EP1109041A1 - Optisches Bauelement-Modul - Google Patents

Optisches Bauelement-Modul Download PDF

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Publication number
EP1109041A1
EP1109041A1 EP00126567A EP00126567A EP1109041A1 EP 1109041 A1 EP1109041 A1 EP 1109041A1 EP 00126567 A EP00126567 A EP 00126567A EP 00126567 A EP00126567 A EP 00126567A EP 1109041 A1 EP1109041 A1 EP 1109041A1
Authority
EP
European Patent Office
Prior art keywords
optical
transparent structure
semiconductor device
positioning
face
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP00126567A
Other languages
English (en)
French (fr)
Inventor
Shuichi Japan Aviation Electr. Ind. Ltd. Aihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Aviation Electronics Industry Ltd
Original Assignee
Japan Aviation Electronics Industry Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Aviation Electronics Industry Ltd filed Critical Japan Aviation Electronics Industry Ltd
Publication of EP1109041A1 publication Critical patent/EP1109041A1/de
Withdrawn legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/4232—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using the surface tension of fluid solder to align the elements, e.g. solder bump techniques
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G02B6/4221—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements involving a visual detection of the position of the elements, e.g. by using a microscope or a camera
    • G02B6/4224—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements involving a visual detection of the position of the elements, e.g. by using a microscope or a camera using visual alignment markings, e.g. index methods
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres

Definitions

  • the present invention relates to an optical device module in which a light emitting device which emits light from its surface substantially at right angles thereto, such as a laser diode, or a light receiving device which receives light substantially at right angles to its surface, such as a photo diode (which elements will hereinafter be generically referred to as an optical semiconductor device) and the optical path of an optical waveguide member such as an optical fiber or optical waveguide board, i.e. the core of the optical fiber or the optical waveguide of the optical waveguide board, are interconnected by an optical path bent substantially at right angles.
  • a light emitting device which emits light from its surface substantially at right angles thereto, such as a laser diode, or a light receiving device which receives light substantially at right angles to its surface, such as a photo diode (which elements will hereinafter be generically referred to as an optical semiconductor device) and the optical path of an optical waveguide member such as an optical fiber or optical waveguide board, i.e. the core of the optical fiber or the optical
  • Fig. 9 is a diagrammatic showing of a conventional optical device module of this kind proposed in Japanese Patent Application Laid-Open Gazette No. 08-21930.
  • Reference numeral 12 denotes a photo detector disposed in a casing 11, 13 a window made in the top panel of the casing 11, 14 a condenser lens fitted in the window 13, 15 an optical fiber disposed on the top of the casing 11, and 16 a reflecting surface formed by cutting one end face of the optical fiber 15 at an angle of about 45 degrees.
  • Light propagated through the optical fiber 15 is bent at right angles by the reflecting surface 16 and gathered by the condenser lens 14 for incidence on the photo detector 12 as indicated by the broken line.
  • a conventional optical device module of this kind As depicted in Figs. 11 and 12, a frame-like guide block 21 with a rectangular opening has formed integrally therewith a guide prism 22, an optical fiber is disposed in each recess 23 of the guide block 21 with the end face of the optical fiber 15 abutted against the guide prism 22, and a light receiving device 24 is fitted in the frame of the guide block 21. Light from the optical fiber 15 is bent by the guide prism 22 for incidence on the light receiving device 24.
  • Fig. 9 suffers much difficulty in aligning the point of incidence on the reflecting surface 16 of the optical fiber 15, the axis of the lens 13 and the light-receiving center of the photo detector 12; hence, it is not easy to launch the light from the optical fiber 15 into the photo detector 12 with high efficiency.
  • Fig. 10 too, it is very difficult to align the reflecting-point of the prism 17, the axis of the lens and the light-receiving center of the photo detector.
  • the abutment of the end face of the optical fiber 15 against one side of the guide prism 22 ensures accurate positioning, but the light receiving device 24 needs to be fitted snugly in the frame of the guide block 21.
