CN1720108B - 导热的电磁干扰屏蔽 - Google Patents
导热的电磁干扰屏蔽 Download PDFInfo
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Abstract
结合电磁能吸收材料与导热材料,如与电子设备结合用于热控制的那些,从而抑制电磁干扰(EMI)经其透过。公开了材料和结合EMI吸收材料与导热材料的方法,从而以经济上有效的方式改进EMI屏蔽效应。在一个实施方案中,通过结合EMI吸收材料(例如铁素体颗粒)与导热材料(例如陶瓷颗粒),其中各自悬浮在弹性基体(例如硅氧烷)内,从而制备导热的EMI吸收剂。在应用中,导热的EMI吸收材料层施加在电子器件或组件和散热片之间。
Description
发明背景
1.发明领域
本发明一般地涉及在电子应用中的热管理,和更具体地涉及具有电磁能衰减性能的导热体。
2.现有技术的说明
此处所使用的术语EMI应当认为一般是指电磁干扰和射频干扰(RFI)发射这二者,和术语“电磁”应当认为一般是指电磁和射频。
电子器件典型地产生热辐射作为不可避免的副产物。所产生的热辐射量可与源电子组件或器件的开关速度和复杂性相关。由于较新的电子器件倾向于在越来越大的开关速度下操作,因此它们也将导致较大的热辐射。这些增加的热辐射,在一定程度上,具有干扰源电子组件功能和其它邻近器件与组件功能的危险。
因此,应当温和地耗散不想要的热辐射,以排除或最小化任何非所需的效果。除去不想要的热辐射的现有技术的解决方法包括在电子组件上提供热垫和将散热片连接到该热垫上。散热片通常包括导热率高的材料。当与产热电子组件紧密接触地放置时,散热片将热量传导离开组件。散热片还具有促进热量从散热片通过例如对流转移到周围环境的特性。例如,散热片常常包括对于给定的体积来说,导致相对大表面积的“翼片”。
此外,在正常操作下,电子组件典型地产生非所需的电子能,而电磁能会干扰位于附近的电子设备的操作,这是由于通过辐射和传导导致的EMI辐射所致。电磁能可在宽范围的波长与频率下存在。为了最小化与EMI有关的问题,可屏蔽非所需的电磁能源并接地,以减少在周围环境内的发射。或者或另外,可类似地屏蔽EMI的感受器并接地,以保护它们避免在周围环境内的EMI。因此,设计屏蔽,以便相对于阻挡层、外壳或电子设备位于其内的其它机壳,防止电磁能的进入和外流。
完美的EMI设计原理建议尽可能靠近源头处理EMI,以排除不想要的EMI进入局部环境内,从而最小化干扰的危险。遗憾的是,要求使用散热片的组件和器件并不完全适于在源头处对EMI的保护处理,因为这种处理会干扰散热片的操作。散热片应当与电子组件紧密接触,以提供传热路径且还对周围环境开放,以允许散热片通过对流传热发挥作用。
发明概述
一般地,本发明涉及电磁干扰吸收传热的缝隙填料,如用电磁干扰吸收材料处理的弹性(例如硅氧烷)垫。EMI吸收材料吸收在处理的热垫上入射的部分EMI,从而在宽的操作频率范围内减少通过热垫EMI的透射。吸收材料可通过功率的耗散从环境中除去部分EMI,所述功率的耗散来自于损耗机理。这些损耗机理包括在介电材料内的偏振损耗和在具有有限导电率的传导材料内的传导或电阻损耗。
因此,一方面,本发明涉及降低因电子器件产生的电磁发射的复合材料,该复合材料包括导热材料和电磁能吸收材料的结合。导热材料促进热能从器件上转移和电磁能吸收材料降低因该器件产生的电磁发射。
在一个实施方案中,至少一种导热材料和电磁能吸收材料是颗粒。颗粒一般来说可以是球形,如微球或其它形状,如粉末、纤维、薄片及其结合。该复合材料进一步包括其中导热材料和电磁能吸收材料在其内悬浮的基体材料。
