WO2013024809A1 - Feuille conductrice de la chaleur, absorbante de manière électromagnétique et instrument électronique - Google Patents

Feuille conductrice de la chaleur, absorbante de manière électromagnétique et instrument électronique Download PDF

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Publication number
WO2013024809A1
WO2013024809A1 PCT/JP2012/070465 JP2012070465W WO2013024809A1 WO 2013024809 A1 WO2013024809 A1 WO 2013024809A1 JP 2012070465 W JP2012070465 W JP 2012070465W WO 2013024809 A1 WO2013024809 A1 WO 2013024809A1
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WO
WIPO (PCT)
Prior art keywords
magnetic metal
metal particles
electromagnetic wave
conductive sheet
magnetic
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PCT/JP2012/070465
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English (en)
Japanese (ja)
Inventor
久村　達雄
佑介 久保
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デクセリアルズ株式会社
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Publication of WO2013024809A1 publication Critical patent/WO2013024809A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
    • H01F1/20—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
    • H01F1/22—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together
    • H01F1/24—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated
    • H01F1/26—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated by macromolecular organic substances

Definitions

  • the present invention efficiently transfers heat from an electronic component such as a semiconductor package to a heat radiating component such as a heat sink, a heat pipe, and a heat sink in the vicinity of a signal transmission unit that transmits a high-frequency signal inside the electronic device. It is related with the electromagnetic wave absorptive heat conductive sheet which can absorb.
  • a heat sink, a heat pipe, a heat sink, or the like made of a metal material having a high thermal conductivity such as copper or aluminum is widely used.
  • These heat dissipating parts having excellent thermal conductivity are disposed so as to be close to an electronic part such as a semiconductor package which is a heat generating part in the electronic device in order to reduce the heat dissipation effect or the temperature rise in the device. Further, these heat dissipating parts having excellent thermal conductivity are arranged from the electronic part as the heat generating part to a low temperature place. Further, in order to fill a space generated when the electronic component and the metal heat dissipation component are bonded, a flexible heat conductive sheet is disposed between the electronic component and the metal heat dissipation component.
  • the heat generating part in the electronic device is an electronic component such as a semiconductor element having a high current density.
  • a high current density means a high electric field strength or magnetic field strength that can cause unwanted radiation. For this reason, when a heat dissipating component made of metal is disposed in the vicinity of an electronic component, there are often cases where a harmonic component of an electric signal flowing in the electronic component is received with heat.
  • the heat dissipating part since the heat dissipating part is made of a metal material, it may function as a harmonic component antenna itself or as a harmonic noise component transmission path. .
  • thermal conductive sheet that contains a magnetic material in order to prevent the heat dissipation component from functioning as an antenna, that is, to cut off the coupling of the magnetic field
  • Patent Document 1 a thermal conductive sheet that contains a magnetic material in order to prevent the heat dissipation component from functioning as an antenna, that is, to cut off the coupling of the magnetic field.
  • Such a heat conductive sheet includes a magnetic material having a high magnetic permeability such as ferrite in a polymer material such as silicone or acrylic, thereby providing both functions of heat conductivity and electromagnetic wave suppression. Realized.
  • the characteristics of the above-described heat conductive sheet having both the heat conduction characteristics and the electromagnetic wave suppression characteristics change greatly depending on the filling amount of the target powder contained in the polymer material as the base material.
  • the thermal conductivity has the following relationship according to the Bruggeman equation. (Reference: "High heat conductivity of heat dissipation materials for electronic equipment parts and measurement / evaluation technology for heat conductivity", Technical Information Association, 2003)
  • ⁇ e is the thermal conductivity of the entire sheet
  • ⁇ d is the thermal conductivity of the thermally conductive material
  • ⁇ c is the thermal conductivity of the base polymer material
  • ⁇ is the volume of the thermally conductive material in the sheet. It is a fraction.
  • This magnetic characteristic also has the following relationship, for example, according to the Lichtenecker equation. (Reference: “Studies on low-loss, high-permittivity magnetic materials”, IEICE Transactions C, Vol. J86-C, No. 4, pp. 450-456, 2003)
  • mu r1 is the complex relative permeability of the magnetic material
  • mu r2 are complex relative permeability of the preform
  • [nu 1 is the volume fraction of the magnetic material
  • [nu 2 Mother This is the volume fraction of the material.
  • the heat conduction characteristics and the electromagnetic wave suppression characteristics vary greatly depending on the amounts of the magnetic material and the heat conductive material filled in the sheet.
  • the maximum filling rate is 74 vol%.
  • small spherical magnetic powder is sequentially packed in the gap between the previously filled spherical magnetic powder.
  • the present invention has been proposed in view of such circumstances, and an electromagnetic wave-absorbing heat conductive sheet having good functions of both heat conduction characteristics and electromagnetic wave absorption characteristics and the electromagnetic wave-absorbing heat conduction sheet are mounted.
  • An object is to provide electronic equipment.
  • the present invention provides an electromagnetic wave absorbing heat conductive sheet disposed in the vicinity of a signal transmission unit that transmits a high-frequency signal inside an electronic device. It contains particles and second magnetic metal particles having an average particle size smaller than that of the first magnetic metal particles and smaller electric resistivity than that of the first metal particles.
  • the electronic apparatus includes a signal transmission unit that transmits a high-frequency signal and an electromagnetic wave absorbing heat conductive sheet disposed in the vicinity of the signal transmission unit, and the electromagnetic wave absorbing heat conductive sheet is flexible.
  • the resin material contains first magnetic metal particles and second magnetic metal particles having an average particle size smaller than that of the first magnetic metal particles and lower electric resistivity than that of the first metal particles.
  • the present invention provides a flexible resin material comprising a first magnetic metal particle and a second magnetic material having an average particle size smaller than that of the first magnetic metal particle and lower electrical resistivity than that of the first metal particle. Since the metal particles are contained, it is possible to provide a heat conductive sheet having both functions of heat conduction characteristics and electromagnetic wave suppression characteristics. Furthermore, it is possible to provide an electromagnetic wave suppressing and radiating sheet having high thermal conductivity and a high electromagnetic wave suppressing effect and also having flexibility.
  • FIG. 1A shows a configuration of an electronic device on which an electromagnetic wave absorbing heat conductive sheet to which the present invention is applied is mounted
  • FIG. 1B is a diagram showing a modification thereof.
  • FIG. 2 is a diagram for explaining electromagnetic wave absorption characteristics of the electromagnetic wave absorbing heat conductive sheet to which the present invention is applied.
  • FIG. 3 is a diagram for explaining frequency characteristics related to electromagnetic wave absorption characteristics of an electromagnetic wave absorbing heat conductive sheet to which the present invention is applied.
  • the electromagnetic wave absorptive heat conductive sheet to which the present invention is applied is disposed in the vicinity of a signal transmission unit that transmits a high frequency signal inside an electronic device.
  • This electromagnetic wave absorptive heat conductive sheet efficiently transfers heat from an electronic component such as a semiconductor package to a heat radiating component such as a heat radiating plate, a heat pipe, and a heat sink, and absorbs electromagnetic waves.
  • the electromagnetic wave absorptive heat conductive sheet to which the present invention is applied is attached to a circuit board 1a inside the electronic apparatus 1 as shown in FIG. 1A, for example. That is, the sheet 11 having electromagnetic wave absorption and thermal conductivity as shown in FIG. 1A includes a high-frequency signal transmission board 17 that transmits a high-frequency signal and a heat-dissipating metal plate 12 that dissipates heat generated by the high-frequency signal transmission board 17. Between.
  • the sheet 11 has a circuit board such that one surface 11a is in close contact with the resin mold 13 for sealing the semiconductor package constituting the high-frequency signal transmission substrate 17, and the other surface 11b is in close contact with the heat dissipation metal plate 12. Affixed to 1a.
  • the high-frequency signal transmission substrate 17 is a specific example of a signal transmission unit that transmits a high-frequency signal inside the electronic device 1.
  • the dielectric substrate 16 has a copper foil 15 serving as a GND electrode on one surface and a second surface.
  • a microstrip line is constituted by the copper signal line 14 formed by patterning.
  • the high-frequency signal transmission board 17 is designed so that the far field strength when operating itself is suppressed to a predetermined value or less in order to prevent the influence of unnecessary radiation.
  • the heat radiating metal plate 12 receives a harmonic component of an electric signal flowing in the signal line 14 of the high-frequency signal transmission board 17 facing through the sheet 11. It functions as an antenna for harmonic components, and as a result, the far field strength is increased.
  • the magnetic metal particles are adjusted so that the volume fraction in the sheet 11 is equal to or greater than a predetermined value. Is contained.
