KR970705594A - 프리프레그 및 복합 재료용 에폭시수지 혼합물(epoxy resin mixtures for prepregs and composites) - Google Patents
프리프레그 및 복합 재료용 에폭시수지 혼합물(epoxy resin mixtures for prepregs and composites) Download PDFInfo
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- KR970705594A KR970705594A KR1019970701503A KR19970701503A KR970705594A KR 970705594 A KR970705594 A KR 970705594A KR 1019970701503 A KR1019970701503 A KR 1019970701503A KR 19970701503 A KR19970701503 A KR 19970701503A KR 970705594 A KR970705594 A KR 970705594A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/52—Amino carboxylic acids
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
- C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
- C08G59/1488—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing phosphorus
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
- C08G59/304—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing phosphorus
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
- C08G59/4021—Ureas; Thioureas; Guanidines; Dicyandiamides
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
- Y10T428/31518—Next to glass or quartz
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31525—Next to glass or quartz
Abstract
프리프레그 및 복합 재료를 제조하기 위한 에폭시수지 혼합물은 하기 성분을 함유한다 : -A) 분자 당 2개 이상의 에폭시기를 가진 폴리에폭시드 화합룰 및 B) 포스핀산 무수물, 포스폰산 무수물 또는 포스폰산 반-에스테르로부터 유도된 구조 단위로 형성된, 0.02 내지 1몰/100g의 에폭시가를 가진 인-변성된 에폭시 수지; -경화제로서 디시안디아미드 및/또는 아미노벤조산 유도체; -아민 경화 촉진제.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
Claims (10)
- 프리그래그 및 복합 제료를 제조하기 위한 에폭시수지 혼합물에 있어서, 에폭시수지 혼합물이 하기 성분을 함유하는 것을 특징으로 하는 에폭시수지 혼합물 : -A) 분자 당 2개 이상의 에폭시기를 가진 폴리에폭시드 화합룰 및 B) 포스핀산 무수물, 포스폰산 무수물 또는 포스폰산 반-에스테르로부터 유도된 구조 단위로 형성된, 0.02 내지 1몰/100g의 에폭시가를 가진 인-변성된 에폭시 수지; -경화제로서 디시안디아미드 및/또는 하기 화학식(1)의 방향족 아민;상기 식에서, X는 H원자이고, Y는 1 내지 3C원자를 가진 알킬기이며, m 또는 n은 m+n=4인 0 내지 4의 정수이고, R은 OH-기 또는 NR1R2-기 이고, 여기서 R1및 R2기는 - 서로 독립적으로 -H 원자 또는 1 내지 3C 원자를 가진 알킬기 또는 아릴기 이거나, 또는 R1및 R2중 하나는 상기 의미이고 다른 하나는 NR3R4기이며, 여기서 R3또는 R4=H 또는 1 내지 3C 원자를 가진 알킬이고, 또는 R1및 R2는 N 원자와 함께 헤테로고리 그룹을 형성함; -아민 경화 촉진제.
- 제1항에 있어서, 에폭시수지 혼합물이 비스페놀-A-디글리시딜에테르와 초과량의 비스페놀-A의 반응에 의해 제조된 인 유리 에폭시수지를 포함하거나, 또는 비스페놀-A, 비스페놀-F, 또는 비스페놀-A 또는 비스페놀-F와 에피클로로히드린의 축합에 의해 얻어진 고분자 페녹시수지의 형태인 페놀 OH기를 가진 글리시딜기 유리 화합물을 포함하는 것을 특징으로 하는 에폭시수지 혼합물.
- 제2항에 있어서, 수지 혼합물 중의 인 유리 에폭시수지의 양이 30질량%, 바람직하게는 10질량% 이하인 것을 특징으로 하는 에폭시수지 혼합물.
- 제2항 또는 제3항에 있어서, 수지 혼합물 중의 글리시딜기 유리 화합물의 양이 20질량%, 바람직하게는 10질량% 이하인 것을 특징으로 하는 에폭시수지 혼합물.
