HK1026967A1 - Conductive paste and method of forming an antenna for a transponder - Google Patents

Conductive paste and method of forming an antenna for a transponder

Info

Publication number
HK1026967A1
HK1026967A1 HK00105666A HK00105666A HK1026967A1 HK 1026967 A1 HK1026967 A1 HK 1026967A1 HK 00105666 A HK00105666 A HK 00105666A HK 00105666 A HK00105666 A HK 00105666A HK 1026967 A1 HK1026967 A1 HK 1026967A1
Authority
HK
Hong Kong
Prior art keywords
transponder
antenna
forming
conductive paste
paste
Prior art date
Application number
HK00105666A
Other languages
English (en)
Inventor
Yasuhiro Endo
Toru Maruyama
Yasuo Kagami
Kazunari Kodama
Original Assignee
Toppan Forms Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP10278959A external-priority patent/JP2000113138A/ja
Priority claimed from JP2313099A external-priority patent/JP2000219829A/ja
Priority claimed from JP2313399A external-priority patent/JP2000219824A/ja
Priority claimed from JP11093968A external-priority patent/JP2000286550A/ja
Priority claimed from JP11125312A external-priority patent/JP2000319593A/ja
Priority claimed from JP11125307A external-priority patent/JP2000319583A/ja
Priority claimed from JP11125309A external-priority patent/JP2000319592A/ja
Priority claimed from JP12530699A external-priority patent/JP2000315705A/ja
Priority claimed from JP15289699A external-priority patent/JP4216951B2/ja
Priority claimed from JP20937499A external-priority patent/JP2000172813A/ja
Application filed by Toppan Forms Co Ltd filed Critical Toppan Forms Co Ltd
Publication of HK1026967A1 publication Critical patent/HK1026967A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Paints Or Removers (AREA)
  • Details Of Aerials (AREA)
HK00105666A 1998-09-30 2000-09-08 Conductive paste and method of forming an antenna for a transponder HK1026967A1 (en)

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
JP10278959A JP2000113138A (ja) 1998-09-30 1998-09-30 非接触ｉｃモジュール用アンテナの形成方法
JP2313099A JP2000219829A (ja) 1999-01-29 1999-01-29 光硬化導電ペーストとこれを塗工したシート類
JP2313399A JP2000219824A (ja) 1999-01-29 1999-01-29 光硬化銀塗料とこれが塗工されたシート類
JP11093968A JP2000286550A (ja) 1999-03-31 1999-03-31 紙上多層回路の形成方法とこの方法からなるプリント配線紙
JP11125312A JP2000319593A (ja) 1999-04-30 1999-04-30 導電インキの硬化方法
JP11125307A JP2000319583A (ja) 1999-04-30 1999-04-30 光硬化型導電ペースト
JP11125309A JP2000319592A (ja) 1999-04-30 1999-04-30 導電インキ
JP12530699A JP2000315705A (ja) 1999-04-30 1999-04-30 Ｉｃベアチップの実装方法
JP15289699A JP4216951B2 (ja) 1999-05-31 1999-05-31 薄形アンテナの作成方法
JP20937499A JP2000172813A (ja) 1998-09-30 1999-07-23 非接触ｉｃモジュ―ル用アンテナの形成方法

Publications (1)

Publication Number Publication Date
HK1026967A1 true HK1026967A1 (en) 2000-12-29

Family

ID=27579732

Family Applications (3)

Application Number Title Priority Date Filing Date
HK00105666A HK1026967A1 (en) 1998-09-30 2000-09-08 Conductive paste and method of forming an antenna for a transponder
HK04109657A HK1067437A1 (en) 1998-09-30 2004-12-07 Method of curing conductive paste and method of forming antenna for transponder
HK04109838A HK1067754A1 (en) 1998-09-30 2004-12-13 Conductive paste and method of forming an antenna for transponder

Family Applications After (2)

Application Number Title Priority Date Filing Date
HK04109657A HK1067437A1 (en) 1998-09-30 2004-12-07 Method of curing conductive paste and method of forming antenna for transponder
HK04109838A HK1067754A1 (en) 1998-09-30 2004-12-13 Conductive paste and method of forming an antenna for transponder

Country Status (8)

Country Link
US (1) US6165386A (de)
EP (5) EP1475743B1 (de)
KR (2) KR100629923B1 (de)
CN (1) CN1184266C (de)
CA (2) CA2628782C (de)
DE (3) DE69935022T2 (de)
HK (3) HK1026967A1 (de)
SG (3) SG115440A1 (de)

Families Citing this family (105)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4448617B2 (ja) * 1998-07-01 2010-04-14 セイコーエプソン株式会社 半導体装置及びその製造方法、回路基板並びに電子機器
KR100402154B1 (ko) * 1999-04-01 2003-10-17 미쯔이카가쿠 가부시기가이샤 이방 도전성 페이스트
US6290881B1 (en) 1999-04-14 2001-09-18 Allied Photochemical, Inc. Ultraviolet curable silver composition and related method
US6767577B1 (en) 1999-10-06 2004-07-27 Allied Photochemical, Inc. Uv curable compositions for producing electroluminescent coatings
US6805917B1 (en) 1999-12-06 2004-10-19 Roy C. Krohn UV curable compositions for producing decorative metallic coatings
MXPA02006735A (es) 2000-01-13 2002-10-11 Uv Specialties Inc Composiciones ferromagneticas que se pueden curar con luz uv.
WO2001051567A1 (en) 2000-01-13 2001-07-19 Uv Specialties, Inc. Uv curable transparent conductive compositions
JP2001207150A (ja) * 2000-01-26 2001-07-31 Sony Chem Corp 接着剤組成物
JP3989154B2 (ja) * 2000-03-13 2007-10-10 信越化学工業株式会社 導電性インク組成物
WO2001078908A1 (en) * 2000-04-04 2001-10-25 Parlex Corporation High speed flip chip assembly process
US7547579B1 (en) * 2000-04-06 2009-06-16 Micron Technology, Inc. Underfill process
US6923378B2 (en) 2000-12-22 2005-08-02 Digimarc Id Systems Identification card
SE519904C2 (sv) 2000-12-29 2003-04-22 Amc Centurion Ab Tillverkning av antennanordningar
US6951596B2 (en) 2002-01-18 2005-10-04 Avery Dennison Corporation RFID label technique
US20040217472A1 (en) * 2001-02-16 2004-11-04 Integral Technologies, Inc. Low cost chip carrier with integrated antenna, heat sink, or EMI shielding functions manufactured from conductive loaded resin-based materials
US6462711B1 (en) * 2001-04-02 2002-10-08 Comsat Corporation Multi-layer flat plate antenna with low-cost material and high-conductivity additive processing
US6817530B2 (en) 2001-12-18 2004-11-16 Digimarc Id Systems Multiple image security features for identification documents and methods of making same
EP1459239B1 (de) 2001-12-24 2012-04-04 L-1 Secure Credentialing, Inc. Verdeckte variableninformationen auf id-dokumenten und verfahren zu ihrer herstellung
CA2470600C (en) 2001-12-24 2009-12-22 Digimarc Id Systems, Llc Systems, compositions, and methods for full color laser engraving of id documents
WO2003056499A2 (en) 2001-12-24 2003-07-10 Digimarc Id Systems Llc Pet based multi-multi-layer smart cards
US7728048B2 (en) 2002-12-20 2010-06-01 L-1 Secure Credentialing, Inc. Increasing thermal conductivity of host polymer used with laser engraving methods and compositions
US7815124B2 (en) 2002-04-09 2010-10-19 L-1 Secure Credentialing, Inc. Image processing techniques for printing identification cards and documents
CA2470547C (en) 2001-12-24 2008-05-20 Digimarc Id Systems, Llc Laser etched security features for identification documents and methods of making same
US7442408B2 (en) * 2002-03-26 2008-10-28 Hewlett-Packard Development Company, L.P. Methods for ink-jet printing circuitry
US7824029B2 (en) 2002-05-10 2010-11-02 L-1 Secure Credentialing, Inc. Identification card printer-assembler for over the counter card issuing
JP4389148B2 (ja) * 2002-05-17 2009-12-24 日立化成工業株式会社 導電ペースト
US7023347B2 (en) 2002-08-02 2006-04-04 Symbol Technologies, Inc. Method and system for forming a die frame and for transferring dies therewith
US6848162B2 (en) * 2002-08-02 2005-02-01 Matrics, Inc. System and method of transferring dies using an adhesive surface
US20040077473A1 (en) * 2002-10-16 2004-04-22 Kimberly-Clark Worldwide, Inc. Method and apparatus for making pads
US7804982B2 (en) 2002-11-26 2010-09-28 L-1 Secure Credentialing, Inc. Systems and methods for managing and detecting fraud in image databases used with identification documents
JP2006514487A (ja) * 2003-03-05 2006-04-27 インチューン サーキッツ オサケ ユキチュア 導電パターン製造方法
US7225991B2 (en) 2003-04-16 2007-06-05 Digimarc Corporation Three dimensional data storage
US20050005434A1 (en) * 2003-06-12 2005-01-13 Matrics, Inc. Method, system, and apparatus for high volume transfer of dies
US20050134436A1 (en) * 2003-12-19 2005-06-23 George Brookner Multiple RFID anti-collision interrogation method
US7107836B2 (en) * 2003-12-19 2006-09-19 Neopost Industrie Sa Radio frequency tagging for indicia printing and product information
US7370808B2 (en) * 2004-01-12 2008-05-13 Symbol Technologies, Inc. Method and system for manufacturing radio frequency identification tag antennas
CA2553203A1 (en) * 2004-01-12 2005-08-04 Symbol Technologies, Inc. Radio frequency identification tag inlay sortation and assembly
US20050224590A1 (en) * 2004-04-13 2005-10-13 John Melngailis Method and system for fabricating integrated circuit chips with unique identification numbers
US20050247916A1 (en) * 2004-05-06 2005-11-10 Mccormick Demetrius Compositions for use in electronics devices
WO2005120164A2 (en) * 2004-06-10 2005-12-22 Galtronics Ltd. Three dimensional antennas formed using wet conductive materials and methods for production thereof
US7331500B2 (en) * 2004-06-25 2008-02-19 Intel Corporation Solder bumps formation using solder paste with shape retaining attribute
WO2006012358A2 (en) * 2004-06-29 2006-02-02 Symbol Technologies, Inc. Systems and methods for testing radio frequency identification tags
FR2873470A1 (fr) * 2004-07-21 2006-01-27 Fci Sa Dispositif de connexion pour circuits plats
CA2576772A1 (en) * 2004-08-17 2006-03-02 Symbol Technologies, Inc. Singulation of radio frequency identification (rfid) tags for testing and/or programming
US7500307B2 (en) 2004-09-22 2009-03-10 Avery Dennison Corporation High-speed RFID circuit placement method
CA2583729A1 (en) * 2004-10-21 2006-05-04 Englebienne & Associates Stable metal/conductive polymer composite colloids and methods for making and using the same
US20060093732A1 (en) * 2004-10-29 2006-05-04 David Schut Ink-jet printing of coupling agents for trace or circuit deposition templating
US20060172230A1 (en) * 2005-02-02 2006-08-03 Dsm Ip Assets B.V. Method and composition for reducing waste in photo-imaging applications
US20060223225A1 (en) * 2005-03-29 2006-10-05 Symbol Technologies, Inc. Method, system, and apparatus for transfer of integrated circuit dies using an attractive force
JP2006276640A (ja) * 2005-03-30 2006-10-12 Taiyo Ink Mfg Ltd 感光性ペースト及びそれを用いて得られる焼成物パターン
JP2006302679A (ja) * 2005-04-21 2006-11-02 Seiko Epson Corp 導電膜の形成方法、及び電子機器の製造方法
US7623034B2 (en) 2005-04-25 2009-11-24 Avery Dennison Corporation High-speed RFID circuit placement method and device
CN1730574B (zh) * 2005-08-18 2011-09-14 杨永树 辐射硬化型导电油墨以及利用辐射硬化型导电油墨制成导电基材之方法
US20070074278A1 (en) * 2005-09-27 2007-03-29 Fargo Electronics, Inc. Imaged Watermark in a Credential Product
WO2007062131A2 (en) * 2005-11-22 2007-05-31 Ndsu Research Foundation Conductive ink compositions
US20070131016A1 (en) * 2005-12-13 2007-06-14 Symbol Technologies, Inc. Transferring die(s) from an intermediate surface to a substrate
US20070139057A1 (en) * 2005-12-15 2007-06-21 Symbol Technologies, Inc. System and method for radio frequency identification tag direct connection test
US8067253B2 (en) 2005-12-21 2011-11-29 Avery Dennison Corporation Electrical device and method of manufacturing electrical devices using film embossing techniques to embed integrated circuits into film
US7555826B2 (en) * 2005-12-22 2009-07-07 Avery Dennison Corporation Method of manufacturing RFID devices
US20070158024A1 (en) * 2006-01-11 2007-07-12 Symbol Technologies, Inc. Methods and systems for removing multiple die(s) from a surface
JP5099289B2 (ja) * 2006-02-03 2012-12-19 ソニーケミカル＆インフォメーションデバイス株式会社 熱硬化型接着剤
US20070213429A1 (en) * 2006-03-10 2007-09-13 Chih-Min Cheng Anisotropic conductive adhesive
US7972683B2 (en) * 2006-03-28 2011-07-05 Innovative Micro Technology Wafer bonding material with embedded conductive particles
US20070244657A1 (en) * 2006-04-11 2007-10-18 Drago Randall A Methods and systems for testing radio frequency identification (RFID) tags having multiple antennas
US7554793B2 (en) * 2006-11-16 2009-06-30 Kemet Electronics Corporation Low temperature curable conductive adhesive and capacitors formed thereby
US8404160B2 (en) 2007-05-18 2013-03-26 Applied Nanotech Holdings, Inc. Metallic ink
US10231344B2 (en) 2007-05-18 2019-03-12 Applied Nanotech Holdings, Inc. Metallic ink
US8345345B2 (en) 2007-06-27 2013-01-01 Gentex Corporation Electrochromic device having an improved fill port plug
KR101030654B1 (ko) * 2007-09-19 2011-04-20 엘지전자 주식회사 휴대 단말기 및 그 회로 구성 방법
US20090169724A1 (en) * 2007-12-27 2009-07-02 Toshiaki Ogiwara Conductive paste for use in membrane touch switch applications
US8506849B2 (en) 2008-03-05 2013-08-13 Applied Nanotech Holdings, Inc. Additives and modifiers for solvent- and water-based metallic conductive inks
US9730333B2 (en) * 2008-05-15 2017-08-08 Applied Nanotech Holdings, Inc. Photo-curing process for metallic inks
US20100000762A1 (en) * 2008-07-02 2010-01-07 Applied Nanotech Holdings, Inc. Metallic pastes and inks