  • the sheet 11 having an electromagnetic wave absorbing heat conduction function to which the present invention is applied may not be brought into close contact with the heat radiating metal plate 12 as shown in FIG. 1B, for example. 1B, the sheet 11 absorbs electromagnetic waves emitted from the high-frequency signal transmission board 17 without deteriorating the heat dissipation efficiency of the heat generated in the high-frequency signal transmission board 17. Can do.
  • the sheet 11 includes a flexible resin material, a first magnetic metal particle, and a second magnetic metal having an average particle size smaller than that of the first magnetic metal particle and lower electrical resistivity than that of the first magnetic metal particle. It contains particles.
  • the sheet 11 having such a configuration can achieve both good heat conduction characteristics and good electromagnetic wave suppression characteristics, as is apparent from the performance evaluation described later.
  • the sheet 11 prepared under the following conditions was used to evaluate the heat conduction characteristics and the electromagnetic wave suppression effect.
  • a silicone resin is used for the flexible resin material
  • a spherical magnetic amorphous alloy having an average particle size of 6 ⁇ m is used for the first magnetic metal particles
  • a spherical iron powder having an average particle size of 1.5 ⁇ m is used for the second magnetic metal particles.
  • the “average particle diameter” in the present embodiment specifically refers to the median diameter (also referred to as D50) in which the large side and the small side are equal when the powder is divided into two from a certain particle diameter. For example, in this embodiment, it can be calculated by a laser diffraction / scattering method.
  • the electrical resistivity is 0.5 ⁇ m.
  • the above materials it is particularly preferable to use a material having an electrical resistivity of 0.8 ⁇ m or more from the viewpoint of increasing the average particle size and improving the filling property.
  • the electrical resistivity of the second magnetic metal particles may be lower than 0.5 ⁇ m, which is smaller than that of the first magnetic metal particles, but in order to achieve particularly good thermal conductivity. Is preferably 0.3 ⁇ m or less.
  • magnetic metal amorphous particles having a high electrical resistivity are suitable.
  • the magnetic metal amorphous particles include Fe—Si—B, Fe—Si—B—C, Co—Si—B, Co—Zr, Co—Nb, and Co—Ta. However, it is not limited to these.
  • Crystalline magnetic metals include Fe, Co, Ni, or Fe—Ni, Fe—Co, Fe—Al, Fe—Si, Fe—Si—Al, Fe—Ni—Si. -Al type and the like.
  • the microcrystalline magnetic metal is a material obtained by finely crystallizing these crystalline materials by adding a small amount of N, C, O, B or the like.
  • the electrical resistivity is 0.5 ⁇ m or more, and at least one kind of substantially spherical magnetic particles such as a sphere and a polyhedron is the first magnetic metal particle,
  • the second magnetic metal particle at least one kind of magnetic particles having an average particle size smaller than that of one magnetic metal particle and an electrical resistivity smaller than 0.5 ⁇ m is used.
  • the average particle diameter of the second magnetic metal particles can be set in plural if the particle diameter ratio is in the range of 5 to 50% with respect to the first magnetic metal particle diameter. That is, the second magnetic metal particles can be used in combination of a plurality of materials, compositions and particle sizes.
  • heat conductive particles such as alumina, boron nitride, silicon nitride, aluminum nitride, silicon carbide, etc. are added. You can also. Such heat conduction particles are preferably smaller in particle size than the first magnetic metal particles and have a shape close to a sphere.
  • the flexible resin examples include resins such as epoxy resin, phenol resin, melamine resin, urea resin, and unsaturated polyester, and rubber such as silicone rubber, urethane rubber, acrylic rubber, butyl rubber, and ethylene propylene rubber.
  • resins such as epoxy resin, phenol resin, melamine resin, urea resin, and unsaturated polyester
  • rubber such as silicone rubber, urethane rubber, acrylic rubber, butyl rubber, and ethylene propylene rubber.
  • surface treatment agents such as a flame retardant, a reaction regulator, a crosslinking agent, and a silane coupling agent, can be further added and used.
  • the complex relative permeability was measured as follows.
  • the produced sheet was punched into a ring shape having an outer diameter of 20 mm and an inner diameter of 6 mm to produce a measurement sample.
  • the complex relative permeability of this measurement sample was measured using a measuring instrument “Agilent 4291B RF Impedance / Material Analyzer” manufactured by Agilent Technologies.
  • thermal conductivity was calculated as follows. The produced sheet is cut into a size of about 1 cm square, and the cut sample is sandwiched between a metal heat sink and a metal heater case, and is pressed into contact with a force of 1 kgf. Heat with power. When the temperature of the metal heater case and the metal heat sink became constant, the temperature difference between them was measured. The thermal conductivity was calculated from the following formula.
  • FIG. 2 shows the measurement result of the imaginary part of the complex relative permeability. Since the imaginary part of the complex relative permeability is a magnetic loss term of permeability, it can be used as an evaluation index of magnetic absorption characteristics. As is clear from FIG. 2, a large magnetic loss is observed around 2 GHz.
