting medium 170 may be various types of insulating and heat-conducting medium in the prior art, for example, may be heat-conducting silicone grease.
  • the second electronic device 160 can be connected to the first shield 180 through the second insulating and heat-conducting medium 170, so that the heat generated during the operation of the second electronic device 160 can pass through the second insulating and heat-conducting medium 170 quickly Conducted to the first shield 180 to dissipate heat through the first shield 180 .
  • an injection hole 141 for injecting the second insulating and heat-conducting medium 170 into the second cavity may also be opened on the first shielding cover 180 .
  • an injection hole 141 is opened on the first shielding case 180 , and the first After the second insulating and heat-conducting medium 170 , a sealing plate 190 for closing the injection hole 141 may be connected to the first shielding case 180 .
  • the heat generated by the second electronic device 160 in the first shield 180 can pass through the first rigid-flex board.
  • the flexible board layer 112 of 110 is conducted to the heat dissipation device 120 , so as to improve the heat dissipation effect of the second electronic device 160 in the first shielding case 180 .
  • the circuit board assembly further includes a second shielding case 330 , and the second shielding case 330 is located on the first circuit board 140 facing away from the first circuit board 140 .
  • One side of a rigid-flex board 110, and the second shielding case 330 is connected to the first circuit board 140, and the second shielding case 330 and the first circuit board 140 are enclosed to form a third cavity;
  • the side of the first circuit board 140 facing away from the first rigid-flex board 110 is provided with a seventh electronic device 340, the third cavity is filled with a third insulating and heat-conducting medium 350, and the seventh electronic device 340 is connected to the second shielding case 330 through the third insulating and heat-conducting medium 350 .
  • the heat generated by the seventh electronic device 340 in the second shielding case 330 can be quickly conducted to the first circuit board 140 through the third insulating and heat-conducting medium 350.
  • the second shielding case 330 is used to dissipate heat through the second shielding case 330 .
  • the soft board layer 112 includes a first segment 1124 that does not cover the hard board layer 111 , and the first segment 1124 includes a coil wound around the heat dissipation device 120 In the winding part, the heat dissipation area 113 is located in the winding part.
  • the soft board layer 112 may be a flexible circuit board. Since the first section 1124 of the soft ply 112 does not cover the hard ply 111 , that is, the first section 1124 does not cover the hard ply. Therefore, the first segment 1124 can be wound arbitrarily inside the electronic device. In this way, the first segment 1124 can be wound inside the electronic device, so that more electronic devices in the electronic device can be electrically connected to the first rigid-flex board 110 , thereby realizing Realize the interconnection between more electronic devices in electronic equipment.
  • first segment 1124 can also be wound around the heat dissipation device 120 , wherein the winding portion can be wound close to the heat dissipation device 120 .
  • the contact area between the heat sink 120 and the first segment 1124 can be increased, that is, the contact area between the first segment 1124 can be increased.
  • the area of the heat dissipation region 113 can be increased, so that the heat dissipation effect during the heat dissipation process based on the first rigid-flex board 110 can be further improved.
  • the circuit board assembly includes at least two heat dissipation devices 120 .
  • the heat dissipation region 113 may include at least two heat conduction subregions, wherein one heat conduction subregion corresponds to one heat dissipation device 120 , and the heat dissipation device 120 is connected to the heat dissipation subregion corresponding to the heat dissipation device 120 .
  • the at least two heat dissipation devices 120 are usually distributed in different positions inside the electronic device. Therefore, in one embodiment of the present application, the first segment 1124 of the soft board layer 112 can be bent or wound inside the electronic device, so as to realize that the soft board layer 112 is connected to the at least two parts respectively. A heat dissipation device 120 is connected.
  • the at least two heat dissipation components include a battery 310, a speaker module 260, and a middle frame 300
  • the first segment 1124 includes a first sub-segment 11241 and a second sub-segment 11242, so The first sub-section 11241 and the second sub-section 11242 protrude from both ends of the hard board layer 111 respectively, and a part of the first sub-section 11241 is attached to the middle frame 300 Therefore, another part of the first subsection 11241 is wound around the battery 310, and at the same time, the first subsection 11241 is provided with a first electrical connection area 1125 for electrical connection with the battery 310, The first rigid-flex board 110 is electrically connected to the battery 310 through the first electrical connection area 1125 .
  • a part of the second subsection 11242 is attached to the middle frame 300, another part of the second subsection 11242 is attached to the speaker module 260, and the second subsection 11242 There is a second electrical connection area 1126 for electrical connection with the speaker module 260 , and the first rigid-flex board 110 is electrically connected with the speaker module 260 through the second electrical connection area 1126 .
  • the heat conducted to the soft board layer 112 can be conducted to the at least two heat dissipation parts respectively, thereby further improving The heat dissipation effect in the heat dissipation process based on the first rigid-flex board 110 for heat dissipation.
  • the circuit board assembly further includes a fifth electronic device
  • the first rigid-flex board 110 includes a board body and an extension board 320 extending outward from one side of the board body, the first The five electronic devices are electrically connected to the first rigid-flex board 110 through the extension board 320 .
  • the first electrical connection area 1125 and the second electrical connection area 1126 are respectively located at two ends of the connecting board body, and the extension board 320 is further provided with a third electrical connection area 1127 .
  • the fifth electronic device is a display module 270 , and the display module 270 is electrically connected to the third electrical appliance connection area 1127 .
  • the extension board 320 includes a first part perpendicular to the combination board body and a second part opposite to the combination board body, and the fifth electronic device is located in the second part facing away from the first soft part.
  • One side of the hard bonded board 110 One side of the hard bonded board 110 .
  • a third insulating and heat-conducting medium 350 is provided between the second portion and the first shielding case 180 , and the second portion is connected to the first shielding case 180 through the third insulating and heat-conducting medium 350 . Since the display module 270 is located on the outer surface of the electronic device, the display module 270 can be used as a heat dissipation component. In this way, the heat transferred from the first rigid-flex board 110 to the first shielding case 180 can pass through the first shielding case 180 sequentially.
  • the third insulating and heat-conducting medium 350 and the second part are delivered to the display module 270 for emission.
  • the first rigid-flex board 110 by making the first rigid-flex board 110 include a board body and an extension board 320, the first rigid-flex board 110 can be connected to more electronic devices. Since the combination board body and the extension board 320 are integrally formed, the usage of board-to-board connectors can be reduced, thereby reducing the size of the electronic device.
  • the heat generated by the fifth electronic device mounted on the extension board 320 can be transferred to the heat dissipation component through the extension board 320 and the first rigid-flex board 110 in sequence.
  • the heat on the first rigid-flex board 110 may also be transferred to the fifth electronic device through the extension plate 320 for heat dissipation.
  • the soft board layer 112 includes a heat conduction layer 1121 and a heat conduction film 1123 , and the heat conduction film 1123 covers the surface of the heat conduction layer 1121 .
  • the heat conduction film 1123 may be various types of insulating and heat conduction film materials in the prior art.
  • it may be a film material formed by adding graphite to an ordinary insulating film material.
