FI954321A - Epoksidihartsiseoksia - Google Patents

Epoksidihartsiseoksia Download PDF

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Publication number
FI954321A
FI954321A FI954321A FI954321A FI954321A FI 954321 A FI954321 A FI 954321A FI 954321 A FI954321 A FI 954321A FI 954321 A FI954321 A FI 954321A FI 954321 A FI954321 A FI 954321A
Authority
FI
Finland
Prior art keywords
pct
date sep
acids
sec
molding materials
Prior art date
Application number
FI954321A
Other languages
English (en)
Swedish (sv)
Other versions
FI954321A0 (fi
FI107612B (fi
Inventor
Gentzkow Wolfgang Von
Juergen Huber
Heinrich Kapitza
Wolfgang Rogler
Hans-Jerg Kleiner
Original Assignee
Siemens Ag
Hoechst Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19934308184 external-priority patent/DE4308184A1/de
Application filed by Siemens Ag, Hoechst Ag filed Critical Siemens Ag
Publication of FI954321A0 publication Critical patent/FI954321A0/fi
Publication of FI954321A publication Critical patent/FI954321A/fi
Application granted granted Critical
Publication of FI107612B publication Critical patent/FI107612B/fi

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1405—Polycondensates modified by chemical after-treatment with inorganic compounds
    • C08G59/1422—Polycondensates modified by chemical after-treatment with inorganic compounds containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1488—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/304—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/508—Amines heterocyclic containing only nitrogen as a heteroatom having three nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/508—Amines heterocyclic containing only nitrogen as a heteroatom having three nitrogen atoms in the ring
    • C08G59/5086—Triazines; Melamines; Guanamines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31518—Next to glass or quartz
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31525—Next to glass or quartz
FI954321A 1993-03-15 1995-09-14 Epoksidihartsiseoksia FI107612B (fi)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE4308184 1993-03-15
DE19934308184 DE4308184A1 (de) 1993-03-15 1993-03-15 Epoxidharzmischungen
EP9400750 1994-03-10
PCT/EP1994/000750 WO1994021706A1 (de) 1993-03-15 1994-03-10 Epoxidharzmischungen

Publications (3)

Publication Number Publication Date
FI954321A0 FI954321A0 (fi) 1995-09-14
FI954321A true FI954321A (fi) 1995-09-14
FI107612B FI107612B (fi) 2001-09-14

Family

ID=6482839

Family Applications (2)

Application Number Title Priority Date Filing Date
FI954292A FI954292A (fi) 1993-03-15 1995-09-13 Fosforilla muunnettuja epoksihartseja, menetelmä niiden valmistamiseksi ja niiden käyttö
FI954321A FI107612B (fi) 1993-03-15 1995-09-14 Epoksidihartsiseoksia

Family Applications Before (1)

Application Number Title Priority Date Filing Date
FI954292A FI954292A (fi) 1993-03-15 1995-09-13 Fosforilla muunnettuja epoksihartseja, menetelmä niiden valmistamiseksi ja niiden käyttö

Country Status (15)

Country Link
US (1) US5648171A (fi)
EP (2) EP0689559B1 (fi)
JP (2) JPH08507814A (fi)
KR (2) KR100304600B1 (fi)
CN (2) CN1046949C (fi)
AT (1) ATE154369T1 (fi)
CA (2) CA2158366A1 (fi)
CZ (2) CZ287737B6 (fi)
DE (2) DE4340834A1 (fi)
FI (2) FI954292A (fi)
HU (2) HU213902B (fi)
PL (2) PL176714B1 (fi)
RU (2) RU2116323C1 (fi)
TW (2) TW261622B (fi)
WO (2) WO1994021705A1 (fi)

