JP4914678B2 - 電子機器 - Google Patents
電子機器 Download PDFInfo
- Publication number
- JP4914678B2 JP4914678B2 JP2006235940A JP2006235940A JP4914678B2 JP 4914678 B2 JP4914678 B2 JP 4914678B2 JP 2006235940 A JP2006235940 A JP 2006235940A JP 2006235940 A JP2006235940 A JP 2006235940A JP 4914678 B2 JP4914678 B2 JP 4914678B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- shield
- electronic
- circuit board
- circuit component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229910000859 α-Fe Inorganic materials 0.000 claims description 32
- 230000017525 heat dissipation Effects 0.000 claims description 15
- 230000002093 peripheral effect Effects 0.000 claims description 10
- 239000000758 substrate Substances 0.000 description 17
- 239000000463 material Substances 0.000 description 13
- 230000000694 effects Effects 0.000 description 12
- 229910052751 metal Inorganic materials 0.000 description 12
- 239000002184 metal Substances 0.000 description 12
- 230000005855 radiation Effects 0.000 description 12
- 208000028659 discharge Diseases 0.000 description 9
- 230000007257 malfunction Effects 0.000 description 7
- 238000012360 testing method Methods 0.000 description 6
- 230000001419 dependent effect Effects 0.000 description 4
- 230000006378 damage Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 230000000191 radiation effect Effects 0.000 description 2
- 208000032365 Electromagnetic interference Diseases 0.000 description 1
- 229910003286 Ni-Mn Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 235000012489 doughnuts Nutrition 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 239000006247 magnetic powder Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0067—Devices for protecting against damage from electrostatic discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0233—Filters, inductors or a magnetic substance
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
12 …ハウジング
30 …周辺機器用コネクタ
32 …AVコネクタ
36 …基板
36e …接地層
36f …接地面
38 …GPU
40 …CPU
44 …シールド
44Aa …凸部
44Ab …スリット
46(12u)…底板(ハウジング底面)
48 …放熱フィン
48a …放熱板
48b …ベース
50 …熱伝導シート
52 …フェライトリング
54,56 …金属ネジ
Claims (3)
- 回路基板、当該回路基板上に取り付けられる電子回路部品、当該電子回路部品で発生する熱を放熱するために当該電子回路部品上に配置される金属性の放熱部材を備える電子機器であって、
前記回路基板に接地され、かつ前記放熱部材の近傍に少なくともその一面が位置するように配置される当該回路基板を覆うシールド、
前記放熱部材を前記回路基板に接地する接地部材、および
前記接地部材の周面近傍に配置される磁性部材を備え、
前記シールドにはスリットが形成され、
前記放熱部材は放熱板および当該放熱板を支えるベースで構成され、
前記ベースは前記シールドと前記電子回路部品との間隙に配置され、
前記放熱板の一部が前記スリットから当該シールドの外部に露出している、電子機器。 - その上面および下面が前記ベースの下面および前記電子回路部品の上面とそれぞれ密着される熱伝導シートをさらに備える、請求項1記載の電子機器。
- 前記磁性部材はリング状のフェライトである、請求項1または2に記載の電子機器。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006235940A JP4914678B2 (ja) | 2006-08-31 | 2006-08-31 | 電子機器 |
US11/822,934 US7889503B2 (en) | 2006-08-31 | 2007-07-11 | Electronic appliance having an electronic component and a heat-dissipating plate |
EP07112726A EP1895826B1 (en) | 2006-08-31 | 2007-07-18 | Electronic Appliance with a metallic heat dissipating member |
CN2007101391604A CN101137282B (zh) | 2006-08-31 | 2007-07-20 | 电子装置 |
HK08105218.7A HK1115263A1 (en) | 2006-08-31 | 2008-05-09 | Electronic appliance |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006235940A JP4914678B2 (ja) | 2006-08-31 | 2006-08-31 | 電子機器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008060358A JP2008060358A (ja) | 2008-03-13 |
JP4914678B2 true JP4914678B2 (ja) | 2012-04-11 |
Family
ID=38828533
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006235940A Active JP4914678B2 (ja) | 2006-08-31 | 2006-08-31 | 電子機器 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7889503B2 (ja) |
EP (1) | EP1895826B1 (ja) |
JP (1) | JP4914678B2 (ja) |
CN (1) | CN101137282B (ja) |
HK (1) | HK1115263A1 (ja) |
Families Citing this family (31)
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JP4699967B2 (ja) * | 2006-09-21 | 2011-06-15 | 株式会社ソニー・コンピュータエンタテインメント | 情報処理装置 |
JP2009099876A (ja) * | 2007-10-19 | 2009-05-07 | Yokogawa Electric Corp | シールドケースユニット |
CN101620459A (zh) * | 2008-06-30 | 2010-01-06 | 鸿富锦精密工业(深圳)有限公司 | 电子设备及其支撑件 |
US7834446B2 (en) | 2008-09-03 | 2010-11-16 | Kabushiki Kaisha Toshiba | Electronic device and method for coping with electrostatic discharge |
JP4958189B2 (ja) * | 2009-04-07 | 2012-06-20 | シャープ株式会社 | 集積回路の搭載構造 |
US8487235B2 (en) * | 2009-04-13 | 2013-07-16 | Rockwell Automation Technologies, Inc. | Photoelectric sensor for sensing a target at a predetermined location |
JP5402200B2 (ja) * | 2009-04-20 | 2014-01-29 | 株式会社リコー | 熱移動機構及び情報機器 |
TW201221041A (en) * | 2010-11-11 | 2012-05-16 | Hon Hai Prec Ind Co Ltd | Heat dissipation apparatus assembly |
CN102468254A (zh) * | 2010-11-12 | 2012-05-23 | 鸿富锦精密工业(深圳)有限公司 | 散热装置组合 |
CN102595840A (zh) * | 2011-01-18 | 2012-07-18 | 鸿富锦精密工业(深圳)有限公司 | 电子装置 |
US8477513B2 (en) * | 2011-03-25 | 2013-07-02 | Delphi Technologies, Inc. | Electrical connector shield |
TW201241603A (en) * | 2011-04-08 | 2012-10-16 | Asustek Comp Inc | Motherboard |
US8809697B2 (en) | 2011-05-05 | 2014-08-19 | Carefusion 303, Inc. | Passive cooling and EMI shielding system |
CN103188915A (zh) * | 2011-12-30 | 2013-07-03 | 鸿富锦精密工业(深圳)有限公司 | 散热装置及带有该散热装置的电子设备 |
JP5619966B2 (ja) * | 2012-10-11 | 2014-11-05 | アサステック・コンピューター・インコーポレイテッドAsustek Computer Inc. | 放熱構造 |
CA2809725A1 (en) * | 2013-03-11 | 2014-09-11 | Sureshchandra B. Patel | Multiprocessor computing apparatus with wireless interconnect for communication among its components |
KR20160090144A (ko) * | 2015-01-21 | 2016-07-29 | 주식회사 아모그린텍 | 방열 시트 일체형 안테나 모듈 |
KR101609642B1 (ko) * | 2015-07-10 | 2016-04-08 | 주식회사 아모그린텍 | Nfc 안테나 일체형 방열시트 및 이를 구비하는 휴대단말기 |
CN109936278B (zh) * | 2015-07-30 | 2021-10-15 | 台达电子工业股份有限公司 | 内建emi电路的变频器结构 |
US20170071076A1 (en) * | 2015-09-03 | 2017-03-09 | Adlink Technology Inc. | Thermal conducting structure applied to network control automation system |
DE102016108868A1 (de) * | 2016-05-13 | 2017-11-16 | Kathrein Werke Kg | Adapterplatte für HF-Strukturen |
US10290587B2 (en) | 2016-11-03 | 2019-05-14 | Toyota Motor Engineering & Manufacturing North America, Inc. | Cooler with emi-limiting inductor |
US10108234B1 (en) * | 2017-06-09 | 2018-10-23 | Nzxt Inc. | Shielded motherboard |
JP6440779B1 (ja) * | 2017-07-04 | 2018-12-19 | 三菱電機株式会社 | 電力変換装置 |
JP6439834B2 (ja) * | 2017-08-22 | 2018-12-19 | 株式会社デンソー | 制御装置 |
US11184997B2 (en) * | 2018-04-23 | 2021-11-23 | Intel Corporation | System to reduce coolant use in an array of circuit boards |
KR102547948B1 (ko) | 2018-08-30 | 2023-06-26 | 삼성전자주식회사 | 정전기 방지 구조물을 포함하는 솔리드 스테이트 드라이브 장치 |
CN109950216B (zh) * | 2019-04-15 | 2021-07-13 | 南京棠邑科创服务有限公司 | 一种esd晶体管结构 |
US11488796B2 (en) * | 2019-04-24 | 2022-11-01 | Applied Materials, Inc. | Thermal break for high-frequency antennae |
US12038241B2 (en) * | 2020-07-28 | 2024-07-16 | Kyle Borden Marquis | Layered radiator for efficient heat rejection |
CN114751268A (zh) * | 2021-01-08 | 2022-07-15 | 通力股份公司 | 输送机驱动单元和输送机 |
Family Cites Families (25)
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JPH0810730B2 (ja) * | 1993-02-24 | 1996-01-31 | 日本電気株式会社 | パッケージのシールド構造 |
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JP4445409B2 (ja) * | 2005-02-23 | 2010-04-07 | 株式会社東芝 | 電子機器の放熱装置 |
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JP2009283828A (ja) * | 2008-05-26 | 2009-12-03 | Nec Electronics Corp | 半導体装置および半導体装置の製造方法 |
-
2006
- 2006-08-31 JP JP2006235940A patent/JP4914678B2/ja active Active
-
2007
- 2007-07-11 US US11/822,934 patent/US7889503B2/en not_active Expired - Fee Related
- 2007-07-18 EP EP07112726A patent/EP1895826B1/en active Active
- 2007-07-20 CN CN2007101391604A patent/CN101137282B/zh active Active
-
2008
- 2008-05-09 HK HK08105218.7A patent/HK1115263A1/xx unknown
Also Published As
Publication number | Publication date |
---|---|
EP1895826A3 (en) | 2009-08-12 |
EP1895826A2 (en) | 2008-03-05 |
CN101137282B (zh) | 2012-01-04 |
US20080055861A1 (en) | 2008-03-06 |
US7889503B2 (en) | 2011-02-15 |
HK1115263A1 (en) | 2008-11-21 |
CN101137282A (zh) | 2008-03-05 |
EP1895826B1 (en) | 2011-12-21 |
JP2008060358A (ja) | 2008-03-13 |
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