JP2006504272A - 熱伝導性emiシールド - Google Patents
熱伝導性emiシールド Download PDFInfo
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- JP2006504272A JP2006504272A JP2004546972A JP2004546972A JP2006504272A JP 2006504272 A JP2006504272 A JP 2006504272A JP 2004546972 A JP2004546972 A JP 2004546972A JP 2004546972 A JP2004546972 A JP 2004546972A JP 2006504272 A JP2006504272 A JP 2006504272A
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- thermally conductive
- conductive composite
- electromagnetic energy
- emi
- energy absorbing
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- BNPSSFBOAGDEEL-UHFFFAOYSA-N albuterol sulfate Chemical compound OS(O)(=O)=O.CC(C)(C)NCC(O)C1=CC=C(O)C(CO)=C1.CC(C)(C)NCC(O)C1=CC=C(O)C(CO)=C1 BNPSSFBOAGDEEL-UHFFFAOYSA-N 0.000 description 1
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
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- H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
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- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
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- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
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- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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Abstract
EMI吸収材料と熱伝導性材料を一緒にする材料および方法が開示され、それによってEMI遮蔽の有効性を経済的に効率のよい方法で改善する。1の実施態様では、熱伝導性EMI吸収体が、EMI吸収材料(たとえば、フェライト粒子)と熱伝導性材料(たとえば、セラミック粒子)を一緒にし、それぞれがエラストマーマトリックス(たとえば、シリコーン)中に懸濁されることによって調製される。用途においては、1層の熱伝導性EMI吸収材料が電子機器または部品とヒートシンクとの間に付与される。
Description
試験報告書
本報告書は、熱伝導性充填剤を含み、良好な熱伝導性をも提供する、複数の電磁エネルギー吸収材料の熱伝導率の試験をまとめる。
3つの試験サンプルが調製され、そして熱特性が試験された。サンプルのそれぞれは、電磁表面波を吸収するように処方された鉄(Fe)充填エラストマー材料から成っていた。試験サンプルのいくつかの具体的な詳細が下の表1に載せられている。
熱抵抗試験が内部試験手順に従って、およびASTM規格D5470に従って実施された。試験サンプルは最初に熱インピーダンス試験具の大きさに合う1インチ直径の円に切り出された。熱抵抗測定のすべては50℃、および100psiでなされた。
3つの吸収体試験サンプルの熱伝導率が表2に示される。2つの標準的な吸収体材料、サンプルNo.1およびサンプルNo.2は非常に似た熱伝導率(約1.0ワット/m−℃)を持ち、一方、第3の吸収体材料、サンプルNo.3は実質的に、これらより高い熱伝導率(約1.5ワット/m−℃)を持つ。
Claims (31)
- 電子機器によって生成される電磁放出を減少するための熱伝導性複合材料であって、当該熱伝導性複合材料が、
熱伝導性材料、および、
電磁エネルギー吸収材料、
を組み合わせて含み、当該熱伝導性材料が当該電子機器からの熱エネルギーの移動を促進し、かつ当該電磁エネルギー吸収材料が該機器によって生成される電磁放出を減少する、熱伝導性複合材料。 - 当該熱伝導性材料および当該電磁エネルギー吸収材料の少なくとも1が、回転楕円体、楕円体および不規則な回転楕円体からなる群から選ばれた形を持つ顆粒の形態をした粒子を含む、請求項1に記載された熱伝導性複合材料。
- 当該熱伝導性材料および当該電磁エネルギー吸収材料の少なくとも1が、ストランド、フレーク、粉体およびこれらの組み合わせからなる群から選ばれた形態を持つ粒子を含む、請求項1に記載された熱伝導性複合材料。
- 当該熱伝導性材料が窒化アルミニウム、窒化ホウ素、鉄、金属酸化物およびこれらの組み合わせからなる群から選ばれる、請求項1に記載された熱伝導性複合材料。
- 当該熱伝導性材料がセラミック材料である、請求項1に記載された熱伝導性複合材料。
- 当該電磁エネルギー吸収材料が電導性材料;メタリックシルバー;鉄カルボニル粉体;鉄、ケイ素およびアルミニウムの合金;フェライト;ケイ化鉄;磁性合金;磁性フレーク;磁性材料;およびこれらの組み合わせからなる群から選ばれる、請求項1に記載された熱伝導性複合材料。
- 当該熱伝導性材料および当該電磁エネルギー吸収材料がマトリックス材料中に懸濁されている、請求項1に記載された熱伝導性複合材料。
- 当該マトリックス材料が電磁エネルギーに対して実質的に透明である、請求項7に記載された熱伝導性複合材料。
- 当該マトリックス材料が約4より小さい比誘電率および約0.1より小さい損失正接を持つ、請求項8に記載された熱伝導性複合材料。
- 当該マトリックス材料がエラストマー、天然ゴム、合成ゴム、PDP、EPDMゴム、およびこれらの組み合わせからなる群から選ばれる、請求項7に記載された熱伝導性複合材料。
- 当該マトリックス材料が重合体を含む、請求項7に記載された熱伝導性複合材料。
- 当該マトリックス材料がシリコーン、フルオロシリコーン、イソプレン、ニトリル、クロルスルホン化ポリエチレン、ネオプレン、フルオロエラストマー、ウレタン、熱可塑性プラスチック、熱可塑性エラストマー(TPE)、ポリアミドTPE、熱可塑性ポリウレタン(TPU)、およびこれらの組み合わせからなる群から選ばれる、請求項7に記載された熱伝導性複合材料。
- 当該マトリックス材料が熱可塑性および熱硬化性材料からなる群から選ばれた固体材料である、請求項7に記載された熱伝導性複合材料。
- 当該マトリックス材料が液体である、請求項7に記載された熱伝導性複合材料。
- 当該液体がシリコーン、エポキシ、ポリエステル樹脂、およびこれらの組み合わせからなる群から選ばれる、請求項14に記載された熱伝導性複合材料。
- 当該マトリックス材料が環境温度では固相で存在し、そして装置作動温度では液相に転移する相変化材料を含む、請求項7に記載された熱伝導性複合材料。
- 当該マトリックス材料がパラフィンワックスとエチレン−酢酸ビニル共重合体の混合物を含む、請求項7に記載された熱伝導性複合材料。
- 当該マトリックス材料が約100℃の融点および約1000の分子量を持つ合成ワックスを含む、請求項7に記載された熱伝導性複合材料。
- 当該電磁エネルギー吸収材料が約1.0GHzで約3.0より大きい、そして10GHzで約1.5より大きい比透磁率を持つ、請求項1に記載された熱伝導性複合材料。
- 当該複合材料が約0.01インチより大きい厚さを持つシートの形態をしている、請求項1に記載された熱伝導性複合材料。
- 当該複合材料が約0.18インチより小さい厚さを持つシートの形態をしている、請求項1に記載された熱伝導性複合材料。
- 当該複合材料がシートの形態をしていて、そしてさらに当該シートの少なくとも1面上に接着剤を含む、請求項1に記載された熱伝導性複合材料。
- 当該接着剤が熱伝導性接着剤である、請求項22に記載された熱伝導性複合材料。
- 当該接着剤が感圧性、熱伝導性接着剤である、請求項22に記載された熱伝導性複合材料。
- 当該接着剤がアクリル、シリコーン、ゴムおよびこれらの組み合わせからなる群から選ばれた化合物に基づいている、請求項22に記載された熱伝導性複合材料。
- 当該接着剤がさらにセラミック粉体を含む、請求項22に記載された熱伝導性複合材料。
- (a)熱伝導性材料を用意すること、
(b)電磁エネルギー吸収材料を用意すること、そして、
(c)熱伝導性材料を電磁エネルギー吸収材料と一緒にすること、
の段階を含む、機器によって生成される電磁放出を減少する方法。 - 一緒にされた熱伝導性材料および電磁エネルギー吸収材料をマトリックス材料中に懸濁させる段階をさらに含む請求項27に記載された方法。
- 一緒にされた熱伝導性材料および電磁エネルギー吸収材料を当該機器および近傍の構造体の間に置く段階をさらに含む請求項27に記載された方法。
- 近傍の構造体がヒートシンクを含む、請求項29の方法。
- 当該機器が集積回路を含む、請求項29の方法。
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JP2001358265A (ja) | 2000-06-14 | 2001-12-26 | Daido Steel Co Ltd | 電磁波抑制伝熱成形体 |
US6851869B2 (en) * | 2000-08-04 | 2005-02-08 | Cool Options, Inc. | Highly thermally conductive electronic connector |
US6557859B2 (en) * | 2000-08-04 | 2003-05-06 | Cool Options, Inc. | Injection moldable elastomeric gasket |
CN1170891C (zh) | 2000-12-18 | 2004-10-13 | 黄佳玉 | 一种防电磁辐射的吸波材料 |
JP2002217342A (ja) | 2001-01-16 | 2002-08-02 | Denki Kagaku Kogyo Kk | 相変化型放熱部材及びその製造方法、用途 |
JP2002374092A (ja) * | 2001-06-15 | 2002-12-26 | Polymatech Co Ltd | 放熱性電波吸収体 |
US7262369B1 (en) * | 2006-03-09 | 2007-08-28 | Laird Technologies, Inc. | Combined board level EMI shielding and thermal management |
-
2003
- 2003-10-21 EP EP03776490A patent/EP1558403A4/en not_active Ceased
- 2003-10-21 JP JP2004546972A patent/JP2006504272A/ja active Pending
- 2003-10-21 US US10/531,890 patent/US7608326B2/en active Active
- 2003-10-21 TW TW92129139A patent/TWI335207B/zh not_active IP Right Cessation
- 2003-10-21 AU AU2003284309A patent/AU2003284309A1/en not_active Abandoned
- 2003-10-21 CN CN2003801049053A patent/CN1720108B/zh not_active Expired - Lifetime
- 2003-10-21 WO PCT/US2003/033353 patent/WO2004037447A1/en active Application Filing
- 2003-10-21 CN CN2010101566865A patent/CN101835365B/zh not_active Expired - Lifetime
-
2008
- 2008-07-15 US US12/173,802 patent/US7842381B2/en active Active
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009527794A (ja) * | 2006-02-23 | 2009-07-30 | エルジー・ケム・リミテッド | ディスプレイ装置、ディスプレイ装置用熱伝導性粘着シート、およびその製造方法 |
WO2010004996A1 (ja) | 2008-07-10 | 2010-01-14 | アルプス電気株式会社 | 熱伝導性ノイズ抑制シート |
JP2017149131A (ja) * | 2015-11-23 | 2017-08-31 | ザ・ボーイング・カンパニーThe Boeing Company | 複合部品の加熱の制御 |
CN105720042A (zh) * | 2016-02-03 | 2016-06-29 | 中电海康集团有限公司 | 一种对电子元器件进行抗干扰处理的方法 |
US10631397B1 (en) | 2018-10-25 | 2020-04-21 | Seiko Epson Corporation | Printed circuit board, electronic device and heat conduction sheet |
Also Published As
Publication number | Publication date |
---|---|
TW200409590A (en) | 2004-06-01 |
US20060099403A1 (en) | 2006-05-11 |
CN1720108A (zh) | 2006-01-11 |
CN1720108B (zh) | 2010-04-21 |
CN101835365A (zh) | 2010-09-15 |
TWI335207B (en) | 2010-12-21 |
US7842381B2 (en) | 2010-11-30 |
EP1558403A1 (en) | 2005-08-03 |
EP1558403A4 (en) | 2006-12-20 |
WO2004037447A1 (en) | 2004-05-06 |
US20090016025A1 (en) | 2009-01-15 |
AU2003284309A1 (en) | 2004-05-13 |
CN101835365B (zh) | 2013-03-27 |
US7608326B2 (en) | 2009-10-27 |
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