WO2001016968A1 - Feuille absorbant la chaleur et le rayonnement thermique - Google Patents

Feuille absorbant la chaleur et le rayonnement thermique Download PDF

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Publication number
WO2001016968A1
WO2001016968A1 PCT/JP2000/005641 JP0005641W WO0116968A1 WO 2001016968 A1 WO2001016968 A1 WO 2001016968A1 JP 0005641 W JP0005641 W JP 0005641W WO 0116968 A1 WO0116968 A1 WO 0116968A1
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WO
WIPO (PCT)
Prior art keywords
conductive sheet
sheet
radio wave
soft magnetic
absorbing heat
Prior art date
Application number
PCT/JP2000/005641
Other languages
English (en)
Japanese (ja)
Inventor
Yasuji Nakayama
Makoto Ishikura
Junji Konda
Hiroaki Ono
Manabu Teranishi
Original Assignee
Fdk Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fdk Corporation filed Critical Fdk Corporation
Publication of WO2001016968A1 publication Critical patent/WO2001016968A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a radio wave absorbing heat conductive sheet, and more specifically, to an improvement in a structure for removing heat and noise in an electronic circuit.
  • an insulating soft magnetic layer is laminated on the surface of a conductive support as shown in Japanese Patent Application Laid-Open No.
  • a radio wave absorber having a structure in which a dielectric layer is formed on the surface of a conductive magnetic layer.
  • the insulating soft magnetic layer is obtained by hardening the soft magnetic powder with an organic binder. This radio wave absorber is placed on a semiconductor device or the like that is subject to noise suppression.
  • a silica fine powder of 10 to 90% by weight having an average particle diameter of 0.1 to 50% is used. Containing 40 to 90% by weight of a thermally conductive filler composed of 90 to 10% by weight of alumina fine powder having an average particle size of 0.1 to 5m (excluding 5m).
  • a thermally conductive silicone rubber composition formed by the heat treatment. Then, the silicone rubber obtained by curing the composition by an addition reaction curing type or condensation reaction curing type curing mechanism is attached to a semiconductor element or the like to be subjected to a heat radiation measure.
  • the inventions disclosed in Japanese Patent Application Laid-Open No. Hei 7-212 979 and Japanese Patent Application Laid-Open No. Hei 9-111 1124 are applicable to both measures against radiated noise and in-machine failure and measures against heat radiation of semiconductor elements. It was not an invention that would take optimal measures.
  • the invention of Japanese Patent Application Laid-Open No. Hei 7-212,799 can reduce noise, but does not have sufficient heat conductivity, and can be mounted on a semiconductor device that requires heat radiation measures such as CPU. Have difficulty.
  • the filler in the silicone is not a substance contributing to radio wave absorption, and it is not expected to reduce radiation noise due to radio wave absorption.
  • the present invention has been made in view of the above background, and has as its object to solve the above-described problems, to provide a radio wave absorbing property required as a noise countermeasure for a semiconductor device, and to generate a semiconductor device such as a semiconductor device.
  • An object of the present invention is to provide a radio wave absorbing heat conductive sheet having both properties of high heat conductivity that absorbs heat and guides the heat to the outside.
  • the radio wave absorbing heat conductive sheet according to the present invention is constituted by a soft sheet formed by mixing a soft magnetic powder with a silicone resin.
  • the soft magnetic powder filled in the silicone resin allows a high complex magnetic permeability ('-j ⁇ ') to be obtained in a wide frequency band from DC to 20 GHz.
  • the imaginary part (;) of the complex permeability becomes large.
  • the imaginary term " of the complex permeability is proportional to the resistance component (R) of the high-frequency impedance, and electromagnetic energy is easily converted to heat as the imaginary term ( ⁇ ) increases. The conversion absorbs radio noise.
  • silicone-based resins have higher thermal conductivity and heat resistance than other resins, but by mixing with soft magnetic powders having higher thermal conductivity than organic substances, This sheet has a higher thermal conductivity than the silicone resin alone.
  • the radio wave absorbing heat conductive sheet of the present invention when the radio wave absorbing heat conductive sheet of the present invention is brought into contact with the surface of a target article such as a semiconductor device, the heat generated from the target article is absorbed by the radio wave absorbing heat conductive sheet, heat is conducted inside the sheet, and the heat is transferred. Released outside. And, if the radio wave absorbing heat conductive sheet of the present invention is interposed between the heat radiating component such as a heat sink and the target article, the heat generated from the target article can be efficiently transmitted to the heat radiating component, and the heat radiating effect is improved. improves.
  • radio wave noise emitted from the target article is absorbed in the radio wave absorption and heat conduction sheet, it does not leak out and does not reflect internally.
  • radio wave noise from the outside is also absorbed by the radio wave absorbing heat conductive sheet, so that the noise is suppressed from entering the target article.
  • the radio wave absorbing heat conductive sheet of the present invention is made to be a soft sheet, when the radio wave absorbing heat conductive sheet of the present invention is brought into contact with the surface of the object by being pressed relatively, the surface of the soft sheet (adhesion) Surface) is also deformed and adheres without gaps. Therefore, the heat resistance at the contact surface is small, and the above-described measures for heat dissipation accompanying heat absorption are more remarkably exhibited. The same can be said for the absorption of radio noise.
  • the soft magnetic powder at least one of a ferrite soft magnetic powder and a metal soft magnetic powder can be used. With this configuration, the thermal conductivity is improved.
  • the volume resistivity is as high as 10 ⁇ ⁇ cm or more, which is effective when insulating properties are required. Become smaller.
  • the volume resistivity is lower than that of ferrite-based soft magnetic powder, and the reflection of radio waves increases. Therefore, an appropriate material is selected according to the required specifications and the like.
  • the metal-based soft magnetic powder is at least one of permalloy, sendust, gay steel, permendur, pure iron, and magnetic stainless steel. Is composed of a spherical or flat particle shape.
  • the radio wave absorbing heat conductive sheet is further improved in a predetermined frequency band.
  • the imaginary term ( ⁇ ⁇ ) of the complex magnetic permeability can be shown.
  • the flattened metal soft magnetic powder is oriented in the surface direction of the sheet to suppress the effect of the demagnetizing field in the surface direction, and the imaginary number of high complex permeability at a given frequency The term ( ⁇ ) is obtained.
  • the surface of the flexible sheet has tackiness.
  • the silicone resin itself can be mounted on the surface of the target article without using an adhesive due to its own adhesiveness.
  • the radio wave absorbing heat conductive sheet can be brought into direct contact with the target article on the circuit board, which is a noise transmission source, so that noise absorption is improved.
  • the flexible sheet may be provided on both sides or one side of the conductive sheet.
  • the conductive sheet enhances the shielding effect of radio waves, and is effective when shielding radiated noise to prevent leakage to the outside.
  • the shielding effect can be obtained by using only the conductive sheet, there are problems such as the reflection of radio waves becoming large and the reflected wave adversely affecting the target article, and radiation noise from the target article being re-emitted by the conductive sheet. cause.
  • the conductive sheet is made of, for example, a metal foil, a metal mesh, a metal-coated resin mesh, a conductive nonwoven fabric, a conductive woven fabric, a resin mixed with a conductive powder (carbon powder, metal powder, or the like).
  • the conductive sheet is made of a soft magnetic metal. With this configuration, the shielding property in a low frequency band (1 MHz or less) is improved by the conductive sheet in the above-described radio wave absorbing heat conductive sheet.
  • the soft sheet may be mixed with a non-magnetic inorganic powder. It is good to configure.
  • a non-magnetic inorganic powder for example, A l 2 ⁇ 3, Z N_ ⁇ , there are M n O, etc., since the non-magnetic inorganic powder is provided with a high heat transfer electrical resistance as compared with a silicone resin, these When mixed with the electromagnetic wave absorbing heat conductive sheet, the thermal conductivity of the electromagnetic wave absorbing heat conductive sheet is improved.
  • a “soft sheet” is a sheet that is elastically deformed when pressed against the surface of a target article, and has such a softness that the sheet surface is deformed into a shape along the surface shape of the target article. Then, it is not always necessary to have an elastic restoring force to return to the original sheet shape when separated from the target article. And, as an example, when evaluated in terms of rubber hardness, those having a hardness of 50 or less correspond. Of course, the rubber hardness is a standard, and any rubber having a higher hardness may have the above-mentioned properties.
  • FIG. 1 is a perspective view showing a first embodiment of a radio wave absorbing heat conductive sheet according to the present invention
  • FIG. 2 (a) is a second embodiment of a radio wave absorbing heat conductive sheet according to the present invention.
  • FIG. 2 (b) is a front view showing a second embodiment of the radio wave absorbing heat conductive sheet according to the present invention
  • FIG. 3 is an implementation view of the radio wave absorbing heat conductive sheet according to the present invention.
  • FIG. 4 is a front view showing a state in which the form is mounted on an electronic circuit
  • FIG. 4 is a cross-sectional view showing a state in which the embodiment of the radio wave absorbing heat conductive sheet according to the present invention is mounted on another electronic circuit
  • FIG. 6 is a view showing a part of the results of an experiment conducted to determine an optimum component for the embodiment of the radio wave absorbing heat conducting sheet according to the present invention.
  • FIG. 10 is a diagram illustrating a part of results of another experiment performed in order to obtain an optimal component.
  • FIG. 1 shows a first embodiment of a radio wave absorbing heat conductive sheet according to the present invention.
  • the radio wave absorbing heat conductive sheet 1 of the present embodiment has It is composed of a flexible sheet 1a composed of a flat sheet piece.
