KR960701116A - 에폭시수지 혼합물(epoxy resin mixtures) - Google Patents

에폭시수지 혼합물(epoxy resin mixtures) Download PDF

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KR960701116A
KR960701116A KR1019950703869A KR19950703869A KR960701116A KR 960701116 A KR960701116 A KR 960701116A KR 1019950703869 A KR1019950703869 A KR 1019950703869A KR 19950703869 A KR19950703869 A KR 19950703869A KR 960701116 A KR960701116 A KR 960701116A
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epoxy resin
resin mixture
mixture according
phosphorus
weight
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KR1019950703869A
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KR100304601B1 (ko
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볼프강 폰 겐츠코브
위르겐 후버
하인리히 카피차
볼프강 로글러
한스-예르크 클라이너
디터 빌헬름
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디터 크리스트·게르하르트 퀼
지멘스 악티엔게젤샤프트
볼프강 로제르트·한스 짜우너
회히스트 악티엔게젤샤프트
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1488—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/508—Amines heterocyclic containing only nitrogen as a heteroatom having three nitrogen atoms in the ring
    • C08G59/5086—Triazines; Melamines; Guanamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K21/00—Fireproofing materials
    • C09K21/14—Macromolecular materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31518—Next to glass or quartz
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31525—Next to glass or quartz

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Reinforced Plastic Materials (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Organic Insulating Materials (AREA)

Abstract

프리프레그 및 복합재료의 제조를 위해 사용되는 에폭시수지 혼합물은 하기 성분을 포함하면, 저렴하게 제조 될 수 있고, 양호한 가공성을 가지며, 높은 유리전이온도를 갖는 동시에 향상된 층간 접착 및 Cu접착을 나나내는 -난연제의 첨가없이 -난연성 성형재료를 수득할 수 있다: -하기 (A) 및 (B)로부터 유도된 구조단위로 구성된, 0.02 내지 1mol/100g의 에폭시값을 가진 인-변성된 에폭시수지: (A) 분자 당 적어도 2개의 에폭시기를 가진 폴리에폭시화합물, (B) 포스핀산 무수물 및/또는 포스폰산 무수물-경화제로서 방향족 폴리아민.

Description

에폭시 혼합물(EPOXY RESIN MIXTURES)
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (10)

  1. 프리프레그 및 복합재로를 제조하기 위한 에폭시수지 혼합물에 있어서, 하기 성분을 함유하는 것을 특징으로 하는 에폭시수지 혼합물: -하기 (A) 및 (B)로부터 유도된 구조단위로 구성된. 0.02 내지 1mol/100g의 에폭시값을 가진 인-변성된 에폭시수지 : (A) 분자 당 적어도 2개의 에폭시기를 가진 폴리에폭시화합물, (B) 포스핀산 무수물 및/또는 포스폰산 무수물, -경화제로서 하기 일반식의 방향족 폴리아민:상기 식에서, 3개의 방향족 부분구조의 각각에서 잔기 R¹ 및 R²중 하나는 HH이고 다른 잔기는 알킬이다.
  2. 제1항에 있어서, 인-변성된 에폭시수지의 인함량이 0.5 내지 13중량% 바람직하게는 1 내지 8중량%인 것을 특징으로 하는 에폭시수지 혼합물.
  3. 제1항 또는 제2항에 있어서, 에폭시수지 혼합물이 부가로 인이 없는 방향족 및/또는 헤테로고리 에폭시수지를, 경우에 따라 시클로지방족 에폭시수지와의 혼합물로 함유하는 것을 특징으로 하는 에폭시수지 혼합물.
  4. 제3항에 있어서, 80중량% 이하의 인-변성된 에폭시수지로 대체되는 것을 특징으로 하는 에폭시수지 혼합물.
  5. 제1항 내지 4항중 어느 한 항에 있어서, 에폭시작용기 및 아민수소작용기 사이의 비율이 1:0.5 내지 1:1.1, 바람직하게는 1:0.7 내지 1:0.9인 것을 특징으로 하는 에폭시수지 혼합물.
  6. 제1항 내지 4항중 어느 한 항에 있어서, 경화제가 도다른 방향족 및/도는 헤테로고리 폴리아민 혼합되는 것을 특징으로 하는 에폭시수지 혼합물.
  7. 제1항 내지 6항중 어느 한항에 있어서, 에폭시수지 혼합물이 촉진제를 함유하는 것을 특징으로 하는 에폭시수지 혼합물.
  8. 제1항 내지 7항중 어느 한 항에 있어서, 인 함량이 수지 혼합물에 대해 0.5 내지 6중량%, 바람직하게는 1 내지 4중량%인 것을 특징으로 하는 에폭시수지 혼합물.
  9. 제1항 내지 8항중 어느 한 항에 따른 에폭시수지 혼합물로 제조된, 섬유, 부직포 또는 직물의 형태로 또는 평면재료의 형태인 유기 또는 무기 보강재료를 기재로 한 프리프레그 및 복합재료.
  10. 유리섬유직물 및 제1항 내지 8항중 어느 한 항에 따른 에폭시수지 혼합물로 제조된 프리프레그로 이루어진 프리트기판.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950703869A 1993-03-15 1994-03-10 에폭시수지혼합물 KR100304601B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DEP4308187.8 1993-03-15
DE4308187A DE4308187A1 (de) 1993-03-15 1993-03-15 Epoxidharzmischungen
PCT/EP1994/000747 WO1994021703A1 (de) 1993-03-15 1994-03-10 Epoxidharzmischungen

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KR960701116A true KR960701116A (ko) 1996-02-24
KR100304601B1 KR100304601B1 (ko) 2001-11-22

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US (1) US5587243A (ko)
EP (1) EP0689557B1 (ko)
JP (1) JPH08507811A (ko)
KR (1) KR100304601B1 (ko)
CN (1) CN1046950C (ko)
AT (1) ATE166660T1 (ko)
CA (1) CA2158367A1 (ko)
CZ (1) CZ287738B6 (ko)
DE (2) DE4308187A1 (ko)
FI (1) FI107613B (ko)
HU (1) HU214197B (ko)
PL (1) PL176640B1 (ko)
RU (1) RU2118970C1 (ko)
WO (1) WO1994021703A1 (ko)

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HU9502672D0 (en) 1995-11-28
HUT74028A (en) 1996-10-28
DE4308187A1 (de) 1994-09-22
FI954322A0 (fi) 1995-09-14
RU2118970C1 (ru) 1998-09-20
FI954322A (fi) 1995-09-14
CN1046950C (zh) 1999-12-01
KR100304601B1 (ko) 2001-11-22
WO1994021703A1 (de) 1994-09-29
CN1119445A (zh) 1996-03-27
DE59406090D1 (de) 1998-07-02
EP0689557A1 (de) 1996-01-03
US5587243A (en) 1996-12-24
FI107613B (fi) 2001-09-14
CA2158367A1 (en) 1994-09-29
HU214197B (hu) 1998-01-28
JPH08507811A (ja) 1996-08-20
EP0689557B1 (de) 1998-05-27
CZ224795A3 (en) 1996-01-17
PL310627A1 (en) 1995-12-27
CZ287738B6 (en) 2001-01-17
PL176640B1 (pl) 1999-07-30
ATE166660T1 (de) 1998-06-15

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