ATE298771T1 - Epoxyharzzusammensetzung zur einkapselung von halbleitern - Google Patents
Epoxyharzzusammensetzung zur einkapselung von halbleiternInfo
- Publication number
- ATE298771T1 ATE298771T1 AT02710526T AT02710526T ATE298771T1 AT E298771 T1 ATE298771 T1 AT E298771T1 AT 02710526 T AT02710526 T AT 02710526T AT 02710526 T AT02710526 T AT 02710526T AT E298771 T1 ATE298771 T1 AT E298771T1
- Authority
- AT
- Austria
- Prior art keywords
- epoxy resin
- group
- resin composition
- general formula
- compound
- Prior art date
Links
- 239000003822 epoxy resin Substances 0.000 title abstract 5
- 229920000647 polyepoxide Polymers 0.000 title abstract 5
- 239000000203 mixture Substances 0.000 title abstract 3
- 239000004065 semiconductor Substances 0.000 title abstract 2
- -1 thiodiphenol compound Chemical class 0.000 abstract 3
- 125000003545 alkoxy group Chemical group 0.000 abstract 2
- 125000000217 alkyl group Chemical group 0.000 abstract 2
- 125000003710 aryl alkyl group Chemical group 0.000 abstract 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 abstract 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract 1
- 238000005538 encapsulation Methods 0.000 abstract 1
- 229910052739 hydrogen Inorganic materials 0.000 abstract 1
- 239000001257 hydrogen Substances 0.000 abstract 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 abstract 1
- 239000011256 inorganic filler Substances 0.000 abstract 1
- 229910003475 inorganic filler Inorganic materials 0.000 abstract 1
- 239000004848 polyfunctional curative Substances 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001011383A JP2002212268A (ja) | 2001-01-19 | 2001-01-19 | 半導体封止用エポキシ樹脂組成物 |
| PCT/NL2002/000008 WO2002057333A2 (en) | 2001-01-19 | 2002-01-08 | Epoxy resin composition for semiconductor encapsulation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE298771T1 true ATE298771T1 (de) | 2005-07-15 |
Family
ID=18878529
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT02710526T ATE298771T1 (de) | 2001-01-19 | 2002-01-08 | Epoxyharzzusammensetzung zur einkapselung von halbleitern |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20040048971A1 (de) |
| EP (1) | EP1352008B1 (de) |
| JP (1) | JP2002212268A (de) |
| KR (1) | KR20030077576A (de) |
| CN (1) | CN1203104C (de) |
| AT (1) | ATE298771T1 (de) |
| DE (1) | DE60204844T2 (de) |
| WO (1) | WO2002057333A2 (de) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101084252B (zh) * | 2004-12-21 | 2012-06-13 | 日本化药株式会社 | 环氧树脂、环氧树脂组合物及其固化物 |
| JP2007162001A (ja) * | 2005-11-21 | 2007-06-28 | Shin Etsu Chem Co Ltd | 液状エポキシ樹脂組成物 |
| JP5062714B2 (ja) * | 2006-01-19 | 2012-10-31 | 日本化薬株式会社 | 活性エネルギー線硬化型樹脂組成物、及びその用途 |
| ATE528333T1 (de) | 2006-06-16 | 2011-10-15 | Huntsman Adv Mat Switzerland | Beschichtungssystem |
| EP2397521B1 (de) * | 2009-02-12 | 2017-01-25 | JX Nippon Oil & Energy Corporation | Benzoxazinharzzusammensetzung |
| KR101326960B1 (ko) * | 2011-05-20 | 2013-11-13 | 엘지이노텍 주식회사 | 에폭시 수지 조성물 및 이를 이용한 방열회로기판 |
| KR101326934B1 (ko) * | 2011-08-31 | 2013-11-11 | 엘지이노텍 주식회사 | 에폭시 수지 조성물 및 이를 이용한 방열회로기판 |
| DE102012200273A1 (de) * | 2012-01-11 | 2013-07-11 | Robert Bosch Gmbh | Elektronisches Bauteil mit korrosionsgeschützter Bondverbindung und Verfahren zur Herstellung des Bauteils |
| CN102633990A (zh) * | 2012-04-05 | 2012-08-15 | 广东生益科技股份有限公司 | 环氧树脂组合物及使用其制作的半固化片与覆铜箔层压板 |
| SG11201704514XA (en) * | 2014-12-04 | 2017-07-28 | Mitsubishi Chem Corp | Tetramethylbiphenol type epoxy resin, epoxy resin composition, cured product and semiconductor sealing material |
| TWI717446B (zh) * | 2016-01-07 | 2021-02-01 | 日商積水化學工業股份有限公司 | 液晶顯示元件用密封劑、上下導通材料及液晶顯示元件 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0539439A (ja) * | 1991-08-05 | 1993-02-19 | Nippon Kayaku Co Ltd | エポキシ樹脂粉体塗料組成物 |
| SG87725A1 (en) * | 1992-09-21 | 2002-04-16 | Sumitomo Bakelite Co | Epoxy resin composition |
| JP3214739B2 (ja) * | 1992-11-13 | 2001-10-02 | 三井化学株式会社 | エポキシ樹脂組成物 |
-
2001
- 2001-01-19 JP JP2001011383A patent/JP2002212268A/ja active Pending
-
2002
- 2002-01-08 CN CNB028038770A patent/CN1203104C/zh not_active Expired - Fee Related
- 2002-01-08 KR KR10-2003-7009423A patent/KR20030077576A/ko not_active Application Discontinuation
- 2002-01-08 EP EP02710526A patent/EP1352008B1/de not_active Expired - Lifetime
- 2002-01-08 WO PCT/NL2002/000008 patent/WO2002057333A2/en active IP Right Grant
- 2002-01-08 AT AT02710526T patent/ATE298771T1/de not_active IP Right Cessation
- 2002-01-08 DE DE60204844T patent/DE60204844T2/de not_active Expired - Fee Related
- 2002-01-08 US US10/250,605 patent/US20040048971A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| CN1487963A (zh) | 2004-04-07 |
| EP1352008A2 (de) | 2003-10-15 |
| CN1203104C (zh) | 2005-05-25 |
| US20040048971A1 (en) | 2004-03-11 |
| DE60204844T2 (de) | 2006-05-11 |
| WO2002057333A3 (en) | 2002-10-17 |
| WO2002057333A2 (en) | 2002-07-25 |
| EP1352008B1 (de) | 2005-06-29 |
| KR20030077576A (ko) | 2003-10-01 |
| JP2002212268A (ja) | 2002-07-31 |
| DE60204844D1 (de) | 2005-08-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |