TW200619240A - Star polymer, acid-decomposable resin composition, resist composition, and di(meth) acrylate compound - Google Patents

Star polymer, acid-decomposable resin composition, resist composition, and di(meth) acrylate compound

Info

Publication number
TW200619240A
TW200619240A TW094127407A TW94127407A TW200619240A TW 200619240 A TW200619240 A TW 200619240A TW 094127407 A TW094127407 A TW 094127407A TW 94127407 A TW94127407 A TW 94127407A TW 200619240 A TW200619240 A TW 200619240A
Authority
TW
Taiwan
Prior art keywords
star polymer
meth
acid
acrylate compound
decomposable resin
Prior art date
Application number
TW094127407A
Other languages
Chinese (zh)
Inventor
Shinji Marumo
Original Assignee
Nippon Soda Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Soda Co filed Critical Nippon Soda Co
Publication of TW200619240A publication Critical patent/TW200619240A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
    • C07C69/52—Esters of acyclic unsaturated carboxylic acids having the esterified carboxyl group bound to an acyclic carbon atom
    • C07C69/533—Monocarboxylic acid esters having only one carbon-to-carbon double bond
    • C07C69/54—Acrylic acid esters; Methacrylic acid esters

Abstract

A star polymer comprises a core derived from a compound represented by the following general formula (I): (in formula (I), R1 and R2 each independently represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, A represents divalent or polyvalent organic bond group excluding an acetal structure, B represents divalent or polyvalent organic bond group including an acetal structure of ketal structure, and n1 to n4 each independently represents an integer of 1 or more), and the polymer exhibits a property such that it is easily cleaved by acids, and has an acetal structure that imparts thermal stability, and allows easy mass production of the polymer.
TW094127407A 2004-08-13 2005-08-12 Star polymer, acid-decomposable resin composition, resist composition, and di(meth) acrylate compound TW200619240A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004235905 2004-08-13

Publications (1)

Publication Number Publication Date
TW200619240A true TW200619240A (en) 2006-06-16

Family

ID=35839408

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094127407A TW200619240A (en) 2004-08-13 2005-08-12 Star polymer, acid-decomposable resin composition, resist composition, and di(meth) acrylate compound

Country Status (3)

Country Link
JP (1) JP4421614B2 (en)
TW (1) TW200619240A (en)
WO (1) WO2006016648A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106893053A (en) * 2015-12-18 2017-06-27 陶氏环球技术有限责任公司 The unstable hyper branched copolymer of acid and associated photo-corrosion-resisting agent composition and the method for forming electronic device

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4851140B2 (en) * 2005-08-09 2012-01-11 三菱レイヨン株式会社 (Meth) acrylic acid ester, polymer, resist composition, and method for producing substrate on which pattern is formed
JP2007316508A (en) 2006-05-29 2007-12-06 Tokyo Ohka Kogyo Co Ltd Degradable composition and method of use thereof
EP2186838B1 (en) * 2007-08-31 2014-08-27 Nippon Soda Co., Ltd. Method for producing star polymer
JP5553488B2 (en) 2008-06-06 2014-07-16 株式会社ダイセル Lithographic polymer and process for producing the same
JP5663153B2 (en) * 2008-08-27 2015-02-04 東京応化工業株式会社 Positive resist composition and resist pattern forming method
JP2010250278A (en) * 2009-03-26 2010-11-04 Tokyo Ohka Kogyo Co Ltd Positive resist composition, method of forming resist pattern
JP5645495B2 (en) * 2010-06-17 2014-12-24 東京応化工業株式会社 Positive resist composition and resist pattern forming method
CN112125998A (en) * 2020-09-30 2020-12-25 中国科学院宁波材料技术与工程研究所 Acetal type dynamic covalent network material and preparation method thereof

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4746714A (en) * 1986-06-17 1988-05-24 E. I. Du Pont De Nemours And Company Stabilized acrylic resin
ZA876445B (en) * 1986-08-29 1989-04-26 Du Pont Hybrid acrylic star polymers and preparation
DE69312700T2 (en) * 1992-04-14 1998-02-19 Cornell Res Foundation Inc MACROMOLECULES BASED ON DENDRITIC POLYMERS AND METHOD FOR THE PRODUCTION THEREOF
JP4183293B2 (en) * 1997-07-09 2008-11-19 日本曹達株式会社 (Meth) acrylic acid ester polymer and production method thereof
JP2000063327A (en) * 1998-08-17 2000-02-29 Toyo Ink Mfg Co Ltd Production of reactive hemiacetalate, reactive hemiacetalate produced thereby and its hardened material
JP2002338535A (en) * 2001-05-17 2002-11-27 Nitto Denko Corp Polyhydroxy dendrimer and method for producing the same
JP4052904B2 (en) * 2002-09-04 2008-02-27 株式会社日本触媒 Aqueous composition containing (meth) acrylate compound
US7736834B2 (en) * 2003-08-28 2010-06-15 Hitachi Chemical Company, Ltd. Photosensitive resin composition, photosensitive element employing it, resist pattern forming method, process for manufacturing printed circuit board and method for removing photocured product

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106893053A (en) * 2015-12-18 2017-06-27 陶氏环球技术有限责任公司 The unstable hyper branched copolymer of acid and associated photo-corrosion-resisting agent composition and the method for forming electronic device
CN106893053B (en) * 2015-12-18 2019-02-22 陶氏环球技术有限责任公司 Sour unstable hyper branched copolymer and associated photo-corrosion-resisting agent composition and the method for forming electronic device

Also Published As

Publication number Publication date
JP4421614B2 (en) 2010-02-24
JPWO2006016648A1 (en) 2008-05-01
WO2006016648A1 (en) 2006-02-16

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