WO2008123238A1 - 樹脂組成物 - Google Patents

樹脂組成物 Download PDF

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Publication number
WO2008123238A1
WO2008123238A1 PCT/JP2008/055554 JP2008055554W WO2008123238A1 WO 2008123238 A1 WO2008123238 A1 WO 2008123238A1 JP 2008055554 W JP2008055554 W JP 2008055554W WO 2008123238 A1 WO2008123238 A1 WO 2008123238A1
Authority
WO
WIPO (PCT)
Prior art keywords
formula
resin composition
hydrogen atom
carbon atoms
alkyl group
Prior art date
Application number
PCT/JP2008/055554
Other languages
English (en)
French (fr)
Inventor
Shinya Tanaka
Yoshitaka Takezawa
Original Assignee
Sumitomo Chemical Company, Limited
Hitachi, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Chemical Company, Limited, Hitachi, Ltd. filed Critical Sumitomo Chemical Company, Limited
Priority to EP08722764A priority Critical patent/EP2133380A1/en
Priority to CN200880017410A priority patent/CN101720336A/zh
Priority to US12/450,431 priority patent/US20100160555A1/en
Publication of WO2008123238A1 publication Critical patent/WO2008123238A1/ja

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/226—Mixtures of di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5033—Amines aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O

Abstract

　式（１） （式中、Ａｒ１、Ａｒ２およびＡｒ３はそれぞれ同一または相異なって、下記式（ａ）で示されるいずれかの二価基を表わす。ここで、Ｒは水素原子または炭素数１～８のアルキル基を表わす。） で示されるエポキシ化合物と、 式（２） （式中、Ｒ5は水素原子または炭素数１～８のアルキル基を表わし、Ｑ２は単結合または炭素数１～８の直鎖状アルキレン基を表わす。） で示されるエポキシ化合物とを含むことを特徴とする樹脂組成物。
PCT/JP2008/055554 2007-03-26 2008-03-25 樹脂組成物 WO2008123238A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP08722764A EP2133380A1 (en) 2007-03-26 2008-03-25 Resin composition
CN200880017410A CN101720336A (zh) 2007-03-26 2008-03-25 树脂组合物
US12/450,431 US20100160555A1 (en) 2007-03-26 2008-03-25 Resin composition

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007078666A JP2008239679A (ja) 2007-03-26 2007-03-26 エポキシ樹脂組成物
JP2007-078666 2007-03-26

Publications (1)

Publication Number Publication Date
WO2008123238A1 true WO2008123238A1 (ja) 2008-10-16

Family

ID=39830731

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/055554 WO2008123238A1 (ja) 2007-03-26 2008-03-25 樹脂組成物

Country Status (7)

Country Link
US (1) US20100160555A1 (ja)
EP (1) EP2133380A1 (ja)
JP (1) JP2008239679A (ja)
KR (1) KR20090129487A (ja)
CN (1) CN101720336A (ja)
TW (1) TW200844159A (ja)
WO (1) WO2008123238A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018168556A1 (ja) * 2017-03-15 2018-09-20 日立化成株式会社 エポキシ樹脂、エポキシ樹脂組成物、エポキシ樹脂硬化物及び複合材料

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JP5020125B2 (ja) * 2008-03-10 2012-09-05 新神戸電機株式会社 積層板の製造法
JP5750861B2 (ja) * 2009-12-17 2015-07-22 Jnc株式会社 オキシラニル基を有する重合性液晶化合物、重合性液晶組成物および重合体
EP2444450A1 (de) 2010-10-19 2012-04-25 Hinterwaldner Consulting & Partner (Gbr) Zusammensetzungen zur Herstellung abhäsiver Beschichtungen
US9876581B2 (en) * 2016-02-10 2018-01-23 Inphi Corporation Circuit for multi-path interference mitigation in an optical communication system
WO2017209210A1 (ja) * 2016-06-02 2017-12-07 日立化成株式会社 エポキシ樹脂組成物、ｂステージシート、硬化エポキシ樹脂組成物、樹脂シート、樹脂付金属箔、及び金属基板
JP2018030929A (ja) * 2016-08-23 2018-03-01 日立化成株式会社 エポキシ樹脂組成物、樹脂シート、ｂステージシート、硬化物、ｃステージシート、樹脂付金属箔、及び金属基板
CN112041380A (zh) * 2018-04-27 2020-12-04 东丽株式会社 预浸料坯以及碳纤维增强复合材料
WO2023128018A1 (ko) * 2021-12-30 2023-07-06 예영준 선박구조체 제조를 위한 카르복실기가 포함된 에폭시 발포 조성물 및 이로부터 형성된 선박구조체

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JPH05140138A (ja) * 1991-11-26 1993-06-08 Nippon Kayaku Co Ltd エポキシ樹脂、樹脂組成物及び硬化物
US5811504A (en) 1995-08-03 1998-09-22 Cornell Research Foundation, Inc. Liquid crystalline epoxy monomer and liquid crystalline epoxy resin containing mesogen twins
WO2005061473A1 (ja) * 2003-12-24 2005-07-07 Sumitomo Chemical Company, Limited エポキシ化合物および該エポキシ化合物を硬化せしめてなるエポキシ樹脂硬化物
JP2006274125A (ja) * 2005-03-30 2006-10-12 Sumitomo Chemical Co Ltd エポキシ化合物およびエポキシ樹脂硬化物
JP2007078666A (ja) 2005-09-16 2007-03-29 National Institute Of Information & Communication Technology 電磁波形状検出方法及び装置
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018168556A1 (ja) * 2017-03-15 2018-09-20 日立化成株式会社 エポキシ樹脂、エポキシ樹脂組成物、エポキシ樹脂硬化物及び複合材料
JPWO2018168556A1 (ja) * 2017-03-15 2020-01-16 日立化成株式会社 エポキシ樹脂、エポキシ樹脂組成物、エポキシ樹脂硬化物及び複合材料
US11466119B2 (en) 2017-03-15 2022-10-11 Showa Denko Materials Co., Ltd. Epoxy resin, epoxy resin composition, epoxy resin cured product, and composite material

Also Published As

Publication number Publication date
JP2008239679A (ja) 2008-10-09
KR20090129487A (ko) 2009-12-16
CN101720336A (zh) 2010-06-02
US20100160555A1 (en) 2010-06-24
TW200844159A (en) 2008-11-16
EP2133380A1 (en) 2009-12-16

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