  • the inside dimensions of the frame of the guide block 21 and/or outside dimensions of the light receiving device 24 be adjusted for each optical device module.
  • the illustrated structure lacks general versatility.
  • the light receiving device 24, once fitted in the frame of the guide block 21, is fixed and its position cannot be adjusted so that its light receiving surface is placed at a correct position.
  • an optical device module comprising:
  • Figs. 1A and 1B illustrate an embodiment according to the first aspect of the present invention which employs an optical fiber 15 as an optical waveguide member.
  • Reference numeral 31 denotes a substantially rectangular transparent structure molded of transparent glass or transparent synthetic resin.
  • the transparent structure 31 has a prismatic protrusion 31 a formed integrally therewith on one surface, in this example, on the top 32 of the structure 31.
  • the prismatic protrusion 3 la has a positioning surface 33 substantially vertical to the top 32 of the transparent structure 31 and a reflecting surface 34 forming an angle of approximately 45 degrees with respect to the positioning surface 33, that is, oblique to the top 32 of the transparent structure 31.
  • the height of the positioning surface 33 from the top 32 of the transparent structure 31 is about the same as or larger than the diameter of the optical fiber 15.
  • One end face of the optical fiber 15 placed on the top 32 of the transparent structure 31 is abutted against the positioning surface 33 so that the optical fiber 15 is positioned horizontally.
  • the optical fiber 15 is disposed substantially at right angles to
  • a rectangular recess 31R surrounded by a square frame-shaped support wall 31b along the marginal edge of the underside of the transparent structure 31.
  • a wiring board 35 is attached in abutting relation to the end face of the frame-shaped support wall 31b in parallel with the underside of the transparent structure 31.
  • the wiring board 35 is a printed wiring board of glass epoxy or ceramics, which has printed on the side thereof facing the transparent structure 31 a conductor pattern 36 forming an electrode, terminals and lead wires interconnecting them.
  • an optical semiconductor device 37 On the electrode portion of the conductor pattern 36 there is placed an optical semiconductor device 37 by soldering, for instance.
  • An electrode on the optical semiconductor device 37 and the electrode of the conductor pattern 36 are interconnected by a bonding wire 38.
  • the optical semiconductor device 37 is disposed with its device surface, in this example, its light emitting surface 39, held opposite the reflecting surface 34 of the prismatic protrusion 31 a across the transparent structure 31.
  • the wiring board 35 and the transparent structure 31 are assembled in such a way as described below.
  • the wiring board 35 is positioned relative to the transparent structure 31 in adjacent but spaced relationship to the lower end face of the support wall 31b, and then moved vertically into abutment thereon in such a manner as to cover the recess 31R surrounded by the support wall 31b.
  • an ultraviolet setting adhesive layer 41 is irradiated with ultraviolet rays to cure the adhesive layer, and consequently, the wiring board 35 hermetically seals and separates the recess 31R of the transparent structure 31 from the outside.
  • the optical semiconductor device 37 is placed on the wiring board 35 in the recess 31R.
  • the optical semiconductor device 37 is sealed in the recess 31b for protection. Since the transparent structure 31 and the wiring board 35 define the recess 31R as mentioned above, the overall size of the module can be reduced accordingly.
  • the wiring board 35 having the adhesive layer 41 serves as a means for supporting the optical semiconductor device 37 in the transparent structure 31.
  • light 42 emitted from the optical semiconductor device or light emitting element 37 having a light emitting end face on the side opposite the wiring board 35 somewhat spreads and strikes on the prismatic protrusion 31a of the transparent structure 31.
  • the incident light is reflected 90 degrees by the reflecting surface 34 of the protrusion 31a which forms an angle of 45 degrees with respect to the axis of emitted light from the light emitting device 37.
  • the reflected light passes through the positioning surface 33 of the protrusion 31 a and impinges on the core 15a (an optical path) of the optical fiber 15.
  • the angle of total reflection is equal to or smaller than 45 degrees which is determined by the relative refractive index of the transparent structure 31, total reflection of the emitted light from the light emitting device 37 occurs on the reflecting surface 34 of the transparent structure 31, permitting the incidence of approximately the entire quantity of emitted light on the core 15a of the optical fiber 15.
  • the total reflection is hard to occur, its reflection efficiency of the reflecting surface 34 can be increased as by evaporating metal it to form a mirror 43.
  • the optical coupling efficiency in this case is determined by a scattering loss on the total reflection surface, the spreading of the emitted light on the end face of the optical fiber 15, and deviations between the optical axes of the emitted and the reflected light and the optical axis of the optical fiber 15.
  • the reflection loss is zero
  • the light emitting device 37 is a point source and the spread angle of the emitted light is 10 degrees
  • the emitted light in an optical path 0.6 mm apart from the light emitting device 37 becomes a ray bundle 0.105 mm in diameter.
  • the transparent structure 31 (including the protrusion 31 a and the support wall 31b) can be molded of glass or similar material. This can be said to provide a high optical coupling efficiency with more ease and at lower cost than in the case of a conventional method of forming a similar reflecting surface by obliquely cutting an optical fiber.
  • At lease three positioning marks 44 are placed in each of the end face of the support wall 31 1B of the transparent structure 31 and the wiring board 35 at the positions where they are to be put together.
  • the transparent structure 31 is held above the wiring board 35 and their positioning marks 44 are aligned visually from above, after which the transparent structure 31 and the wiring board 35 are bonded to each other.
  • the positioning marks 44 in the wiring board 35 can be placed simultaneously with the formation of the conductor pattern 36.
  • the positioning marks 44 may be fiducial marks.
  • the positioning marks can be formed with an accuracy of 50 ⁇ m in the case of a glass epoxy wiring board and with an accuracy of 10 ⁇ m in the case of a ceramic wiring board.
  • the positioning marks on the transparent structure 31 can be formed, for example, by masked evaporation of metal with an accuracy of the submicron order. This allows ease in attaining a relative accuracy of, for instance, 5 ⁇ m or below that is usually needed in GI-500MMF (a graded index type 50- ⁇ m multimode optical fiber).
  • the height H1 of the support wall 31b be minimized within the range in which not to interfere the bonding wire 38.
  • the coupling efficiency of approximately 100% can be achieved by the alignment of the optical axes of the emitted light and the core of the optical fiber 15 and the coincidence of the diameter of the emitted light with the core diameter of the optical fiber 15.
  • the spread of the emitted light to be smaller than the core diameter of the optical fiber 15 (in the case of an optical waveguide member, the diameter of the optical waveguide)
  • Figs. 2A and 2B illustrate another embodiment of the present invention in which the reflecting surface 34 of the prismatic protrusion 31 a is formed, for example, as a paraboloid (of revolution) to thereby light-gathering power.
  • the curved surface in parabolic form and aligning the center of the light emitting surface of the light emitting device 37 with the focal point of the paraboloid reflected rays of light from the reflecting surface 34 become parallel rays, that is, the reflected light is kept from spreading, and consequently, the diameter of the ray bundle at the end face of the optical fiber 15 can be made smaller than the core diameter.
  • a convexity 45 is formed in the underside of the transparent structure 31 facing the light emitting device 37 in the Fig. 1 embodiment so that the convexity 45 serves as a lens, and this function is the same as is obtainable with the Fig. 2 embodiment.
  • the lens is shown to be a convex lens as a physical structure, it is also possible to employ a Fresnel lens or microplanar lens that provides the same function as the convex lens by partly changing the refractive index of the transparent structure 31. In this instance, the curved surface 45 is not formed.
  • the Fig. 4 embodiment is a combination of the embodiments of Figs. 2 and 3. As depicted in Fig. 4, the light-gathering power is provided in the reflecting surface 34 and in the underside of the transparent structure 31 facing the light emitting device 37.
