KR960701115A - 에폭시수지 혼합물(epoxy resin mixtures) - Google Patents
에폭시수지 혼합물(epoxy resin mixtures) Download PDFInfo
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- KR960701115A KR960701115A KR1019950703868A KR19950703868A KR960701115A KR 960701115 A KR960701115 A KR 960701115A KR 1019950703868 A KR1019950703868 A KR 1019950703868A KR 19950703868 A KR19950703868 A KR 19950703868A KR 960701115 A KR960701115 A KR 960701115A
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- epoxy resin
- resin mixture
- mixture according
- phosphorus
- epoxy
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
- C08G59/1405—Polycondensates modified by chemical after-treatment with inorganic compounds
- C08G59/1422—Polycondensates modified by chemical after-treatment with inorganic compounds containing phosphorus
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
- C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
- C08G59/1488—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing phosphorus
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
- C08G59/304—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing phosphorus
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5046—Amines heterocyclic
- C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
- C08G59/508—Amines heterocyclic containing only nitrogen as a heteroatom having three nitrogen atoms in the ring
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5046—Amines heterocyclic
- C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
- C08G59/508—Amines heterocyclic containing only nitrogen as a heteroatom having three nitrogen atoms in the ring
- C08G59/5086—Triazines; Melamines; Guanamines
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
- Y10T428/31518—Next to glass or quartz
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31525—Next to glass or quartz
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Epoxy Resins (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Paints Or Removers (AREA)
- Organic Insulating Materials (AREA)
Abstract
프리프레그 및 복합재료의 제조를 위해 사용되는 에폭시수지 혼합물은 하기 성분을 포함하면, 저렴하게 제조 될 수 있고, 양호한 가공성을 가지며, 높은 우리전이온도를 갖는 동시에 향상된 층간 접착 및 Cu접착을 나타내는 -난연제의 첨가없이 난연성 성형재료를 수득할 수 있다: -하기 (A) 및 (B)로부터 유도된 구조단위로 구성된, 0.02 내지 1mol/100g의 에폭시값을 가진 인-변성된 에폭시수지: (A) 분자 당 적어도 2개의 에폭시기를 가진 폴리에폭시화합물. (B) 포스핀산, 포스폰산, 피로로스폰산 및 포스폰산하프에스테르 그룹으로 이루어진 적어도 하나의 호합물, -경화제로서 방향족 폴리아민.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
Claims (10)
- 프리프레그 및 복합재로를 제조하기 위한 에폭시수지 혼합물에 있어서, 하기 성분을 함유하는 것을 특징으로 하는 에폭시수지 혼합물: -하기 (A) 및 (B)로부터 유도된 구조단위로 구성된. 0.02 내지 1mol/100g의 에폭시값을 가진 인-변성된 에폭시수지 : (A) 분자 당 적어도 2개의 에폭시기를 가진 폴리에폭시화합물, (B) 포스핀산, 포스폰산, 피로포스폰산 및 포스폰산하프에스테르 그룹으로 이루어진 적어도 하나의 화합물, -경화제로서 하기 일반식의 방향족 폴리아민:상기 식에서, 3개의 방향족 부분구조의 가가각에서 잔기 R¹ 및 R²중 하나는 HH이고 다른 잔기는 알킬이다.
- 제1항에 있어서, 인-변성된 에폭시수지의 인 함량이 0.5 내지 13중량% 바람직하게는 1 내지 8중량%인 것을 특징으로 하는 에폭시수지 혼합물.
- 제1항 또는 제2항에 있어서, 에폭시수지 혼합물이 부가로 인이 없는 방향족 및/또는 헤테로고리 에폭시수지를, 경우에 따라 시클로지방족 에폭시수지와의 혼합물로 함유하는 것을 특징으로 하는 에폭시수지 혼합물.
- 제3항에 있어서, 80중량% 이하의 인-변성된 에폭시수지로 대체되는 것을 특징으로 하는 에폭시수지 혼합물.
- 제1항 내지 4항중 어느 한 항에 있어서, 에폭시작용기 및 아민수소작용기 사이의 비율이 1:0.5 내지 1:1.1, 바람직하게는 1:0.7 내지 1:0.9인 것을 특징으로 하는 에폭시수지 혼합물.
- 제1항 내지 4항중 어느 한 항에 있어서, 경화제가 도다른 방향족 및/도는 헤테로고리 폴리아민 혼합되는 것을 특징으로 하는 에폭시수지 혼합물.
- 제1항 내지 6항중 어느 한항에 있어서, 에폭시수지 혼합물이 촉진제를 함유하는 것을 특징으로 하는 에폭시수지 혼합물.
- 제1항 내지 7항중 어느 한 항에 있어서, 인 함량이 수지 혼합물에 대해 0.5 내지 6중량%, 바람직하게는 1 내지 4중량%인 것을 특징으로 하는 에폭시수지 혼합물.
- 제1항 내지 8항중 어느 한 항에 따른 에폭시수지 혼합물로 제조된, 섬유, 부직포 또는 직물의 형태로 또는 평면재료의 형태인 유기 또는 무기 보강재료를 기재로 한 프리프레그 및 복합재료.
- 유리섬유직물 및 제1항 내지 8항중 어느 한 항에 따른 에폭시수지 혼합물로 제조된 프리프레그로 이루어진 프리트기판.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19934308184 DE4308184A1 (de) | 1993-03-15 | 1993-03-15 | Epoxidharzmischungen |
DEP4308184.3 | 1993-03-15 | ||
PCT/EP1994/000750 WO1994021706A1 (de) | 1993-03-15 | 1994-03-10 | Epoxidharzmischungen |
Publications (2)
Publication Number | Publication Date |
---|---|
KR960701115A true KR960701115A (ko) | 1996-02-24 |
KR100304600B1 KR100304600B1 (ko) | 2001-11-22 |
Family
ID=6482839
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950703897A KR960701118A (ko) | 1993-03-15 | 1994-03-10 | 인-개질된 에폭시 수지, 이들의 제조방법 및 이들의 용도(phosphorus-modified epoxy resins, process for producing them and their use) |
KR1019950703868A KR100304600B1 (ko) | 1993-03-15 | 1994-03-10 | 에폭시수지혼합물 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950703897A KR960701118A (ko) | 1993-03-15 | 1994-03-10 | 인-개질된 에폭시 수지, 이들의 제조방법 및 이들의 용도(phosphorus-modified epoxy resins, process for producing them and their use) |
Country Status (15)
Country | Link |
---|---|
US (1) | US5648171A (ko) |
EP (2) | EP0689559B1 (ko) |
JP (2) | JPH08507813A (ko) |
KR (2) | KR960701118A (ko) |
CN (2) | CN1119447A (ko) |
AT (1) | ATE154369T1 (ko) |
CA (2) | CA2158362A1 (ko) |
CZ (2) | CZ287737B6 (ko) |
DE (2) | DE4340834A1 (ko) |
FI (2) | FI954292A (ko) |
HU (2) | HU214671B (ko) |
PL (2) | PL175777B1 (ko) |
RU (2) | RU2126426C1 (ko) |
TW (2) | TW261622B (ko) |
WO (2) | WO1994021706A1 (ko) |
Families Citing this family (45)
Publication number | Priority date | Publication date | Assignee | Title |
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DE4308187A1 (de) * | 1993-03-15 | 1994-09-22 | Siemens Ag | Epoxidharzmischungen |
TW294693B (ko) * | 1994-09-09 | 1997-01-01 | Siemens Ag | |
DE19613066C2 (de) * | 1996-04-01 | 1998-09-10 | Clariant Gmbh | Verfahren zur Herstellung phosphormodifizierter Epoxidharze |
DE19613067C2 (de) * | 1996-04-01 | 1998-12-03 | Clariant Gmbh | Phosphormodifizierte Epoxidharzmischungen aus Epoxidharzen, phosphorhaltigen Verbindungen und einem Härter, ein Verfahren zu deren Herstellung und ihre Verwendung |
DE19619095A1 (de) | 1996-05-06 | 1997-11-13 | Schill & Seilacher | Flammfeste Epoxidharze und Flammschutzmittel für Epoxidharze |
JP2001503790A (ja) | 1996-09-26 | 2001-03-21 | シーメンス アクチエンゲゼルシヤフト | エポキシ樹脂混合物 |
US6207595B1 (en) | 1998-03-02 | 2001-03-27 | International Business Machines Corporation | Laminate and method of manufacture thereof |
DE19917428A1 (de) | 1999-04-19 | 2000-10-26 | Clariant Gmbh | Flammwidrige phosphormodifizierte Epoxidharze |
JP4535559B2 (ja) * | 2000-04-04 | 2010-09-01 | イビデン株式会社 | 多層プリント配線板 |
DE60045173D1 (de) | 1999-08-12 | 2010-12-09 | Ibiden Co Ltd | Mehrschichtige Leiterplatte mit einer Lötstoppzusammensetzung |
JP4530469B2 (ja) * | 2000-04-04 | 2010-08-25 | イビデン株式会社 | 多層プリント配線板および多層プリント配線板の製造方法 |
WO2002066485A2 (en) * | 2001-02-15 | 2002-08-29 | Pabu Services, Inc. | Novel hydroxyaryl phosphine oxides, glycidyl ethers and epoxy compositions, composites and laminates derived therefrom |
US6887950B2 (en) * | 2001-02-15 | 2005-05-03 | Pabu Services, Inc. | Phosphine oxide hydroxyaryl mixtures with novolac resins for co-curing epoxy resins |
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JP2002275244A (ja) * | 2001-03-19 | 2002-09-25 | Dainippon Ink & Chem Inc | エポキシ樹脂組成物 |
AT411061B (de) * | 2001-11-30 | 2003-09-25 | Solutia Austria Gmbh | Wässrige härter für wässrige epoxidharzdispersionen |
TWI278481B (en) * | 2002-04-16 | 2007-04-11 | Hitachi Chemical Co Ltd | Thermosetting resin composition, prepreg and laminate using the same |
JP5250972B2 (ja) * | 2004-02-27 | 2013-07-31 | 東レ株式会社 | 炭素繊維強化複合材料用エポキシ樹脂組成物、プリプレグ、一体化成形品、繊維強化複合材料板、および電気・電子機器用筐体 |
KR101184139B1 (ko) * | 2004-03-29 | 2012-09-18 | 스미토모 베이클라이트 가부시키가이샤 | 수지 조성물, 수지 부착 금속박, 기재 부착 절연시트 및다층 프린트 배선판 |
US7270845B2 (en) * | 2004-03-31 | 2007-09-18 | Endicott Interconnect Technologies, Inc. | Dielectric composition for forming dielectric layer for use in circuitized substrates |
US7145221B2 (en) * | 2004-03-31 | 2006-12-05 | Endicott Interconnect Technologies, Inc. | Low moisture absorptive circuitized substrate, method of making same, electrical assembly utilizing same, and information handling system utilizing same |
US7078816B2 (en) | 2004-03-31 | 2006-07-18 | Endicott Interconnect Technologies, Inc. | Circuitized substrate |
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1993
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- 1994-03-10 CZ CZ952400A patent/CZ240095A3/cs unknown
- 1994-03-10 CA CA002158362A patent/CA2158362A1/en not_active Abandoned
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- 1994-03-10 US US08/522,333 patent/US5648171A/en not_active Expired - Fee Related
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- 1994-03-10 KR KR1019950703897A patent/KR960701118A/ko not_active Application Discontinuation
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- 1994-03-10 EP EP94911149A patent/EP0689559B1/de not_active Expired - Lifetime
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- 1994-03-10 RU RU95121641A patent/RU2116323C1/ru active
- 1994-03-10 WO PCT/EP1994/000749 patent/WO1994021705A1/de not_active Application Discontinuation
- 1994-03-10 EP EP94911874A patent/EP0689560A1/de not_active Withdrawn
- 1994-04-21 TW TW083103560A patent/TW261622B/zh active
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