一般来说,基体材料能透过电磁能,例如由相对介电常数小于约4和损耗角正切值小于约0.1来定义。在一个实施方案中,以液体形式制备基体。在另一实施方案中,以固体形式制备基体。在另一实施方案中,以相变材料形式制备基体,所述相变材料在环境室温下以固相存在和在设备操作温度下转变为液相。在另一实施方案中,以热固性材料形式制备基体。
在一些实施方案中,以厚度大于约0.010英寸和小于约0.18英寸的片材形式形成导热的EMI吸收剂。在其它实施方案中,片材包括导热粘合层。
在另一方面中,本发明涉及降低由器件产生的电磁发射的方法,该方法包括下述步骤:提供导热材料,提供电磁能吸收材料,和结合该导热材料与电磁能吸收材料。
在一个实施方案中,该方法包括在基体材料内悬浮结合的导热材料与电磁能吸收材料的额外步骤。
在另一实施方案中,该方法包括将结合的导热材料与电磁能吸收材料置于器件和邻近结构之间,例如置于集成电路与散热片之间的额外步骤。
附图简述
参考下述说明,并结合附图,可更好地理解本发明的优点,其中:
图1是示意图,它描述了标记例举组成组分的导热EMI吸收剂的实施方案的透视图;
图2是示意图,它描述了导热的EMI吸收剂,如图1所示的实施方案的例举应用的透视图;
图3A和3B是示意图,它描述了分别以片材和以可辊压胶带形式形成的导热EMI吸收剂的可供替代的实施方案的透视图;
图4是示意图,它描述了图1所述的导热EMI吸收剂的可供替代的实施方案,其中从例如图3A的片材上切割成所需形状。
图5是示意图,它描述了图1所述的导热EMI吸收剂的可供替代的实施方案的透视图,其中根据预定形状预成形屏蔽;
图6是可流动形式,如液体的导热EMI吸收剂的可供替代的实施方案的示意图;
图7是示意图,它描述了可流动的导热EMI吸收剂,如图6所述的实施方案的例举应用的透视图;
图8是流程图,它描述了制备导热EMI吸收剂,如制备图1所示实施方案的方法的实施方案;和
图9是测量本发明的导热EMI屏蔽的导热率所使用的试验装置的平面示意图。
发明详述
可使用具有电磁能吸收性能的材料抑制在宽范围频率内的EMI透射。这种EMI吸收材料可提供显著的电磁屏蔽效应,例如在约2GHz一直到约100GHz下出现的EMI频率下衰减达约5dB或更高。
根据本发明,可通过在能以导热缝隙填料或垫的形式使用的基础基体(例如弹性体)内,结合EMI吸收填料和导热填料,从而形成导热EMI吸收剂。一般来说,所得导热EMI吸收剂可以以任何导热材料形式,例如在电子组件(例如“芯片”)和散热片之间施加。
参考图1,以矩形体积形式示出了导热EMI吸收剂(导热的EMI屏蔽)100。导热的EMI屏蔽100的正面表示屏蔽100的内部组成的截面视图。亦即,导热的EMI屏蔽100包括许多EMI吸收剂110和许多导热剂120,二者均悬浮在基体材料130内。尽管EMI吸收剂110和导热剂120无一以与任何相邻颗粒110、120接触的形式示出,但发生这种接触的结构包括在本发明内。例如,对于其中导热剂颗粒120彼此紧密靠近并接触的结构来说,导热的EMI屏蔽100的导热率通常提高。
如图1所示的单独的EMI吸收剂110、导热剂120的相对尺寸,和基体130的厚度仅仅是用于说明目的。一般来说,悬浮的填料110、120极小(也就是说,细微)。小的填料颗粒110、120有利于其中导热的EMI屏蔽100的总厚度薄,例如,导热的EMI屏蔽100的厚度显著小于电子组件/器件或散热片厚度的实施方案。
类似地,悬浮的颗粒110、120的相对形状可以是任意形状。图1所示的椭圆形的悬浮颗粒110、120仅仅是用于说明目的。一般来说,悬浮颗粒110、120的形状可以是颗粒,如球形、椭圆形或不规则球形。或者,悬浮颗粒110、120的形状可以是绳股、薄片、粉末或任何一种或所有这些形状的结合。
EMI吸收剂110起到吸收电磁能(也就是说,EMI)的作用。EMI吸收剂110将电磁能通过统称为损耗的工艺转化成另一形式的能量。电的损耗机理包括传导损耗、介电损耗和磁化损耗。传导损耗是指因电磁能转化成热能导致的EMI下降。电磁能诱导电流在具有有限传导率的EMI吸收剂110内流动。有限的传导率导致部分诱导电流通过电阻产生热。介电损耗是指因电磁能转化成相对介电常数不一致的吸收剂110内分子的机械位移导致的EMI下降。磁性损耗是指因电磁能转化成EMI吸收剂110内磁矩的再校准导致的EMI下降。
在一些实施方案中,EMI吸收剂110显示出比空气更好的导热性。例如,球形铁颗粒选择作为EMI吸收剂110,这是因为它们的EMI吸收性能还提供一定程度的导热性。然而,一般来说,厚度相当的EMI吸收剂110的导热率显著低于基本上非EMI吸收导热剂120,如陶瓷颗粒所提供的导热率数值。
一般来说,EMI吸收剂110选自导电材料、金属银、羰基铁粉、SENDUST(含85%铁、9.5%硅和5.5%铝的合金)、铁素体、硅化铁、磁性合金、磁性薄片及其结合。在一些实施方案中,EMI吸收剂110是磁性材料。在一个特别的实施方案中,EMI吸收剂110在约1.0GHz下的相对磁导率大于约3.0,和在10GHz下大于约1.5。
导热体120包括显著小于空气的热阻抗值。低的热阻抗值允许导热体120有效传导热能。一般来说,导热体120选自氮化铝(AlN)、氮化硼、铁(Fe)、金属氧化物及其结合。在一些实施方案中,导热体包括陶瓷材料。在一个特别的实施方案中,导热体120包括导热率大于约1.5瓦特/m-℃的Fe-AlN(分别为40%和20%体积)。此处以附件A的形式提供例举的试验报道,该试验报道包括测量试样导热率的试验工序以及所测量的导热率试验结果,和在此将其全部引入。
一般来说,选择基体材料130,以便具有允许它与许多散热片应用中遇到的表面缺陷(例如电子组件或器件和散热片的消光表面的表面缺陷)保形的性能。基体材料130的其它所需性能包括材料130能接受并悬浮大量体积的颗粒110、120(例如达约60%体积)且没有牺牲基体材料130的其它有利性能,如保形性、柔性和回弹性。一般来说,基体材料130还基本上透过电磁能,结果基体材料130没有妨碍EMI吸收剂110的吸收作用。例如,相对介电常数小于约4和损耗角正切值小于约0.1的基体材料130足以透过EMI。然而,在该范围以外的数值也被加以考虑。
一般来说,可以以固体、液体或相变材料形式选择基体材料130。其中基体材料130是固体的实施方案进一步包括热塑性材料和热固性材料。热塑性材料可加热并成形,然后可反复再加热和再成形。热塑性聚合物分子的形状通常为线性或略微支化,从而当加热到高于有效熔点时,允许它们在压力下流动。热固性材料也可加热和成形,然而,它们不可能再加工(也就是说,当再加热时,在压力下使之流动)。热固性材料当被加热时,经历化学以及相变化。它们的分子形成三维交联网络。
在一些固体实施方案中,基体材料130选自弹性体、天然橡胶、合成橡胶、PDP、乙烯丙烯二烯烃单体(EPDM)橡胶及其结合。在其它实施方案中,基体材料130包括聚合物。基体材料130也可选自硅氧烷、氟硅氧烷、异戊二烯、丁腈橡胶、氯磺化聚乙烯(例如)、新戊二烯、氟弹性体、聚氨酯、热塑性塑料,如热塑性弹性体(TPE)、聚酰胺TPE和热塑性聚氨酯(TPU)及其结合。
参考图2,示出了例举应用,其中所示地安装在电路板210上的电子组件200与散热片220相适配。电子组件200可以是电子电路(例如微电路或“芯片”)。或者,电子组件200可以是电子器件,如(例如,在金属外壳或“罐”内安装的)包括一个或多个电子组件的封装模块。在任意一种情况下,电子组件200产生热能作为其电子功能的副产物,这些热能应当被耗散,以确保电子组件200继续在其设计参数内操作和避免因过热导致的物理损坏。