  • the above-described embodiments are intended to raise the limitations on the degree of accuracy in mounting parts by reducing the diameter of the ray bundle, but the alignment of respective optical axes requires a high degree of precision in mounting the light emitting device 37 on the board 35, in mounting the transparent structure 31 on the board 35 and in connecting the transparent structure 31 and the optical fiber 15 to each other.
  • the mounting accuracy for aligning the optical axes can be enhanced by placing the optical fiber 15, the transparent structure 31 and the light emitting device 37 at certain fiducial points (parts) as well as by improving the mounting precision.
  • Figs. 5A to 5C illustrate an embodiment according to the second aspect of the present invention which is designed to provide increased mounting accuracy.
  • This embodiment uses an optical fiber as the optical waveguide member and a light emitting device as the semiconductor device.
  • the transparent structure 31 is as a fiducial part, on which the optical fiber 15 and the light emitting device 37 are mounted.
  • Reference numeral 31c denotes a thick-walled portion which is formed integrally with the top 32 of the rectangular transparent structure 31 and has a V-shaped groove 52 cut therein and extending about halfway from one end of the transparent structure 31 lengthwise.
  • the prismatic protrusion 31 a is formed integrally with top 32 of the transparent structure 31 in adjacent but spaced relation to the end face of the V-shaped groove 52, and the prismatic protrusion 31 a forms the positioning surface 33 and the reflecting surface 34.
  • the end face of the optical fiber 15 is abutted against the positioning surface 33 so that the optical fiber 15 is positioned in the side-to-side direction.
  • the light emitting device 37 is mounted directly on the underside of the transparent structure 31 with the optical axes of the reflecting surface 34 and the optical fiber 15 held in alignment with the optical axis of the light emitting device 37.
  • the solder adhesive layer by the solder bump 37S serves to support the light emitting device 37 on the transparent structure 31.
  • the transparent structure 31 has the above-mentioned V-shaped groove 52 as a guide which enables the optical fiber 15 to be aligned with the optical axis of the light reflected off the reflecting surface 34 and hence allows ease in mounting the optical fiber 15 in alignment with the optical axis of the light emitted from the light emitting device 37.
  • This embodiment uses the optical fiber, which is positioned by the V-shaped guide structure. Accordingly, the V-shaped groove 52 extends substantially at right angles to the positioning surface 33. This embodiment also permits relative positioning of the light emitting device 37 and the transparent structure 31 in the plane parallel to the underside of the latter.
  • the conventional face down bonding (which is referred to also as flip-chip bonding) it is customary to utilize an image recognition system in which: a probe equipped with image pickup means is inserted into the space between the surface of the light emitting device and the surface of the wiring board to be bonded; images of the both surfaces are alternately picked up; their relative position is judged and determined after processing the picked up images; and the both surfaces are bonded after pulling out the probe from the space between them.
  • the wiring board side is the transparent structure 31
  • their relative positioning can be achieved simply by visual observation or picking up their images from above the top of the transparent structure 31.
  • the positioning can be accomplished with reference to the electrode on the transparent substrate and the electrode of the light emitting device 37 that are to be interconnected; however, it is also possible to place fiducial mark on the transparent structure so that it is positioned with respect to a part of the light emitting device 37 such as an electrode that is not connected to the transparent structure, or its light emitting surface, or a swelled portion in the case of a mesa structure.
  • a tape fiber 15' having plural cores 15a arranged in parallel is abutted at one end against the positioning surface 33 of the prismatic protrusion 31a formed integrally with the transparent structure 31 on the top thereof and having the same length as the width of the tape fiber 15'.
  • the optical axes of the cores 15a are bent by the reflecting surface 34 of the protrusion 31a so that they pass through the transparent structure 31 and reach the individual light emitting devices 37 disposed on the wiring board 35.
  • the light emitting devices 37 may be mounted on the transparent structure 37 as depicted in Fig. 5.
  • the tape fiber 15' may be substituted with an optical waveguide member having plural optical waveguides formed side by side.
  • the position of the core 15a of the optical fiber 15 is determined only by the positioning surface 33 of the transparent structure 31, but it may also be positioned in a two-dimensional plane as depicted in Fig. 7.
  • Fig. 7 there is protrusively provided on the top 32 of the transparent structure 31 a guide portion 55 having a reference surface 54 perpendicular to the positioning surface 33 and the top 32.
  • the end face of an optical waveguide member 56 is abutted against the positioning surface 33 with one side of the waveguide member 56 held in abutment on the reference surface 54; thus, the optical waveguide member 56 is positioned in the two-dimensional plane on the transparent structure 31.
  • the optical waveguide member 56 is shown to have a plurality of optical waveguides or optical paths arranged side by side.
  • the optical semiconductor devices 37 are placed on the wiring board 35 in a one-to-one correspondence with the plurality of optical waveguides as depicted in Figs. 1A and 1B, or mounted by face bonding on the underside of the transparent structure 31 as depicted in Fig. 5.
  • the optical waveguide member 56 having the plurality of optical waveguides 67 is used, but this structure is applicable as well to the optical waveguide member having one optical waveguide.
  • the optical waveguide member 56 may be the optical tape fiber 15' depicted in Fig. 6.
  • Fig. 8 illustrates a modified form of the Fig. 5 embodiment, in which the optical fiber 15 and the transparent structure 31 are equipped with a connector 61 and a receptacle 62, respectively, so that the former is detachably mounted on the latter.
  • the connector 61 has: a through hole 64 in, for example, a thick rod-like coupling portion 63 centrally thereof, through which the optical fiber 15 is inserted and fixed therein; a pair of parallel engaging pieces 65 extending in the same direction from opposite ends of the coupling portion 63; a pair of hooks 66 protrusively provided on the tip end portions of the engaging pieces 65 in opposing relation to the optical fiber 15; and a pair of keys 67 protrusively provided on the inside surfaces of the engaging pieces 66 and extended in the same direction as the optical fiber 15.
  • the coupling portion 63, the engaging pieces 65, the hooks 66 and the keys 67 are integrally molded of a synthetic resin material, and the opposite end portions of the engaging pieces 65 can be elastically pushed apart.
  • the receptacle 62 for receiving the connector 61 is shown to be formed integrally with the transparent structure 31 that has formed integrally therewith the V-shaped groove 52 for guiding and positioning the optical cable 15.
  • the thick-walled portion with the V-shaped groove 52 cut therein has a pair of engaging portions 68 outwardly projecting from each side surface thereof to thereby define a key groove 69 which extends substantially at right angles to the positioning surface 33 of the prismatic protrusion 31a.
  • Those portions of the two pairs of engaging portions 68 on the side thereof opposite the protrusion 31 a are gradually protruded, that is, tapered so that the spacing of the engaging portions 68 on the both sides of the thick-walled portion gradually increases toward the positioning surface 33.
  • the engaging pieces 65 of the connector 61 are elastically pushed outward in the opposite directions by the tapered surfaces of the engaging portions 68.
  • the hooks 66 slide over the engaging portions 68 and snap elastically into engagement with the side surfaces of the engaging portions 68 on the side thereof facing the positioning surface 33, thereby assembling the connector 61 and the receptacle 62 into a unitary structure.
  • the coupling portion 68 of the connector 61 abuts against the end face of the transparent structure 31 and the end face of the optical fiber 15 abuts against or lies adjacent the positioning surface 33, whereby the optical fiber 15 is positioned in the direction perpendicular to the positioning surface 33.
  • the keys 65 are inserted in and guided by the key grooves 69 and the optical fiber 15 is inserted in the V-shaped groove 52 just in the center thereof, whereby the optical fiber 15 is positioned in the planes parallel with and vertical to the transparent structure 31, respectively.
  • the optical semiconductor device 37 is mounted on the transparent structure 31 as depicted in Fig. 1 or 5.
  • the Fig. 8 embodiment has been described to be applied to the optical coupling of the optical fiber 15 and the optical semiconductor device 37, but the illustrated structure is applicable as well to the optical coupling of the tape fiber 15' and a plurality of optical semiconductor devices 3.
  • the connector-receptacle structure can be applied to the combination of the optical waveguide member having one or more optical waveguides and the optical semiconductor device or devices.
  • the optical waveguide member can be used in place of the optical fiber 15.
  • the optical semiconductor device 37 has been described to be a light emitting device, it may also be light receiving element or photo detector.
  • the reflecting surface 34 may also be formed as such a light-gathering curved surface as described in respect of Figs. 2, 3 and 4, and the portion of the transparent structure 31 facing the optical semiconductor device 37 may also be equipped with light-gathering lens power.
  • a prismatic protrusion is formed integrally with a block-shaped transparent structure on one side thereof and the vertical surface of the prismatic protrusion is used for positioning an optical waveguide member, and an optical semiconductor device is placed opposite the other side of the transparent structure. Since the optical semiconductor device is positioned using a positioning mark placed in the above-mentioned other side of the transparent structure, they can be fixedly assembled with a high degree of positioning accuracy--this provides high optical coupling efficiency.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)
  • Light Receiving Elements (AREA)
EP00126567A 1999-12-16 2000-12-12 Optisches Bauelement-Modul Withdrawn EP1109041A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP35747899 1999-12-16
JP35747899A JP2001174671A (ja) 1999-12-16 1999-12-16 光素子モジュール

Publications (1)

Publication Number Publication Date
EP1109041A1 true EP1109041A1 (de) 2001-06-20

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EP00126567A Withdrawn EP1109041A1 (de) 1999-12-16 2000-12-12 Optisches Bauelement-Modul

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US (1) US6491447B2 (de)
EP (1) EP1109041A1 (de)
JP (1) JP2001174671A (de)

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FR2836236A1 (fr) * 2002-02-21 2003-08-22 Framatome Connectors Int Dispositif de couplage optoelectronique perfectionne
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EP1517166A2 (de) * 2003-09-15 2005-03-23 Rohm and Haas Electronic Materials, L.L.C. Vorrichtungsgehäuse und Verfahren zu derer Prüfung und Herstellung
US6957006B2 (en) 2002-02-15 2005-10-18 Omron Corporation Optical element and optical device using the same
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GB2397393B (en) * 2002-12-12 2007-05-16 Agilent Technologies Inc Optical apparatus and method
WO2007128021A1 (de) 2006-05-08 2007-11-15 At & S Austria Technologie & Systemtechnik Aktiengesellschaft Leiterplattenelement mit optoelektronischem bauelement und licht-wellenleiter
EP2116879A3 (de) * 2008-04-10 2009-12-23 Tyco Electronics Nederland B.V. Optische Schnittstelle
WO2011040830A1 (en) 2009-09-30 2011-04-07 Corning Incorporated Optical fiber end structures for improved multi-mode bandwidth, and related systems and methods
WO2012031780A3 (de) * 2010-09-12 2012-05-10 Amphenol-Tuchel Electronics Gmbh Optische kopplungsvorrichtung, optoelektronisches bauelement und optoelektronischer transceiver
WO2012031781A3 (de) * 2010-09-12 2012-05-24 Amphenol-Tuchel Electronics Gmbh Optische kopplungsvorrichtung, optoelektronisches bauelement und optoelektronischer transceiver
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WO2013148763A1 (en) * 2012-03-30 2013-10-03 Corning Cable Systems Llc Total-internal-reflection fiber optic interface modules and assemblies
CN103424812A (zh) * 2012-05-16 2013-12-04 鸿富锦精密工业（深圳）有限公司 光纤连接器
CN103885134A (zh) * 2012-12-22 2014-06-25 鸿富锦精密工业（深圳）有限公司 光耦合透镜及光纤耦合连接器
CN104335092A (zh) * 2012-03-30 2015-02-04 康宁光电通信有限责任公司 具有不同光学路径的全内反射光纤接口模块和使用所述模块的组件
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