US8580894B2 (en) * 2008-10-10 2013-11-12 Incoat Llc Two part, low molecular weight self curing, low viscosity acrylic penetrant, sealant and coating composition, and methods for using the same
US8534562B2 (en) * 2008-12-18 2013-09-17 Avery Dennison Corporation Badge with RFID device
CN102365713B (zh) 2009-03-27 2015-11-25 应用纳米技术控股股份有限公司 增强光和/或激光烧结的缓冲层
US8485436B2 (en) * 2009-04-06 2013-07-16 Mastercard International Incorporated Simulated contactless identification card reader
US8422197B2 (en) 2009-07-15 2013-04-16 Applied Nanotech Holdings, Inc. Applying optical energy to nanoparticles to produce a specified nanostructure
JP2011068783A (ja) 2009-09-25 2011-04-07 Fujifilm Corp インク組成物、及び、インクジェット記録方法
JPWO2011114846A1 (ja) * 2010-03-18 2013-06-27 東レ株式会社 感光性導電ペーストおよび導電パターンの製造方法
JP5170156B2 (ja) * 2010-05-14 2013-03-27 株式会社村田製作所 無線ｉｃデバイス
EP2676991B1 (de) * 2011-02-14 2020-07-15 LG Chem, Ltd. Substratfilm und verfahren zu seiner herstellung
KR101827047B1 (ko) * 2012-03-02 2018-02-07 펄스 일렉트로닉스, 인크. 피착 안테나 장치 및 방법
WO2014011578A1 (en) 2012-07-09 2014-01-16 Applied Nanotech Holdings, Inc. Photosintering of micron-sized copper particles
JP5772755B2 (ja) * 2012-08-02 2015-09-02 信越化学工業株式会社 太陽電池電極用ペースト組成物
US9057925B2 (en) 2013-03-15 2015-06-16 Gentex Corporation Fill port plugs for electrochromic devices
US10020561B2 (en) 2013-09-19 2018-07-10 Pulse Finland Oy Deposited three-dimensional antenna apparatus and methods
CN106463828B (zh) 2014-02-12 2021-04-06 脉冲芬兰有限公司 用于导电元件沉积和形成的方法和设备
CN103943955A (zh) * 2014-04-30 2014-07-23 苏州玄禾物联网科技有限公司 一种rfid标签天线的制造方法
US9833802B2 (en) 2014-06-27 2017-12-05 Pulse Finland Oy Methods and apparatus for conductive element deposition and formation
JP6309842B2 (ja) * 2014-07-03 2018-04-11 田中貴金属工業株式会社 光硬化型導電性インク組成物
JP6368288B2 (ja) * 2015-08-07 2018-08-01 福田金属箔粉工業株式会社 フレーク状銀粒子の集合体及び該銀粒子の集合体を含有するペースト
JP2018536731A (ja) 2015-11-17 2018-12-13 ディーエスエム アイピー アセッツ ビー．ブイ．Ｄｓｍ Ｉｐ Ａｓｓｅｔｓ Ｂ．Ｖ． 改善された付加造形用アンチモンフリー放射線硬化性組成物およびインベストメント鋳造プロセスにおけるその用途
CN107346442A (zh) * 2017-06-30 2017-11-14 青岛海大新星计算机工程中心 一种可定向识别的rfid电子标签
JP6673322B2 (ja) * 2017-12-20 2020-03-25 住友ベークライト株式会社 導電性ペーストおよび伸縮性配線基板
JP7291460B2 (ja) * 2018-02-07 2023-06-15 株式会社ミマキエンジニアリング 放射線硬化型インク、積層物、放射線硬化型インクの製造方法
EP3849485A4 (de) * 2018-09-12 2022-06-15 Massachusetts Institute of Technology System und verfahren zur drahtlosen erfassung der gesundheitsüberwachung
US11805603B2 (en) 2019-06-24 2023-10-31 International Business Machines Corporation Applying a solderable surface to conductive ink
US20220351876A1 (en) * 2020-01-17 2022-11-03 Soltrium Advanced Materials Technology, Ltd. Acrylic conductive paste for semiconductor device and methods
CN113412319B (zh) * 2020-01-17 2022-11-22 深圳市首骋新材料科技有限公司 一种环氧树脂导电胶及其制备方法和应用
CN111349228A (zh) * 2020-03-17 2020-06-30 北京化工大学 一种利用活性长链单体扩大环氧转子相光聚合温度区间的方法及其应用
CN111349227A (zh) * 2020-03-17 2020-06-30 北京化工大学 一种长链环氧阳离子单体转子相光聚合及其应用
CN114907794A (zh) * 2021-02-08 2022-08-16 翌骅实业股份有限公司 低银固含量导电胶及其制作方法
CN113382552A (zh) * 2021-05-24 2021-09-10 深圳市志凌伟业光电有限公司 导线断路修补方法
JP7231124B1 (ja) * 2022-03-30 2023-03-01 東洋インキＳｃホールディングス株式会社 金属板用接合剤、プリント配線板用補強部材及びその製造方法、並びに、配線板及びその製造方法

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3801364A (en) * 1971-02-03 1974-04-02 Matsushita Electric Ind Co Ltd Method for making printed circuits which include printed resistors
US4595606A (en) * 1984-07-18 1986-06-17 Rohm And Haas Company Solderable conductive compositions having high adhesive strength
US4959178A (en) * 1987-01-27 1990-09-25 Advanced Products Inc. Actinic radiation-curable conductive polymer thick film compositions and their use thereof
US5061551A (en) * 1987-02-06 1991-10-29 Key-Tech, Inc. Printed circuit board
JPS6414302A (en) * 1987-07-02 1989-01-18 Aprica Kassai Kk Disposable diaper
WO1990008809A1 (fr) * 1989-01-30 1990-08-09 Asahi Kasei Kogyo Kabushiki Kaisha Composition conductive pateuse et son durcissement
JPH03152992A (ja) * 1989-10-27 1991-06-28 W R Grace & Co 印刷回路板及びその製造方法
US5376403A (en) * 1990-02-09 1994-12-27 Capote; Miguel A. Electrically conductive compositions and methods for the preparation and use thereof
JPH04304272A (ja) * 1991-03-29 1992-10-27 Ajinomoto Co Inc 導電性ペーストの硬化物の製造方法
JPH05166018A (ja) * 1991-12-12 1993-07-02 Fujitsu Ltd 非接触ｉｃカード
EP0698275A4 (de) * 1993-04-28 1996-09-04 Mark Mitchnick Leitfähige polymere
JPH0714626A (ja) * 1993-06-23 1995-01-17 Shin Etsu Polymer Co Ltd ヒ−トシ−ルコネクタ−
US5522216A (en) * 1994-01-12 1996-06-04 Marlow Industries, Inc. Thermoelectric refrigerator
DE4428732C1 (de) * 1994-08-15 1996-01-04 Angewandte Digital Elektronik Mehrlagige Chipkartenspulen für kontaktfreie Chipkarten
JPH08116205A (ja) * 1994-10-17 1996-05-07 Nippon Steel Corp 漏れ波導波管スロット・アレーアンテナの製造方法
US5951918A (en) * 1995-02-08 1999-09-14 Hitachi Chemical Company, Ltd. Composite electroconductive powder, electroconductive paste, process for producing electroconductive paste, electric circuit and process for producing electric circuit
JPH08216570A (ja) * 1995-02-09 1996-08-27 Hitachi Chem Co Ltd Ｉｃカード
JP2814477B2 (ja) * 1995-04-13 1998-10-22 ソニーケミカル株式会社 非接触式ｉｃカード及びその製造方法
JP3778592B2 (ja) * 1995-04-19 2006-05-24 東洋紡績株式会社 金属めっき下地用導電性ペースト
JPH09198481A (ja) * 1996-01-17 1997-07-31 Toshiba Chem Corp 電子タグ
JP3242568B2 (ja) * 1996-04-12 2001-12-25 富士通株式会社 パターン形成方法
CN1126785C (zh) * 1996-05-13 2003-11-05 松下电器产业株式会社 导电性丙烯树脂组合物及零件盛放容器
JPH10157353A (ja) * 1996-11-27 1998-06-16 Toshiba Corp 無線カードおよびその製造方法
JPH1196833A (ja) * 1997-09-16 1999-04-09 Hitachi Chem Co Ltd 導電ペースト及びこれを用いた印刷アンテナ回路を有する非接触ｉｃカード
JPH11161760A (ja) * 1997-11-26 1999-06-18 Hitachi Ltd 薄型電子回路部品及びその製造方法及びその製造装置
WO2000003354A1 (fr) * 1998-07-08 2000-01-20 Dai Nippon Printing Co., Ltd. Carte a circuit integre sans contact et son procede de fabrication

Also Published As

Publication number Publication date
DE69935022T2 (de) 2007-05-16
EP1484714A1 (de) 2004-12-08
EP1486912A1 (de) 2004-12-15
KR20000023478A (ko) 2000-04-25
DE69935021T2 (de) 2007-05-24
EP1484713B1 (de) 2007-01-24
DE69928346D1 (de) 2005-12-22
CN1262492A (zh) 2000-08-09
US6165386A (en) 2000-12-26
EP1475743B1 (de) 2007-01-24
HK1067754A1 (en) 2005-04-15
SG105526A1 (en) 2004-08-27
EP1484713A1 (de) 2004-12-08
CA2284978C (en) 2009-06-16
CA2628782A1 (en) 2000-03-30
EP0991014A2 (de) 2000-04-05
DE69935021D1 (de) 2007-03-15
CA2284978A1 (en) 2000-03-30
DE69928346T2 (de) 2006-06-01
HK1067437A1 (en) 2005-04-08
KR100692926B1 (ko) 2007-03-12
EP0991014B1 (de) 2005-11-16
KR20060063821A (ko) 2006-06-12
SG74754A1 (en) 2000-08-22
DE69935022D1 (de) 2007-03-15
KR100629923B1 (ko) 2006-09-29
CA2628782C (en) 2009-09-01
SG115440A1 (en) 2005-10-28
EP1475743A1 (de) 2004-11-10
EP0991014A3 (de) 2003-06-18
CN1184266C (zh) 2005-01-12

Similar Documents

Publication Publication Date Title
HK1026967A1 (en) Conductive paste and method of forming an antenna for a transponder
GB2345196B (en) An antenna and method of production
AU7458398A (en) Microwave antenna system and method
EP0776530A4 (de) Verfahren und antenne mit einem rundstrahldiagramm
AU5954996A (en) Method of manufacturing a printed antenna
AU9680298A (en) Advanced electronic microminiature package and method
GB2325576B (en) Waterproofing method for an introduction portion of a covered conductor
EP0763265A4 (de) Antenne und verfahren zu deren herstellung
GB2282487B (en) Antenna assembly for radio circuit and method therefor
AU6735098A (en) Method for making a contactless card with antenna connected with soldered wires
GB2314460B (en) Integral antenna assembly for a radio and method of manufacturing
GB2323478B (en) Antenna and method of manufacture of a radio
GB2317995B (en) Antenna assembly and method for attaching an antenna
GB2345022B (en) Method for manufacturing an antenna body for a phone
AU1283799A (en) Method of making a part utilizing an electrically conductive material
GB2337635B (en) Method of forming a conducting structure
GB9913365D0 (en) Antenna and its manufacturing method
GB2347587B (en) Communication apparatus having a retractable antenna and method of operating the communication apparatus
AU5046799A (en) Method for making an antenna for a medium comprising an electronic circuit
GB2301486B (en) A method of manufacturing an antenna
PL329182A1 (en) Method of making a radiating structuire of a radar antenna
GB2321146B (en) Method for calibrating a radio receiver and a radio receiver
AU5141999A (en) A system and a method for plating of a conductive pattern
GB2347274B (en) Antenna arrangement and method of manufacturing an antenna arrangement
AU697937B2 (en) Antenna and method of manufacture of a radio

Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20180929