一般来说,散热片220是从寄主组件200中耗散热量的器件。散热片220首先通过传导吸收来自寄主组件200的热量。散热片220然后将所吸收的热量通过对流耗散到周围空气中。所选散热片220的特定类型或形式不是关键的。相反,散热片220可以是许多各种可商购散热片中的任何一种,或者甚至是常规设计的散热片。
导热的EMI屏蔽230促进从组件200到散热片220的热传导。一般来说,导热的EMI屏蔽230的厚度(在受护的组件200与散热片之间的尺寸)小于预定的最大值。例如,在一个实施方案中,导热的EMI屏蔽230的最大厚度小于约0.18英寸。此外,导热的EMI屏蔽230的厚度通常大于预定的最小值。若导热的EMI屏蔽太薄,则将提供体积不足的EMI吸收材料来充分吸收来自组件200的EMI。例如,在一个实施方案中,导热的EMI屏蔽230的最小厚度大于约0.01英寸。
在一种例举的结构中,厚度为0.125英寸的导热的EMI屏蔽230在约5GHz一直到至少约18GHz的频率范围内显示出至少约5dB的衰减。在另一例举的结构中,厚度为0.02英寸的导热的EMI屏蔽230在向上延伸到约10GHz的频率范围下显示出至少约3dB的衰减。在另一例举的结构中,厚度为0.04英寸的导热的EMI屏蔽230在约9GHz一直到至少约15GHz的频率范围内显示出至少约10dB的衰减,和在向上延伸到约15GHz的频率范围内显示出至少约6dB的衰减。在又一例举的结构中,厚度为0.060英寸±0.005英寸的导热的EMI屏蔽230在向上延伸到约4GHz的频率范围下显示出至少约5dB的衰减,在约6GHz一直到至少约10GHz的频率范围内显示出至少约10dB的较大衰减。此处以附件B的形式制表并提供了丁腈橡胶的综合(真实和想象)相对介电常数(εr)和综合(真实和想象)相对磁导率(μr),在此将其全部引入。
参考图3A,以片材结构形式示出了导热的EMI屏蔽。一般来说,可以以片材300形式形成导热的EMI屏蔽。片材300包括长度(L′)宽度(W′)和厚度(T′)。在一个实施方案中,可根据特定应用的尺寸,如散热片220将施加到其上的电子组件200的长度与宽度,来选择长度与宽度。在另一实施方案中,可以以预定的尺寸,如长度26英寸、宽度6英寸和厚度或者0.030英寸或者0.060英寸,制造片材300。然而任何尺寸可加以考虑。
导热的EMI屏蔽100的又一其它实施方案可包括刚才所述的片材300,所述片材300进一步包括粘合层310。粘合层310可以是导热粘合剂,以维持总的导热率。可使用粘合层310将散热片220固定到电子组件200上。在一些实施方案中,片材300包括第二粘合层,这两层促进散热片220粘合到电子组件200上。在一些实施方案中,使用压敏粘合剂、导热粘合剂配制粘合层310。一般来说,压敏粘合剂(PSA)可以以包括丙烯酸、硅氧烷、橡胶的化合物及其结合为基础。例如通过包括陶瓷粉末来提高导热率。
在可供替代的实施方案中,现参考图3B,可以以胶带320形式形成导热的EMI屏蔽。胶带320,例如可以以类似于粘合剂作衬里的胶带的常规辊卷形式储存在辊卷330上。胶带320一般显示出与图3A的片材300中已经描述过的那些相类似的结构和组成特征。类似于片材300,胶带320包括第二宽度(W″)和第二厚度(T″)。一般来说,胶带卷实施方案的长度是任意的,因为胶带320的长度基本上比任何单独应用的长。所以,可从辊卷330上分离(例如“切割”)适于所打算应用的胶带320的长度。再者,类似于前面所述的片材300,胶带320可包括第一粘合层340。类似于双面紧固的胶带,胶带320还可包括第二粘合层。
现参考图4,示出了构造为片材400的导热的EMI屏蔽100的可供替代的实施方案。在这一实施方案中,可从片材400中切割所需应用的形状,如矩形410′和椭圆形410″(通常410),从而得到任何所需二维形状的导热的EMI屏蔽100。因此,可以冲切片材400产生应用形状410的所需轮廓。或者,可从图3A所示的空白片材300中常规切割出应用形状410的所需轮廓。
在又一实施方案中,可以以任何所需形状预成形导热的EMI屏蔽。现参考图5,示出了在非平面应用中的预成形的屏蔽500。可以以任何所需形状,如所示的矩形槽、圆柱形槽和半圆形槽,模塑或挤塑导热的EMI屏蔽。这种非平面的导热的EMI屏蔽500可与非平面的电子组件200,如圆柱形器件或组件(例如“罐”)结合使用。
参考图6,示出了液体导热的EMI屏蔽600的一个实施方案。一般地示出了容纳液体导热EMI屏蔽溶液620的容器610。在标记为“详细视图A”的插图中更详细地示出了一部分溶液620“A”。该详细视图示出了溶液620包括EMI吸收剂颗粒630和导热剂颗粒640,它们各自悬浮在液体基体650内。一般来说,颗粒630、640的特性类似于图1中所述的相应颗粒110、120的特性。类似于图1中所述的基体,液体基体650基本上对电磁辐射透明。可以以液体形式形成液体基体650,所述液体可以油漆在待处理的可用表面上。或者,可以以凝胶,如油脂,或以糊剂或原地倾倒的化合物形式形成液体基体650。在一些实施方案中,液体导热的EMI屏蔽600可通过油漆、喷涂或其它合适的方法施加到所打算的表面上。基体材料也可以是选自硅氧烷、环氧树脂、聚酯树脂及其结合中的液体。
在一个实施方案中,图1所示的基体130是合适地选择的具有固体和液体二者性能的相变材料。在环境室温下,相变材料的行为象固体一样,从而提供容易的处理和储存。然而,相变材料在设备操作温度处或以下时显示出再流动温度,从而能起到“润湿作用”。基体130再流动,从而允许复合材料100中的EMI吸收颗粒110和导热颗粒120在任何缝隙内,例如由表面缺陷引起的那些缝隙内流动。
参考图7,示出了电子组件700、散热片710和导热EMI屏蔽720的截面视图的特写细节。同样示出了组件700和散热片710每一种或二者的表面缺陷730。为了说明的目的,以放大的方式描绘了表面缺陷730。以液体或相变材料形式配制的基体650能在表面缺陷730内流动,因此能除去空气缝隙,从而最小化在器件700和相连的散热片710之间的热阻抗。除去空气缝隙的总效果降低了电子组件700和散热片710之间的热阻抗,从而导致改进的传热效率。基体材料可以是熔点为约51℃的石蜡和28%熔点为约74℃的乙烯乙酸乙烯酯共聚物的混合物。例如,可使用95重量份石蜡和5重量份乙烯乙酸乙烯酯共聚物的混合物。或者,可使用25重量份石蜡和6重量份乙烯乙酸乙烯酯共聚物的混合物。或者,基体材料还可以是熔点为约100℃和分子量为约1000的合成石蜡。这种石蜡术语称为费托合成过程中得到的蜡的类型。
参考图8,该流程图示出了制备导热EMI吸收剂100,如图1或图6所示实施方案的方法。在步骤800处提供EMI吸收剂颗粒110、630。同样在步骤810处提供导热颗粒120、640。EMI吸收剂颗粒110、630和导热颗粒120、640结合并悬浮在或者固体基体材料130或者液体基体材料650内。一旦制备,在步骤830处施加复合的导热EMI屏蔽100、600在电子组件200、700与散热片220、710之间。
已示出了例举和优选的实施方案,熟练本领域的技术人员会意识到在所要求保护的本发明的精神与范围内,许多变化是可能的。因此,目的是仅通过权利要求的范围,其中包括所有变体和等价物来限制本发明。
附件A
试验报道
范围:
该报告概述了包括导热填料在内的多种电磁能吸收材料的导热测试,均提供良好的导热率。
该部分的说明
制备三个试样并测试热性能。每一样品由配制成吸收电磁表面波的铁(Fe)填充的弹性材料组成。下表1列出了试样的一些具体细节。
表1:试样
样品编号 | 试样说明 |
1 | 以体积计,在异戊二烯内50%的Fe,样条厚度为30、60、90和125mil |
样品编号 | 试样说明 |
2 | 以体积计,在硅氧烷内41.5%的Fe,样条厚度为20、30、60和100mil |
3 | 以体积计,在硅氧烷内40%的Fe加上20%的氮化铝(AlN),样条厚度为30、60、90和120mil |
试验工序:
根据内部试验工序和根据ASTM说明D5470进行耐热测试。将试样首先冲切成直径1英寸的圆,与热阻抗探针的尺寸相匹配。在50℃、100psi下进行所有的耐热测量。
图9示出了试验装置900。试样910放置在两个抛光的金属板920、930之间,这两块金属板920、930堆叠在图9所示的试验组件900内。从加热板940处输入热量,其中在除了测试方向的所有方向上通过施加相同温度到位于加热板940上方与周围的保护加热器950上,从而保护加热板940避免热损失。上部的计量单元920直接位于加热器940的下方,接着是试样910,然后是下部的计量单元930。热量从具有水冷的深冷板960的试验叠层组件的底部引出。使用包埋在计量单元920、930内的热电偶970,外推在试样910的每一侧面上的表面温度。使用SRM1462参考材料进行这,所述参考材料的导热率比试样大得多。
在试验过程中,使用气动圆柱体,在恒压下压缩样品。然后允许叠层组件达到稳态,在该点处计算样品的热阻。一旦测量了数种厚度的材料的热阻(平均5次)并作图,通过该数据以最小平方近似线的斜率的导数形式计算导热率。
试验结果:
表2示出了三个吸收试样的导热率。两个标准的吸收材料,样品No.1和样品No.2,具有非常类似的导热率(约1.0瓦特/m-℃),而第三种吸收剂材料,样品No.3具有显著较高的导热率(约1.5瓦特/m-℃)。
表2:导热率
试样 | 导热率(约1.5瓦特/m-℃) | 标准偏差 |
样品No.1 | 0.986 | 0.0632 |
样品No.2 | 1.022 | 0.0959 |
样品No.3 | 1.511 | 0.0637 |
附件B丁腈橡胶(40%)
频率(GHz) | μ<sub>r</sub> | μ<sub>l</sub> | ε<sub>r</sub> | ε<sub>l</sub> |
0.915 | 4 | -1.77 | 12.277 | -0.251 |
1.15 | 4 | -1.77 | 12.277 | -0.251 |
2 | 3.4 | -1.74 | 12.277 | -0.251 |
2.245 | 3.29 | -1.735 | 12.277 | -0.251 |
3 | 2.95 | -1.72 | 12.277 | -0.251 |
4 | 2.58 | -1.67 | 12.277 | -0.251 |
5 | 2.219 | -1.624 | 12.277 | -0.251 |
6 | 2.05 | -1.58 | 12.277 | -0.251 |
7 | 1.88 | -1.55 | 12.277 | -0.251 |
8 | 1.65 | -1.52 | 12.277 | -0.251 |
9 | 1.5 | -1.48 | 12.277 | -0.251 |
9.5 | 1.45 | -1.43 | 12.277 | -0.251 |
10 | 1.39 | -1.4 | 12.277 | -0.251 |
11 | 1.34 | -1.36 | 12.277 | -0.251 |
12 | 1.27 | -1.32 | 12.277 | -0.251 |
13 | 1.201 | -1.273 | 12.277 | -0.251 |
14 | 1.18 | -1.24 | 12.277 | -0.251 |
15 | 1.14 | -1.21 | 12.277 | -0.251 |
15.5 | 1.1 | -1.18 | 12.277 | -0.251 |
16 | 1.057 | -1.147 | 12.277 | -0.251 |
17 | 1.04 | -1.125 | 12.277 | -0.251 |
18 | 1.03 | -1.1 | 12.277 | -0.251 |
频率(GHz) | μ<sub>r</sub> | μ<sub>l</sub> | ε<sub>r</sub> | ε<sub>l</sub> |
20 | 0.854 | -0.955 | 12.277 | -0.251 |
25 | 0.68 | -0.74 | 12.277 | -0.251 |
30 | 0.6 | -0.54 | 12.277 | -0.251 |
35 | 0.533 | -0.34 | 12.277 | -0.251 |
40 | 0.461 | -0.165 | 12.277 | -0.251 |
Claims (26)
1.一种降低电子器件产生的电磁发射用的导热复合材料,所述导热复合材料包括:
粒状形式的导热材料;和
粒状形式的电磁能吸收材料的结合,
所述导热材料和所述电磁能吸收材料悬浮在聚合物基体材料内,所述聚合物基体材料对电磁能基本上透明,所述聚合物基体材料包括具有再流动温度的相变材料,该相变材料在被加热到再流动温度时允许悬浮在聚合物基体材料内的粒状形式的导热材料和电磁能吸收材料流入缝隙内;
其中将所述导热复合材料设置成当将其放置到电子器件和相邻结构之间时,所述导热材料促进热能从所述电子器件上转移和所述电磁能吸收材料降低该器件产生的电磁发射。
2.权利要求1的导热复合材料,其中所述导热材料和所述电磁能吸收材料为选自球形、椭圆形和不规则球形的粒状颗粒。
3.权利要求1的导热复合材料,其中所述导热材料和所述电磁能吸收材料中的至少一种包括具有选自绳股、薄片、粉末及其结合中的形状的颗粒。
4.权利要求1的导热复合材料,其中所述导热材料选自氮化铝、氮化硼、铁、金属氧化物及其结合。
5.权利要求1的导热复合材料,其中所述导热材料是陶瓷材料。
6.权利要求1的导热复合材料,其中所述电磁能吸收材料选自金属银;羰基铁粉;铁、硅和铝的合金;铁素体;硅化铁;磁性合金;磁性薄片;及其结合。
7.权利要求1的导热复合材料,其中所述基体材料的相对介电常数小于4和损耗角正切值小于0.1。
8.权利要求1的导热复合材料,其中所述基体材料包括聚合物。
9.权利要求1的导热复合材料,其中所述基体材料选自热塑性塑料、热塑性弹性体、热塑性聚氨酯及其结合。
10.权利要求1的导热复合材料,其中所述基体材料是选自热塑性的固体材料。
11.权利要求1的导热复合材料,其中所述基体材料包括相变材料,所述相变材料在室温下以固相存在和在设备操作温度下转变成液相。
12.权利要求1的导热复合材料,其中所述聚合物基体材料包括石蜡和乙烯乙酸乙烯酯共聚物的混合物。
13.权利要求1的导热复合材料,其中所述聚合物基体材料包括熔点为100℃和分子量为1000的合成蜡。
14.权利要求1的导热复合材料,其中所述电磁能吸收材料的相对磁导率在1.0GHz下大于3.0,和在10GHz下大于1.5。
15.权利要求1的导热复合材料,其中所述复合材料是厚度大于0.01英寸的片材。
16.权利要求1的导热复合材料,其中所述复合材料是厚度小于0.18英寸的片材。
17.权利要求1的导热复合材料,其中所述聚合物基体材料包括熔点为51℃的石蜡和28%熔点为74℃的乙烯乙酸乙烯酯共聚物的混合物。
18.权利要求1的导热复合材料,其中所述复合材料是片材形式,和进一步包括在所述片材的至少一侧上的粘合剂。
19.权利要求18的导热复合材料,其中所述粘合剂是导热粘合剂
20.权利要求18的导热复合材料,其中所述粘合剂是压敏导热粘合剂。
21.权利要求1的导热复合材料,其中所述聚合物基体材料包括25重量份的熔点为51℃的石蜡和6重量份的熔点为74℃的28%乙烯乙酸乙烯酯共聚物的混合物。
22.权利要求18的导热复合材料,其中所述粘合剂进一步包括陶瓷粉末或是基于选自丙烯酸、硅氧烷、橡胶及其结合中的化合物。
23.权利要求1的导热复合材料,其中所述聚合物基体材料包括95重量份的熔点为51℃的石蜡和5重量份的熔点为74℃的28%乙烯乙酸乙烯酯共聚物的混合物。
24.一种降低器件产生的电磁发射的方法,该方法包括下述步骤:
(a)提供粒状形式的导热材料;
(b)提供粒状形式的电磁能吸收材料;
(c)结合导热材料与电磁能吸收材料;
(d)在聚合物基体材料内悬浮结合的导热材料和电磁能吸收材料,该聚合物基体材料包括具有再流动温度的相变材料,该相变材料在被加热到再流动温度时允许悬浮在聚合物基体材料内的粒状形式的导热材料和电磁能吸收材料流入缝隙内;和
(e)在所述器件和相邻的结构之间放置结合的导热材料和电磁能吸收材料。
25.权利要求24的方法,其中所述聚合物基体材料包括:
25重量份的熔点为51℃的石蜡和6重量份的熔点为74℃的28%乙烯乙酸乙烯酯共聚物的混合物;或
95重量份的熔点为51℃的石蜡和5重量份的熔点为74℃的28%乙烯乙酸乙烯酯共聚物的混合物;或
熔点为51℃的石蜡和熔点为74℃的28%乙烯乙酸乙烯酯共聚物的混合物。
26.权利要求24的方法,其中该相变材料在室温表现出固体行为并且在等于或低于设备操作温度具有再流动温度;以及
加热该相变材料到再流动温度包括操作该器件。
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WO2004037447A1 (en) | 2004-05-06 |
AU2003284309A1 (en) | 2004-05-13 |
CN101835365A (zh) | 2010-09-15 |
TWI335207B (en) | 2010-12-21 |
CN101835365B (zh) | 2013-03-27 |
US20060099403A1 (en) | 2006-05-11 |
US20090016025A1 (en) | 2009-01-15 |
CN1720108A (zh) | 2006-01-11 |
EP1558403A4 (en) | 2006-12-20 |
EP1558403A1 (en) | 2005-08-03 |
JP2006504272A (ja) | 2006-02-02 |
US7842381B2 (en) | 2010-11-30 |
US7608326B2 (en) | 2009-10-27 |
TW200409590A (en) | 2004-06-01 |
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