JP6245071B2 - 光伝送モジュール - Google Patents
光伝送モジュール Download PDFInfo
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- JP6245071B2 JP6245071B2 JP2014107594A JP2014107594A JP6245071B2 JP 6245071 B2 JP6245071 B2 JP 6245071B2 JP 2014107594 A JP2014107594 A JP 2014107594A JP 2014107594 A JP2014107594 A JP 2014107594A JP 6245071 B2 JP6245071 B2 JP 6245071B2
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- 230000005540 biological transmission Effects 0.000 title claims description 65
- 210000000078 claw Anatomy 0.000 claims description 23
- 238000006243 chemical reaction Methods 0.000 claims description 4
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- 229910010272 inorganic material Inorganic materials 0.000 description 6
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
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- 230000005499 meniscus Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
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- 239000003960 organic solvent Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
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- 229910004298 SiO 2 Inorganic materials 0.000 description 1
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Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4245—Mounting of the opto-electronic elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
- G02B6/4257—Details of housings having a supporting carrier or a mounting substrate or a mounting plate
- G02B6/4259—Details of housings having a supporting carrier or a mounting substrate or a mounting plate of the transparent type
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02251—Out-coupling of light using optical fibres
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0239—Combinations of electrical or optical elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
- G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
- G02B6/425—Optical features
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
- H01S5/0071—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping for beam steering, e.g. using a mirror outside the cavity to change the beam direction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Optical Couplings Of Light Guides (AREA)
- Semiconductor Lasers (AREA)
- Light Receiving Elements (AREA)
Description
(図2)とを繋ぐ複数の配線22が形成されている。具体的には、第2部材20の内面20aには、少なくとも配線22a,22b,22c,22d,22e,22fが形成されている。それぞれの配線22は、第2部材20の内面20aの略中央に配置されている駆動素子41と内面20aの縁(長辺)との間に延びており、一部の配線22は、発光素子40を迂回して内面20aの縁に達している。もっとも、図5に示されている配線パターンは一例である。
10 第1部材
11 底部
11a 内面(底部内面)
11b 外面(底部外面)
12 側壁
12a 端面(側壁端面)
13 開口部
14,14a〜14f 電極
15 右側壁
15a (右側壁の)外面
16 左側壁
16a (左側壁の)外面
17 閉空間
20 第2部材
20a (第2部材の)内面
20b (第2部材の)外面
22,22a〜22f 配線
30 コネクタ部材
30a (コネクタ部材の)上面
30b (コネクタ部材の)底面
33a,34a V溝
33b,34b 突起
35a,35b 爪
40 発光素子
41 駆動素子
43 光ファイバ
44 ファイバ保持部材
50 基板
51 基板表面
52 配線
53 メニスカス
60 固定具
Claims (6)
- 光電変換機能を有する光素子を備える光伝送モジュールであって、
底部及び側壁を備え、一面が開口した第1部材と、
前記第1部材の前記側壁の端面に接合され、前記第1部材の開口部を密閉する第2部材と、
前記第2部材に着脱可能であり、かつ、光配線が接続されるコネクタ部材と、
前記第1部材の前記底部の内面と対向する前記第2部材の内面に実装された前記光素子と、
前記第2部材の前記内面に形成され、前記第1部材の前記側壁を横断して前記第1部材の内外に延びる配線と、
前記第1部材の前記側壁の外面に形成された電極と、を有し、
前記第2部材は、前記光素子から出射される光及び/又は前記光素子に入射される光の少なくとも一方を透過させ、
前記コネクタ部材は、前記第2部材を透過した光の進行方向を変換して接続されている光配線に入射させ、又は、接続されている光配線から出射された光の進行方向を変換して前記第2部材に入射させ、
前記電極の一方の端部は、前記第1部材の外に延びている前記配線の一方の端部と電気的に接続され、
前記電極の他方の端部は、当該光伝送モジュールが実装される実装面に形成されている配線又は電極に半田付けされており、更に
前記コネクタ部材は、前記第2部材の前記内面と反対側の前記第2部材の外面に搭載されており、
前記第2部材の前記外面と平行なX方向における前記第2部材と前記コネクタ部材との相対的位置関係を規定する第1係合手段と、
前記第2部材の前記外面と平行であり、かつ、前記X方向と直交するY方向における前記第2部材と前記コネクタ部材との相対的位置関係を規定する第2係合手段と、
前記第2部材の前記外面に対して垂直なZ方向における前記第2部材と前記コネクタ部材との相対的位置関係を規定する第3係合手段と、を有する、
光伝送モジュール。 - 請求項1に記載の光伝送モジュールであって、
前記第1係合手段及び前記第2係合手段のそれぞれは、前記第2部材の前記外面と該外面に対向する前記コネクタ部材の底面とに形成された凹凸により構成されている、
光伝送モジュール。 - 請求項2に記載の光伝送モジュールであって、
前記第1係合手段及び前記第2係合手段のそれぞれは、前記第2部材の前記外面に形成された溝と、前記コネクタ部材の前記底面に形成され、前記溝に嵌合する突起と、から構成されている、
光伝送モジュール。 - 請求項1乃至3に記載の光伝送モジュールであって、
前記第3係合手段は、前記コネクタ部材に一体成形され、前記第1部材または前記第2部材に係止可能及び係止解除可能な爪により構成されている、
光伝送モジュール。 - 請求項4に記載の光伝送モジュールであって、
前記第3係合手段を構成する前記爪は、係止される状態と係止が解除される状態とに弾性変形可能である、
