DK1142921T3 - Phosphorholdige epoxyharpikspræparater, flammehæmmende harpiksark eller bane under anvendelse af den phosphorholdige epoxyharpiks, harpiksbelagt metalfolie, prepreg og lamineret plade, flerlagsplade - Google Patents

Phosphorholdige epoxyharpikspræparater, flammehæmmende harpiksark eller bane under anvendelse af den phosphorholdige epoxyharpiks, harpiksbelagt metalfolie, prepreg og lamineret plade, flerlagsplade

Info

Publication number
DK1142921T3
DK1142921T3 DK00126572T DK00126572T DK1142921T3 DK 1142921 T3 DK1142921 T3 DK 1142921T3 DK 00126572 T DK00126572 T DK 00126572T DK 00126572 T DK00126572 T DK 00126572T DK 1142921 T3 DK1142921 T3 DK 1142921T3
Authority
DK
Denmark
Prior art keywords
epoxy resin
resin
phosphorous epoxy
phosphorus containing
hydrogen atom
Prior art date
Application number
DK00126572T
Other languages
Danish (da)
English (en)
Inventor
Takashi Sagara
Toshiharu Takata
Kiyoaki Ihara
Hidetaka Kakiuchi
Kazuo Ishihara
Chiaki Asano
Masao Gunji
Hiroshi Sato
Original Assignee
Matsushita Electric Works Ltd
Toto Kasei Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd, Toto Kasei Kk filed Critical Matsushita Electric Works Ltd
Application granted granted Critical
Publication of DK1142921T3 publication Critical patent/DK1142921T3/da

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/304—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing phosphorus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49894—Materials of the insulating layers or coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
    • Y10T428/24994—Fiber embedded in or on the surface of a polymeric matrix
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31522—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31529—Next to metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Laminated Bodies (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Fireproofing Substances (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
DK00126572T 2000-04-06 2000-12-12 Phosphorholdige epoxyharpikspræparater, flammehæmmende harpiksark eller bane under anvendelse af den phosphorholdige epoxyharpiks, harpiksbelagt metalfolie, prepreg og lamineret plade, flerlagsplade DK1142921T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000104284A JP4588834B2 (ja) 2000-04-06 2000-04-06 リン含有エポキシ樹脂組成物及び、該リン含有エポキシ樹脂を用いる難燃性の樹脂シート、樹脂付き金属箔、プリプレグ及び積層板、多層板

Publications (1)

Publication Number Publication Date
DK1142921T3 true DK1142921T3 (da) 2008-01-28

Family

ID=18617859

Family Applications (1)

Application Number Title Priority Date Filing Date
DK00126572T DK1142921T3 (da) 2000-04-06 2000-12-12 Phosphorholdige epoxyharpikspræparater, flammehæmmende harpiksark eller bane under anvendelse af den phosphorholdige epoxyharpiks, harpiksbelagt metalfolie, prepreg og lamineret plade, flerlagsplade

Country Status (10)

Country Link
US (2) US6524709B1 (de)
EP (1) EP1142921B1 (de)
JP (1) JP4588834B2 (de)
KR (1) KR100564814B1 (de)
CN (2) CN1240772C (de)
AT (1) ATE376565T1 (de)
DE (1) DE60036856T2 (de)
DK (1) DK1142921T3 (de)
HK (1) HK1040410A1 (de)
TW (1) TW555809B (de)

Families Citing this family (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002003702A (ja) * 2000-06-21 2002-01-09 Matsushita Electric Works Ltd エポキシ樹脂組成物、絶縁フィルム、樹脂付き金属箔及び多層プリント配線板
WO2002022704A1 (fr) * 2000-09-12 2002-03-21 Mitsui Chemicals, Inc. Resine epoxyde contenant du phosphore, composition a base de resine epoxyde, tres resistante a la chaleur et ignifugeante, et lamine
JP4783984B2 (ja) * 2001-02-15 2011-09-28 日立化成工業株式会社 樹脂組成物およびその用途ならびにそれらの製造方法
JP4837175B2 (ja) * 2001-02-23 2011-12-14 新日鐵化学株式会社 リン含有エポキシ樹脂組成物
JP2003281940A (ja) * 2002-03-25 2003-10-03 Hitachi Chem Co Ltd 絶縁樹脂組成物，銅箔付き絶縁材および銅張積層板
EP1513890A1 (de) * 2002-05-30 2005-03-16 Dow Global Technologies Inc. Halogenfreie flammwidrige thermoplastharzzusammensetzungen
US7141627B2 (en) * 2002-10-31 2006-11-28 Dainippon Ink And Chemicals, Inc. Epoxy resin composition
SG110189A1 (en) * 2003-09-26 2005-04-28 Japan Epoxy Resins Co Ltd Epoxy compound, preparation method thereof, and use thereof
TWI346111B (en) * 2004-02-09 2011-08-01 Nippon Kayaku Kk Photosensitive resin composition and products of cured product thereof
TWI285297B (en) * 2004-02-09 2007-08-11 Chi Mei Corp Light-sensitive resin composition for black matrix
CN100384932C (zh) * 2004-10-11 2008-04-30 广东生益科技股份有限公司 一种热固性树脂组合物以及使用它的预浸料、印刷电路用层压板
EP1814949B1 (de) * 2004-11-26 2009-11-04 LG Chem, Ltd. Nicht-halogene flammenhemmende epoxidharzzusammensetzung und prepreg sowie kupferkaschiertes laminat damit
KR100587483B1 (ko) * 2005-03-11 2006-06-09 국도화학 주식회사 난연성 고내열 에폭시수지 조성물
JP2006342217A (ja) * 2005-06-07 2006-12-21 Sanko Kk リン含有難燃性ビスフェノール型エポキシ樹脂の製造方法並びにリン含有難燃性ビスフェノール型エポキシ樹脂及びリン含有難燃性ビスフェノール型エポキシ樹脂組成物
EP2922099B1 (de) * 2005-08-12 2019-01-02 Cambrios Film Solutions Corporation Transparente leiter auf Nanodrahtbasis
JP4244975B2 (ja) * 2005-08-26 2009-03-25 パナソニック電工株式会社 プリプレグ用エポキシ樹脂組成物、プリプレグ、多層プリント配線板
CN101341182A (zh) * 2005-12-22 2009-01-07 陶氏环球技术公司 包含混合催化剂体系的可固化环氧树脂组合物以及由其制得的层压材料
JP2007291227A (ja) * 2006-04-25 2007-11-08 Toto Kasei Co Ltd 難燃性炭素繊維強化複合材料
JP5334373B2 (ja) * 2007-03-05 2013-11-06 新日鉄住金化学株式会社 新規なリン含有エポキシ樹脂、該エポキシ樹脂を必須成分とするエポキシ樹脂組成物及びその硬化物
TWI342322B (en) * 2007-03-28 2011-05-21 Grand Tek Advance Material Science Co Ltd Halogen-free flame retardant epoxy resin composition, prepreg, and copper clad laminate
TWI347330B (en) * 2007-04-23 2011-08-21 Ind Tech Res Inst Flame retardant crosslink agent and epoxy resin compositions free of halogen and phosphor
KR101571084B1 (ko) * 2007-05-18 2015-11-23 신닛테츠 수미킨 가가쿠 가부시키가이샤 신규 난연성 에폭시 수지와 그 에폭시 수지를 필수성분으로 하는 에폭시 수지조성물 및 그 경화물
KR100877342B1 (ko) * 2007-09-13 2009-01-07 삼성전기주식회사 인쇄회로기판용 난연성 수지 조성물, 이를 이용한 인쇄회로기판 및 그 제조방법
US20090258161A1 (en) * 2008-04-10 2009-10-15 Japp Robert M Circuitized substrate with P-aramid dielectric layers and method of making same
EP2346939A1 (de) * 2008-10-29 2011-07-27 Icl-ip America Inc. Phosphorhaltige flammwidrige epoxidharzzusammensetzung, prepreg und laminat davon
JP5399733B2 (ja) * 2009-02-16 2014-01-29 新日鉄住金化学株式会社 難燃性リン含有エポキシ樹脂組成物及びその硬化物
JP5608161B2 (ja) * 2009-03-26 2014-10-15 パナソニック株式会社 エポキシ樹脂組成物、プリプレグ、樹脂付き金属箔、樹脂シート、積層板、および多層板
JP5441477B2 (ja) * 2009-04-01 2014-03-12 新日鉄住金化学株式会社 難燃性リン含有エポキシ樹脂組成物及びその硬化物
EP2578613B8 (de) * 2010-05-31 2018-12-19 Hitachi Chemical Company, Ltd. Epoxidharzzusammensetzung und prepreg, geträgerter harzfilm, mit einer metallfolie kaschierte laminatplatte und mehrschichtige bestückte leiterplatte mit besagter zusammensetzung
JP5579008B2 (ja) * 2010-09-29 2014-08-27 新日鉄住金化学株式会社 リン含有エポキシ樹脂
TWI408143B (zh) * 2010-11-03 2013-09-11 Univ Nat Chunghsing 具有不對稱磷系雙酚結構之化合物、其環氧樹脂半固化物衍生物及其一鍋化製造方法
CN103370353B (zh) * 2011-02-16 2016-03-23 三菱丽阳株式会社 环氧树脂组合物、预浸料及纤维强化复合材料
CN108314774B (zh) 2012-06-15 2021-02-12 日铁化学材料株式会社 含磷的环氧树脂和以该环氧树脂作为必须成分的组合物、固化物
JP5786839B2 (ja) * 2012-12-05 2015-09-30 株式会社デンソー エポキシ樹脂組成物および接着構造体の製造方法
CN103059265A (zh) * 2013-01-20 2013-04-24 安徽善孚新材料科技有限公司 一种含萘环结构无卤阻燃环氧树脂及其制备方法
CN105358624B (zh) * 2013-07-04 2017-06-06 松下知识产权经营株式会社 树脂组合物、预浸料和层压板
TWI667276B (zh) 2014-05-29 2019-08-01 美商羅傑斯公司 具改良耐燃劑系統之電路物質及由其形成之物件
KR102539483B1 (ko) * 2015-01-29 2023-06-02 가부시끼가이샤 레조낙 에폭시 수지 조성물, 반경화 에폭시 수지 조성물, 수지 시트 및 프리프레그
CN104987664B (zh) * 2015-06-26 2018-02-09 四川东材科技集团股份有限公司 一种特高压直流输变电用绝缘层、模压结构件及其制备方法
US10233365B2 (en) 2015-11-25 2019-03-19 Rogers Corporation Bond ply materials and circuit assemblies formed therefrom
JP6793517B2 (ja) * 2016-10-17 2020-12-02 株式会社ダイセル シート状プリプレグ
JP2019178233A (ja) 2018-03-30 2019-10-17 日鉄ケミカル＆マテリアル株式会社 リン含有ビニル樹脂を含む低誘電難燃性組成物
JP2020122034A (ja) 2019-01-29 2020-08-13 日鉄ケミカル＆マテリアル株式会社 エポキシ樹脂組成物及びその硬化物
EP4026865B1 (de) 2019-09-06 2023-08-09 Panasonic Intellectual Property Management Co., Ltd. Harzzusammensetzung, prepreg, harzbeschichtete folie, harzbeschichtete metallfolie, metallbeschichtete laminierte platte und leiterplatte

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60126293A (ja) * 1983-12-09 1985-07-05 Sanko Kaihatsu Kagaku Kenkyusho:Kk 環状有機りん化合物及びその製造方法
JPH0784509B2 (ja) 1991-08-02 1995-09-13 北興化学工業株式会社 リン含有エポキシ樹脂の製造方法
JPH10330596A (ja) * 1997-05-30 1998-12-15 Sumitomo Bakelite Co Ltd 難燃性樹脂組成物およびこれを用いた半導体封止材料
JP3533973B2 (ja) * 1998-01-27 2004-06-07 東都化成株式会社 リン含有エポキシ樹脂組成物
TW528769B (en) * 1998-06-19 2003-04-21 Nat Science Council Flame retardant advanced epoxy resins and cured epoxy resins, and preparation thereof
JP2000080251A (ja) * 1998-09-03 2000-03-21 Matsushita Electric Works Ltd リン変性難燃性エポキシ樹脂組成物およびその製造方法およびそのリン変性難燃性エポキシ樹脂組成物を用いた成形品および積層体
JP3873248B2 (ja) * 1998-11-13 2007-01-24 東都化成株式会社 合成樹脂用難燃剤及び難燃性樹脂組成物
US6291627B1 (en) * 1999-03-03 2001-09-18 National Science Council Epoxy resin rendered flame retardant by reaction with 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide
JP4224912B2 (ja) * 1999-12-22 2009-02-18 パナソニック電工株式会社 リン含有エポキシ樹脂組成物、これを用いたプリプレグ、樹脂付き金属箔、接着シート、積層板及び多層板、塗工用樹脂ワニス及びこれを用いた多層板