  • Such magnetic loss at high frequencies of magnetic metal materials mainly includes eddy current loss and loss due to ferromagnetic resonance.
  • FIG. 3 shows a case where the electrical resistivity is changed with the average particle diameter of the spherical magnetic metal particles being 6 ⁇ m and the initial permeability ⁇ i being 40 in order to evaluate the deterioration of the magnetic permeability due to the eddy current loss in the spherical magnetic metal particles.
  • the frequency characteristic of the imaginary part ⁇ r ′′ of the complex relative permeability is calculated.
  • the imaginary part ⁇ r ′′ of the complex relative permeability is shown normalized by the initial permeability ⁇ i .
  • the electric resistivity when the electrical resistivity is low, the magnetic loss greatly shifts to the low frequency side.
  • the electric resistivity In a sheet using spherical magnetic metal particles having an average particle diameter of 6 ⁇ m, the electric resistivity must be 0.5 ⁇ m or more in order to bring the peak of magnetic loss to the GHz band.
  • the electrical resistivity is 1.1 ⁇ m
  • the average particle diameter needs to be 9 ⁇ m, 8 ⁇ m and 2.8 ⁇ m, respectively.
  • the material has a high electrical resistivity, it is possible to obtain a frequency characteristic that absorbs electromagnetic waves in a good high frequency band even if the particle size is increased, and if the material has a low electrical resistivity, the particle size Unless it is made small, it is impossible to obtain frequency characteristics that absorb electromagnetic waves in a good high frequency band.
  • the flexible resin material in order to realize the frequency characteristics of absorbing electromagnetic waves in the high frequency band as described above, is highly filled with magnetic metal particles having different average particle diameters in consideration of the following points.
  • the particle size that can be produced is generally several ⁇ m to several tens of ⁇ m, which is the minimum particle size of commercially available materials. Is about 5-6 ⁇ m.
  • Such a material intended to absorb electromagnetic waves in the GHz band is used as the first magnetic metal material, and magnetic metal particles having a small average particle diameter are used as the second magnetic metal material. If it arrange
  • the particle size of the second magnetic metal particles is 5 to 50% of the average particle size of the first magnetic metal particles, and the second magnetic metal particles have a second magnetic particle size relative to the first magnetic metal particles.
  • the mixing ratio of the metal particles is 10 to 60 vol%, the filling of the magnetic metal particles in the flexible resin can be increased.
  • the second magnetic metal particles are small in size and are not easily affected by eddy current loss, it is not necessary to increase the electrical resistivity, and from the viewpoint of increasing the thermal conductivity, the second magnetic metal particles have a small electrical resistivity. Is selected. This is because the movement of free electrons in the metal affects the thermal conductivity, so that a metal material having a higher electrical conductivity, that is, a lower electrical resistivity can increase the thermal conductivity.
  • a spherical magnetic amorphous alloy having an electrical resistivity of 1.1 ⁇ m and an average particle size of 6 ⁇ m is used as the first magnetic metal.
  • a spherical iron powder having an electrical resistivity of 0.15 ⁇ m and an average particle size of 1.5 ⁇ m is selected as the second magnetic metal particle.
  • the sheet according to the example has a high thermal conductivity of 2.0 W / m ⁇ K, and has excellent thermal conductivity characteristics.
  • the thermal conductivity of is evaluated.
  • the thermal conductivity of the sheet according to the comparison target was 1.71 W / m ⁇ K.
  • the sheet 11 according to the example uses about 18% of the thermal conductivity as the second magnetic metal particle by using iron powder having a lower electrical resistivity than the amorphous powder. was able to improve.
  • the thermal conductivity of the finished product sheet can be greatly improved.
  • the electromagnetic wave absorptive heat conductive sheet to which the present invention is applied has the first magnetic metal particles and the first magnetic metal particles having a smaller average particle size than the first magnetic metal particles. Since the second magnetic metal particles having an electric resistivity smaller than that of the metal particles are contained, it is possible to provide a heat conductive sheet having both functions of heat conduction characteristics and electromagnetic wave suppression characteristics. Furthermore, it is possible to provide an electromagnetic wave suppressing and radiating sheet having high thermal conductivity and a high electromagnetic wave suppressing effect and also having flexibility.
  • a material in which the electrical resistivity of the first magnetic metal particles is 0.5 ⁇ m or more is selected, and a material in which the electrical resistivity of the second magnetic metal particles is less than 0.5 ⁇ m is selected.
  • 1 Electronic device 1a circuit board, 11 sheet, 12 heat dissipation metal plate, 13 resin mold, 14 signal lines, 15 copper foil, 16 dielectric substrate, 17 high frequency signal transmission board

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Power Engineering (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Hard Magnetic Materials (AREA)
  • Soft Magnetic Materials (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention porte sur une feuille conductrice de la chaleur, absorbante de manière électromagnétique, qui présente d'excellentes caractéristiques en termes de conduction de la chaleur et d'absorption électromagnétique. La feuille conductrice de la chaleur, absorbante de manière électromagnétique (11), est disposée près d'un substrat transmettant des signaux haute fréquence (17) afin de transmettre un signal haute fréquence, le substrat étant disposé à l'intérieur d'un instrument électronique (1), la feuille étant caractérisée en ce que des premières particules métalliques magnétiques et des secondes particules métalliques magnétiques sont comprises sur une matière de résine flexible. Les secondes particules métalliques magnétiques ont un diamètre moyen de particules plus petit et une résistivité électrique plus faible que les premières particules métalliques magnétiques.
PCT/JP2012/070465 2011-08-18 2012-08-10 Feuille conductrice de la chaleur, absorbante de manière électromagnétique et instrument électronique WO2013024809A1 (fr)

Applications Claiming Priority (2)

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JP2011178854A JP2013042026A (ja) 2011-08-18 2011-08-18 電磁波吸収性熱伝導シート、及び、電子機器
JP2011-178854 2011-08-18

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WO2013024809A1 true WO2013024809A1 (fr) 2013-02-21

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TW (1) TW201320116A (fr)
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115335487A (zh) * 2020-03-31 2022-11-11 3M创新有限公司 导热电磁吸收材料

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6612676B2 (ja) * 2016-05-17 2019-11-27 株式会社リケン 近傍界用ノイズ抑制シート
JP7005132B2 (ja) * 2016-09-29 2022-02-04 大同特殊鋼株式会社 電磁波吸収シート
JP6461414B1 (ja) * 2018-08-02 2019-01-30 加川　清二 電磁波吸収複合シート

Citations (6)

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JPH0527060A (ja) * 1991-07-16 1993-02-05 Riken Corp 電波吸収用複合材
JP2002374092A (ja) * 2001-06-15 2002-12-26 Polymatech Co Ltd 放熱性電波吸収体
JP2006310812A (ja) * 2005-03-30 2006-11-09 Yasuyuki Agari 熱伝導性シート
JP2007031695A (ja) * 2005-06-20 2007-02-08 Achilles Corp 電磁波吸収性と熱伝導性を有するアクリル系樹脂組成物及び樹脂シート
JP2010183033A (ja) * 2009-02-09 2010-08-19 Sony Corp 電磁波抑制放熱用組成物及び電磁波抑制放熱用組成物の製造方法
JP2010186856A (ja) * 2009-02-12 2010-08-26 Sony Chemical & Information Device Corp 熱伝導性シート

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0527060A (ja) * 1991-07-16 1993-02-05 Riken Corp 電波吸収用複合材
JP2002374092A (ja) * 2001-06-15 2002-12-26 Polymatech Co Ltd 放熱性電波吸収体
JP2006310812A (ja) * 2005-03-30 2006-11-09 Yasuyuki Agari 熱伝導性シート
JP2007031695A (ja) * 2005-06-20 2007-02-08 Achilles Corp 電磁波吸収性と熱伝導性を有するアクリル系樹脂組成物及び樹脂シート
JP2010183033A (ja) * 2009-02-09 2010-08-19 Sony Corp 電磁波抑制放熱用組成物及び電磁波抑制放熱用組成物の製造方法
JP2010186856A (ja) * 2009-02-12 2010-08-26 Sony Chemical & Information Device Corp 熱伝導性シート

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115335487A (zh) * 2020-03-31 2022-11-11 3M创新有限公司 导热电磁吸收材料
CN115335487B (zh) * 2020-03-31 2024-03-08 3M创新有限公司 导热电磁吸收材料

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