  • the electronic device electrically connected to the first rigid-flex board 110 may pass through the heat conduction film 1123 and be electrically connected to the flexible circuit board.
  • the heat conduction effect of the soft board layer 112 can be further improved by covering the heat conduction film 1123 on the surface of the heat conduction layer 1121, so that when heat is conducted to the heat conduction region 114 of the heat conduction film 1123, it can pass through
  • the heat conduction film 1123 conducts heat and conducts heat to the heat dissipation area 113 to improve the efficiency of heat conduction in the flexible board layer 112 , thereby further improving the heat dissipation effect in the heat dissipation process based on the first rigid-flex board 110 .
  • the circuit board assembly further includes a third electronic device 210, a connection hole 11231 is opened on the surface of the heat conduction film 1123, and a connection terminal of the third electronic device 210 passes through the connection hole 11231 and the The heat conduction layer 1121 is electrically connected.
  • the part of the heat conduction layer 1121 opposite to the connection hole 11231 may be exposed outside the heat conduction film 1123 , and in one embodiment of the present application, the heat conduction film 1123 may be A plurality of connection holes 11231 are opened, so that the portions of the heat conduction layer 1121 opposite to the plurality of connection holes 11231 can jointly form pads, so that the heat conduction layer 1121 is soldered to the third electronic device 210 through the pads.
  • the heat conduction layer 1121 is soldered to the third electronic device 210 through spherical solder balls, and the solder balls are in contact with the heat conduction film 1123, so as to connect the third electronic device 210 during operation.
  • the generated heat is conducted to the heat conduction film 1123 through the solder balls to dissipate heat.
  • the heat generated during the operation of the third electronic device 210 can be directly transferred to the heat-conducting layer 1121 and the heat-conducting film 1123, thereby passing
  • the heat conduction layer 1121 and the heat conduction film 1123 are directly transferred to the heat dissipation area 113 to further improve the heat dissipation effect during the heat dissipation process based on the first rigid-flex board 110 .
  • the hard board layer 111 includes a ring-shaped first region 1111
  • the circuit board assembly further includes a fourth electronic device 280 and a sixth electronic device 290, and the fourth electronic device 280 and the heat conduction layer 1121 are electrically connected, and the first region 1111 is disposed around the fourth electronic device 280 , and the sixth electronic device 290 is located in the first region 1111 .
  • the thickness dimension of the electronic equipment is related to the height dimension of the electronic devices installed in the electronic equipment to a certain extent, and various types of electronic devices need to be installed inside the electronic equipment, and the shapes of the electronic devices are usually different.
  • the height of some electronic devices is relatively large, it may generally lead to an increase in the overall thickness of the electronic device, which is not conducive to the thinning of the electronic device.
  • the fourth electronic device 280 may be an electronic device with a larger height and dimension in the electronic device.
  • electronic devices with a larger height and dimension can be installed inside the first area 1111, that is, the fourth electronic device 280 and the soft board Layer 112 is directly electrically connected.
  • the sum of the thicknesses of the fourth electronic device 280 and the first rigid-flex board 110 is: the height of the fourth electronic device 280 and the thickness of the flexible board layer 112 sum of thicknesses.
  • the fourth electronic device 280 is installed on the hard board layer 111, even if the fourth electronic device 280 is connected to the soft board layer 112 through the hard board layer 111, after the fourth electronic device 280 is installed, the fourth electronic device 280
  • the sum of the height of the first rigid-flex board 110 is: the sum of the height of the fourth electronic device 280 , the thickness of the rigid board layer 111 and the thickness of the soft board layer 112 . It can be seen that, in the embodiment of the present application, by directly connecting the fourth electronic device 280 to the flexible board layer 112 , it is beneficial to reduce the overall thickness of the circuit board assembly, and further facilitate the thinning of electronic equipment.
  • the first region 1111 can also be provided with a sixth electronic device 290 , and the sixth electronic device 290 can communicate with the soft board layer 111
  • the board layers 112 are electrically connected.
  • the fourth electronic device 280 by installing the fourth electronic device 280 inside the annular area, it is beneficial to reduce the overall thickness of the circuit board assembly.
  • the annular area is a hard board layer, the The annular area effectively supports the flexible board area inside the annular area, avoiding bending of the flexible board area inside the annular area, thereby improving the stability of the connection between the fourth electronic device 280 and the flexible board layer 112 .
  • the circuit board assembly includes a connector 220, a reinforcement board 230 and a second circuit board, and the connector 220 and the reinforcement board 230 are respectively arranged on opposite sides of the first rigid-flex board 110.
  • the first rigid-flex board 110 is electrically connected to the second circuit board through the connector 220 .
  • the connector 220 can be various types of connectors used to connect different electronic devices in the prior art, for example, please refer to FIG. 8 , in one embodiment of the present application, the connector 220 can be a BTB connector .
  • the BTB connector is arranged at one end of the flexible board layer 112, and the first rigid-flex board 110 can be electrically connected to the second circuit board through the BTB connector 220.
  • a reinforcing plate 230 can be provided on the side of the soft board layer 112 facing away from the BTB connector 220, so that the first rigid-flex board 110 can be strengthened against the BTB.
  • the supporting effect of the connector 220 prevents bending at the joint between the first rigid-flex board 110 and the BTB connector 220 .
  • the circuit board assembly includes a second circuit board
  • the heat conduction layer 1121 includes a second area
  • the second area does not cover the hard board layer 111
  • the first The second area forms a gold finger 250 or a pad 240
  • the first rigid-flex board 110 is electrically connected to the second circuit board through the second area, wherein the pad 240 may be a gold pad.
  • connection methods can be used to electrically connect the second circuit board to the first rigid-flex board 110 according to the specific type of the second circuit board.
  • the second circuit board includes a second rigid-flex board 360, a third shield 390, an eighth electronic device 400, and a ninth electronic device 410, and the third shield 390 and the second soft
  • the hard-bonded board 360 is connected, and the third shielding cover 390 and the second rigid-flex board 360 enclose to form a fourth cavity, and the eighth electronic device 400 and the ninth electronic device 410 are respectively connected to the
  • the second rigid-flex board 360 is electrically connected, and the eighth electronic device 400 and the ninth electronic device 410 are respectively located in the fourth cavity;
  • the second rigid-flex board 360 includes a second hard board layer 3601 and a second soft board layer 3602, the second hard board layer 3601 covers the surface of the second soft board layer 3602, and the second hard board layer 3602 covers the surface of the second soft board layer 3602.
  • the board layer 3601 is provided with a first groove opening toward the third shielding case 390, at least part of the eighth electronic device 400 is embedded in the first groove, and the ninth electronic device 410 is located in the first groove. Outside the first groove;
  • the eighth electronic device 400 and the ninth electronic device 410 are electrically connected to the second hard board layer 3601 respectively.
  • first rigid-flex board 110 and the second rigid-flex board 360 may be different circuit boards in the same electronic device, and the first rigid-flex board 110 and the second rigid-flex board 360 The hard bonded board 360 is electrically connected.