Also Published As

Publication number Publication date
US6933050B2 (en) 2005-08-23
EP1142921B1 (de) 2007-10-24
KR20010096506A (ko) 2001-11-07
CN100432130C (zh) 2008-11-12
US6524709B1 (en) 2003-02-25
CN1737056A (zh) 2006-02-22
JP2001288247A (ja) 2001-10-16
KR100564814B1 (ko) 2006-03-27
TW555809B (en) 2003-10-01
DE60036856T2 (de) 2008-07-31
ATE376565T1 (de) 2007-11-15
HK1040410A1 (en) 2002-06-07
DE60036856D1 (de) 2007-12-06
CN1316463A (zh) 2001-10-10
CN1240772C (zh) 2006-02-08
US20030162935A1 (en) 2003-08-28
JP4588834B2 (ja) 2010-12-01
EP1142921A1 (de) 2001-10-10

Similar Documents

Publication Publication Date Title
DK1142921T3 (da) Phosphorholdige epoxyharpikspræparater, flammehæmmende harpiksark eller bane under anvendelse af den phosphorholdige epoxyharpiks, harpiksbelagt metalfolie, prepreg og lamineret plade, flerlagsplade
EP2116560A4 (de) Polyester, zusammensetzung davon und folie daraus
TW200611927A (en) Prepreg, method for producing the same, laminated sheet and printed circuit board
DE60118776D1 (de) Polymerisierbare, flüssigkristalline dioxetane, deren herstellung und verwendung
KR970705594A (ko) 프리프레그 및 복합 재료용 에폭시수지 혼합물(epoxy resin mixtures for prepregs and composites)
ATE536392T1 (de) Polymerzusammensetzung mit metallalkoxidkondensationsprodukt, organischer silanverbindung und borverbindung
KR900009935A (ko) 액정 조성물
DE50113704D1 (de) Alkoxysilylgruppenhaltige bindemittel und bindemittelzusammensetzungen, verfahren zu deren herstellung und deren verwendung
EP1826196A3 (de) Vinylether-Verbindungen
DK1114076T3 (da) Acceleratorer til hærdbare systemer
IL203744A (en) Amino phenyl acid compound, preparations containing it and its use
KR890013121A (ko) 복합 물질용 에폭시 수지 조성물
WO2008123238A1 (ja) 樹脂組成物
MY136400A (en) Resin composition, and use and method for preparing the same
DE60228990D1 (de) Bicyclische verbindung
DE60336390D1 (en) Polyacetalharzzusammensetzung
DE69719465T2 (de) Alkylenverbrückte Alkyl-Phosphonate
KR890011949A (ko) 에폭시 수지 조성물 및 이를 사용하는 복합재료용 프리프레그(prepreg)
KR950008523A (ko) 에폭시 수지 재료용 인 함유 방염 가공제
DE60204844D1 (de) Epoxyharzzusammensetzung zur einkapselung von halbleitern
DE69427119D1 (de) Epoxydharze auf der basis von substiuiertem resorcinol
ITMI913399A1 (it) Copoliestere lineare contenente fosforo, procedimento di preparazione e uso quale addittivo antifiamma
KR960705793A (ko) 에테르화된 알킬 또는 아릴카바밀메틸화된 아미노트리아진 및 이를 함유하는 경화성 조성물(etherified alkyl or arylcarbamylmethylated aminotri-azines and curable compositions containing the same)
DE60220446D1 (de) Harzzusammensetzung
KR910004639A (ko) 방염성 인 화합물 및 이를 함유하는 조성물과 그의 용도