CN101620459A - 电子设备及其支撑件 - Google Patents
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- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
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- H—ELECTRICITY
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
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- H—ELECTRICITY
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
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- H—ELECTRICITY
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- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
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- H—ELECTRICITY
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- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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Abstract
一种电子设备,包括设有接地线的电路板、设置于电路板上的芯片、设置于芯片上用于为芯片散热的散热器、固定件、用于支撑电路板的支撑件和设置于支撑件和电路板之间的绝缘片,支撑件上设置有导电块,固定件用于将散热器和支撑件固定于电路板上,绝缘片上设置有通孔,导电块穿过该通孔并与接地线相接触以导走电路板上的静电。上述电子设备通过支撑件支撑该电路板,以防止因散热器过重而造成的电路板变形、内部线路断裂等问题,保护电路板。本发明还有涉及一种电子设备的支撑件。
Description
技术领域
本发明涉及一种电子设备,尤其涉及一种具有支撑板的电子设备。
背景技术
中央处理器是电脑处理资讯的神经中枢,电脑的整体性能可否提升,很大程度取决于中央处理器的性能。因此,高频高速的中央处理器推陈出新,势必为市场的必然趋势。然而,高频高速的中央处理器产生的热愈来愈多,进而使得电脑内部的温度越来越高,严重威胁着中央处理器运作的稳定性。为确保中央处理器的正常运作,必须及时排除其产生的热量。
业界通常采用在中央处理器的表面设置有一散热器,用以及时排出热量。中央处理器固定于电路板上,散热器贴合于中央处理器之上。电路板上开设有具有内螺纹的固定孔,通过螺钉等固定元件穿过散热器后螺合于电路板的固定孔内,从而固定散热器,便于及时排出中央处理器产生的热量。
然而,由于散热器具有一定的重量,因此,其会向中央处理器施加一定的作用力,进而使得中央处理器向电路板施加作用力,造成电路板变形、内部线路断裂等问题。
发明内容
有鉴于此,有必要提供一种可保护电路板的电子设备。
还有必要提供一种可保护电路板的支撑件。
一种电子设备,包括设有接地线的电路板、设置于电路板上的芯片、设置于芯片上用于为芯片散热的散热器、固定件、用于支撑电路板的支撑件和设置于支撑件和电路板之间的绝缘片,支撑件上设置有导电块,固定件用于将散热器和支撑件固定于电路板上,绝缘片上设置有通孔,导电块穿过该通孔并与接地线相接触以导走电路板上的静电。
一种支撑件,用于支撑电路板,支撑件上凸设有导电块,导电块用于穿过该设置于电路板和支撑件之间的绝缘片的通孔并与该电路板的接地线相接触以导走该电路板上的静电。
上述电子设备通过支撑件支撑该电路板,以防止因散热器过重而造成的电路板变形、内部线路断裂等问题,保护电路板。
附图说明
图1为一较佳实施方式电子设备的分解图。
图2为图1中电子设备的立体图。
图3为图2中电子设备的III-III向局部剖面图。
具体实施方式
请参阅图1和图2,为一较佳实施方式电子设备100的分解图和立体图。电子设备包括电路板10、固定于电路板10之上的中央处理器20、用于支撑电路板10的支撑件30、设置于支撑件30与电路板10之间的绝缘片40、固定于电路板10上并位于中央处理器20之上的散热器50、弹性件60以及用于将散热器50、电路板10和支撑件30顺次固定在一起的固定件70。
请同时参阅图3,电路板10上设置有多个电子元件(图未标示),其上开设有用于固定支撑件30的固定孔11和便于插设中央处理器20的插槽13。电路板10上还设有与固定孔11相邻便于导走电路板10上静电的接地线14,接地线14环绕固定孔11设置,且与插槽13分别设置于中央处理器20相背的两表面上。
中央处理器20固定于电路板10上的插槽13上。
支撑件30为一导电元件,其包括基板31、凸设于基板31上的定位柱32、开设于定位柱32上的定位孔33以及凸设于基板31上的导电块35。定位柱32装配于固定孔11内,以便于将支撑件30固定于电路板10之上。定位孔33设置有内螺纹。导电块35为圆环台状,其环绕定位柱32设置,且其位置与接地线14的位置相对,用以与接地线14接触,以便于导走电路板10上的静电和吸收电路板10上的电磁波,保护电路板10上的电子元件,使得电路板10上的电子元件能正常工作。
绝缘片40设置于电路板10和支撑件30之间,以使得基板31与电路板10之间不会直接接触而造成电气短路。绝缘片40上开设有通孔41,以便于支撑件30上的导电块35和定位柱32穿过通孔41后与电路板10接触。
散热器50贴设于中央处理器20之上,用以协助中央处理器20散热,使中央处理器20不会因为过热而造成运作不稳定。散热器50上开设有穿孔51。
固定件70包括头部71和尾部73。尾部73上设置有外螺纹。固定件70的尾部73穿过穿孔51后螺合入装配于固定孔11内的定位柱32的定位孔33内,从而将散热器50、电路板10和支撑件30固定在一起,防止因散热器50过重而造成的电路板10变形、内部线路断裂等问题,保护电路板10。
弹性件60套设于固定件70上,并挡设于散热器50和固定件70的头部71之间。当固定件70的尾部73螺合于定位柱32上时,弹性件60被压缩,用以将散热器50压设于电路板10上。
在本实施方式中,该电子设备100上的中央处理器20还可以为北桥、GPU等需要散热器50协助散热的芯片。
Claims (11)
1.一种电子设备,包括设有接地线的电路板、设置于电路板上的芯片、设置于该芯片上用于为该芯片散热的散热器以及固定件,其特征在于:该电子设备还包括用于支撑该电路板的支撑件和设置于支撑件和电路板之间的绝缘片,该支撑件上设置有导电块,该固定件用于将该散热器和该支撑件固定于该电路板上,该绝缘片上设置有通孔,该导电块穿过该通孔并与该接地线相接触以导走电路板上的静电。
2.如权利要求1所述的电子设备,其特征在于:该电路板上开设有固定孔,该散热器上开设有穿孔,该支撑件上开设有定位孔,该固定件顺次穿过穿孔和固定孔后装配于定位孔内。
3.如权利要求2所述的电子设备,其特征在于:该接地线环绕该固定孔设置,而该导电块环绕该定位孔设置,其位置与该接地线的位置相对。
4.如权利要求2所述的电子设备,其特征在于:该支撑件包括一定位柱,该定位孔开设于该定位柱上,该定位柱装配于固定孔内。
5.如权利要求4所述的电子设备,其特征在于:该接地线环绕该固定孔设置,而该导电块环绕该定位柱设置,其位置与该接地线的位置相对。
6.如权利要求1所述的电子设备,其特征在于:该电子设备还包括挡设于该固定件和散热器之间的弹性件,该弹性件在该散热器和支撑件固定于该电路板上时被压缩。
7.如权利要求6所述的电子设备,其特征在于:该弹性件套设于该固定件之上。
8.如权利要求1所述的电子设备,其特征在于:该接地线与该芯片分别设置于该电路板相背的表面上。
9.一种支撑件,用于支撑电路板,其特征在于:该支撑件上凸设有导电块,该导电块用于穿过该设置于电路板和支撑件之间的绝缘片的通孔并与该电路板的接地线相接触以导走该电路板上的静电。
10.如权利要求9所述的支撑件,其特征在于:该支撑件上设置有用于将支撑件固定于电路板上的定位孔,该导电块环绕该定位孔设置,以与该接地线的位置相对。
11.如权利要求10所述的支撑件,其特征在于:该支撑件包括一定位柱,该定位孔开设于该定位柱上,该定位柱用于穿过该通孔将该支撑件固定于该电路板上。
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CN200810302441A CN101620459A (zh) | 2008-06-30 | 2008-06-30 | 电子设备及其支撑件 |
US12/485,935 US20090323273A1 (en) | 2008-06-30 | 2009-06-17 | Support device and electronic device using same |
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CN200810302441A CN101620459A (zh) | 2008-06-30 | 2008-06-30 | 电子设备及其支撑件 |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104486900A (zh) * | 2014-11-07 | 2015-04-01 | 广东风华高新科技股份有限公司 | 用于电路板的支撑件及其制备方法 |
CN107249249A (zh) * | 2017-04-24 | 2017-10-13 | 广东美的暖通设备有限公司 | 室外机电控装置、室外机及空调器 |
CN110167308A (zh) * | 2019-05-27 | 2019-08-23 | 珠海格力电器股份有限公司 | 安装结构、电器盒及换热设备 |
CN114911319A (zh) * | 2021-02-07 | 2022-08-16 | 北京图森智途科技有限公司 | 电路板安装方法及相关电子设备 |
CN114911315A (zh) * | 2021-02-07 | 2022-08-16 | 北京图森智途科技有限公司 | 计算设备及计算设备的安装方法 |
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CN102111987A (zh) * | 2009-12-28 | 2011-06-29 | 富准精密工业(深圳)有限公司 | 锁固结构及其制造方法、以及应用该锁固结构的散热装置 |
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US6362977B1 (en) * | 2000-04-19 | 2002-03-26 | Hewlett-Packard Company | EMI containment assembly for an integrated circuit chip |
TW578981U (en) * | 2001-11-30 | 2004-03-01 | Foxconn Prec Components Co Ltd | Heat dissipating assembly |
US6480388B1 (en) * | 2002-03-20 | 2002-11-12 | Hon Hai Precision Ind. Co., Ltd. | Back plate assembly for motherboard |
US20040075982A1 (en) * | 2002-10-21 | 2004-04-22 | Kim David K. | Heat sink frame with improved electromagnetic interference (EMI) suppression characteristics |
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US20070121300A1 (en) * | 2005-11-29 | 2007-05-31 | Wan-Lin Xia | Back plate assembly for mounting a heat sink assembly to a motherboard |
JP4914678B2 (ja) * | 2006-08-31 | 2012-04-11 | 任天堂株式会社 | 電子機器 |
US20080266807A1 (en) * | 2007-04-27 | 2008-10-30 | Cray Inc. | Electronic assembly with emi shielding heat sink |
US7834446B2 (en) * | 2008-09-03 | 2010-11-16 | Kabushiki Kaisha Toshiba | Electronic device and method for coping with electrostatic discharge |
-
2008
- 2008-06-30 CN CN200810302441A patent/CN101620459A/zh active Pending
-
2009
- 2009-06-17 US US12/485,935 patent/US20090323273A1/en not_active Abandoned
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104486900A (zh) * | 2014-11-07 | 2015-04-01 | 广东风华高新科技股份有限公司 | 用于电路板的支撑件及其制备方法 |
CN107249249A (zh) * | 2017-04-24 | 2017-10-13 | 广东美的暖通设备有限公司 | 室外机电控装置、室外机及空调器 |
CN110167308A (zh) * | 2019-05-27 | 2019-08-23 | 珠海格力电器股份有限公司 | 安装结构、电器盒及换热设备 |
CN114911319A (zh) * | 2021-02-07 | 2022-08-16 | 北京图森智途科技有限公司 | 电路板安装方法及相关电子设备 |
CN114911315A (zh) * | 2021-02-07 | 2022-08-16 | 北京图森智途科技有限公司 | 计算设备及计算设备的安装方法 |
CN114911315B (zh) * | 2021-02-07 | 2024-02-06 | 北京图森智途科技有限公司 | 计算设备及计算设备的安装方法 |
CN114911319B (zh) * | 2021-02-07 | 2024-04-12 | 北京图森智途科技有限公司 | 电路板安装方法及相关电子设备 |
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