WO2010004996A1 - 熱伝導性ノイズ抑制シート - Google Patents
熱伝導性ノイズ抑制シート Download PDFInfo
- Publication number
- WO2010004996A1 WO2010004996A1 PCT/JP2009/062377 JP2009062377W WO2010004996A1 WO 2010004996 A1 WO2010004996 A1 WO 2010004996A1 JP 2009062377 W JP2009062377 W JP 2009062377W WO 2010004996 A1 WO2010004996 A1 WO 2010004996A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- noise suppression
- particles
- ferrite particles
- ferrite
- content
- Prior art date
Links
- 230000001629 suppression Effects 0.000 title claims abstract description 70
- 239000002245 particle Substances 0.000 claims abstract description 157
- 229910000859 α-Fe Inorganic materials 0.000 claims abstract description 118
- 239000012798 spherical particle Substances 0.000 claims abstract description 24
- 239000011159 matrix material Substances 0.000 claims abstract description 21
- 239000007787 solid Substances 0.000 claims abstract description 21
- 239000004020 conductor Substances 0.000 claims description 21
- 229920001296 polysiloxane Polymers 0.000 claims description 9
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 7
- 230000000052 comparative effect Effects 0.000 description 23
- 230000035699 permeability Effects 0.000 description 17
- 230000006835 compression Effects 0.000 description 10
- 238000007906 compression Methods 0.000 description 10
- 239000004065 semiconductor Substances 0.000 description 9
- 238000002474 experimental method Methods 0.000 description 8
- 239000000945 filler Substances 0.000 description 8
- 229910018605 Ni—Zn Inorganic materials 0.000 description 6
- 239000000126 substance Substances 0.000 description 5
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 235000010724 Wisteria floribunda Nutrition 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
- H01L2224/29299—Base material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
- H01L2224/29299—Base material
- H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/29338—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/2936—Iron [Fe] as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00013—Fully indexed content
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01012—Magnesium [Mg]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01025—Manganese [Mn]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0103—Zinc [Zn]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Definitions
- the present invention relates to a thermally conductive noise suppression sheet excellent in noise suppression effect and excellent in thermal conductivity in a wide frequency band ranging from 100 MHz band to GHz band.
- the heat conductive noise suppression sheet used in the above applications converts electromagnetic energy emitted from the semiconductor component into thermal energy, transmits the thermal energy in the sheet, and dissipates the heat to the heat sink.
- Patent Document 1 describes increasing the noise suppression effect by increasing the imaginary part ⁇ ′ ′ of the complex relative magnetic permeability.
- the thermally conductive noise suppression sheet is disposed between a semiconductor component such as an IC and the heat sink, and in this case, the thermally conductive noise suppression sheet is compressed and used, but if the compression ratio of the sheet is poor Adhesion between the substrate and the substrate is degraded, which causes the thermal conductivity to be degraded.
- JP 2001-68312 A Japanese Patent Application Publication No. 2006-504272
- the present invention is intended to solve the above-mentioned conventional problems, and in particular, it is possible to obtain a high noise suppression effect in a wide frequency band ranging from 100 MHz band to GHz band and having excellent thermal conductivity. It aims at providing a noise suppression sheet.
- the thermally conductive noise suppression sheet in the present invention is A first ferrite particle, a second ferrite particle, a thermally conductive material, and a matrix material
- the first ferrite particles are spherical particles having an average particle diameter of 50 to 150 ⁇ m and a content of 5 to 25% by volume based on the total solid components
- the second ferrite particles are characterized in that they are irregular-shaped particles having an average particle diameter of 50 ⁇ m or less and a content of 5 to 45% by volume with respect to the total solid component.
- the imaginary part ⁇ ′ ′ of the complex relative permeability in the 100 MHz band can be increased.
- the imaginary part ⁇ ′ ′ of the complex relative permeability in the GHz band is decreased.
- the imaginary part ⁇ ′ ′ of the complex relative dielectric constant in the several GHz band can be reduced, whereby a high noise suppression effect can be obtained in a wide frequency band ranging from the 100 MHz band to the GHz band.
- the present invention high thermal conductivity is secured by appropriately controlling the content of the first ferrite particles, which comprises the first ferrite particles consisting of spherical particles having an average particle diameter larger than that of the second ferrite particles.
- the compression rate can be increased, and the thermal conductivity can be effectively improved.
- the content of the first ferrite is preferably 10% by volume or more, and more preferably 20% by volume or more.
- the content of the second ferrite is preferably 30% by volume or more.
- the content of the first ferrite particles may be 20 to 25% by volume, and the content of the second ferrite particles may be 10 to 20% by volume.
- the content of the second ferrite particles is set to a small value, and high noise suppression can be achieved without increasing the filling rate of the filler as a whole.