光伝送モジュール。 - 請求項1乃至3に記載の光伝送モジュールであって、
前記第3係合手段は、前記第2部材と前記コネクタ部材とに跨る、前記コネクタ部材とは別体の固定具により構成される、
光伝送モジュール。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014107594A JP6245071B2 (ja) | 2014-05-23 | 2014-05-23 | 光伝送モジュール |
US14/705,372 US9389376B2 (en) | 2014-05-23 | 2015-05-06 | Optical transmission module |
CN201510245803.8A CN105093437B (zh) | 2014-05-23 | 2015-05-14 | 光传送模块 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014107594A JP6245071B2 (ja) | 2014-05-23 | 2014-05-23 | 光伝送モジュール |
Publications (2)
Publication Number | Publication Date |
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JP2015222803A JP2015222803A (ja) | 2015-12-10 |
JP6245071B2 true JP6245071B2 (ja) | 2017-12-13 |
Family
ID=54555921
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JP2014107594A Expired - Fee Related JP6245071B2 (ja) | 2014-05-23 | 2014-05-23 | 光伝送モジュール |
Country Status (3)
Country | Link |
---|---|
US (1) | US9389376B2 (ja) |
JP (1) | JP6245071B2 (ja) |
CN (1) | CN105093437B (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
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DE102016103123A1 (de) * | 2016-02-23 | 2017-08-24 | Vishay Semiconductor Gmbh | Optoelektronische Vorrichtung |
US10241264B2 (en) * | 2016-07-01 | 2019-03-26 | Advanced Semiconductor Engineering, Inc. | Semiconductor device packages |
EP3840543A1 (en) * | 2019-12-20 | 2021-06-23 | Knowledge Development for POF SL | Fiber optic connector |
CN111323878B (zh) * | 2020-04-01 | 2021-10-15 | 联合微电子中心有限责任公司 | 一种激光器芯片与硅基光电子芯片的耦合对准装置及方法 |
JP2022180123A (ja) * | 2021-05-24 | 2022-12-06 | 日亜化学工業株式会社 | 発光装置および発光装置の製造方法 |
Family Cites Families (17)
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US5168537A (en) * | 1991-06-28 | 1992-12-01 | Digital Equipment Corporation | Method and apparatus for coupling light between an optoelectronic device and a waveguide |
US5790730A (en) * | 1994-11-10 | 1998-08-04 | Kravitz; Stanley H. | Package for integrated optic circuit and method |
US7004644B1 (en) * | 1999-06-29 | 2006-02-28 | Finisar Corporation | Hermetic chip-scale package for photonic devices |
US6374004B1 (en) * | 1999-10-14 | 2002-04-16 | Digital Optics Corporation | Optical subassembly |
JP2001174671A (ja) * | 1999-12-16 | 2001-06-29 | Japan Aviation Electronics Industry Ltd | 光素子モジュール |
AU2001294934A1 (en) * | 2000-09-29 | 2002-04-08 | Cielo Communications, Inc. | High speed optical subassembly with ceramic carrier |
JP4218241B2 (ja) * | 2001-12-27 | 2009-02-04 | 三菱電機株式会社 | 光モジュール、および光送信もしくは光受信装置 |
JP2004246279A (ja) * | 2003-02-17 | 2004-09-02 | Seiko Epson Corp | 光モジュール及びその製造方法、光通信装置、光電気混載集積回路、回路基板、電子機器 |
WO2004097481A1 (ja) * | 2003-04-30 | 2004-11-11 | Fujikura Ltd. | 光トランシーバおよび光コネクタ |
US7144788B2 (en) * | 2004-02-19 | 2006-12-05 | Sumitomo Electric Industries, Ltd. | Method for manufacturing a transmitting optical sub-assembly with a thermo-electric cooler therein |
JP2005315902A (ja) * | 2004-04-26 | 2005-11-10 | Seiko Epson Corp | 光コネクタ |
JP4116017B2 (ja) * | 2005-05-25 | 2008-07-09 | 株式会社フジクラ | 光コネクタ |
JP2006023777A (ja) | 2005-09-15 | 2006-01-26 | Seiko Epson Corp | 光モジュール、光通信装置、光電気混載集積回路、回路基板、電子機器 |
JP4372805B2 (ja) * | 2007-05-10 | 2009-11-25 | シャープ株式会社 | 光電信号伝送装置、光電信号伝送システム、および、光電信号伝送システムを用いた電子機器 |
JP2009122197A (ja) * | 2007-11-12 | 2009-06-04 | Fujikura Ltd | 光コネクタの位置決め構造 |
JP5610156B2 (ja) * | 2011-01-31 | 2014-10-22 | 日立金属株式会社 | 光電変換モジュール及び光電変換モジュールの製造方法 |
JP2015222402A (ja) * | 2014-05-23 | 2015-12-10 | 日立金属株式会社 | 光伝送モジュール |
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2014
- 2014-05-23 JP JP2014107594A patent/JP6245071B2/ja not_active Expired - Fee Related
-
2015
- 2015-05-06 US US14/705,372 patent/US9389376B2/en active Active
- 2015-05-14 CN CN201510245803.8A patent/CN105093437B/zh not_active Expired - Fee Related
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US20150338586A1 (en) | 2015-11-26 |
US9389376B2 (en) | 2016-07-12 |
CN105093437B (zh) | 2018-08-28 |
CN105093437A (zh) | 2015-11-25 |
JP2015222803A (ja) | 2015-12-10 |
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