TW200508271A - Phosphorus-modified epoxy resin - Google Patents
Phosphorus-modified epoxy resinInfo
- Publication number
- TW200508271A TW200508271A TW093100057A TW93100057A TW200508271A TW 200508271 A TW200508271 A TW 200508271A TW 093100057 A TW093100057 A TW 093100057A TW 93100057 A TW93100057 A TW 93100057A TW 200508271 A TW200508271 A TW 200508271A
- Authority
- TW
- Taiwan
- Prior art keywords
- phosphorus
- epoxy resin
- modified epoxy
- polyepoxide
- weight
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
- C08G59/1405—Polycondensates modified by chemical after-treatment with inorganic compounds
- C08G59/1422—Polycondensates modified by chemical after-treatment with inorganic compounds containing phosphorus
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
- C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
- C08G59/1488—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing phosphorus
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
- C08G59/304—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing phosphorus
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49894—Materials of the insulating layers or coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Epoxy Resins (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Abstract
The invention relates to a phosphorus-modified epoxy resin, to a method for producing the same, and to a phosphorus-modified epoxy resin and to its use. The aim of the invention is to provide a phosphorus-modified epoxy resin that can be produced in a simple manner and that has excellent fire-retardant properties while being temperature and moisture resistant. The phosphorus-modified epoxy resin is produced by reacting at least one polyepoxide having at least two epoxide groups with, based on 100 % by weight of the polyepoxide, 5 to 50 % by weight of polyphenylene methylphosphonate having a molecular weight of 500 to 20000 g/mol at a temperature of 80 DEG C to 150 DEG, preferably 130 DEG C to 140 DEG C, and a reaction time of 0.5 to 6 hours. The reaction is substantially carried out in the melt of the polyepoxide.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2003100462 DE10300462A1 (en) | 2003-01-07 | 2003-01-07 | Phosphorus modified epoxy resin |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200508271A true TW200508271A (en) | 2005-03-01 |
TWI301841B TWI301841B (en) | 2008-10-11 |
Family
ID=32519747
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW93100057A TWI301841B (en) | 2003-01-07 | 2004-01-02 | Phosphormodifiziertes epoxidharz |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1583788A1 (en) |
DE (1) | DE10300462A1 (en) |
TW (1) | TWI301841B (en) |
WO (1) | WO2004060957A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101679675B (en) * | 2007-06-14 | 2013-06-05 | 巴斯夫欧洲公司 | Flame retardant compositions |
CN101831139B (en) * | 2009-03-11 | 2013-08-28 | 联茂电子股份有限公司 | Epoxy resin compound and film and substrate made from same |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20060019547A (en) * | 2003-05-22 | 2006-03-03 | 슈프레스타 엘엘씨 | Polyphosphonate flame retardant curing agent for epoxy resin |
CA2561582A1 (en) * | 2004-04-01 | 2005-12-15 | Sergei V. Levchik | Low heat release and low smoke reinforcing fiber/epoxy composites |
US7910665B2 (en) | 2004-05-19 | 2011-03-22 | Icl-Ip America Inc. | Composition of epoxy resin and epoxy-reactive polyphosphonate |
AU2016380284B2 (en) * | 2015-12-30 | 2021-10-28 | Cytec Industries Inc. | Multifunctional surfacing material with burn-through resistance |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2925207A1 (en) * | 1979-06-22 | 1981-01-29 | Bayer Ag | THERMOPLASTIC, BRANCHED, AROMATIC POLYPHOSPHONATES, THEIR USE AND A METHOD FOR THE PRODUCTION THEREOF |
KR100271050B1 (en) * | 1995-06-27 | 2001-03-02 | 우찌가사끼 이사오 | Epoxy resin composition for printed wiring board and laminated board produced wiht the use of the same |
DE19608611A1 (en) * | 1996-03-06 | 1997-09-11 | Hoechst Ag | Phosphorus-modified coating compositions, a process for their preparation and their use |
JPH1180178A (en) * | 1997-09-12 | 1999-03-26 | Hitachi Chem Co Ltd | Oligomer terminated with phosphorus-containing phenol and its production |
KR100904566B1 (en) * | 2001-10-04 | 2009-06-25 | 슈프레스타 엘엘씨 | Oligomeric, hydroxy-terminated phosphonates and a composition comprising the same |
-
2003
- 2003-01-07 DE DE2003100462 patent/DE10300462A1/en not_active Withdrawn
-
2004
- 2004-01-02 TW TW93100057A patent/TWI301841B/en not_active IP Right Cessation
- 2004-01-06 WO PCT/EP2004/000023 patent/WO2004060957A1/en active Application Filing
- 2004-01-06 EP EP04700258A patent/EP1583788A1/en not_active Ceased
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101679675B (en) * | 2007-06-14 | 2013-06-05 | 巴斯夫欧洲公司 | Flame retardant compositions |
TWI450921B (en) * | 2007-06-14 | 2014-09-01 | Ciba Holding Inc | Flame retardant compositions |
CN101831139B (en) * | 2009-03-11 | 2013-08-28 | 联茂电子股份有限公司 | Epoxy resin compound and film and substrate made from same |
Also Published As
Publication number | Publication date |
---|---|
EP1583788A1 (en) | 2005-10-12 |
DE10300462A1 (en) | 2004-07-15 |
TWI301841B (en) | 2008-10-11 |
WO2004060957A1 (en) | 2004-07-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |