TW200636388A - Photosensitive resin composition for forming lens - Google Patents
Photosensitive resin composition for forming lensInfo
- Publication number
- TW200636388A TW200636388A TW095105814A TW95105814A TW200636388A TW 200636388 A TW200636388 A TW 200636388A TW 095105814 A TW095105814 A TW 095105814A TW 95105814 A TW95105814 A TW 95105814A TW 200636388 A TW200636388 A TW 200636388A
- Authority
- TW
- Taiwan
- Prior art keywords
- resin composition
- photosensitive resin
- forming lens
- resin component
- alkali
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
Abstract
Abstract: A photosensitive resin composition for forming lens having excellent heat resistance is provided. The photosensitive resin composition contains (A) an alkali-soluble resin component and (B) a photosensitizer, in which (A) the alkali-soluble resin component contains a resin component having a structure unit (a1) expressed by the following general formula (a1): , in the general formula (a1), R0 represents a hydrogen atom or a methyl group, R1 represents a single bond or an alkylene group having 1 to 5 carbon atoms, R2 represents an alkyl group having 1 to 5 carbon atoms, "a" represents an integer of 1 to 5, "b" represents 0 or an integer of 1 to 4, and "a+b" is not higher than 5. It should be noted that in the case in which two or more of R2 exist, each of which may differ from each other and may be the same.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005068909A JP2006251464A (en) | 2005-03-11 | 2005-03-11 | Photosensitive resin composition for lens formation |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200636388A true TW200636388A (en) | 2006-10-16 |
TWI315448B TWI315448B (en) | 2009-10-01 |
Family
ID=37092019
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095105814A TWI315448B (en) | 2005-03-11 | 2006-02-21 | Photosensitive resin composition for forming lens |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2006251464A (en) |
KR (1) | KR100740823B1 (en) |
TW (1) | TWI315448B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI825195B (en) * | 2018-12-25 | 2023-12-11 | 日商東京應化工業股份有限公司 | Resin composition and method for manufacturing substrate with microlens pattern |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20090005976A (en) | 2007-07-09 | 2009-01-14 | 도쿄 오카 고교 가부시키가이샤 | Photosensitive resin composition and microlens formed with use thereof |
US9823391B2 (en) | 2012-10-23 | 2017-11-21 | Nissan Chemical Industries, Ltd. | Non-photosensitive resin composition |
JP6792207B2 (en) | 2015-12-21 | 2020-11-25 | 日産化学株式会社 | Resin composition |
WO2018021049A1 (en) | 2016-07-28 | 2018-02-01 | 日産化学工業株式会社 | Resin composition |
KR102413261B1 (en) * | 2018-12-21 | 2022-06-27 | 주식회사 엘지화학 | Photosensitive resin composition, photoresist, color filter and display device |
JP7311846B2 (en) | 2019-11-06 | 2023-07-20 | 日産化学株式会社 | Non-photosensitive resin composition |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3092158B2 (en) * | 1989-12-01 | 2000-09-25 | 東ソー株式会社 | Positive photosensitive material for lens formation |
DE4002397A1 (en) * | 1990-01-27 | 1991-08-01 | Hoechst Ag | Positive photosensitive mixt. contg. hydroxy-aralkyl acrylate polymer - and sensitiser, useful in printing plate mfr. and as photoresist |
DE4006856A1 (en) * | 1990-03-05 | 1991-09-12 | Hoechst Ag | HAZARDOUS POSITIVE WORKING LIGHT-SENSITIVE RECORDING MATERIAL AND METHOD FOR PRODUCING A COLOR TEST PICTURE USING THIS MATERIAL |
JP3003808B2 (en) * | 1991-03-14 | 2000-01-31 | 東京応化工業株式会社 | Micro lens and manufacturing method thereof |
JP3082179B2 (en) * | 1992-07-03 | 2000-08-28 | ジェイエスアール株式会社 | Photosensitive resin composition for lenses |
JP3114166B2 (en) * | 1992-10-22 | 2000-12-04 | ジェイエスアール株式会社 | Radiation-sensitive resin composition for microlenses |
JPH07168359A (en) * | 1993-12-15 | 1995-07-04 | Tosoh Corp | Photosensitive material for microlens |
DE4414896A1 (en) * | 1994-04-28 | 1995-11-02 | Hoechst Ag | Positive working radiation sensitive mixture |
JP3783512B2 (en) * | 2000-02-29 | 2006-06-07 | Jsr株式会社 | Radiation-sensitive resin composition and interlayer insulating film formed therefrom |
CA2453237A1 (en) * | 2001-07-26 | 2003-02-06 | Ciba Specialty Chemicals Holding Inc. | Photosensitive resin composition |
-
2005
- 2005-03-11 JP JP2005068909A patent/JP2006251464A/en active Pending
-
2006
- 2006-02-21 TW TW095105814A patent/TWI315448B/en active
- 2006-03-07 KR KR1020060021277A patent/KR100740823B1/en active IP Right Grant
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI825195B (en) * | 2018-12-25 | 2023-12-11 | 日商東京應化工業股份有限公司 | Resin composition and method for manufacturing substrate with microlens pattern |
Also Published As
Publication number | Publication date |
---|---|
KR20060097616A (en) | 2006-09-14 |
KR100740823B1 (en) | 2007-07-19 |
TWI315448B (en) | 2009-10-01 |
JP2006251464A (en) | 2006-09-21 |
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