DE60204844D1 - Epoxyharzzusammensetzung zur einkapselung von halbleitern - Google Patents
Epoxyharzzusammensetzung zur einkapselung von halbleiternInfo
- Publication number
- DE60204844D1 DE60204844D1 DE60204844T DE60204844T DE60204844D1 DE 60204844 D1 DE60204844 D1 DE 60204844D1 DE 60204844 T DE60204844 T DE 60204844T DE 60204844 T DE60204844 T DE 60204844T DE 60204844 D1 DE60204844 D1 DE 60204844D1
- Authority
- DE
- Germany
- Prior art keywords
- epoxy resin
- group
- resin composition
- general formula
- semiconductors
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000003822 epoxy resin Substances 0.000 title abstract 5
- 229920000647 polyepoxide Polymers 0.000 title abstract 5
- 239000000203 mixture Substances 0.000 title abstract 3
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 238000004806 packaging method and process Methods 0.000 title 1
- -1 thiodiphenol compound Chemical class 0.000 abstract 3
- 125000003545 alkoxy group Chemical group 0.000 abstract 2
- 125000000217 alkyl group Chemical group 0.000 abstract 2
- 125000003710 aryl alkyl group Chemical group 0.000 abstract 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 abstract 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract 1
- 238000005538 encapsulation Methods 0.000 abstract 1
- 229910052739 hydrogen Inorganic materials 0.000 abstract 1
- 239000001257 hydrogen Substances 0.000 abstract 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 abstract 1
- 239000011256 inorganic filler Substances 0.000 abstract 1
- 229910003475 inorganic filler Inorganic materials 0.000 abstract 1
- 239000004848 polyfunctional curative Substances 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001011383A JP2002212268A (ja) | 2001-01-19 | 2001-01-19 | 半導体封止用エポキシ樹脂組成物 |
| JP2001011383 | 2001-01-19 | ||
| PCT/NL2002/000008 WO2002057333A2 (en) | 2001-01-19 | 2002-01-08 | Epoxy resin composition for semiconductor encapsulation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE60204844D1 true DE60204844D1 (de) | 2005-08-04 |
| DE60204844T2 DE60204844T2 (de) | 2006-05-11 |
Family
ID=18878529
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE60204844T Expired - Fee Related DE60204844T2 (de) | 2001-01-19 | 2002-01-08 | Epoxyharzzusammensetzung zur einkapselung von halbleitern |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20040048971A1 (de) |
| EP (1) | EP1352008B1 (de) |
| JP (1) | JP2002212268A (de) |
| KR (1) | KR20030077576A (de) |
| CN (1) | CN1203104C (de) |
| AT (1) | ATE298771T1 (de) |
| DE (1) | DE60204844T2 (de) |
| WO (1) | WO2002057333A2 (de) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI397540B (zh) * | 2004-12-21 | 2013-06-01 | Nippon Kayaku Kk | 環氧樹脂，環氧樹脂組成物及其硬化物 |
| JP2007162001A (ja) * | 2005-11-21 | 2007-06-28 | Shin Etsu Chem Co Ltd | 液状エポキシ樹脂組成物 |
| JP5062714B2 (ja) * | 2006-01-19 | 2012-10-31 | 日本化薬株式会社 | 活性エネルギー線硬化型樹脂組成物、及びその用途 |
| KR101386027B1 (ko) * | 2006-06-16 | 2014-04-24 | 훈츠만 어드밴스트 머티리얼스(스위처랜드) 게엠베하 | 코팅 시스템 |
| CN102439088A (zh) * | 2009-02-12 | 2012-05-02 | 吉坤日矿日石能源株式会社 | 苯并*嗪树脂组合物 |
| KR101326960B1 (ko) * | 2011-05-20 | 2013-11-13 | 엘지이노텍 주식회사 | 에폭시 수지 조성물 및 이를 이용한 방열회로기판 |
| KR101326934B1 (ko) * | 2011-08-31 | 2013-11-11 | 엘지이노텍 주식회사 | 에폭시 수지 조성물 및 이를 이용한 방열회로기판 |
| DE102012200273A1 (de) * | 2012-01-11 | 2013-07-11 | Robert Bosch Gmbh | Elektronisches Bauteil mit korrosionsgeschützter Bondverbindung und Verfahren zur Herstellung des Bauteils |
| CN102633990A (zh) * | 2012-04-05 | 2012-08-15 | 广东生益科技股份有限公司 | 环氧树脂组合物及使用其制作的半固化片与覆铜箔层压板 |
| MY181374A (en) | 2014-12-04 | 2020-12-21 | Mitsubishi Chem Corp | Tetramethylbiphenol type epoxy resin, epoxy resin composition, cured product, and semiconductor sealing material |