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DE4308187A1 (de) * 1993-03-15 1994-09-22 Siemens Ag Epoxidharzmischungen
TW294693B (fi) * 1994-09-09 1997-01-01 Siemens Ag
DE19613067C2 (de) * 1996-04-01 1998-12-03 Clariant Gmbh Phosphormodifizierte Epoxidharzmischungen aus Epoxidharzen, phosphorhaltigen Verbindungen und einem Härter, ein Verfahren zu deren Herstellung und ihre Verwendung
DE19613066C2 (de) * 1996-04-01 1998-09-10 Clariant Gmbh Verfahren zur Herstellung phosphormodifizierter Epoxidharze
DE19619095A1 (de) 1996-05-06 1997-11-13 Schill & Seilacher Flammfeste Epoxidharze und Flammschutzmittel für Epoxidharze
DE59711794D1 (de) 1996-09-26 2004-08-26 Siemens Ag Epoxidharzmischungen
US6207595B1 (en) * 1998-03-02 2001-03-27 International Business Machines Corporation Laminate and method of manufacture thereof
DE19917428A1 (de) 1999-04-19 2000-10-26 Clariant Gmbh Flammwidrige phosphormodifizierte Epoxidharze
EP2053908B1 (en) 1999-08-12 2011-12-21 Ibiden Co., Ltd. Multilayer printed wiring board with a solder resist composition
JP4535559B2 (ja) * 2000-04-04 2010-09-01 イビデン株式会社 多層プリント配線板
JP4530469B2 (ja) * 2000-04-04 2010-08-25 イビデン株式会社 多層プリント配線板および多層プリント配線板の製造方法
US20060099458A1 (en) * 2001-02-15 2006-05-11 Hanson Mark V 1, 4-Hydroquinone functionalized phosphinates and phosphonates
US6887950B2 (en) * 2001-02-15 2005-05-03 Pabu Services, Inc. Phosphine oxide hydroxyaryl mixtures with novolac resins for co-curing epoxy resins
US6733698B2 (en) 2001-02-15 2004-05-11 Pabu Services, Inc. Mixture of mono-, bis- and tris-(hydroxyaryl) phosphine oxides useful to make polyglycidyl ethers or in epoxy compositions
JP2002275244A (ja) * 2001-03-19 2002-09-25 Dainippon Ink & Chem Inc エポキシ樹脂組成物
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TWI278481B (en) * 2002-04-16 2007-04-11 Hitachi Chemical Co Ltd Thermosetting resin composition, prepreg and laminate using the same
JP5250972B2 (ja) * 2004-02-27 2013-07-31 東レ株式会社 炭素繊維強化複合材料用エポキシ樹脂組成物、プリプレグ、一体化成形品、繊維強化複合材料板、および電気・電子機器用筐体
JP5085125B2 (ja) * 2004-03-29 2012-11-28 住友ベークライト株式会社 樹脂組成物、樹脂付き金属箔、基材付き絶縁シートおよび多層プリント配線板
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US7145221B2 (en) * 2004-03-31 2006-12-05 Endicott Interconnect Technologies, Inc. Low moisture absorptive circuitized substrate, method of making same, electrical assembly utilizing same, and information handling system utilizing same
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JP2011502206A (ja) * 2007-10-31 2011-01-20 ロード コーポレーション 油性基体への接着性の改善のための添加剤
EP2083030A1 (en) * 2008-01-15 2009-07-29 Cytec Surface Specialties Austria GmbH Water-borne epoxy resin systems
US20090258161A1 (en) * 2008-04-10 2009-10-15 Japp Robert M Circuitized substrate with P-aramid dielectric layers and method of making same
CN101591471B (zh) * 2008-05-26 2011-03-16 台燿科技股份有限公司 处理无卤素铜箔基板材料的树脂组合物
US20110065870A1 (en) 2009-09-11 2011-03-17 Chemtura Corporation Tris(Hydroxoxyphenyl) Phosphine Oxides and their Use as Flame Retardants for Epoxy Resins
US20110065838A1 (en) 2009-09-11 2011-03-17 Chemtura Corporation Hydroxyphenyl Phosphine Oxide Mixtures and their use as Flame Retardants for Epoxy Resins
EP2528971A2 (en) * 2010-01-29 2012-12-05 Dow Global Technologies LLC Compositions having phosphorus-containing compounds
CN101880507B (zh) * 2010-07-02 2013-03-13 石家庄市金达特种涂料有限公司 一种膨胀型水性防火清漆及制备方法
CN102304321A (zh) * 2011-08-31 2012-01-04 蚌埠市英路光电有限公司 酚型聚酯漆包线漆及其制备方法
CN102304320A (zh) * 2011-08-31 2012-01-04 蚌埠市英路光电有限公司 一种低温环保聚酯亚胺漆包线漆及其制备方法
CN102304322B (zh) * 2011-08-31 2013-07-31 蚌埠市英路光电有限公司 一种耐热聚酯亚胺漆包线漆及其制备方法
US9181628B2 (en) * 2011-09-14 2015-11-10 Prc-Desoto International, Inc. Coating/sealant systems, aqueous resinous dispersions, and methods of electrocoating
CN102559014B (zh) * 2011-12-14 2014-05-28 东华大学 一种电动工具转子用无溶剂滴浸漆及其制备方法
RU2573003C2 (ru) * 2013-11-28 2016-01-20 Российская Федерация, от имени которой выступает Министерство промышленности и торговли Российской Федерации (Минпромторг России) Эпоксивинилэфирная смола и огнестойкий полимерный композиционный материал на ее основе
RU2569537C1 (ru) * 2014-09-19 2015-11-27 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Комсомольский-на-Амуре государственный технический университет" (ФГБОУ ВПО "КнАГТУ") Способ получения слоистого пластика
US9534108B2 (en) 2015-03-13 2017-01-03 Chemtura Corporation Flame retardant epoxy resins comprising phosphorus containing flame retardants
CN108191840B (zh) * 2017-12-13 2020-11-24 华南理工大学 一种含六氢三嗪结构环氧树脂预聚物及其制备方法
CN109400957B (zh) * 2018-07-19 2020-11-27 中国科学院宁波材料技术与工程研究所 一种生物碱磷酸盐阻燃剂及其制备方法
US20220056261A1 (en) * 2019-03-28 2022-02-24 Safran Cabin Inc. Fire retardant epoxy resin
US20240101755A1 (en) * 2019-10-18 2024-03-28 Toray Industries, Inc. Flame retardant epoxy resin composition
US20240093003A1 (en) * 2019-10-18 2024-03-21 Toray Industries, Inc. Flame retardant composition, prepreg, and fiber reinforced composite material

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Also Published As

Publication number Publication date
JPH08507814A (ja) 1996-08-20
HU9502639D0 (en) 1995-11-28
HU213902B (en) 1997-11-28
FI954321A0 (fi) 1995-09-14
TW261622B (fi) 1995-11-01
EP0689560A1 (de) 1996-01-03
FI954292A0 (fi) 1995-09-13
PL175777B1 (pl) 1999-02-26
PL310630A1 (en) 1995-12-27
KR960701118A (ko) 1996-02-24
WO1994021706A1 (de) 1994-09-29
FI107612B (fi) 2001-09-14
CN1046949C (zh) 1999-12-01
US5648171A (en) 1997-07-15
HUT73149A (en) 1996-06-28
PL176714B1 (pl) 1999-07-30
HUT73868A (en) 1996-10-28
DE59403119D1 (de) 1997-07-17
CA2158366A1 (en) 1994-09-29
CZ240095A3 (en) 1996-01-17
KR960701115A (ko) 1996-02-24
PL310629A1 (en) 1995-12-27
EP0689559A1 (de) 1996-01-03
CZ287737B6 (en) 2001-01-17
WO1994021705A1 (de) 1994-09-29
CN1119444A (zh) 1996-03-27
EP0689559B1 (de) 1997-06-11
RU2126426C1 (ru) 1999-02-20
CN1119447A (zh) 1996-03-27
CZ224695A3 (en) 1996-01-17
JPH08507813A (ja) 1996-08-20
TW261623B (fi) 1995-11-01
HU214671B (hu) 1998-04-28
CA2158362A1 (en) 1994-09-29
KR100304600B1 (ko) 2001-11-22
FI954292A (fi) 1995-09-13
ATE154369T1 (de) 1997-06-15
DE4340834A1 (de) 1994-09-22
HU9502671D0 (en) 1995-11-28
RU2116323C1 (ru) 1998-07-27

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