HK1040410A1 - Epoxy resin compositions containing phosphorus andthe uses thereof - Google Patents

Epoxy resin compositions containing phosphorus andthe uses thereof

Info

Publication number
HK1040410A1
HK1040410A1 HK02101848A HK02101848A HK1040410A1 HK 1040410 A1 HK1040410 A1 HK 1040410A1 HK 02101848 A HK02101848 A HK 02101848A HK 02101848 A HK02101848 A HK 02101848A HK 1040410 A1 HK1040410 A1 HK 1040410A1
Authority
HK
Hong Kong
Prior art keywords
epoxy resin
phosphorus containing
hydrogen atom
resin compositions
phosphorus
Prior art date
Application number
HK02101848A
Other languages
English (en)
Inventor
Takashi Sagara
Toshiharu Takata
Kiyoaki Ihara
Hidetaka Kakiuchi
Kazuo Ishihara
Chiaki Asano
Masao Gunji
Hiroshi Sato
Original Assignee
Matsusita Electric Works Ltd
Toto Kasei Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsusita Electric Works Ltd, Toto Kasei Kk filed Critical Matsusita Electric Works Ltd
Publication of HK1040410A1 publication Critical patent/HK1040410A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/304—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing phosphorus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49894—Materials of the insulating layers or coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
    • Y10T428/24994—Fiber embedded in or on the surface of a polymeric matrix
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31522—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31529—Next to metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
  • Fireproofing Substances (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
HK02101848A 2000-04-06 2002-03-11 Epoxy resin compositions containing phosphorus andthe uses thereof HK1040410A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000104284A JP4588834B2 (ja) 2000-04-06 2000-04-06 リン含有エポキシ樹脂組成物及び、該リン含有エポキシ樹脂を用いる難燃性の樹脂シート、樹脂付き金属箔、プリプレグ及び積層板、多層板

Publications (1)

Publication Number Publication Date
HK1040410A1 true HK1040410A1 (en) 2002-06-07

Family

ID=18617859

Family Applications (1)

Application Number Title Priority Date Filing Date
HK02101848A HK1040410A1 (en) 2000-04-06 2002-03-11 Epoxy resin compositions containing phosphorus andthe uses thereof

Country Status (10)

Country Link
US (2) US6524709B1 (xx)
EP (1) EP1142921B1 (xx)
JP (1) JP4588834B2 (xx)
KR (1) KR100564814B1 (xx)
CN (2) CN1240772C (xx)
AT (1) ATE376565T1 (xx)
DE (1) DE60036856T2 (xx)
DK (1) DK1142921T3 (xx)
HK (1) HK1040410A1 (xx)
TW (1) TW555809B (xx)

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CN101679602B (zh) * 2007-05-18 2013-04-17 新日铁住金化学株式会社 阻燃性环氧树脂、以该环氧树脂作为必要组分的环氧树脂组合物及其固化物
KR100877342B1 (ko) * 2007-09-13 2009-01-07 삼성전기주식회사 인쇄회로기판용 난연성 수지 조성물, 이를 이용한 인쇄회로기판 및 그 제조방법
US20090258161A1 (en) * 2008-04-10 2009-10-15 Japp Robert M Circuitized substrate with P-aramid dielectric layers and method of making same
CN102203176A (zh) * 2008-10-29 2011-09-28 Icl-Ip美国公司 含磷阻燃环氧树脂组合物、其预浸料和层压板
JP5399733B2 (ja) * 2009-02-16 2014-01-29 新日鉄住金化学株式会社 難燃性リン含有エポキシ樹脂組成物及びその硬化物
CN102361903B (zh) * 2009-03-26 2013-08-28 松下电器产业株式会社 环氧树脂组合物、预浸料、树脂涂覆的金属箔、树脂片、层压板和多层板
JP5441477B2 (ja) * 2009-04-01 2014-03-12 新日鉄住金化学株式会社 難燃性リン含有エポキシ樹脂組成物及びその硬化物
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CN103059265A (zh) * 2013-01-20 2013-04-24 安徽善孚新材料科技有限公司 一种含萘环结构无卤阻燃环氧树脂及其制备方法
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TWI667276B (zh) 2014-05-29 2019-08-01 美商羅傑斯公司 具改良耐燃劑系統之電路物質及由其形成之物件
CN107207701B (zh) * 2015-01-29 2020-07-24 日立化成株式会社 环氧树脂组合物、半固化环氧树脂组合物、树脂片及预浸渍体
CN104987664B (zh) * 2015-06-26 2018-02-09 四川东材科技集团股份有限公司 一种特高压直流输变电用绝缘层、模压结构件及其制备方法
US10233365B2 (en) 2015-11-25 2019-03-19 Rogers Corporation Bond ply materials and circuit assemblies formed therefrom
JP6793517B2 (ja) 2016-10-17 2020-12-02 株式会社ダイセル シート状プリプレグ
JP2019178233A (ja) 2018-03-30 2019-10-17 日鉄ケミカル＆マテリアル株式会社 リン含有ビニル樹脂を含む低誘電難燃性組成物
JP2020122034A (ja) 2019-01-29 2020-08-13 日鉄ケミカル＆マテリアル株式会社 エポキシ樹脂組成物及びその硬化物
JP7489617B2 (ja) 2019-09-06 2024-05-24 パナソニックＩｐマネジメント株式会社 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及びプリント配線板
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Also Published As

Publication number Publication date
JP4588834B2 (ja) 2010-12-01
CN1240772C (zh) 2006-02-08
TW555809B (en) 2003-10-01
CN100432130C (zh) 2008-11-12
US6524709B1 (en) 2003-02-25
EP1142921B1 (en) 2007-10-24
CN1737056A (zh) 2006-02-22
KR100564814B1 (ko) 2006-03-27
US6933050B2 (en) 2005-08-23
KR20010096506A (ko) 2001-11-07
CN1316463A (zh) 2001-10-10
DE60036856T2 (de) 2008-07-31
DE60036856D1 (de) 2007-12-06
US20030162935A1 (en) 2003-08-28
JP2001288247A (ja) 2001-10-16
EP1142921A1 (en) 2001-10-10
DK1142921T3 (da) 2008-01-28
ATE376565T1 (de) 2007-11-15

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20161130