- high thermal conductivity and compressibility can be secured to obtain excellent thermal conductivity.
- the irregularly shaped particles are obtained by grinding the spherical particles.
- a heat conductive material may be further included.
- the heat conductive material is preferably aluminum oxide having an average particle diameter of 5 to 25 ⁇ m and a content of 2.5 to 10% by volume relative to the total solid component.
- the matrix material is preferably a silicone gel having a content of 30 to 57.5% by volume with respect to the total solid component.
- thermally conductive noise suppression sheet of the present invention high noise suppression effect can be obtained in a wide frequency band ranging from 100 MHz band to GHz band, and excellent thermal conductivity can be obtained.
- Sectional drawing which shows the use form of the heat conductive noise suppression sheet
- FIG. 1 is a cross-sectional view showing a usage of a thermally conductive noise suppression sheet according to this embodiment
- FIG. 2 is a schematic view showing an internal structure of the sheet.
- symbol 1 shown in FIG. 1 is semiconductor components, such as IC, and the code
- the thickness H1 of the heat conductive noise suppression sheet 3 in the present embodiment is about 1 to 5 mm.
- the heat conductive noise suppression sheet 3 is configured to have the first ferrite particles 4, the second ferrite particles 5, the heat conductive material 6, and the matrix material 7.
- the first ferrite particles 4 are spherical particles having an average particle diameter of 50 to 150 ⁇ m and a content of 5 to 25% by volume based on all the solid components.
- spherical particles refers to particles having no surface on the surface and having a flatness (aspect ratio) in the range of 1 to 2.
- the "average particle diameter” in the present specification indicates the particle diameter (D50) at a cumulative value of 50%.
- the content of the first ferrite particles 4 is preferably in the range of 10 to 25% by volume, and more preferably in the range of 20 to 25% by volume.
- the second ferrite particle 5 is an irregularly shaped particle having an average particle diameter of 50 ⁇ m or less and a content of 5 to 45% by volume relative to the total solid component.
- amorphous particles refer to particles other than spherical particles, and to particles having a loose shape.
- the average particle size of the second ferrite particles 5 is smaller than the average particle size of the first ferrite particles 4.
- the content of the second ferrite particles 5 is preferably in the range of 30 to 45% by volume. It is preferable that the second ferrite particles 5 which are irregularly shaped particles are obtained by grinding the first ferrite particles 4 which are spherical particles. The addition of the second ferrite particles 5 improves the compatibility with the matrix material 7.
- the first ferrite particles 4 and the second ferrite particles 5 can use existing ferrites such as Mn--Zn ferrite and Ni--Zn ferrite.
- the heat conductive material 6 examples include aluminum oxide, magnesium oxide, zinc oxide, titanium oxide, aluminum nitride, boron nitride, silicon nitride and the like. However, the heat conductive material 6 is preferably aluminum oxide.
- the heat conductive material 6 preferably has an average particle diameter of 5 to 25 ⁇ m and a content of 2.5 to 10% by volume based on all the solid components. Preferably, it is 5 to 7% by volume.
- the heat conductive material 6 may not be contained and the first ferrite particles 4, the second ferrite particles 5 and the matrix material 7 may be used.
- the matrix material 7 preferably uses a silicone gel in order to improve the heat resistance and tackiness (tackiness) of the sheet.
- the matrix material 7 preferably has a content of 30 to 57.5% by volume with respect to the total solid component. Preferably, it is 35 to 45% by volume.
- the heat conductive noise suppression sheet 3 of the present embodiment can increase the imaginary part ⁇ ′ ′ of the complex relative permeability in the 100 MHz band.
- the imaginary part ⁇ ′ ′ of the complex relative permeability can be made 3 or more .
- the imaginary part ⁇ ′ ′ of the complex relative dielectric constant in the GHz band can be reduced.
- the imaginary part ⁇ ′ ′ of the complex relative dielectric constant can be suppressed to 0.2 or less.
- the addition of the first ferrite particles 4 is performed by adding an imaginary part ⁇ ′ ′ of complex relative magnetic permeability in the 100 MHz band.
- the imaginary part ⁇ ′ ′ of the complex relative magnetic permeability in the GHz band tends to be small, as in the conventional example. Therefore, in the present embodiment, even if the imaginary part ⁇ ′ ′ of the complex relative permeability in the GHz band is small, the imaginary part ⁇ ′ ′ of the complex relative permittivity in the GHz band is improved in order to improve the noise suppression effect in the GHz band. I focused on it.
- the imaginary part ⁇ ′ ′ of the complex relative dielectric constant in the GHz band is reduced.
- the fact that the imaginary part ⁇ ′ ′ of the complex relative dielectric constant is small means that the insulation resistance is high.
- the reason that the imaginary part ⁇ ′ ′ of the complex relative dielectric constant in the GHz band is reduced is that the second ferrite particles 5 which are amorphous particles are added with a predetermined particle diameter and a predetermined amount.
- the second ferrite particles 5 which are amorphous particles added in the present embodiment suppress the sedimentation phenomenon of the first ferrite particles and the like in the manufacturing process, and the second ferrite particles 5 are well compatible with the matrix material 7. It is considered that, by appropriately interposing between the first ferrite particles 4, the contact between the ferrite particles is suppressed, the insulation resistance is increased, and the imaginary part ⁇ ′ ′ of the complex relative dielectric constant is reduced.
- the addition of the thermal conductive material 6 added to improve the thermal conductivity is also considered to be a factor for reducing the imaginary part ⁇ ′ ′ of the complex relative dielectric constant.
- the imaginary part ⁇ ′ ′ of the complex relative permeability in the 100 MHz band can be increased. Also, even if the imaginary part ⁇ ′ ′ of the complex relative permeability in the GHz band is small, the present embodiment In the embodiment, the imaginary part ⁇ ′ ′ of the complex relative dielectric constant in the GHz band can be reduced. This allows appropriate conversion of electromagnetic energy to thermal energy in a wide frequency band ranging from 100 MHz to the GHz band, and thermal conductivity
- the heat conductive noise suppression sheet 3 according to the present embodiment has a high noise suppression effect in a wide frequency band ranging from 100 MHz to GHz band. You can get it.
- thermally conductive noise suppression sheet 3 of the present embodiment it is possible to obtain excellent thermal conductivity.
- the first ferrite particles 4 which are spherical particles larger than the second ferrite particles 5 are included.
- the thermal conductivity is improved by containing the first ferrite particles 4.
- the thermally conductive noise suppression sheet 3 is interposed between the semiconductor component 1 and the heat sink 2.
- the thickness of the thermally conductive noise suppression sheet 3 is crushed by being pressed by, for example, a housing from the thickness direction of the thermally conductive noise suppression sheet 3.
- the compression ratio of the thermal conductivity noise suppression sheet 3 is high, the adhesion between the thermal conductivity noise suppression sheet 3 and the semiconductor component 1 and between the thermal conductivity noise suppression sheet 3 and the heat sink 2 can be improved. It is possible to obtain excellent thermal conductivity.
- the first ferrite particles 4 having a spherical particle diameter are contained in an amount of 5 to 25% by volume, and the second ferrite particles 5 are further contained in an appropriate amount from the viewpoint of noise suppression effect etc. It is possible to obtain excellent thermal conductivity.
- the total content obtained by adding each content of the first ferrite particles 4, the second ferrite particles 5 and the heat conductive material 6 (when the heat conductive material 6 is not contained, the total content of the ferrite particles 4 and 5 is contained)
- the amount is about 50 to 60% by volume.
- the content of the first ferrite particles 4 is set to 20 to 25% by volume so that the content of the second ferrite particles 5 or each content of the second ferrite particles 5 and the heat conductive material 6 is contained. Even if the total content added is as low as 10 to 20% by volume, it is possible to obtain excellent thermal conductivity together with the noise suppression effect. Note that this embodiment is suitable for applications requiring excellent thermal conductivity even if the noise suppression effect is somewhat reduced because the content of the second ferrite particles 5 is small.
- the thermally conductive noise suppression sheet 3 of the present embodiment also needs a silane coupling agent, a platinum catalyst, a flame retardant, etc. You may add according to.
- the first ferrite particles 4, the second ferrite particles 5, and the heat conductive material 6 are charged into a solution in which the matrix material 7 is dissolved and stirred to obtain a slurry.
- the second ferrite particles 5 which are indeterminate particles are obtained by crushing the first ferrite particles 4 which are spherical particles.
- heat treatment is performed to form a sheet-like thermally conductive noise suppression sheet 3.
- a kneaded product of the matrix material 7, the first ferrite particles 4, the second ferrite particles 5, and the heat conductive material 6 may be formed into a sheet by a hot press or the like without using a solvent.
- Example 1 (1) First ferrite particles (spherical particles): KNI-109GS (Ni-Zn ferrite) manufactured by JFE Chemical Corporation was used. The average particle size was 100 ⁇ m. Moreover, the addition amount with respect to all the solid components was 20 volume%. (2) Second ferrite particles (amorphous particles): KNI-109 GSM (Ni-Zn ferrite) manufactured by JFE Chemical Corporation was used. The average particle size was 40 ⁇ m. Moreover, the addition amount with respect to all the solid components was 35 volume%. (3) Thermal conductive material: Aluminum oxide (AS-40 manufactured by Showa Denko KK) having an average particle diameter of 12 ⁇ m was used.
- FIG. 6 is a cross-sectional photograph (SEM photograph) of the thermally conductive noise suppression sheet of the example.
- SEM photograph the first ferrite particles, which are spherical particles, were scattered at one place without being stagnant.
- the 2nd ferrite particle which is an irregular-shaped particle, a heat conduction material, and a matrix material intervene between the 1st ferrite particles.
- the matrix material intervened between the particles and filled in the gaps between the particles.
- FIG. 7 is a cross-sectional photograph (SEM photograph) of the thermally conductive noise suppression sheet of Conventional Example 1. As shown in FIG. 7, it was found that the Ni—Zn ferrite particles are irregularly shaped particles corresponding to the second ferrite particles of this example.
- Comparative example 1 (1) First ferrite particles (spherical particles): KNI-109GS manufactured by JEF Chemical Corporation was used. The average particle size was 100 ⁇ m. Moreover, the addition amount with respect to all the solid components was 55 volume%. (2) Thermal conductive material: Aluminum oxide (AS-40 manufactured by Showa Denko KK) having an average particle diameter of 12 ⁇ m was used. Moreover, the addition amount with respect to all the solid components was 5 volume%. (3) Matrix material: Silicone gel (SE1896FR manufactured by Toray Dow Corning Silicone Co., Ltd.) was used. Moreover, the addition amount with respect to all the solid components was 40 volume%.
- FIG. 3 is a graph showing the frequency characteristics of the imaginary part ⁇ ′ ′ of the complex relative magnetic permeability in each sample. As shown in FIG. 3, in the frequency band of the 100 MHz band, the imaginary part ⁇ ′ ′ of the complex relative permeability in Example 1 is larger than that in Conventional Example 1 and almost equal to that in Comparative Example 1.
- FIG. 4 is a graph showing the frequency characteristics of the imaginary part ⁇ ′ ′ of the complex relative dielectric constant in each sample. As shown in FIG. 4, in the frequency band of about 1 GHz or more, the imaginary part ⁇ ′ ′ of the complex relative dielectric constant in Example 1 is smaller than that in Conventional Example 1 and Comparative Example 1.
- the imaginary part ⁇ ′ ′ of the complex relative permeability can be effectively increased in the frequency band of several hundred MHz, and the imaginary part ⁇ ′ ′ of the complex relative permittivity is effective in the frequency band of 1 GHz or more. It turned out that it can be made as small as possible.
- FIG. 5 is a graph showing the frequency characteristics of noise attenuation in each sample.
- the amount of noise attenuation was measured by a spectrum analyzer with a tracking generator (hereinafter referred to as TG).
- TG a tracking generator
- the signal strength with and without the sample is measured, and from the difference between the two, the noise attenuation of the sample I asked for performance.
- FIG. 5 uses the noise attenuation amount of Conventional Example 1 as a reference value, and the noise attenuation amounts of Example 1 and Comparative Example 1 are shown as a difference from the reference value. Therefore, FIG. 5 shows that the noise attenuation amount is larger than that of Conventional Example 1 when the attenuation amount is a positive value, and the noise attenuation amount is smaller than that of Conventional Example 1 when the attenuation amount is a negative value.
- the noise attenuation amount of the embodiment in the 100 MHz band is equivalent to that of Comparative Example 1 and can be larger than that of Conventional Example 1. Further, it was found that the noise attenuation amount of the embodiment in the GHz band is larger than that of Comparative Example 1 and is equal to or more than that of Conventional Example 1.
- the noise suppression effect can be relatively enhanced in the GHz band in the conventional example 1 in which the ferrite particles are amorphous particles, it has been found that the noise suppression effect in the 100 MHz band is lowered.
- Example 1 in which both the first ferrite particles, which are spherical particles, and the second ferrite particles, which are irregular particles, are added, excellent noise suppression is achieved over a wide frequency band from 100 MHz to GHz. It turned out that the effect can be exhibited.
- thermal conductivity was simulated using an analysis model in which the matrix material is made of silicone gel and the filler content is 60% by volume.
- the number of first ferrite particles was changed to 2, 4, 6, and 11, and the temperature change from the lower surface to the upper surface of the analysis model was analyzed.
- FIG. 8 is a simulation result (schematic view) showing a temperature change from the lower surface to the upper surface in a cross section which appears by cutting the analytical model in the thickness direction.
- FIG. 8A shows the case where the number of first ferrite particles is two
- FIG. 8B shows the case where the number of first ferrite particles is four
- FIG. 8C shows the first ferrite.
- FIG. 8D is an experimental result when the number of first ferrite particles is eleven.
- the content of the entire filler is fixed at 60% by volume, so it was found from this experiment that the first ferrite particles of spherical particle size greatly contribute to the thermal conductivity.
- thermal conductivity can be increased.
- content of the first ferrite particles is too large, the thermal conductivity is lowered due to the reduction of the compressibility, so the preferable content is In order to determine the amount, a thermally conductive noise suppression sheet shown in Table 1 below was prepared.
- Example 1 and Comparative Example 1 shown in Table 1 are the same as those used in the experiment in FIG.
- Table 1 in Comparative Example 1 in which the volume percentage of the first ferrite particles (KNI-109GS) was considerably increased, it was found that sheet formation was difficult. Further, in Comparative Example 1, although the volume percentage of the first ferrite particles was large, the resin and the filler did not fit well, and the air entered the structure, so the thermal conductivity became low. Further, in Comparative Example 1 in the above state, the compression rate is also bad, and as a result, the heat conduction performance is extremely deteriorated.
- Comparative Example 3 shown in Table 1, high thermal conductivity is obtained with the first ferrite particles (KNI-109GS) at 35 volume% and the second ferrite particles (KNI-109GSM) at 20 volume%.
- the content of the first ferrite particles is still large and sheet forming is difficult, and even if sheet forming is possible, the sheet is compressed when the thermally conductive noise suppressing sheet is interposed between the semiconductor component and the heat sink was found to be fragile and prone to collapse.
- Comparative Examples 2 and 4 to 7 are experimental results in which none of the first ferrite particles is contained and the second ferrite particles (KNI-109GSM) are contained in a considerably large amount of 50% by volume or 55% by volume, In any case, sufficient thermal conductivity could not be obtained.
- Example 1 to 3 sheet formation was possible and all were able to obtain high thermal conductivity.
- KNI-106 GSM manufactured by JEF Chemical Corporation was used as the second ferrite particle. It was found that Examples 1 to 3 not only have high thermal conductivity but also high compression ratio as described below, and excellent thermal conductivity can be obtained.
- Example 4 contains the first ferrite particles in a larger amount than the second ferrite particles, and the thermal conductivity is smaller than in Examples 1 to 3, but the first contribution to the thermal conductivity Because a large amount of ferrite particles is added, although the filler content is smaller than in Comparative Examples 6 and 7, the thermal conductivity is higher than those in Comparative Examples.
- the data is not shown in Example 4, since the total amount of the filler consisting of the first and second ferrite particles is small, it is possible to further increase the compressibility and obtain excellent thermal conductivity. Can be expected to
- thermoly conductive noise suppression sheet was produced in which the alumina was 2.5 vol%, the matrix material was 42.5 vol%, and the other conditions were the same as in Example 1.
- thermoly conductive noise suppression sheet (EGR-11F) manufactured by Fuji Highpolymer Co., Ltd. was used as Comparative Example 8.
- FIG. 9 is a cross-sectional photograph (SEM photograph) of the thermally conductive noise suppression sheet of Comparative Example 8. As shown in FIG. 9, it was found that the ferrite particles were not ferrite particles of spherical particle diameter, but were irregular shaped particles corresponding to the second ferrite particles of this example.
- the thermal conductivity noise suppression sheet described above is exposed to an environment with a temperature of 130 ° C. and a humidity of 85% for 20 hours, and further compression to the thermal conductivity noise sheet at 150 ° C. by 50%, an environment of -65 ° C. Stress was applied by repeating 50% compression for 30 minutes each for 20 cycles.
- each thermally conductive noise suppression sheet is placed on the heater and compressed in the vertical direction, the heater side of each thermally conductive noise suppression sheet and the opposite side to the heater side Surface temperature difference was determined.
- the temperature difference was smaller than in the comparative example, and it was found that the example had high thermal conductivity and compressibility, and was excellent in thermal conductivity.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Toxicology (AREA)
- Electromagnetism (AREA)
- Health & Medical Sciences (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
しかしながら熱伝導性を向上させるには単にフィラーの充填量を大きくして熱伝導率を上げても圧縮率の低下により効果的に熱伝導性を向上させることができないとわかった。熱伝導性ノイズ抑制シートはIC等の半導体部品とヒートシンク間に設置され、その際、前記熱伝導性ノイズ抑制シートは圧縮して用いられるがシートの圧縮率が悪いとシートとヒートシンク間、及びシートと基板間の密着性が悪くなり、熱伝導性が劣化する要因となる。
第1フェライト粒子と、第2フェライト粒子と、熱伝導材と、マトリクス材と、を有し、
前記第1フェライト粒子は、平均粒径が50~150μmで、全固形成分に対して含有量が5~25体積%の球形粒子であり、
前記第2フェライト粒子は、平均粒径が50μm以下で、全固形成分に対して含有量が5~45体積%の不定形粒子であることを特徴とするものである。
不定形粒子である第2フェライト粒子5は、球形粒子である第1フェライト粒子4を粉砕して得られたものであることが好適である。第2フェライト粒子5を添加することで、マトリクス材7とのなじみが良くなる。
(実施例1)
(1) 第1フェライト粒子(球形粒子):JFEケミカル社製のKNI-109GS(Ni-Znフェライト)を使用した。平均粒径は100μmであった。また、全固形成分に対する添加量を20体積%とした。
(2) 第2フェライト粒子(不定形粒子):JFEケミカル社製のKNI-109GSM(Ni-Znフェライト)を使用した。平均粒径は40μmであった。また、全固形成分に対する添加量を35体積%とした。
(3) 熱伝導材:平均粒径が12μmの酸化アルミニウム(昭和電工社製のAS-40)を使用した。また、全固形成分に対する添加量を5体積%とした。
(4) マトリクス材:シリコーンゲル(東レ・ダウコーニング・シリコーン株式会社製のSE1896FR)を使用した。また、全固形成分に対する添加量を40体積%とした。
ソニーケミカル社製のE7000Kを使用した。なお、分析により、従来例1の熱伝導性ノイズ抑制シートは、Ni-Znフェライト粒子、酸化アルミニウム粒子及びシリコーンゲルを含むことがわかった。図7は、従来例1の熱伝導性ノイズ抑制シートの断面写真(SEM写真)である。図7に示すように、Ni-Znフェライト粒子は、本実施例の第2フェライト粒子に相当する不定形粒子であることがわかった。
(1) 第1フェライト粒子(球形粒子):JEFケミカル社製のKNI-109GSを使用した。平均粒径は100μmであった。また、全固形成分に対する添加量を55体積%とした。
(2) 熱伝導材:平均粒径が12μmの酸化アルミニウム(昭和電工社製のAS-40)を使用した。また、全固形成分に対する添加量を5体積%とした。
(3) マトリクス材:シリコーンゲル(東レ・ダウコーニング・シリコーン株式会社製のSE1896FR)を使用した。また、全固形成分に対する添加量を40体積%とした。
図3に示すように、百MHz帯の周波数帯域では、実施例1における複素比透磁率の虚数部μ″は、従来例1よりも大きく、比較例1とほぼ同等であった。
図4に示すように、約1GHz以上の周波数帯域では、実施例1における複素比誘電率の虚数部ε″は、従来例1及び比較例1よりも小さくなった。
実験では、マトリクス材がシリコーンゲルからなり、フィラー含有量を60体積%とした解析モデルを用いて熱伝導性のシミュレーションを行った。
表1に示すように第1フェライト粒子(KNI-109GS)の体積%をかなり大きくした比較例1では、シート成形が困難であるということがわかった。また、比較例1では、第1フェライト粒子の体積%が大きいものの、樹脂とフィラーとがうまく馴染まず、空気が組織内に入り込み、そのため熱伝導率が低くなった。また上記のような状態の比較例1では圧縮率も悪く、その結果、熱伝導の性能は極端に劣化する。
その実験結果が以下の表2に示されている。
2 ヒートシンク
3 熱伝導性ノイズ抑制シート
4 第1フェライト粒子(球形粒子)
5 第2フェライト粒子(不定形粒子)
6 熱伝導材
7 マトリクス材
Claims (9)
- 第1フェライト粒子と、第2フェライト粒子と、マトリクス材と、を有し、
前記第1フェライト粒子は、平均粒径が50~150μmで、全固形成分に対して含有量が5~25体積%の球形粒子であり、
前記第2フェライト粒子は、平均粒径が50μm以下で、全固形成分に対して含有量が5~45体積%の不定形粒子であることを特徴とする熱伝導性ノイズ抑制シート。 - 前記第1フェライトの含有量は、10体積%以上である請求項1記載の熱伝導性ノイズ抑制シート。
- 前記第1フェライトの含有量は、20体積%以上である請求項1記載の熱伝導性ノイズ抑制シート。
- 前記第2フェライトの含有量は、30体積%以上である請求項1ないし3のいずれか1項に記載の熱伝導性ノイズ抑制シート。
- 前記第1フェライト粒子の含有量は20~25体積%で、前記第2フェライト粒子の含有量は10~20体積%の範囲内である請求項1記載の熱伝導性ノイズ抑制シート。
- 前記不定形粒子は、前記球形粒子を粉砕して得られたものである請求項1ないし5のいずれか1項に記載の熱伝導性ノイズ抑制シート。
- 熱伝導材をさらに含む請求項1ないし6のいずれか1項に記載の熱伝導性ノイズ抑制シート。
- 前記熱伝導材は、平均粒径が5~25μmで、全固形成分に対して含有量が2.5~10体積%の酸化アルミニウムである請求項7記載の熱伝導性ノイズ抑制シート。
- マトリクス材は、全固形成分に対して含有量が30~57.5体積%のシリコーンゲルである請求項1ないし8のいずれか1項に記載の熱伝導性ノイズ抑制シート。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010519785A JPWO2010004996A1 (ja) | 2008-07-10 | 2009-07-07 | 熱伝導性ノイズ抑制シート |
EP09794440A EP2317548A1 (en) | 2008-07-10 | 2009-07-07 | Heat-conductive noise suppression sheet |
CN200980126622.6A CN102089879A (zh) | 2008-07-10 | 2009-07-07 | 热传导性噪声抑制片 |
US12/981,085 US20110094827A1 (en) | 2008-07-10 | 2010-12-29 | Heat-conductive noise suppression sheet |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008179664 | 2008-07-10 | ||
JP2008-179664 | 2008-07-10 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/981,085 Continuation US20110094827A1 (en) | 2008-07-10 | 2010-12-29 | Heat-conductive noise suppression sheet |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2010004996A1 true WO2010004996A1 (ja) | 2010-01-14 |
Family
ID=41507109
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2009/062377 WO2010004996A1 (ja) | 2008-07-10 | 2009-07-07 | 熱伝導性ノイズ抑制シート |
Country Status (6)
Country | Link |
---|---|
US (1) | US20110094827A1 (ja) |
EP (1) | EP2317548A1 (ja) |
JP (1) | JPWO2010004996A1 (ja) |
KR (1) | KR20110015693A (ja) |
CN (1) | CN102089879A (ja) |
WO (1) | WO2010004996A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023013356A1 (ja) * | 2021-08-02 | 2023-02-09 | Hoya株式会社 | 内視鏡 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8634195B2 (en) * | 2011-09-01 | 2014-01-21 | International Business Machines Corporation | Heatsink with substance embedded to suppress electromagnetic interference |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0935927A (ja) * | 1995-07-20 | 1997-02-07 | Tokin Corp | 複合磁性体及びそれを用いた電磁干渉抑制体 |
JP2001068312A (ja) | 1999-08-26 | 2001-03-16 | Fuji Elelctrochem Co Ltd | 電波吸収熱伝導シート |
JP2001210924A (ja) * | 2000-01-27 | 2001-08-03 | Tdk Corp | 複合磁性成型物、電子部品、複合磁性組成物および製造方法 |
JP2002184916A (ja) * | 2000-12-15 | 2002-06-28 | Kitagawa Ind Co Ltd | 多機能シート及びその製造方法 |
JP2002371138A (ja) * | 2001-06-15 | 2002-12-26 | Polymatech Co Ltd | 放熱性電波吸収体 |
JP2003183498A (ja) * | 2001-12-13 | 2003-07-03 | Polymatech Co Ltd | 熱伝導性シート |
JP2006504272A (ja) | 2002-10-21 | 2006-02-02 | レアード テクノロジーズ,インコーポレーテッド | 熱伝導性emiシールド |
JP2006310812A (ja) * | 2005-03-30 | 2006-11-09 | Yasuyuki Agari | 熱伝導性シート |
JP2008021991A (ja) * | 2006-06-16 | 2008-01-31 | Nitta Ind Corp | 磁性シート、これを用いたアンテナ装置および電子情報伝達装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5198138A (en) * | 1989-04-19 | 1993-03-30 | Toda Kogyo Corp. | Spherical ferrite particles and ferrite resin composite for bonded magnetic core |
JP3865601B2 (ja) * | 2001-06-12 | 2007-01-10 | 日東電工株式会社 | 電磁波抑制体シート |
JP2002374092A (ja) * | 2001-06-15 | 2002-12-26 | Polymatech Co Ltd | 放熱性電波吸収体 |
-
2009
- 2009-07-07 WO PCT/JP2009/062377 patent/WO2010004996A1/ja active Application Filing
- 2009-07-07 KR KR1020117000427A patent/KR20110015693A/ko not_active Application Discontinuation
- 2009-07-07 EP EP09794440A patent/EP2317548A1/en not_active Withdrawn
- 2009-07-07 JP JP2010519785A patent/JPWO2010004996A1/ja not_active Withdrawn
- 2009-07-07 CN CN200980126622.6A patent/CN102089879A/zh active Pending
-
2010
- 2010-12-29 US US12/981,085 patent/US20110094827A1/en not_active Abandoned
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0935927A (ja) * | 1995-07-20 | 1997-02-07 | Tokin Corp | 複合磁性体及びそれを用いた電磁干渉抑制体 |
JP2001068312A (ja) | 1999-08-26 | 2001-03-16 | Fuji Elelctrochem Co Ltd | 電波吸収熱伝導シート |
JP2001210924A (ja) * | 2000-01-27 | 2001-08-03 | Tdk Corp | 複合磁性成型物、電子部品、複合磁性組成物および製造方法 |
JP2002184916A (ja) * | 2000-12-15 | 2002-06-28 | Kitagawa Ind Co Ltd | 多機能シート及びその製造方法 |
JP2002371138A (ja) * | 2001-06-15 | 2002-12-26 | Polymatech Co Ltd | 放熱性電波吸収体 |
JP2003183498A (ja) * | 2001-12-13 | 2003-07-03 | Polymatech Co Ltd | 熱伝導性シート |
JP2006504272A (ja) | 2002-10-21 | 2006-02-02 | レアード テクノロジーズ,インコーポレーテッド | 熱伝導性emiシールド |
JP2006310812A (ja) * | 2005-03-30 | 2006-11-09 | Yasuyuki Agari | 熱伝導性シート |
JP2008021991A (ja) * | 2006-06-16 | 2008-01-31 | Nitta Ind Corp | 磁性シート、これを用いたアンテナ装置および電子情報伝達装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023013356A1 (ja) * | 2021-08-02 | 2023-02-09 | Hoya株式会社 | 内視鏡 |
Also Published As
Publication number | Publication date |
---|---|
US20110094827A1 (en) | 2011-04-28 |
KR20110015693A (ko) | 2011-02-16 |
EP2317548A1 (en) | 2011-05-04 |
JPWO2010004996A1 (ja) | 2012-01-05 |
CN102089879A (zh) | 2011-06-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI668261B (zh) | 具有混合縱橫比之粒子分散物的熱介面材料 | |
Hsieh et al. | High thermal conductivity epoxy molding compound filled with a combustion synthesized AlN powder | |
KR101248385B1 (ko) | 전자파 차폐특성 및 방열특성을 갖는 하이브리드 복합조성물 및 이 조성물로 제조된 초박막 인쇄용 잉크, 시트, 및 사출용 조성물 | |
US20100301261A1 (en) | Electromagnetic wave absorbing and heat dissipation material | |
CN107207950B (zh) | 具有碳化硅的导热电磁干扰(emi)吸收剂 | |
WO2012023685A1 (ko) | 코어-쉘 타입의 필러 입자를 포함하는 복합 시트용 조성물, 이를 포함하는 복합 시트 및 복합 시트의 제조 방법 | |
KR101549986B1 (ko) | 코어-쉘 타입의 필러 입자를 포함하는 복합 시트용 조성물, 이를 포함하는 복합 시트 및 복합 시트의 제조 방법 | |
US8465663B2 (en) | Composition for electromagnetic wave suppression and heat radiation and method for manufacturing composition for electromagnetic wave suppression and heat radiation | |
CN111554466B (zh) | 一种具有周期结构的导热吸波复合磁片及其制备方法 | |
JPWO2008126416A1 (ja) | 電磁波干渉抑制シート、高周波信号用フラットケーブル、フレキシブルプリント基板及び電磁波干渉抑制シートの製造方法 | |
KR20180109965A (ko) | 압축가능 개스킷, 이를 제조하기 위한 방법, 및 이를 포함하는 전자 제품 | |
JP2004200534A (ja) | 電磁波吸収性熱伝導性シート | |
WO2010004996A1 (ja) | 熱伝導性ノイズ抑制シート | |
JP4746803B2 (ja) | 熱伝導性電磁波シールドシート | |
WO2020250493A1 (ja) | 電磁波吸収性熱伝導性組成物及びそのシート | |
JP2014239236A (ja) | 熱伝導性シート | |
KR101699949B1 (ko) | 전자파 흡수 및 방열 복합 필름, 및 그 제조 방법 | |
WO2020196644A1 (ja) | 塊状窒化ホウ素粒子、熱伝導樹脂組成物及び放熱部材 | |
WO2011101989A1 (ja) | 熱伝導性シート | |
WO2023157683A1 (ja) | 被覆マグネシア粒子、放熱材用フィラー、樹脂組成物、及び被覆マグネシア粒子の製造方法 | |
WO2024018978A1 (ja) | 樹脂層、グリース組成物、電子デバイス | |
KR102539178B1 (ko) | 복합분말 및 이를 포함하는 전자파 차폐시트 | |
WO2023190735A1 (ja) | 熱伝導性フィラー、熱伝導性フィラーの製造方法および熱伝導性樹脂組成物 | |
JP4346536B2 (ja) | 電磁波吸収構造物 | |
KR20160040131A (ko) | 복합 구리입자 및 그 제조방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 200980126622.6 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 09794440 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2010519785 Country of ref document: JP |
|
ENP | Entry into the national phase |
Ref document number: 20117000427 Country of ref document: KR Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2009794440 Country of ref document: EP |