WO2012031780A3 - Optische kopplungsvorrichtung, optoelektronisches bauelement und optoelektronischer transceiver - Google Patents
Optische kopplungsvorrichtung, optoelektronisches bauelement und optoelektronischer transceiver Download PDFInfo
- Publication number
- WO2012031780A3 WO2012031780A3 PCT/EP2011/004581 EP2011004581W WO2012031780A3 WO 2012031780 A3 WO2012031780 A3 WO 2012031780A3 EP 2011004581 W EP2011004581 W EP 2011004581W WO 2012031780 A3 WO2012031780 A3 WO 2012031780A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- optical
- component
- optoelectronic
- coupling means
- face
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/40—Transceivers
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/424—Mounting of the optical light guide
- G02B6/4243—Mounting of the optical light guide into a groove
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4246—Bidirectionally operating package structures
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4251—Sealed packages
- G02B6/4253—Sealed packages by embedding housing components in an adhesive or a polymer material
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Optical Couplings Of Light Guides (AREA)
- Semiconductor Lasers (AREA)
Abstract
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/822,391 US9294197B2 (en) | 2010-09-12 | 2011-09-12 | Optoelectronic component |
JP2013527499A JP2014502363A (ja) | 2010-09-12 | 2011-09-12 | 光電子部品 |
EP11771005.3A EP2614395A2 (de) | 2010-09-12 | 2011-09-12 | Optoelektronisches bauelement |
CN2011800438222A CN103140786A (zh) | 2010-09-12 | 2011-09-12 | 光学联接装置、光电子构件和光电子收发器 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102010044836.2 | 2010-09-12 | ||
DE102010044836 | 2010-09-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2012031780A2 WO2012031780A2 (de) | 2012-03-15 |
WO2012031780A3 true WO2012031780A3 (de) | 2012-05-10 |
Family
ID=44674749
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2011/004581 WO2012031780A2 (de) | 2010-09-12 | 2011-09-12 | Optoelektronisches bauelement |
Country Status (6)
Country | Link |
---|---|
US (1) | US9294197B2 (de) |
EP (1) | EP2614395A2 (de) |
JP (1) | JP2014502363A (de) |
CN (1) | CN103140786A (de) |
DE (1) | DE102011113212A1 (de) |
WO (1) | WO2012031780A2 (de) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ES2726541T3 (es) * | 2012-03-05 | 2019-10-07 | Nanoprecision Products Inc | Dispositivo de acoplamiento que tiene una superficie reflectante estructurada para acoplar la entrada/salida de una fibra óptica |
US20160274318A1 (en) | 2012-03-05 | 2016-09-22 | Nanoprecision Products, Inc. | Optical bench subassembly having integrated photonic device |
TWI468760B (zh) * | 2013-04-01 | 2015-01-11 | Delta Electronics Inc | 光學模組及光收發模組 |
US9739962B2 (en) * | 2013-05-14 | 2017-08-22 | Vixar | Plastic optical fiber data communication links |
CN104422996A (zh) * | 2013-08-22 | 2015-03-18 | 浙江彩虹鱼通讯技术有限公司 | 光电转换器和光电连接装置 |
WO2015110289A1 (en) * | 2014-01-27 | 2015-07-30 | Napatech A/S | Activity diodes and reflective housings |
EP2916151B1 (de) * | 2014-03-05 | 2020-01-01 | Corning Optical Communications LLC | Verfahren zur Herstellung einer Faserkopplungsvorrichtung |
US9891385B2 (en) * | 2015-02-12 | 2018-02-13 | Source Photonics (Chengdu) Co., Ltd. | Integrated lens with multiple optical structures and vent hole |
US9869818B2 (en) * | 2015-02-12 | 2018-01-16 | Source Photonics (Chengdu) Co., Ltd. | Integrated lens with multiple optical structures and vent hole |
US9599782B2 (en) | 2015-04-29 | 2017-03-21 | Technische Universitaet Berlin | Optoelectronic device |
US9971089B2 (en) * | 2015-12-09 | 2018-05-15 | Intel Corporation | Chip-to-chip interconnect with embedded electro-optical bridge structures |
WO2019078485A1 (ko) * | 2017-10-20 | 2019-04-25 | 주식회사 네패스 | 광 모듈 |
GB201721814D0 (en) * | 2017-12-22 | 2018-02-07 | Optoscribe Ltd | Optical apparatus, optical assembly and methods of manufacture thereof |
WO2023076490A1 (en) * | 2021-10-27 | 2023-05-04 | Avicenatech Corp. | Separate optoelectronic substrate |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5369529A (en) * | 1993-07-19 | 1994-11-29 | Motorola, Inc. | Reflective optoelectronic interface device and method of making |
EP1109041A1 (de) * | 1999-12-16 | 2001-06-20 | Japan Aviation Electronics Industry, Limited | Optisches Bauelement-Modul |
US20070147747A1 (en) * | 2005-12-27 | 2007-06-28 | Fujifilm Corporation | Optical module and optical transmission system using the same |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19932430C2 (de) | 1999-07-12 | 2002-03-14 | Harting Elektrooptische Bauteile Gmbh & Co Kg | Opto-elektronische Baugruppe sowie Bauteil für diese Baugruppe |
US6560385B2 (en) | 2001-05-24 | 2003-05-06 | General Electric Company | Fiber optic prism coupler, coupling arrangement and fabrication method |
CN2513127Y (zh) * | 2001-10-30 | 2002-09-25 | 福州康顺光通讯有限公司 | 单纤双向收发模块 |
US7088518B2 (en) | 2002-12-03 | 2006-08-08 | Finisar Corporation | Bidirectional optical device |
US6888988B2 (en) | 2003-03-14 | 2005-05-03 | Agilent Technologies, Inc. | Small form factor all-polymer optical device with integrated dual beam path based on total internal reflection optical turn |
CN2606497Y (zh) * | 2003-04-04 | 2004-03-10 | 深圳飞通光电股份有限公司 | 一种单光纤双向传输光电收发模块( 二) |
-
2011
- 2011-09-12 CN CN2011800438222A patent/CN103140786A/zh active Pending
- 2011-09-12 WO PCT/EP2011/004581 patent/WO2012031780A2/de active Application Filing
- 2011-09-12 JP JP2013527499A patent/JP2014502363A/ja not_active Withdrawn
- 2011-09-12 DE DE102011113212A patent/DE102011113212A1/de not_active Withdrawn
- 2011-09-12 US US13/822,391 patent/US9294197B2/en active Active
- 2011-09-12 EP EP11771005.3A patent/EP2614395A2/de not_active Withdrawn
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5369529A (en) * | 1993-07-19 | 1994-11-29 | Motorola, Inc. | Reflective optoelectronic interface device and method of making |
EP1109041A1 (de) * | 1999-12-16 | 2001-06-20 | Japan Aviation Electronics Industry, Limited | Optisches Bauelement-Modul |
US20070147747A1 (en) * | 2005-12-27 | 2007-06-28 | Fujifilm Corporation | Optical module and optical transmission system using the same |
Also Published As
Publication number | Publication date |
---|---|
US9294197B2 (en) | 2016-03-22 |
DE102011113212A1 (de) | 2012-03-15 |
CN103140786A (zh) | 2013-06-05 |
WO2012031780A2 (de) | 2012-03-15 |
US20140072311A1 (en) | 2014-03-13 |
JP2014502363A (ja) | 2014-01-30 |
EP2614395A2 (de) | 2013-07-17 |
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