  • the soft sheet 1a is formed by mixing a soft magnetic powder with a liquid silicone resin.
  • the soft magnetic powder either a ferrite soft magnetic powder or a metal soft magnetic powder may be used, or a mixture of both may be used.
  • Various types such as Zn-based ferrite, Ni-based ferrite, and Mg- ⁇ -based ferrite can be used. It is preferable to use Ni-based ferrite because heat conduction is best.
  • the mixing ratio of the soft magnetic powder to 100 parts by weight of the liquid silicone resin may be adjusted in the range of 100 parts by weight to 900 parts by weight.
  • the mixing amount of the soft magnetic powder is from 200 parts by weight to 400 parts by weight.
  • it may be mixed with non-magnetic inorganic powders such high A 1 2 ⁇ 3 thermal conductivity for the purpose of improving the thermal conductivity.
  • the non-magnetic inorganic powder is not limited to A 1 2 0 3, high zinc oxide thermal conductivity may be used oxide powder and gold Shokukotai such copper oxide.
  • the surface of the flexible sheet 1a is made to have a sticky tackiness.
  • it can be formed by selecting a silicone resin having viscosity after curing, or by adjusting the amount of a curing agent (vulcanizing agent) added.
  • the radio wave absorbing heat conductive sheet 1 having such components has a rubber hardness of 50 or less, a heat conductivity of 0.5 wZm 'k or more, and a heat resistant temperature of 150 or more. Can be.
  • FIG. 2 shows a second embodiment of the present invention.
  • the soft sheet 1a is attached so as to sandwich the conductive sheet 1b such as a metal foil or a metal mesh from both sides.
  • the conductive sheet 1b such as a metal foil or a metal mesh from both sides.
  • conductive sheet lb in addition to the above, conductive non-woven fabric, conductive woven fabric, resin mixed with conductive powder, or the like may be applied, and carbon powder, metal powder, or the like may be used as the conductive powder. .
  • a soft magnetic metal or resin mixed with a soft magnetic powder is used as the conductive sheet, the effect is improved at a low frequency (1 MHz or less).
  • the surface of the semiconductor component such as the CPU 2 and the both surfaces of the radio wave absorbing heat conductive sheet 1 that is in contact with the connection surface of the heat sink 3 are in close contact with the connection surfaces without any gap. Therefore, the thermal resistance at the connection portion is small, and the heat generated in CPU 2 is efficiently transmitted to heat sink 3 and radiated.
  • the high frequency noise generated from the CPU 2 is also absorbed by the radio wave absorbing heat conductive sheet 1 which is in close contact with the high frequency noise, scattering to the outside as radiation noise can be suppressed as much as possible.
  • FIG. 4 shows a state where the radio wave absorbing heat conductive sheet 1 is mounted on an electronic component in which a substrate 5 on which a semiconductor chip 4 is mounted is housed in a case 6.
  • the radio wave absorbing heat conductive sheet 1 is a soft flat sheet and its surface is sticky, so that it can be fixed simply by placing it between the upper surface 4 a of the semiconductor chip 4 or the like and the case 6. Is determined. That is, the configuration does not require a connection member such as an adhesive tape.
  • by closing the gap between the semiconductor chip 4 and the case 6 for packing the electronic circuit in this manner it is possible to suppress the occurrence of an in-flight failure due to the electromagnetic waves generated from one semiconductor chip being routed to another semiconductor chip. It will be easier.
  • the radio wave absorbing heat conductive sheet and the semiconductor chip 4 etc. are in close contact with each other, the gap formed between them is Noise is not propagated through, and the propagation of noise can be reliably suppressed.
  • the case 6 when the case 6 is made of metal, the case 6 also functions as a heat sink, and a heat dissipation effect can be expected. Even if the case 6 does not have the function of a heat sink, the heat generated from the semiconductor chip 4 and the like proceeds in the thickness direction of the radio wave absorbing heat conductive sheet 1, so that the heat generated in the adjacent element Can be suppressed as much as possible (compared to those that propagate in the air).
  • the liquid silicone resin and the soft magnetic powder are uniformly mixed by a mixer. At this time, it may be mixed with a high thermal conductivity A 1 2 0 3 or the like in order to improve the thermal conductivity.
  • the mixer performs mixing by rotating mixing wings in a closed stainless steel chamber.
  • the pressure in the mixer should be lower than the atmospheric pressure, and care should be taken to prevent air bubbles from entering the liquid silicone resin.
  • the soft magnetic powder is ferrite, it is preferable to control the temperature of the mixture from 40 to 100 in order to adjust the viscosity of the mixture of the liquid silicone resin and the ferrite. .
  • twin-screw extruder allows continuous mixing and improves productivity, but the dispersibility of the liquid silicone resin and ferrite powder is not sufficient, and simple kneading must be performed in advance.
  • the kneaded mixture is applied to the PET film at a thickness of 1 band by the doctor blade method. After coating, heat and cure to complete.
  • a conductive sheet material prepared in advance is sandwiched between the coated sheets during or after the application by the doctor blade method.
  • the thickness of one coating is 0.1 mm. Laminate while chopping below. That is, the metal-based soft magnetic powder is coated while being oriented in the plane direction to have a predetermined thickness. By orienting in the plane direction in this manner, a large projection area of the metal-based magnetic powder in the thickness direction of the sheet can be secured, and the electromagnetic wave absorbing function is improved.
  • the thermal conductivity of the radio wave absorbing heat conductive sheet manufactured as described above may be 0.5 w / m ⁇ k or more when used in a place having a relatively small calorific value.
  • it is more than 1.0 w / m * k, and preferably more than 1.5 w / m ⁇ k.
  • Fig. 5 shows the rubber hardness and thermal conductivity of Samples A to D with different constituent components and their mixing amounts
  • Fig. 6 shows the radio wave absorption characteristics of those samples for the coupling attenuation between the small antennas at each frequency. Shown as level (dB).
  • the amount of silicone resin in all samples is 100 parts by weight, sample A contains 400 parts by weight of Mn-Zn ferrite powder, and sample B contains Mn-Zn system. It contains 600 parts by weight of ferrite powder. Sample C contains 1 0 0 parts by weight of A 1 2 0 3 powder in addition to 3 0 0 parts by weight of M n _ Z n ferrite powder. Sample D contains 400 parts by weight of Ni_Zn ferrite powder. However, none of the above samples used a conductive sheet. As shown in FIG. 5, the rubber hardness is particularly low when the content of the ferrite powder used as the soft magnetic powder is from 300 to 400 parts by weight. From the experimental results other than the sample shown in the figure, it was found that when the amount of the soft magnetic powder was 900 parts by weight or more, it was difficult to mix the powder with a resin matrix such as a liquid silicone resin.
  • the manufacturing method of the embodiment As described in the description, the mixing amount of the soft magnetic powder with respect to 100 parts by weight of the liquid silicone resin was in the range of 100 to 900 parts by weight.
  • the thermal conductivity of the sample C with the children in the A 1 2 0 3 powder is non-magnetic inorganic powder
  • other samples It can be seen that the thermal conductivity is higher. From various experiments, it was confirmed that the thermal conductivity can be easily increased to about 1.5 w / m ⁇ k by adding non-magnetic inorganic powder without deteriorating the rubber hardness or the bond attenuation level. ing.
  • the thermal conductivity required by the user who needs the radio wave absorbing heat conductive sheet as in the present embodiment is about 0.5 to 1.5 w / m'k, depending on the member.
  • this characteristic exhibits good noise absorption characteristics especially as a countermeasure against noise of an electronic circuit including a semiconductor chip such as CPU over a range of 100 MHz to several GHz.
  • the electromagnetic energy of the absorbed electromagnetic waves is converted to heat, but the sample has a higher thermal conductivity and heat resistance than the radio-absorbing heat conductive sheet using other resins because the sample is based on silicone resin. .
  • the larger the amount of the soft magnetic powder the higher the coupling attenuation level.
  • mixing the metallic soft magnetic powder with the ferrite powder, etc. By changing the particle shape in a timely manner, a better coupling attenuation level can be obtained at a specific frequency.
  • the silicone resin As described above, in the radio wave absorbing heat conductive sheet according to the present invention, the silicone resin The structure consists of a soft sheet formed by mixing soft magnetic powder into the surface of a semiconductor chip. It can have good heat conductivity. In addition to having a high complex magnetic permeability, it has electromagnetic wave absorption that can absorb electromagnetic waves in an electronic circuit on which semiconductor elements are mounted over a wide band, and directly absorbs electromagnetic noise generated from such chips. Since heat can be efficiently converted to heat, good noise countermeasures can be taken.
  • a radio wave absorbing heat conductive sheet having high thermal conductivity and insulation properties can be obtained.
  • a radio wave absorbing heat conductive sheet having high heat conductivity and high radio wave absorption can be obtained.
  • the metal-based soft magnetic powder is at least one of permalloy, sendust, gay steel, permendur, pure iron, and magnetic stainless steel, and has a spherical or flat particle shape. If this is the case, a radio wave absorbing heat conductive sheet having high electromagnetic wave absorption in a desired frequency band can be obtained.
  • the adhesiveness between the semiconductor chip in the electronic equipment to be mounted and the electromagnetic wave absorbing heat conductive sheet is improved, so that the heat generated from those chips can be transmitted to the outside.
  • a radio wave absorbing heat conductive sheet that easily absorbs electromagnetic waves can be obtained.
  • the shielding effect in a low frequency band is further improved. Further, when a nonmagnetic inorganic powder is mixed with the soft sheet, a radio wave absorbing heat conductive sheet with further improved heat conductivity can be obtained.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Electromagnetism (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Hard Magnetic Materials (AREA)
  • Soft Magnetic Materials (AREA)

Abstract

L'invention porte sur une feuille absorbant le rayonnement et le bruit électromagnétique et présentant une forte conductivité thermique assurant la diffusion de la chaleur. Ladite feuille (1), relativement molle (d'une dureté de 50 sur l'échelle caoutchouc), et résistant à 150 °C, présente une surface adhésive permettant de la fixer directement et sans adhésif entre un dispositif à semi-conducteur, tel qu'une unité centrale, et un dissipateur thermique. Sa mollesse relative améliore son adhérence et assure une absorption efficace du rayonnement électromagnétique du dispositif à semi-conducteur. La feuille (1) comprend de préférence 100 parties en poids d'une résine liquide de silicone, et 30 parties en poids de poudre faiblement magnétique et 100 parties en poids de poudre minérale non magnétique qui en améliorent l'absorption électromagnétique de 100 MHz à plusieurs GHz ainsi que l'absorption thermique.
PCT/JP2000/005641 1999-08-26 2000-08-23 Feuille absorbant la chaleur et le rayonnement thermique WO2001016968A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP24058099A JP2001068312A (ja) 1999-08-26 1999-08-26 電波吸収熱伝導シート
JP11/240580 1999-08-26

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Publication Number Publication Date
WO2001016968A1 true WO2001016968A1 (fr) 2001-03-08

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WO (1) WO2001016968A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1372162A1 (fr) * 2001-03-21 2003-12-17 Shin-Etsu Chemical Company, Ltd. Composition thermoconductrice absorbant les ondes electromagnetiques et feuille de dissipation de chaleur thermosensible absorbant les ondes electromagnetiques et procede de travail de dissipation de chaleur
WO2009105411A2 (fr) * 2008-02-21 2009-08-27 Alcatel-Lucent Usa Inc. Agents de remplissage à structure périodique thermiquement conducteurs et leurs procédés d'utilisation
CN103620335A (zh) * 2011-05-31 2014-03-05 阿威德热合金有限公司 使散热器可定位的散热器支座
CN112300501A (zh) * 2020-10-19 2021-02-02 深圳市鸿富诚屏蔽材料有限公司 一种导热吸波相变复合材料制备方法及复合材料
CN113995298A (zh) * 2020-07-28 2022-02-01 武汉苏泊尔炊具有限公司 一种导磁材料、导磁板及器具

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JP2002371138A (ja) * 2001-06-15 2002-12-26 Polymatech Co Ltd 放熱性電波吸収体
JP2002374092A (ja) * 2001-06-15 2002-12-26 Polymatech Co Ltd 放熱性電波吸収体
JP2003017888A (ja) * 2001-07-04 2003-01-17 Polymatech Co Ltd 電波吸収シート
JP2003023287A (ja) * 2001-07-05 2003-01-24 Polymatech Co Ltd 電波吸収シート
EP2372983B1 (fr) 2005-08-04 2017-08-30 Lenovo Innovations Limited (Hong Kong) Exécution d'application dans un terminal de communication mobile lors du placement de ce terminal dans un chargeur
KR100734236B1 (ko) 2005-08-05 2007-07-02 치앙 천-리앙 판 연자석 구조
JP5083558B2 (ja) * 2008-05-30 2012-11-28 戸田工業株式会社 ノイズ抑制シート
CN102089879A (zh) 2008-07-10 2011-06-08 阿尔卑斯电气株式会社 热传导性噪声抑制片
JP2010165868A (ja) * 2009-01-15 2010-07-29 Three M Innovative Properties Co ゲル状組成物
JP6017416B2 (ja) * 2010-05-10 2016-11-02 コリア インスティチュ−ト オブ マシナリ− アンド マテリアルズ 広帯域電磁気波吸収体及びその製造方法
JP6366627B2 (ja) 2016-03-25 2018-08-01 デクセリアルズ株式会社 電磁波吸収熱伝導シート、電磁波吸収熱伝導シートの製造方法及び半導体装置
JP7145413B2 (ja) 2018-10-25 2022-10-03 セイコーエプソン株式会社 プリント回路板、電子機器、および熱伝導シート

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JPS6089902A (ja) * 1983-10-24 1985-05-20 Tdk Corp 電波吸収体材料

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Publication number Priority date Publication date Assignee Title
JPS6089902A (ja) * 1983-10-24 1985-05-20 Tdk Corp 電波吸収体材料

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1372162A1 (fr) * 2001-03-21 2003-12-17 Shin-Etsu Chemical Company, Ltd. Composition thermoconductrice absorbant les ondes electromagnetiques et feuille de dissipation de chaleur thermosensible absorbant les ondes electromagnetiques et procede de travail de dissipation de chaleur
EP1372162A4 (fr) * 2001-03-21 2008-12-31 Shinetsu Chemical Co Composition thermoconductrice absorbant les ondes electromagnetiques et feuille de dissipation de chaleur thermosensible absorbant les ondes electromagnetiques et procede de travail de dissipation de chaleur
WO2009105411A2 (fr) * 2008-02-21 2009-08-27 Alcatel-Lucent Usa Inc. Agents de remplissage à structure périodique thermiquement conducteurs et leurs procédés d'utilisation
WO2009105411A3 (fr) * 2008-02-21 2009-12-17 Alcatel-Lucent Usa Inc. Agents de remplissage à structure périodique thermiquement conducteurs et leurs procédés d'utilisation
CN103620335A (zh) * 2011-05-31 2014-03-05 阿威德热合金有限公司 使散热器可定位的散热器支座
CN103620335B (zh) * 2011-05-31 2016-01-13 阿威德热合金有限公司 使散热器可定位的散热器支座
CN113995298A (zh) * 2020-07-28 2022-02-01 武汉苏泊尔炊具有限公司 一种导磁材料、导磁板及器具
CN113995298B (zh) * 2020-07-28 2024-06-04 武汉苏泊尔炊具有限公司 一种导磁材料、导磁板及器具
CN112300501A (zh) * 2020-10-19 2021-02-02 深圳市鸿富诚屏蔽材料有限公司 一种导热吸波相变复合材料制备方法及复合材料

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