  • the above-mentioned eighth electronic device 400 and ninth electronic device 410 may be any electronic device in an electronic device, and the eighth electronic device 400 may be an electronic device with a larger height in an electronic device.
  • a second hard board can be arranged at the groove bottom or the groove wall of the first groove Electrical connections to layer 3601 for mounting electronics.
  • the area facing the second hard board layer 3601 and the third shielding case 390 can be divided into a first connection area and a second connection area, wherein the groove bottom of the first groove forms the The first connecting region, other regions other than the first groove form the second connecting region, since the first connecting region and the second connecting region are respectively located on different planes, the first connecting region
  • the connection area and the second connection area jointly form a stepped position. Since the first groove is opened in the first connection area, that is, there is a partial hollow in the first connection area of the second hard board layer 3601, therefore, the thickness dimension of the second hard board layer 3601 in the first connection area is relatively small.
  • the eighth electronic device 400 with a larger height in the electronic device can be arranged in the first connection area, that is, the eighth electronic device 400 is embedded in the first groove, so as to reduce the size of the eighth electronic device 400.
  • the ninth electronic device 410 with a smaller height dimension can be disposed in the second connection region.
  • the eighth electronic device 400 and the ninth electronic device 410 can be respectively attached to the second hard board layer 3601, thereby forming a stepped attachment.
  • the electronic device in the fourth cavity is relatively isolated from other electronic devices in the electronic device by setting the third shielding cover 390 , so as to avoid the problem of mutual interference between the devices in the electronic device.
  • the electronic device in the fourth cavity is relatively isolated from other electronic devices in the electronic device by setting the third shielding cover 390 , so as to avoid the problem of mutual interference between the devices in the electronic device.
  • by opening the first groove on the second hard board layer 3601 and embedding the eighth electronic device 400 in the first groove it can reduce the number of eighth electronic devices 400 installed in the first groove.
  • the overall thickness of the second rigid-flex board 360 is beneficial to light and thin electronic equipment.
  • Another embodiment of the present application further provides an electronic device, which includes the circuit board assembly described in the above embodiment.
  • the electronic device may be various types of electronic devices, for example, may be various types of mobile phones, tablet computers, smart wearable devices, and the like.
  • the electronic devices such as the first electronic device 130, the second electronic device 160, the third electronic device 210, the fourth electronic device 280, the fifth electronic device, and the sixth electronic device 290 may be each of the electronic devices. types of electronic devices.
  • the electronic devices deployed on the first rigid-flex board 110 can be electrically connected to the flexible board layer 112 directly, or electrically connected to the flexible board layer 112 through the rigid board layer 111 .
  • the electronic device since the electronic device includes the circuit board assembly in the above embodiment, the electronic device can realize all the beneficial effects of the circuit board assembly in the above embodiment. To avoid repetition, no more be repeated.