| TWI717446B (zh) * | 2016-01-07 | 2021-02-01 | 日商積水化學工業股份有限公司 | 液晶顯示元件用密封劑、上下導通材料及液晶顯示元件 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0539439A (ja) * | 1991-08-05 | 1993-02-19 | Nippon Kayaku Co Ltd | エポキシ樹脂粉体塗料組成物 |
| DE69307442T2 (de) * | 1992-09-21 | 1997-08-21 | Sumitomo Bakelite Co | Epoxidharzzusammensetzung auf Basis des Diglycidylethers von Biphenyldiol |
| JP3214739B2 (ja) * | 1992-11-13 | 2001-10-02 | 三井化学株式会社 | エポキシ樹脂組成物 |
-
2001
- 2001-01-19 JP JP2001011383A patent/JP2002212268A/ja active Pending
-
2002
- 2002-01-08 EP EP02710526A patent/EP1352008B1/de not_active Expired - Lifetime
- 2002-01-08 CN CNB028038770A patent/CN1203104C/zh not_active Expired - Fee Related
- 2002-01-08 DE DE60204844T patent/DE60204844T2/de not_active Expired - Fee Related
- 2002-01-08 AT AT02710526T patent/ATE298771T1/de not_active IP Right Cessation
- 2002-01-08 US US10/250,605 patent/US20040048971A1/en not_active Abandoned
- 2002-01-08 WO PCT/NL2002/000008 patent/WO2002057333A2/en active IP Right Grant
- 2002-01-08 KR KR10-2003-7009423A patent/KR20030077576A/ko not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| CN1487963A (zh) | 2004-04-07 |
| JP2002212268A (ja) | 2002-07-31 |
| WO2002057333A2 (en) | 2002-07-25 |
| WO2002057333A3 (en) | 2002-10-17 |
| EP1352008B1 (de) | 2005-06-29 |
| CN1203104C (zh) | 2005-05-25 |
| EP1352008A2 (de) | 2003-10-15 |
| US20040048971A1 (en) | 2004-03-11 |
| DE60204844T2 (de) | 2006-05-11 |
| ATE298771T1 (de) | 2005-07-15 |
| KR20030077576A (ko) | 2003-10-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| MY143183A (en) | Composition of epoxy resin, polyphenolic compound and trisubstituted phosphonionphenolate salt | |
| TW200609207A (en) | Novel phenol compound and novel epoxy resin derivable from such phenol compound | |
| DE60204844D1 (de) | Epoxyharzzusammensetzung zur einkapselung von halbleitern | |
| TWI265179B (en) | Polyamide resin composition, reflecting plate and reflecting plate for light-emitting diode element therefrom | |
| ATE376565T1 (de) | Phosphor enthaltende epoxidharzzusammensetzung, verbundfolie die diese enthält, mehrschichtwerkstoff aus metall, prepreg und laminierte platte, mehrschichtplatte | |
| TW200626660A (en) | Epoxy resin composition and semiconductor device | |
| WO2009041389A1 (ja) | エポキシ樹脂組成物、その硬化物及び発光ダイオード | |
| ATE107676T1 (de) | Epoxidharz-formmassen. | |
| PT787348E (pt) | Composicao de moldagem de resina epoxica | |
| MY134219A (en) | Resin composition for encapsulating semiconductor chip and semiconductor device therewith | |
| MY144740A (en) | Epoxy resin composition and semiconductor device | |
| ATE443731T1 (de) | Fluorharzhärtungssystem | |
| KR970700232A (ko) | 광반도체소자 밀봉용 에폭시수지 조성물 | |
| KR20110095216A (ko) | 광반도체 소자 밀봉용 열경화성 수지 조성물 및 그의 경화물, 및 그를 사용해 얻은 광반도체 장치 | |
| TW200513508A (en) | Epoxy compound, preparation method thereof, and use thereof | |
| EP1548043A4 (de) | Epoxidharzzusammensetzung zur versiegelung eines optischen halbleiters | |
| WO2008123238A1 (ja) | 樹脂組成物 | |
| ATE340207T1 (de) | Vergussmasse mit hohem tg | |
| TW200500412A (en) | Resin composition for encapsulating semiconductor chip and semiconductor device therewith | |
| TW201233724A (en) | Resin composition | |
| TW200420700A (en) | Granular epoxy resin, production method thereof, and granular epoxy resin package | |
| WO2002081559A1 (fr) | Absorbant d'ultraviolet pour resine synthetique et composition de resine synthetique le contenant | |
| WO2002057361A3 (en) | Curing agent for epoxy resins and epoxy resin composition | |
| TW200512252A (en) | Epoxy resin composition and manufacturing method of heat resisting laminated sheet | |
| JP2017095548A (ja) | 光半導体素子封止用熱硬化性エポキシ樹脂組成物及びそれを用いた光半導体装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |