DK0913001T3 - Flerlagsfilmkondensatorstrukturer og fremgangsmåde - Google Patents

Flerlagsfilmkondensatorstrukturer og fremgangsmåde

Info

Publication number
DK0913001T3
DK0913001T3 DK97928073T DK97928073T DK0913001T3 DK 0913001 T3 DK0913001 T3 DK 0913001T3 DK 97928073 T DK97928073 T DK 97928073T DK 97928073 T DK97928073 T DK 97928073T DK 0913001 T3 DK0913001 T3 DK 0913001T3
Authority
DK
Denmark
Prior art keywords
multilayer film
film capacitor
capacitor structures
structures
multilayer
Prior art date
Application number
DK97928073T
Other languages
Danish (da)
English (en)
Inventor
Michael Man-Kuen Watt
Original Assignee
Gennum Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gennum Corp filed Critical Gennum Corp
Application granted granted Critical
Publication of DK0913001T3 publication Critical patent/DK0913001T3/da

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
    • H01L28/40—Capacitors
    • H01L28/60—Electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H01G4/306—Stacked capacitors made by thin film techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
    • H01L27/0805—Capacitors only

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Semiconductor Memories (AREA)
DK97928073T 1996-06-27 1997-06-26 Flerlagsfilmkondensatorstrukturer og fremgangsmåde DK0913001T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/671,057 US5745335A (en) 1996-06-27 1996-06-27 Multi-layer film capacitor structures and method

Publications (1)

Publication Number Publication Date
DK0913001T3 true DK0913001T3 (da) 2004-06-28

Family

ID=24692974

Family Applications (1)

Application Number Title Priority Date Filing Date
DK97928073T DK0913001T3 (da) 1996-06-27 1997-06-26 Flerlagsfilmkondensatorstrukturer og fremgangsmåde

Country Status (7)

Country Link
US (1) US5745335A (fr)
EP (2) EP1408537A3 (fr)
JP (3) JP2000514243A (fr)
AU (1) AU3250097A (fr)
DE (1) DE69727809T2 (fr)
DK (1) DK0913001T3 (fr)
WO (1) WO1998000871A1 (fr)

Families Citing this family (95)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998057341A1 (fr) * 1997-06-10 1998-12-17 Usf Filtration And Separations Group, Inc. Condensateur et procede de fabrication
US5978206A (en) * 1997-09-30 1999-11-02 Hewlett-Packard Company Stacked-fringe integrated circuit capacitors
US6727535B1 (en) 1998-11-09 2004-04-27 Paratek Microwave, Inc. Ferroelectric varactor with built-in DC blocks
EP1135825B1 (fr) * 1998-11-09 2005-04-27 Paratek Microwave, Inc. Varactor ferroelectrique a condensateurs de blocage dc integres
DE69932917D1 (de) * 1999-04-09 2006-10-05 St Microelectronics Nv Schichtförmige Kondensatorvorrichtung
SE513809C2 (sv) * 1999-04-13 2000-11-06 Ericsson Telefon Ab L M Avstämbara mikrovågsanordningar
JP3701138B2 (ja) * 1999-04-23 2005-09-28 松下電器産業株式会社 電子部品の製造方法
FR2801425B1 (fr) * 1999-11-18 2004-05-28 St Microelectronics Sa Capacite integree a dielectrique hybride
US6370013B1 (en) * 1999-11-30 2002-04-09 Kyocera Corporation Electric element incorporating wiring board
US6801422B2 (en) 1999-12-28 2004-10-05 Intel Corporation High performance capacitor
US6724611B1 (en) * 2000-03-29 2004-04-20 Intel Corporation Multi-layer chip capacitor
US6411494B1 (en) * 2000-04-06 2002-06-25 Gennum Corporation Distributed capacitor
US6970362B1 (en) 2000-07-31 2005-11-29 Intel Corporation Electronic assemblies and systems comprising interposer with embedded capacitors
US6611419B1 (en) 2000-07-31 2003-08-26 Intel Corporation Electronic assembly comprising substrate with embedded capacitors
US6775150B1 (en) * 2000-08-30 2004-08-10 Intel Corporation Electronic assembly comprising ceramic/organic hybrid substrate with embedded capacitors and methods of manufacture
US7327582B2 (en) * 2000-09-21 2008-02-05 Ultrasource, Inc. Integrated thin film capacitor/inductor/interconnect system and method
WO2002025709A2 (fr) 2000-09-21 2002-03-28 Casper Michael D Systeme et procede de condensateurs/inducteurs/interconnexions en couches minces integres
US6890629B2 (en) 2001-09-21 2005-05-10 Michael D. Casper Integrated thin film capacitor/inductor/interconnect system and method
US6549396B2 (en) * 2001-04-19 2003-04-15 Gennum Corporation Multiple terminal capacitor structure
US6577492B2 (en) 2001-07-10 2003-06-10 3M Innovative Properties Company Capacitor having epoxy dielectric layer cured with aminophenylfluorenes
JP2003060054A (ja) 2001-08-10 2003-02-28 Rohm Co Ltd 強誘電体キャパシタを有する半導体装置
US7425877B2 (en) * 2001-09-21 2008-09-16 Ultrasource, Inc. Lange coupler system and method
US6998696B2 (en) 2001-09-21 2006-02-14 Casper Michael D Integrated thin film capacitor/inductor/interconnect system and method
JP2004095638A (ja) * 2002-08-29 2004-03-25 Fujitsu Ltd 薄膜デカップリングキャパシタとその製造方法
DE10260352A1 (de) * 2002-12-20 2004-07-15 Infineon Technologies Ag Verfahren zum Herstellen einer Kondensatoranordnung und Kondensatoranordnung
US8569142B2 (en) * 2003-11-28 2013-10-29 Blackberry Limited Multi-level thin film capacitor on a ceramic substrate and method of manufacturing the same
JP4937495B2 (ja) * 2003-12-25 2012-05-23 新光電気工業株式会社 キャパシタ装置、電子部品実装構造及びキャパシタ装置の製造方法
DE102004026232B4 (de) * 2004-05-28 2006-05-04 Infineon Technologies Ag Verfahren zum Ausbilden einer integrierten Halbleiterschaltungsanordnung
JP2006108291A (ja) * 2004-10-04 2006-04-20 Seiko Epson Corp 強誘電体キャパシタ及びその製造方法、並びに強誘電体メモリ装置
FR2881567A1 (fr) * 2005-02-01 2006-08-04 Commissariat Energie Atomique Condensateur a champ de claquage eleve
JP2006253631A (ja) * 2005-02-14 2006-09-21 Fujitsu Ltd 半導体装置及びその製造方法、キャパシタ構造体及びその製造方法
JP2006228828A (ja) * 2005-02-15 2006-08-31 Seiko Npc Corp キャパシタを有する半導体装置
JP4928748B2 (ja) * 2005-06-27 2012-05-09 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
DE102005044330A1 (de) 2005-09-16 2007-03-29 Epcos Ag Abstimmbarer Kondensator und Schaltung mit einem solchen Kondensator
DE102005056906B4 (de) * 2005-11-29 2010-01-07 Infineon Technologies Ag Integrierte Schaltungsanordnung mit in Reihe geschalteten Kondensatoren und Verwendung
WO2008029361A1 (fr) * 2006-09-06 2008-03-13 Nxp B.V. Circuit integré et utilisaton de celui-ci
JP4889512B2 (ja) * 2007-01-22 2012-03-07 ルネサスエレクトロニクス株式会社 半導体集積回路装置
US7936553B2 (en) * 2007-03-22 2011-05-03 Paratek Microwave, Inc. Capacitors adapted for acoustic resonance cancellation
US8467169B2 (en) * 2007-03-22 2013-06-18 Research In Motion Rf, Inc. Capacitors adapted for acoustic resonance cancellation
JP2008277546A (ja) * 2007-04-27 2008-11-13 Rohm Co Ltd 半導体装置
US7981759B2 (en) * 2007-07-11 2011-07-19 Paratek Microwave, Inc. Local oxidation of silicon planarization for polysilicon layers under thin film structures
WO2009078225A1 (fr) * 2007-12-14 2009-06-25 Murata Manufacturing Co., Ltd. Procédé de fabrication d'un condensateur stratifié en couche mince
JP5282194B2 (ja) * 2008-02-01 2013-09-04 セイコーＮｐｃ株式会社 可変容量装置
JP4660566B2 (ja) * 2008-03-17 2011-03-30 株式会社東芝 不揮発性半導体記憶装置
US20090230446A1 (en) 2008-03-17 2009-09-17 Technology Alliance Group, Inc. Semiconductor device and bypass capacitor module
US7910973B2 (en) 2008-03-17 2011-03-22 Kabushiki Kaisha Toshiba Semiconductor storage device
US8680649B2 (en) * 2008-08-22 2014-03-25 Stmicroelectronics (Tours) Sas Multi-layer film capacitor with tapered film sidewalls
US8242375B2 (en) * 2008-09-18 2012-08-14 United Technologies Corporation Conductive emissions protection
JP2010098067A (ja) 2008-10-15 2010-04-30 Toshiba Corp 半導体装置
US8194387B2 (en) 2009-03-20 2012-06-05 Paratek Microwave, Inc. Electrostrictive resonance suppression for tunable capacitors
JP5267268B2 (ja) 2009-03-26 2013-08-21 Ｔｄｋ株式会社 薄膜コンデンサ及びその製造方法
US9908817B2 (en) 2009-06-02 2018-03-06 Uchicago Argonne, Llc Multilayer capacitors, method for making multilayer capacitors
RU2443033C1 (ru) * 2010-12-24 2012-02-20 Владимир Андреевич Степанец Способ управления емкостью электрического конденсатора и конденсатор переменной емкости на основе этого способа
US8842411B2 (en) * 2011-02-23 2014-09-23 Pacesetter, Inc. RF trapezoidal capacitor based EMI feedthru filter assembly
US9082555B2 (en) 2011-08-22 2015-07-14 Micron Technology, Inc. Structure comprising multiple capacitors and methods for forming the structure
KR20130070153A (ko) * 2011-12-19 2013-06-27 에스케이하이닉스 주식회사 반도체 장치의 캐패시터, 레지스터, 메모리 시스템 및 이들의 제조 방법
JP2013207123A (ja) 2012-03-29 2013-10-07 Toshiba Corp 半導体装置
EP2859432A1 (fr) * 2012-06-09 2015-04-15 Johnson Controls Automotive Electronics GmbH Système de capteur capacitif et écran tactile comprenant un système de capteur capacitif
US9299498B2 (en) * 2012-11-15 2016-03-29 Eulex Corp. Miniature wire-bondable capacitor
US9041148B2 (en) * 2013-06-13 2015-05-26 Qualcomm Incorporated Metal-insulator-metal capacitor structures
KR101537717B1 (ko) * 2013-09-17 2015-07-20 신유선 임베디드용 적층 세라믹 캐패시터 및 임베디드용 적층 세라믹 캐패시터의 제조 방법
US20150125342A1 (en) * 2013-11-06 2015-05-07 Kimberly-Clark Worldwide, Inc. Controlled Retention and Removal of Biomaterials and Microbes
CN103745828B (zh) * 2013-11-25 2016-09-28 大连天壹电子有限公司 干式积层陶瓷电容器的漏电流特性改善方法
FR3022072B1 (fr) 2014-06-10 2017-08-25 Commissariat Energie Atomique Dispositif electrique multicouches
US20160181233A1 (en) * 2014-12-23 2016-06-23 Qualcomm Incorporated Metal-insulator-metal (mim) capacitors arranged in a pattern to reduce inductance, and related methods
JP2016162904A (ja) * 2015-03-03 2016-09-05 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
US10115527B2 (en) 2015-03-09 2018-10-30 Blackberry Limited Thin film dielectric stack
WO2016205078A2 (fr) * 2015-06-15 2016-12-22 Sandisk Technologies Llc Dispositifs passifs pour intégration avec dispositifs de mémoire en trois dimensions
US9673271B2 (en) 2015-10-12 2017-06-06 Qorvo Us, Inc. Adaptive capacitors with reduced variation in value and in-line methods for making same
KR101872582B1 (ko) 2016-03-22 2018-06-28 삼성전기주식회사 적층 세라믹 커패시터 및 그 제조 방법
US10297658B2 (en) 2016-06-16 2019-05-21 Blackberry Limited Method and apparatus for a thin film dielectric stack
US10297389B2 (en) 2016-07-28 2019-05-21 Samsung Electro-Mechanics Co., Ltd. Thin-film capacitor having asymmetric shaped vias
US10468187B2 (en) 2016-08-05 2019-11-05 Samsung Electro-Mechanics Co., Ltd. Thin-film ceramic capacitor having capacitance forming portions separated by separation slit
KR101912282B1 (ko) 2016-08-05 2018-10-29 삼성전기 주식회사 박막 커패시터
KR101853195B1 (ko) 2016-09-01 2018-04-27 삼성전기주식회사 박막 커패시터
JP6805702B2 (ja) 2016-10-11 2020-12-23 Tdk株式会社 薄膜コンデンサ
JP6737118B2 (ja) 2016-10-11 2020-08-05 Tdk株式会社 薄膜コンデンサ
JP2018063989A (ja) 2016-10-11 2018-04-19 Tdk株式会社 薄膜キャパシタ
JP2018073888A (ja) * 2016-10-25 2018-05-10 大日本印刷株式会社 電子部品およびその製造方法
KR101942729B1 (ko) 2016-11-24 2019-01-28 삼성전기 주식회사 박막 커패시터
US10896950B2 (en) 2017-02-27 2021-01-19 Nxp Usa, Inc. Method and apparatus for a thin film dielectric stack
US10497774B2 (en) 2017-10-23 2019-12-03 Blackberry Limited Small-gap coplanar tunable capacitors and methods for manufacturing thereof
US10332687B2 (en) 2017-10-23 2019-06-25 Blackberry Limited Tunable coplanar capacitor with vertical tuning and lateral RF path and methods for manufacturing thereof
US10923286B2 (en) * 2018-02-21 2021-02-16 Nxp Usa, Inc. Method and apparatus for compensating for high thermal expansion coefficient mismatch of a stacked device
JP6988688B2 (ja) * 2018-05-21 2022-01-05 株式会社デンソー 半導体装置
US10615294B2 (en) * 2018-06-13 2020-04-07 Qualcomm Incorporated Variable capacitor
US11004614B2 (en) 2018-12-06 2021-05-11 International Business Machines Corporation Stacked capacitors for use in integrated circuit modules and the like
WO2021138839A1 (fr) * 2020-01-08 2021-07-15 深圳市汇顶科技股份有限公司 Condensateur et son procédé de fabrication
US20220406530A1 (en) * 2020-03-23 2022-12-22 Tdk Corporation Thin film capacitor and electronic circuit module having the same
WO2021193513A1 (fr) * 2020-03-24 2021-09-30 Tdk株式会社 Composant de condensateur et module de circuit électronique le comprenant
TWI744183B (zh) * 2021-02-01 2021-10-21 力晶積成電子製造股份有限公司 電容單元及其製造方法
DE112022001264T5 (de) * 2021-03-29 2023-12-14 Rohm Co., Ltd. Isolator, isoliermodul und gate-treiber
US11990470B2 (en) * 2021-09-24 2024-05-21 International Business Machines Corporation Ferroelectric and paraelectric stack capacitors
JP7385949B2 (ja) 2021-11-08 2023-11-24 ウィズメムズ カンパニー リミテッド トレンチキャパシタ及びその製造方法
US11869725B2 (en) * 2021-11-30 2024-01-09 Texas Instruments Incorporated Multi-stacked capacitor

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4470099A (en) * 1982-09-17 1984-09-04 Matsushita Electric Industrial Co., Ltd. Laminated capacitor
JPH0682783B2 (ja) * 1985-03-29 1994-10-19 三菱電機株式会社 容量およびその製造方法
US4827323A (en) * 1986-01-07 1989-05-02 Texas Instruments Incorporated Stacked capacitor
JPH01120858A (ja) * 1987-11-04 1989-05-12 Mitsubishi Electric Corp 集積回路装置
JP2630421B2 (ja) * 1988-04-30 1997-07-16 富士通株式会社 集積回路装置の製造方法
US4914546A (en) * 1989-02-03 1990-04-03 Micrel Incorporated Stacked multi-polysilicon layer capacitor
JPH0312909A (ja) * 1989-06-12 1991-01-21 Matsushita Electric Ind Co Ltd フィルムコンデンサ
JPH0334580A (ja) * 1989-06-30 1991-02-14 Toshiba Corp 電子部品
JPH04111462A (ja) * 1990-08-31 1992-04-13 Fujitsu Ltd 半導体装置
JPH04207011A (ja) * 1990-11-30 1992-07-29 Toshiba Corp 薄膜コンデンサ部品
US5206788A (en) * 1991-12-12 1993-04-27 Ramtron Corporation Series ferroelectric capacitor structure for monolithic integrated circuits and method
JPH0613258A (ja) * 1991-12-20 1994-01-21 Matsushita Electric Ind Co Ltd 薄膜積層コンデンサのパターン形成方法
US5191510A (en) * 1992-04-29 1993-03-02 Ramtron International Corporation Use of palladium as an adhesion layer and as an electrode in ferroelectric memory devices
US5367430A (en) * 1992-10-21 1994-11-22 Presidio Components, Inc. Monolithic multiple capacitor
JPH06231991A (ja) * 1993-02-04 1994-08-19 Matsushita Electric Ind Co Ltd 薄膜積層コンデンサの製造方法
JPH0745786A (ja) * 1993-08-02 1995-02-14 Tdk Corp 複合集積回路部品
JP3190177B2 (ja) * 1993-06-01 2001-07-23 ティーディーケイ株式会社 積層型セラミックチップコンデンサの製造方法
CN1030158C (zh) * 1993-09-14 1995-10-25 山东大学 多层高压大容量陶瓷电容器及其包封方法和包封专用模具
US5414588A (en) * 1993-09-20 1995-05-09 The Regents Of The University Of California High performance capacitors using nano-structure multilayer materials fabrication
JPH07245232A (ja) * 1994-03-07 1995-09-19 Murata Mfg Co Ltd 積層セラミック電子部品及びその製造方法
US5457598A (en) * 1994-04-08 1995-10-10 Radford; Kenneth C. High capacitance thin film capacitor
JPH07283076A (ja) * 1994-04-15 1995-10-27 Nippon Telegr & Teleph Corp <Ntt> キャパシタ

Also Published As

Publication number Publication date
JP5695628B2 (ja) 2015-04-08
EP1408537A2 (fr) 2004-04-14
AU3250097A (en) 1998-01-21
US5745335A (en) 1998-04-28
EP0913001A1 (fr) 1999-05-06
DE69727809D1 (de) 2004-04-01
WO1998000871A1 (fr) 1998-01-08
DE69727809T2 (de) 2005-01-13
EP0913001B1 (fr) 2004-02-25
JP2000514243A (ja) 2000-10-24
JP5225879B2 (ja) 2013-07-03
JP2009152621A (ja) 2009-07-09
JP2013055344A (ja) 2013-03-21
EP1408537A3 (fr) 2004-07-07

Similar Documents

Publication Publication Date Title
DK0913001T3 (da) Flerlagsfilmkondensatorstrukturer og fremgangsmåde
DE69739294D1 (de) Heissschrumpfbare Mehrschichtfolie
DE69606811D1 (de) Mehrschichtfolie
DE69738424D1 (de) Mehrschichtstruktur
DE69721511D1 (de) Mehrschichtiger polyesterfilm
BR9609314A (pt) Película de multicamadas
DE69733792D1 (de) Vielschichtkondensator
DE69842131D1 (de) Vielschichtkondensator
DE69837516D1 (de) Vielschichtkondensator
DK1011527T3 (da) Rörformet flerlagskompositstruktur og fremstillingsfremgangsmåde
DE69736600D1 (de) Hermetisch heisssiegelbarer film und herstellungsverfahren
DE69709462T2 (de) Metallfilm-Kondensator
DE69624888D1 (de) Vielschicht-Durchführungskondensator
DK0707781T3 (da) Faststofkondensator og mikrofonanordninger
NO970762L (no) Brönnstrengskjötlokalisator og fremgangsmåte derved
DE69632355D1 (de) Laminatgegenstand und Fluor-enthaltende Klebstofffolie daraus
NO984031D0 (no) Bµreelement og fremgangsmÕte for fremstilling av samme
FI950739A0 (fi) Saumatavissa oleva monikerroksinen polyolefiinikalvo, menetelmä sen valmistamiseksi sekä sen käyttö
DK0741005T3 (da) Kompositfilm og anvendelse deraf
DE69740177D1 (de) Mehrschichtkörper enthaltend hydroxy-phenoxyether- und polyesterschichten
DE69703151D1 (de) Mehrschicht karte
KR960010909A (ko) 박막형성장치 및 박막형성방법
DE59711803D1 (de) Mono- oder Mehrschichtfilm
DE69602107D1 (de) Mehrschichtiger Fotorezeptor
KR960009003A (ko) 박막형성방법 및 장치