  • the electronic device includes a first housing and a second housing, the first housing is provided with a first circuit board assembly 360, and the second housing is provided with a second circuit board assembly 370, at least one of the first circuit board assembly 360 and the second circuit board assembly 370 is the circuit board assembly;
  • the first circuit board assembly 360 includes a first bonding board
  • the second circuit board assembly 370 includes a second bonding board
  • the first end of the first bonding board is electrically connected to the first end of the second bonding board. connect;
  • the first circuit board assembly 360 is the circuit board assembly
  • the first combination board is the first rigid-flex board 110 ;
  • the second circuit board assembly 370 is the circuit board assembly
  • the second combination board is the first rigid-flex board 110 .
  • the electronic device is a folding screen electronic device
  • the first bonding board and the second bonding board can be respectively soft and hard bonding boards.
  • the flexible layer of the first bonding board and the The soft board layers of the second bonding board are electrically connected. Since the first joint board and the second joint board are connected through the soft board layer, the connection between the first joint board and the second joint board can be relatively bent, thereby facilitating the folding of the folding screen electronic device.
  • first coupling plate and the second coupling plate may be electrically connected by any connection method in FIG. 8 to FIG. 11 .
  • the first casing is folded or unfolded relative to the second casing, and at the same time, the first coupling plate is relatively Rotate on the second connecting plate.
  • waterproof glue 380 can be provided at each welding position for connecting different components.
  • circuit board assembly by applying the circuit board assembly to the folding screen electronic device, it is beneficial to improve the heat dissipation effect of the folding screen electronic device.
  • the term “comprising”, “comprising” or any other variation thereof is intended to cover a non-exclusive inclusion such that a process, method, article or apparatus comprising a set of elements includes not only those elements, It also includes other elements not expressly listed, or elements inherent in the process, method, article, or device. Without further limitations, an element defined by the phrase “comprising a " does not preclude the presence of additional identical elements in the process, method, article, or apparatus comprising that element.
  • the scope of the methods and devices in the embodiments of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in reverse order according to the functions involved. Functions are performed, for example, the described methods may be performed in an order different from that described, and various steps may also be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.

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Abstract

本申请公开了一种电路板组件和电子设备，属于电子产品技术领域。所述电路板组件包括：第一软硬结合板，所述第一软硬结合板包括层叠设置的硬板层和软板层，所述硬板层覆盖于所述软板层的表面，所述软板层包括柔性基板和导热层，所述导热层覆盖于所述柔性基板的表面，所述第一软硬结合板上设有第一电子器件，所述导热层具有散热区域，且所述散热区域未覆盖所述硬板层；第一电路板，所述第一电路板与所述第一软硬结合板之间围合形成第一腔体，所述散热区域位于所述第一腔体之外，所述第一电子器件位于所述第一腔体内。

Description

电路板组件和电子设备
相关申请的交叉引用
本申请主张在2021年12月22日在中国提交的中国专利申请No.202111583325.3的优先权，其全部内容通过引用包含于此。
技术领域
本申请涉及电子产品技术领域，具体涉及一种电路板组件和电子设备。
背景技术
随着电子设备的不断发展，电子设备的功能也在不断完善。相应地，电子设备中的电路板所需功耗也在不断增加，进而导致电子设备在工作过程中的产热量增大。由于电子设备的产热量增大，而电子设备中的散热部件的散热能力有限，从而可能导致在电子设备运行过程中出现发烫的现象。可见，现有的电子设备存在散热效果较差的问题。
发明内容
本申请提供了一种电路板组件和电子设备，可以改善电子设备的散热效果。
为了解决上述技术问题，本申请是这样实现的：
第一方面，本申请实施例提供了一种电路板组件，包括：