- 제1항 내지 제4항 중 어느 한 항에 있어서, 인 함량이 수지 혼합물에 대해, 0.5 내지 5질량%, 바람직하게는 1 내지 4질량%인 것을 특징으로 하는 에폭시수지 혼합물.
- 제1항 내지 제5항 중 어느 한 항에 있어서, 에폭시 관능기 대 NH 관능기의 당량 비율이 1:0.4 내지 1:1.1, 바람직하게는 1:0.5 내지 1:0.8인 것을 특징으로 하는 에폭시수지 혼합물.
- 제1항 내지 제6항 중 어느 한 항에 있어서, 수지 혼합물 중의 경화제의 함량이 0.5 내지 35질량%, 바람직하게는 2 내지 12질량%인 것을 특징으로 하는 에폭시수지 혼합물.
- 제1항 내지 제7항 중 어느 한 항에 있어서, 경화제가 2-아미노벤조산, 4-아미노벤조산, 4-아미노-2-메틸벤조산, 4-아미노벤조산아미드, 4-아미노벤조산디메틸아미드 또는 4-아미노벤조산히드라지드이며, 특히 디시안디아미드 및 4-아미노벤조산의 혼합물인 것을 특징으로 하는 에폭시수지 혼합물.
- 제1항 내지 제8항 중 어느 한 항에 따른 에폭시수지 혼합물로 제조된 섬유, 부직포, 직물 또는 평면 재료 형태의 무기 또는 유기 보강 재료를 기본으로 하는 프리프레그 및 복합 재료.
- 제1항 내지 제8항 중 어느 한 항에 따른 유리 섬유 직물 및 에폭시수지 혼합물로 제조된 프리프레그로 된 프린트 기판.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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DEP4432189.9 | 1994-09-09 | ||
DE4432189 | 1994-09-09 | ||
PCT/DE1995/001136 WO1996007685A1 (de) | 1994-09-09 | 1995-08-25 | Epoxidharzmischungen für prepregs und verbundwerkstoffe |
Publications (1)
Publication Number | Publication Date |
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KR970705594A true KR970705594A (ko) | 1997-10-09 |
Family
ID=6527844
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019970701503A KR970705594A (ko) | 1994-09-09 | 1995-08-25 | 프리프레그 및 복합 재료용 에폭시수지 혼합물(epoxy resin mixtures for prepregs and composites) |
Country Status (10)
Country | Link |
---|---|
US (1) | US5817736A (ko) |
EP (1) | EP0779905B1 (ko) |
JP (1) | JPH10505120A (ko) |
KR (1) | KR970705594A (ko) |
CN (1) | CN1068349C (ko) |
AT (1) | ATE167203T1 (ko) |
CZ (1) | CZ70497A3 (ko) |
DE (1) | DE59502531D1 (ko) |
TW (1) | TW294694B (ko) |
WO (1) | WO1996007685A1 (ko) |
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AU2089601A (en) | 1999-12-13 | 2001-06-18 | Dow Chemical Company, The | Flame retardant phosphorus element-containing epoxy resin compositions |
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CA2863546C (en) * | 2012-02-06 | 2018-03-20 | Momentive Specialty Chemicals Inc. | Epoxy resin formulations for textiles, mats and other fibrous reinforcements for composite applications |
CN103382242B (zh) | 2013-06-25 | 2015-06-24 | 江苏雅克科技股份有限公司 | 含磷阻燃酚醛树脂及以其为原料制备的阻燃环氧树脂固化物 |
CN107266639B (zh) | 2014-08-15 | 2019-08-27 | 江苏雅克科技股份有限公司 | 含磷酚醛树脂化合物及以其为原料制备的含磷阻燃环氧树脂固化物 |
CN105623238B (zh) | 2014-11-06 | 2018-07-27 | 江苏雅克科技股份有限公司 | 含磷官能化聚(亚芳基醚)及以其为原料制备组合物 |
CN105566621B (zh) | 2014-11-11 | 2018-09-21 | 江苏雅克科技股份有限公司 | 低介电含磷聚酯化合物组成及其制法 |
US9534108B2 (en) | 2015-03-13 | 2017-01-03 | Chemtura Corporation | Flame retardant epoxy resins comprising phosphorus containing flame retardants |