第一软硬结合板，所述第一软硬结合板包括层叠设置的硬板层和软板层，所述硬板层覆盖于所述软板层的表面，所述软板层包括柔性基板和导热层，所述导热层覆盖于所述柔性基板的表面，所述第一软硬结合板上设有第一电子器件，所述导热层具有散热区域，且所述散热区域未覆盖所述硬板层；
第一电路板，所述第一电路板与所述第一软硬结合板之间围合形成第一腔体，所述散热区域位于所述第一腔体之外，所述第一电子器件位于所述第一腔体内。
第二方面，本申请实施例提供了一种电子设备，包括上述第一方面所述 的电路板组件。
本申请实施例中，由于软硬结合板包括导热层，且所述导热层包括位于第一腔体之外的散热区域。这样，位于第一腔体内的第一电子器件在工作过程中所产生的热量，可以通过导热层传导至散热区域进行散热，从而可以提高包括所述电路板组件的电子设备的散热效果。进一步地，还可以在多层电路板中降低堆叠厚度，以及板对板连接器的使用量，从而减小电子设备尺寸。
附图说明
图1是本申请实施例提供的电路板组件的结果示意图之一；
图2是本申请实施例提供的电路板组件的结果示意图之二；
图3是本申请实施例提供的电路板组件的结果示意图之三；
图4是本申请实施例提供的电路板组件的结果示意图之四；
图5是本申请实施例提供的电路板组件的结果示意图之五；
图6是本申请实施例提供的电路板组件的结果示意图之六；
图7是本申请实施例中第一软硬结合板的展开示意图；
图8是本申请实施例中第一软硬结合板的一个连接端的结构示意图之一；
图9是本申请实施例中第一软硬结合板的一个连接端的结构示意图之二；
图10是本申请实施例中第二软硬结合板的结构示意图之一；
图11是本申请实施例中第二软硬结合板的结构示意图之二；
图12是本申请实施例中第一电路板组件与第二电路板组件的连接示意图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请的说明书和权利要求书中的术语“第一”、“第二”等是用于区别类似的对象，而不用于描述特定的顺序或先后次序。应该理解这样使用的数 据在适当情况下可以互换，以便本申请的实施例能够以除了在这里图示或描述的那些以外的顺序实施，且“第一”、“第二”等所区分的对象通常为一类，并不限定对象的个数，例如第一对象可以是一个，也可以是多个。此外，说明书以及权利要求中“和/或”表示所连接对象的至少其中之一，字符“示所，一般表示前后关联对象是一种“或”的关系。
随着电子设备的不断发展，电子设备的功能越来越完善，相应地，需要安装于电子设备中的器件也相应增多，因此，通常需要增大电子设备内部的电路板的尺寸，以使电路板能够提供更多的安装空间。基于此，相关技术中提出了可以通过堆叠多层电路板的方式，以增大电路板的安装空间。然而，在多层堆叠电路板中，相邻两个电路板之间通常会形成一个相对封闭的空间，这样，将导致安装于相邻两个电路板之间的电子器件所产生的热量难以进行散出。可见，现有的多层堆叠电路板存在散热效果较差的问题。
基于此，本申请实施例提供了一种电路板组件和电子设备，以解决现有的多层堆叠电路板存在散热效果较差的问题。
下面结合附图，通过具体的实施例及其应用场景对本申请实施例提供的电路板组件和电子设备进行详细地说明。
请参见图1-11，为本申请实施例提供的电路板组件的结构示意图，所述电路板组件，包括：
第一软硬结合板110，所述第一软硬结合板110包括层叠设置的硬板层111和软板层112，所述硬板层111覆盖于所述软板层112的表面，所述软板层112包括柔性基板1122和导热层1121，所述导热层1121覆盖于所述柔性基板1122的表面，所述第一软硬结合板110上设有第一电子器件130，且所述电子器件与所述导热层1121电连接，所述导热层1121具有散热区域113，且所述散热区域113未覆盖所述硬板层111；
第一电路板140，所述第一电路板140与所述第一软硬结合板110之间围合形成第一腔体，所述散热区域113位于所述第一腔体之外，所述第一电子器件130位于所述第一腔体内。
其中，所述第一软硬结合板110可以是相关技术中的各种类型的软硬结合板。请参见图1，可以在所述软板层112的两侧分别覆盖所述硬板层111。 可以理解的是，上述导热层1121可以采用柔性导电导热的蚀刻金属层，一般是铜层，也可以是镀金、镀镍等混合金属叠层，这样，设置于第一软硬结合板110上的不同电子器件之间可以通过导热层1121电连接，同时，设置于第一软硬结合板110上的电子器件在工作过程中所产生的热量还可以通过所述导热层1121传导至散热区域进行散热。
请参见图1，所述第一软硬结合板110和所述第一电路板140可以形成多层堆叠电路板，且所述第一软硬结合板110和所述第一电路板140可以分别用于安装电子设备中的各种器件，且所述第一软硬结合板110与所述第一电路板140可以电连接。例如，请参见图1，所述电路板组件还可以包括呈环形的连接板200，所述第一软硬结合板110通过所述连接板200与所述第一电路板140电连接，且所述第一软硬结合板110、连接板200和第一电路板140共同围合形成所述第一腔体，其中，所述连接板200可以是转接板(interposer)。
此外，所述第一软硬结合板110也可以直接与所述第一电路板140电连接，例如，请参见图3，所述第一电路板140朝向所述第一软硬结合板110的一侧形成有凹槽，所述第一电路板140直接与所述第一软硬结合板110焊接，以围合形成所述第一腔体，其中，所述第一电路板140可以是Cavity连接板200。
请参见图1，由于所述第一软硬结合板110的其中一部分区域形成所述第一腔体的一个腔壁。因此，所述第一腔体内的热量可以通过所述第一软硬结合板110的软板层112传导至散热器件120，即所述第一腔体内的电子器件工作过程中所产生的热量可以通过所述第一软硬结合板110的软板层112传导至散热器件120，从而实现对第一腔体内的电子器件的散热。其中，所述第一腔体内的电子器件可以包括安装于所述第一软硬结合板110上的所述第一电子器件130，也可以是安装于所述第一电路板140上的各种电子器件。
上述第一电路板140可以是现有技术中常见的各种类型的电路板，此外，所述第一电路板140也可以是软硬结合板。上述第一电子器件130的数量可以为多个，且所述多个第一电子器件130可以包括电子设备中的各种不同类型的电器元器件。
上述第一电子器件130可以是电子设备中的各种电子元器件，可以理解的是，电子设备中的不同电子元器件可以通过所述第一软硬结合板110进行连接，以形成各种电路。其中，所述第一电子器件130可以直接与软板层112电连接，此外，所述第一电子器件130也可以通过覆盖于软板层112表面的硬板层111与所述软板层112电连接。这样，不同的电子元器件可以通过所述第一软硬结合板110的软板层112电性导通。
请参见图8，所述软板层112可以包括柔性基板1122和覆盖于柔性基板1122两侧的导热层1121。所述散热区域113可以是所述软板层112未覆盖所述硬板层111的区域。
该实施方式中，由于软硬结合板110包括导热层1121，且所述导热层1121包括位于第一腔体之外的散热区域113。这样，位于第一腔体内的第一电子器件130在工作过程中所产生的热量，可以通过导热层1121传导至散热区域113进行散热，从而可以提高包括所述电路板组件的电子设备的散热效果。也即可以提高多层堆叠电路板的散热效果。
可选地，所述电路板组件还包括散热器件120，所述散热器件120设置于所述散热区域113。
上述散热器件120可以是电子设备中各种用于散热的部件，例如，可以是电子设备中的壳体、支架、均热板等。如此，可以实现将电子器件工作过程中所产生的热量传导至散热部件进行散热。此外，所述散热器件120也可以是所述电子设备中，工作时产热量较少的电子器件，例如，可以是电池310、扬声器等。如此，可以实现均衡电子设备中各个部位的热量，避免出现局部高温的问题。
可以理解的是，当所述散热器件120为电子器件时，所述散热器件120在与所述散热区域113热传导连接的同时，还可以基于自身的端子与第一软硬结合板110电连接。以实现通过第一软硬结合板110导通所述散热器件120与电子设备中的其他电子器件。
该实施方式中，所述散热器件120可以直接与所述散热区域113贴合，也可以通过导热部件进行连接。这样，连接于第一软硬结合板110上的电子器件在工作过程中所产生的热量可以直接通过软板层112的导热层1121传导 至散热区域113，传导至散热区域113的热量可以进一步传导至散热器件120，从而实现对电子器件工作过程中所产生的热量进行散热。
可选地，所述导热层1121具有导热区域114，所述导热区域114未覆盖所述硬板层111，且所述导热区域114位于所述第一腔体内；
所述第一腔体内填充有第一绝缘导热介质150。
其中，所述第一绝缘导热介质150可以是现有技术中各种类型的绝缘导热介质，例如，可以是导热硅脂。第一腔体内的电子器件可以通过所述第一绝缘导热介质150与所述导热区域114连接，例如，可以在所述第一腔体内充满所述第一绝缘导热介质150。这样，第一腔体内的电子器件工作过程中所产生的热量可以通过所述第一绝缘导热介质150传导至所述导热区域114，传导至导热区域114的热量可以通过软板层112传导至散热区域113，然后，散热区域113的热量可以进一步传导至散热器件120进行散热。
上述第一软硬结合板110或者所述第一电路板140上可以设有用于灌注所述第一绝缘导热介质150的注入孔141和排气孔142，例如，请参见图1，在本申请一个实施例中，所述第一电路板140的表面分别开设有用于连通所述第一腔体的注入孔141和排气孔142，这样，可以通过所述注入孔141将所述第一绝缘导热介质150注入第一腔体内，从而在注入过程中，第一腔体内的空气可以通过排气孔142排出。
该实施方式中，通过在所述第一腔体内填充第一绝缘导热介质150，这样，第一腔体内部的电子器件所产生的热量可以通过第一绝缘导热介质150快速传导至导热区域114，从而有利于进一步提高对第一腔体内的电子器件的散热效果。
相关技术中，由于电子设备的不同器件在工作过程中可能会相互影响，因此，现有的电子设备的内部通常会设有屏蔽罩，以通过屏蔽罩隔离可能存在相互影响的部件。然而，由于屏蔽罩通常需要封罩于电路板的特定位置，以将安装于所述特定位置的电子器件进行隔离，因此，所述屏蔽罩与电路板之间通常会形成一个封闭空间，而位于屏蔽罩内部的电子器件所产生的热量通常难以散出。从而导致屏蔽罩内部的散热效果较差的问题。
基于此，在本申请一个可选地实施例中，所述电路板组件还包括第一屏 蔽罩180，所述第一屏蔽罩180位于所述第一软硬结合板110背对所述第一电路板140的一侧，且所述第一屏蔽罩180与所述第一软硬结合板110连接，所述第一屏蔽罩180与所述第一软硬结合板110之间围合形成第二腔体；
所述第一软硬结合板110上设有第二电子器件160，所述第二电子器件160位于所述第二腔体内，所述第二腔体内设有第二绝缘导热介质170。
其中，所述第二电子器件160的数量可以为多个，且所述多个第二电子器件160可以包括电子设备中的各种不同类型的电器元器件。
上述第二绝缘导热介质170可以是现有技术中各种类型的绝缘导热介质，例如，可以是导热硅脂。所述第二电子器件160可以通过所述第二绝缘导热介质170与所述第一屏蔽罩180连接，这样，第二电子器件160工作过程中所产生的热量可以通过第二绝缘导热介质170快速传导至第一屏蔽罩180，以通过第一屏蔽罩180进行散热。
可以理解的是，所述第一屏蔽罩180上也可以开设用于向第二腔体内注入第二绝缘导热介质170的注入孔141。请参见图1，在本申请一个实施例中，所述第一屏蔽罩180上开设有注入孔141，且在通过所述第一屏蔽罩180的注入孔141向所述第二腔体内注入第二绝缘导热介质170之后，可以在所述第一屏蔽罩180上连接用于封闭所述注入孔141的密封板190。
该实施方式中，通过使第一屏蔽罩180与第一软硬结合板110连接，这样，第一屏蔽罩180内的第二电子器件160所产生的热量可以通过所述第一软硬结合板110的软板层112传导至散热器件120，从而改善第一屏蔽罩180内的第二电子器件160的散热效果。
可选地，请参见图3，在本申请一个实施例中，所述电路板组件还包括第二屏蔽罩330，所述第二屏蔽罩330位于所述第一电路板140背对所述第一软硬结合板110的一侧，且所述第二屏蔽罩330与所述第一电路板140连接，所述第二屏蔽罩330与所述第一电路板140之间围合形成第三腔体；
所述第一电路板140背对所述第一软硬结合板110的一侧设有第七电子器件340，所述第三腔体内填充有第三绝缘导热介质350，所述第七电子器件340通过所述第三绝缘导热介质350与所述第二屏蔽罩330连接。
该实施方式中，通过使第二屏蔽罩330与第一电路板140连接，这样， 第二屏蔽罩330内的第七电子器件340所产生的热量可以通过第三绝缘导热介质350快速传导至第二屏蔽罩330，以通过第二屏蔽罩330进行散热。
可选地，所述软板层112包括第一分段1124，所述第一分段1124未覆盖所述硬板层111，所述第一分段1124包括围绕所述散热器件120卷绕的卷绕部，所述散热区域113位于所述卷绕部。
具体地，由于所述软板层112形成所述软硬结合板的软板层，因此，所述软板层112可以采用柔性电路板。由于所述软板层112的第一分段1124未覆盖所述硬板层111，即所述第一分段1124未覆盖硬板层。因此，所述第一分段1124可以在电子设备内部任意卷绕。如此，可以通过所述第一分段1124在电子设备内部卷绕，以使电子设备中的更多电子器件可以与第一软硬结合板110电连接，从而实现基于第一软硬结合板110实现电子设备中的更多电子器件之间的相互连接。
此外，还可以通过使所述第一分段1124围绕所述散热器件120卷绕，其中，所述卷绕部可以贴合所述散热器件120进行卷绕。
该实施方式中，通过使所述软板层112的第一分段1124围绕散热器件120卷绕，从而可以增大散热器件120与第一分段1124之间的接触面积，即可以增大所述散热区域113的面积，从而可以进一步提高基于第一软硬结合板110进行散热的散热过程中的散热效果。
可选地，所述电路板组件包括至少两个所述散热器件120。
具体地，所述散热区域113可以包括至少两个导热子区域，其中，一个导热子区域对应一个散热器件120，且所述散热器件120与所述散热器件120所对应的导热子区域连接。
由于所述至少两个散热器件120通常分布于电子设备内部的不同位置。因此，在本申请一个实施例中，可以通过所述软板层112的第一分段1124在所述电子设备内部弯折或卷绕，以实现所述软板层112分别与所述至少两个散热器件120连接。
例如，请参见图2，所述至少两个散热部件包括电池310、扬声器模组260和中框300，所述第一分段1124包括第一子分段11241和第二子分段11242，所述第一子分段11241和所述第二子分段11242分别从所述硬板层111 的两端向外伸出，所述第一子分段11241的其中部分与所述中框300贴合，所述第一子分段11241的另一部分围绕所述电池310卷绕，同时，所述第一子分段11241上设有用于与所述电池310电连接的第一电器连接区域1125，所述第一软硬结合板110通过所述第一电器连接区域1125与所述电池310电连接。所述第二子分段11242的其中一部分与所述中框300贴合，所述第二子分段11242的另一部分与所述扬声器模组260贴合，且所述第二子分段11242上设有用于与所述扬声器模组260电连接的第二电器连接区域1126，所述第一软硬结合板110通过所述第二电器连接区域1126与所述扬声器模组260电连接。
该实施方式中，通过使所述软板层112分别与至少两个散热器件120进行连接，这样，传导至软板层112中的热量可以分别传导至所述至少两个散热部件，从而进一步提高基于第一软硬结合板110进行散热的散热过程中的散热效果。
可选地，所述电路板组件还包括第五电子器件，所述第一软硬结合板110包括结合板本体和从所述结合板本体的一侧向外延伸的延伸板320，所述第五电子器件通过所述延伸板320与所述第一软硬结合板110电连接。
上述第一电器连接区域1125和第二电器连接区域1126分别位于所述结合板本体的两端，所述延伸板320上还设有第三电器连接区域1127。
请参见图2，在本申请一个实施例中，所述第五电子器件为显示模组270，所述显示模组270与所述第三电器连接区域1127电连接。
此外，所述延伸板320包括与所述结合板本体垂直的第一部分和与所述结合板本体相对的第二部分，所述第五电子器件位于所述第二部分背对所述第一软硬结合板110的一侧。所述第二部分与所述第一屏蔽罩180之间设有第三绝缘导热介质350，且所述第二部分通过所述第三绝缘导热介质350与所述第一屏蔽罩180连接。由于所述显示模组270位于电子设备的外表面，因此，所述显示模组270可以作为散热部件，这样，从第一软硬结合板110传递至第一屏蔽罩180的热量可以依次经过第三绝缘导热介质350和第二部分传递至所述显示模组270散出。
该实施方式中，通过使所述第一软硬结合板110包括结合板本体和延伸 板320，这样，可以使第一软硬结合板110能够连接更多的电子器件。由于所述结合板本体与延伸板320一体成型，因此，还可以减少板对板连接器的使用量，从而减小电子设备尺寸。此外，安装于延伸板320上的第五电子器件所产生的热量，可以依次通过延伸板320和第一软硬结合板110传递至所述散热部件。当所述第五电子器件为散热部件时，所述第一软硬结合板110上的热量也可以通过所述延伸板320传递至所述第五电子器件进行散热。
可选地，所述软板层112包括导热层1121和导热膜1123，所述导热膜1123覆盖于所述导热层1121的表面。
其中，所述导热膜1123可以是现有技术中的各种类型的绝缘的且具有导热功能的膜材。例如，可以是在普通绝缘膜材中参入石墨所形成的膜材。
可以理解的是，与所述第一软硬结合板110电连接的电子器件可以穿透所述导热膜1123与所述柔性电路板电连接。
该实施方式中，通过在所述导热层1121的表面覆盖导热膜1123，从而可以进一步提高所述软板层112的导热效果，这样，当热量传导至导热膜1123的导热区域114时，可以通过所述导热膜1123进行热量传导，并将热量传导至散热区域113，以提高软板层112中热传导的效率，从而进一步提高基于第一软硬结合板110进行散热的散热过程中的散热效果。
可选地，所述电路板组件还包括第三电子器件210，所述导热膜1123的表面开设有连接孔11231，所述第三电子器件210的连接端子穿过所述连接孔11231与所述导热层1121电连接。
具体地，请参见图6，所述导热层1121与所述连接孔11231相对的部分可以显露于所述导热膜1123之外，在本申请一个实施例中，可以在所述导热膜1123上可以开设有多个连接孔11231，这样，导热层1121与多个连接孔11231相对的部分可以共同形成焊盘，以使导热层1121通过所述焊盘与所述第三电子器件210焊接。具体地，所述导热层1121通过圆球状的焊锡球与所述第三电子器件210焊接，且所述焊锡球与所述导热膜1123相接触，以将第三电子器件210在工作过程中所产生的热量通过焊锡球传导至所述导热膜1123进行散热。
该实施方式中，由于所述第三电子器件210直接与所述导热层1121焊接， 这样，第三电子器件210工作过程中所产生的热量可以直接传递至导热层1121和导热膜1123，从而通过导热层1121和导热膜1123直接传递至散热区域113，以进一步提高基于第一软硬结合板110进行散热的散热过程中的散热效果。
可选地，所述硬板层111包括呈环形的第一区域1111，所述电路板组件还包括第四电子器件280和第六电子器件290，所述第四电子器件280与所述导热层1121电连接，且所述第一区域1111环绕所述第四电子器件280设置，所述第六电子器件290位于所述第一区域1111。
相关技术中，电子设备的厚度尺寸在一定程度上与电子设备中安装的电子器件的高度尺寸相关，而电子设备内部的需要安装各种不同类型的电子器件，且电子器件的形状通常不同。当某些电子器件的高度尺寸较大时，通常可能导致电子设备的整体厚度需要加大，进而不利于电子设备的轻薄化。
基于此，本申请实施例中，所述第四电子器件280可以是电子设备中高度尺寸较大的电子器件。通过在所述硬板层111上形成环形的第一区域1111，这样，可以将高度尺寸较大的电子器件安装于所述第一区域1111的内部，即将所述第四电子器件280与软板层112直接电连接，此时，在第四电子器件280安装之后，第四电子器件280与第一软硬结合板110的厚度之和为：第四电子器件280的高度与软板层112的厚度之和。相应地，若使第四电子器件280安装于硬板层111，即使第四电子器件280通过硬板层111与软板层112连接，则在第四电子器件280安装之后，第四电子器件280与第一软硬结合板110的高度之和为：第四电子器件280的高度、硬板层111的厚度和软板层112的厚度之和。可见，本申请实施例通过使第四电子器件280直接与软板层112连接，有利于减小电路板组件的整体厚度，进而有利于电子设备的轻薄化。
请参见图2至图10，在本申请一个实施例中，所述第一区域1111还可以设置第六电子器件290，所述第六电子器件290可以通过所述硬板层111与所述软板层112电连接。
该实施方式中，通过将所述第四电子器件280安装于所述环形区域的内部，这样，有利于减少电路板组件整体的厚度，同时，由于所述环形区域为 硬板层，因此，所述环形区域有效的支撑位于环形区域内部的软板区域，避免位于环形区域内部的软板区域发生弯折，从而可以提高第四电子器件280与软板层112之间连接的稳定性。
可选地，所述电路板组件包括连接器220、补强板230和第二电路板，所述连接器220和所述补强板230分别设置于所述第一软硬结合板110的相背对的两侧，所述第一软硬结合板110通过所述连接器220与所述第二电路板电连接。
其中，连接器220可以是现有技术中各种类型的用于连接不同电子器件的连接器，例如，请参见图8，在本申请一个实施例中，所述连接器220可以为BTB连接器。所述BTB连接器设置于所述软板层112的一端，所述第一软硬结合板110可以通过所述BTB连接器220与所述第二电路板电连接，同时，为提高所述BTB连接器220连接的稳定性，可以在所述软板层112背对所述BTB连接器220的一侧设置补强板230，如此，可以增强所述第一软硬结合板110对所述BTB连接器220的支撑效果，避免第一软硬结合板110与BTB连接器220的连接处出现弯折的现象。
此外，在本申请另一实施例中，所述电路板组件包括第二电路板，所述导热层1121包括第二区域，所述第二区域未覆盖所述硬板层111，且所述第二区域形成金手指250或焊盘240，所述第一软硬结合板110通过所述第二区域与所述第二电路板电连接，其中，所述焊盘240可以为化金焊盘。
该实施方式中，通过设置上述不同类型的连接结构，这样，可以根据第二电路板的具体类型，采用不同的连接方式使第二电路板与第一软硬结合板110电连接。
可选地，所述第二电路板包括第二软硬结合板360、第三屏蔽罩390、第八电子器件400和第九电子器件410，所述第三屏蔽罩390与所述第二软硬结合板360连接，且所述第三屏蔽罩390与所述第二软硬结合板360围合形成第四腔体，所述第八电子器件400和所述第九电子器件410分别与所述第二软硬结合板360电连接，且所述第八电子器件400和所述第九电子器件410分别位于所述第四腔体内；
所述第二软硬结合板360包括第二硬板层3601和第二软板层3602，所述第二硬板层3601覆盖于所述第二软板层3602的表面，所述第二硬板层3601上开设有开口朝向所述第三屏蔽罩390的第一凹槽，所述第八电子器件400的至少部分嵌设于所述第一凹槽内，所述第九电子器件410位于所述第一凹槽外；
所述第八电子器件400和所述第九电子器件410分别与所述第二硬板层3601电连接。
可以理解的是，上述第一软硬结合板110和所述第二软硬结合板360可以为同一电子设备中的不同电路板，且所述第一软硬结合板110与所述第二软硬结合板360电连接。上述第八电子器件400和第九电子器件410可以是电子设备中的任意电子器件，且所述第八电子器件400可以是电子设备中高度尺寸较大的电子器件。
其中，由于开设于所述第二硬板层3601第一凹槽由于未贯穿所述第二硬板层3601，因此，可以在所述第一凹槽的槽底或槽壁设置第二硬板层3601的电连接位，以用于安装电子器件。
具体地，可以将所述第二硬板层3601与所述第三屏蔽罩390正对的区域划分为第一连接区域和第二连接区域，其中，所述第一凹槽的槽底形成所述第一连接区域，所述第一凹槽之外的其他区域形成所述第二连接区域，由于所述第一连接区域和所述第二连接区域分别位于不同平面，因此，所述第一连接区域与所述第二连接区域共同形成台阶位。由于在所述第一连接区域开设由第一凹槽，即在第二硬板层3601的第一连接区域存在部分挖空，因此，第二硬板层3601在第一连接区域的厚度尺寸较薄，这样，可以将电子设备中高度尺寸较大的第八电子器件400设置于所述第一连接区域，即将第八电子器件400嵌设于所述第一凹槽内，以减小第八电子器件400与第二硬板层3601连接之后的总厚度。相应地，可以将高度尺寸较小的第九电子器件410设置于所述第二连接区域。具体地，第八电子器件400和第九电子器件410可以分别贴片在所述第二硬板层3601，从而形成阶梯贴片。
该实施方式中，通过设置第三屏蔽罩390以将第四腔体内的电子器件与电子设备中的其他电子器件相对隔离，以避免电子设备中的器件之间相互干扰的问题。同时，通过在所述第二硬板层3601上开设第一凹槽，并使第八电子器件400嵌设于所述第一凹槽内，这样，可以减小第八电子器件400安装于第二软硬结合板360之后，第二软硬结合板360的整体厚度，进而有利于电子设备的轻薄化。
本申请另一实施例还提供了一种电子设备，所述电子设备包括上述实施例所述的电路板组件。
其中，所述电子设备可以是各种类型的电子设备，例如，可以是各种类型的手机、平板电脑、智能穿戴设备等。
可以理解是的，上述第一电子器件130、第二电子器件160、第三电子器件210、第四电子器件280、第五电子器件、第六电子器件290等电子器件可以是电子设备中的各种类型的电子器件。部署于第一软硬结合板110上的电子器件既可以直接与所述软板层112电连接，也可以通过硬板层111与所述软板层112电连接。
本申请实施例中，由于所述电子设备包括上述实施例中的电路板组件，因此，所述电子设备能够实现上述实施例中，电路板组件的全部有益效果，为避免重复，在此不再予以赘述。
可选地，请参见图12，所述电子设备包括第一壳体和第二壳体，所述第一壳体内设有第一电路板组件360，所述第二壳体内设有第二电路板组件370，所述第一电路板组件360和所述第二电路板组件370中，至少一者为所述电路板组件；
所述第一电路板组件360包括第一结合板，所述第二电路板组件370包括第二结合板，所述第一结合板的第一端与所述第二结合板的第一端电连接；
其中，在所述第一电路板组件360为所述电路板组件的情况下，所述第一结合板为所述第一软硬结合板110；
在所述第二电路板组件370为所述电路板组件的情况下，所述第二结合板为所述第一软硬结合板110。
在本实施例中，所述电子设备为折叠屏电子设备，所述第一结合板和第 二结合板可以分别为软硬结合板，这样，可以使所述第一结合板的软板层与所述第二结合板的软板层电连接。由于第一结合板与第二结合板通过软板层连接，因此，第一结合板与第二结合板的连接处可以相对弯折，从而有利于所述折叠屏电子设备折叠。
其中，所述第一结合板与所述第二结合板之间可以通过图8至图11中任意一种连接方式电连接。
具体地，在所述第一壳体相对于所述第二壳体转动的过程中，所述第一壳体相对于所述第二壳体折叠或展开，同时，所述第一结合板相对于所述第二结合板转动。
此外，请参见图12，为提高所述电子设备的防水性能，可以在各个用于连接不同部件的焊接位置分别设置防水胶380。
该实施方式中，通过将所述电路板组件应用于折叠屏电子设备，从而有利于提高折叠屏电子设备的散热效果。
需要说明的是，在本文中，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者装置不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者装置所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括该要素的过程、方法、物品或者装置中还存在另外的相同要素。此外，需要指出的是，本申请实施方式中的方法和装置的范围不限按示出或讨论的顺序来执行功能，还可包括根据所涉及的功能按基本同时的方式或按相反的顺序来执行功能，例如，可以按不同于所描述的次序来执行所描述的方法，并且还可以添加、省去、或组合各种步骤。另外，参照某些示例所描述的特征可在其他示例中被组合。
上面结合附图对本申请的实施例进行了描述，但是本申请并不局限于上述的具体实施方式，上述的具体实施方式仅仅是示意性的，而不是限制性的，本领域的普通技术人员在本申请的启示下，在不脱离本申请宗旨和权利要求所保护的范围情况下，还可做出很多形式，均属于本申请的保护之内。

Claims (14)

  1. 一种电路板组件，包括：
    第一软硬结合板(110)，所述第一软硬结合板(110)包括层叠设置的硬板层(111)和软板层(112)，所述硬板层(111)覆盖于所述软板层(112)的表面，所述软板层(112)包括柔性基板(1122)和导热层(1121)，所述导热层(1121)覆盖于所述柔性基板(1122)的表面，所述第一软硬结合板(110)上设有第一电子器件(130)，所述导热层(1121)具有散热区域(113)，且所述散热区域(113)未覆盖所述硬板层(111)；
    第一电路板(140)，所述第一电路板(140)与所述第一软硬结合板(110)之间围合形成第一腔体，所述散热区域(113)位于所述第一腔体之外，所述第一电子器件(130)位于所述第一腔体内。
  2. 根据权利要求1所述的电路板组件，其中，所述电路板组件还包括散热器件(120)，所述散热器件(120)设置于所述散热区域(113)。
  3. 根据权利要求1所述的电路板组件，其中，所述导热层(1121)具有导热区域(114)，所述导热区域(114)未覆盖所述硬板层(111)，且所述导热区域(114)位于所述第一腔体内；
    所述第一腔体内填充有第一绝缘导热介质(150)。
  4. 根据权利要求1所述的电路板组件，其中，所述电路板组件还包括第一屏蔽罩(180)，所述第一屏蔽罩(180)位于所述第一软硬结合板(110)背对所述第一电路板(140)的一侧，且所述第一屏蔽罩(180)与所述第一软硬结合板(110)连接，所述第一屏蔽罩(180)与所述第一软硬结合板(110)之间围合形成第二腔体；
    所述第一软硬结合板(110)上设有第二电子器件(160)，所述第二电子器件(160)位于所述第二腔体内，所述第二腔体内设有第二绝缘导热介质(170)。
  5. 根据权利要求2所述的电路板组件，其中，所述软板层(112)包括 第一分段(1124)，所述第一分段(1124)未覆盖所述硬板层(111)，所述第一分段(1124)包括围绕所述散热器件(120)卷绕的卷绕部，所述散热区域(113)位于所述卷绕部。
  6. 根据权利要求1所述的电路板组件，其中，所述软板层(112)还包括导热膜(1123)，所述导热膜(1123)覆盖于所述导热层(1121)的表面。
  7. 根据权利要求6所述的电路板组件，其中，所述电路板组件还包括第三电子器件(210)，所述导热膜(1123)的表面开设有连接孔(11231)，所述第三电子器件(210)的连接端子穿过所述连接孔(11231)与所述导热层(1121)电连接。
  8. 根据权利要求1所述的电路板组件，其中，所述硬板层(111)包括呈环形的第一区域(1111)，所述电路板组件还包括第四电子器件(280)和第六电子器件(290)，所述第四电子器件(280)与所述导热层(1121)电连接，且所述第一区域(1111)环绕所述第四电子器件(280)设置，所述第六电子器件(290)位于所述第一区域(1111)。
  9. 根据权利要求1所述的电路板组件，其中，所述电路板组件包括连接器(220)、补强板(230)和第二电路板，所述连接器(220)和所述补强板(230)分别设置于所述第一软硬结合板(110)的相背对的两侧，所述第一软硬结合板(110)通过所述连接器(220)与所述第二电路板电连接；或者，
    所述电路板组件包括第二电路板，所述导热层(1121)包括第二区域，所述第二区域未覆盖所述硬板层(111)，且所述第二区域形成金手指(250)或焊盘(240)，所述第一软硬结合板(110)通过所述第二区域与所述第二电路板电连接。
  10. 根据权利要求9所述的电路板组件，其中，所述第二电路板包括第二软硬结合板(360)、第三屏蔽罩(390)、第八电子器件(400)和第九电子器件(410)，所述第三屏蔽罩(390)与所述第二软硬结合板(360)连接，且所述第三屏蔽罩(390)与所述第二软硬结合板(360)围合形成第四腔体，所述第八电子器件(400)和所述第九电子器件(410)分别与所述第二软硬 结合板(360)电连接，且所述第八电子器件(400)和所述第九电子器件(410)分别位于所述第四腔体内。
  11. 根据权利要求10所述的电路板组件，其中，所述第二软硬结合板(360)包括第二硬板层(3601)和第二软板层(3602)，所述第二硬板层(3601)覆盖于所述第二软板层(3602)的表面，所述第二硬板层(3601)上开设有开口朝向所述第三屏蔽罩(390)的第一凹槽，所述第八电子器件(400)的至少部分嵌设于所述第一凹槽内，所述第九电子器件(410)位于所述第一凹槽外；
    所述第八电子器件(400)和所述第九电子器件(410)分别与所述第二硬板层(3601)电连接。
  12. 根据权利要求1所述的电路板组件，其中，所述电路板组件还包括第五电子器件，所述第一软硬结合板(110)包括结合板本体和从所述结合板本体的一侧向外延伸的延伸板(320)，所述第五电子器件通过所述延伸板(320)与所述第一软硬结合板(110)电连接。
  13. 一种电子设备，包括权利要求1-12中任一项所述的电路板组件。
  14. 根据权利要求13所述的电子设备，其中，所述电子设备包括第一壳体和第二壳体，所述第一壳体内设有第一电路板组件(360)，所述第二壳体内设有第二电路板组件(370)，所述第一电路板组件(360)和所述第二电路板组件(370)中，至少一者为所述电路板组件；
    所述第一电路板组件(360)包括第一结合板，所述第二电路板组件(370)包括第二结合板，所述第一结合板的第一端与所述第二结合板的第一端电连接；
    其中，在所述第一电路板组件(360)为所述电路板组件的情况下，所述第一结合板为所述第一软硬结合板(110)；
    在所述第二电路板组件(370)为所述电路板组件的情况下，所述第二结合板为所述第一软硬结合板(110)。
PCT/CN2022/139839 2021-12-22 2022-12-19 电路板组件和电子设备 WO2023116592A1 (zh)

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