RU2711163C2 (ru) | 2015-04-17 | 2020-01-15 | Альцхем Тростберг Гмбх | Отвердитель и ускоритель отверждения с огнезащитным действием для отверждения эпоксидных смол (ii) |
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CN114057395B (zh) * | 2021-12-13 | 2023-09-12 | 苏州市华研富士新材料有限公司 | 一种高强度耐高温的玻璃纤维复合板及其生产工艺 |
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DE1934715B2 (de) * | 1969-07-09 | 1976-07-29 | Krüger, Alfred, 5047 Wesseling | Pulverfoermige ueberzugsmittel |
JPS4839832B1 (ko) * | 1970-08-10 | 1973-11-27 | ||
US4111909A (en) * | 1977-04-11 | 1978-09-05 | Celanese Polymer Specialties Company | Controlled reactivity epoxy resin compositions |
JPS58142913A (ja) * | 1982-02-20 | 1983-08-25 | Toshiba Chem Corp | 熱硬化性樹脂組成物 |
JPH01123892A (ja) * | 1987-11-09 | 1989-05-16 | Dai Ichi Kogyo Seiyaku Co Ltd | 新規な反応性難燃剤 |
EP0384940B1 (de) * | 1989-03-03 | 1994-06-22 | Siemens Aktiengesellschaft | Epoxidharzmischungen |
DE4308185A1 (de) * | 1993-03-15 | 1994-09-22 | Siemens Ag | Phosphormodifizierte Epoxidharze, Verfahren zu ihrer Herstellung sowie deren Verwendung |
SG72674A1 (en) * | 1993-03-15 | 2000-05-23 | Hoechst Ag | Phosphorus-modified epoxy resins process for the preparation thereof and use thereof |
DE4308187A1 (de) * | 1993-03-15 | 1994-09-22 | Siemens Ag | Epoxidharzmischungen |
DE4308184A1 (de) * | 1993-03-15 | 1994-09-22 | Siemens Ag | Epoxidharzmischungen |
-
1995
- 1995-07-21 TW TW084107571A patent/TW294694B/zh active
- 1995-08-25 CN CN95194927A patent/CN1068349C/zh not_active Expired - Fee Related
- 1995-08-25 WO PCT/DE1995/001136 patent/WO1996007685A1/de not_active Application Discontinuation
- 1995-08-25 KR KR1019970701503A patent/KR970705594A/ko active IP Right Grant
- 1995-08-25 JP JP8509100A patent/JPH10505120A/ja active Pending
- 1995-08-25 EP EP95928984A patent/EP0779905B1/de not_active Expired - Lifetime
- 1995-08-25 DE DE59502531T patent/DE59502531D1/de not_active Expired - Fee Related
- 1995-08-25 US US08/793,289 patent/US5817736A/en not_active Expired - Fee Related
- 1995-08-25 CZ CZ97704A patent/CZ70497A3/cs unknown
- 1995-08-25 AT AT95928984T patent/ATE167203T1/de not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0779905B1 (de) | 1998-06-10 |
ATE167203T1 (de) | 1998-06-15 |
EP0779905A1 (de) | 1997-06-25 |
JPH10505120A (ja) | 1998-05-19 |
TW294694B (ko) | 1997-01-01 |
WO1996007685A1 (de) | 1996-03-14 |
CN1068349C (zh) | 2001-07-11 |
DE59502531D1 (de) | 1998-07-16 |
CN1157626A (zh) | 1997-08-20 |
CZ70497A3 (en) | 1997-06-11 |
US5817736A (en) | 1998-10-06 |
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