DE69628767D1 - Packung einer Halbleitereinheit, Packungsmethode einer Halbleitereinheit und Einkapselungsmasse für eine Packung einer Halbleitereinheit - Google Patents
Packung einer Halbleitereinheit, Packungsmethode einer Halbleitereinheit und Einkapselungsmasse für eine Packung einer HalbleitereinheitInfo
- Publication number
- DE69628767D1 DE69628767D1 DE69628767T DE69628767T DE69628767D1 DE 69628767 D1 DE69628767 D1 DE 69628767D1 DE 69628767 T DE69628767 T DE 69628767T DE 69628767 T DE69628767 T DE 69628767T DE 69628767 D1 DE69628767 D1 DE 69628767D1
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor unit
- package
- packaging method
- encapsulation compound
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
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- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
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- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/0665—Epoxy resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1277995 | 1995-01-30 | ||
JP1277995 | 1995-01-30 | ||
JP14437395 | 1995-06-12 | ||
JP14437395 | 1995-06-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69628767D1 true DE69628767D1 (de) | 2003-07-24 |
DE69628767T2 DE69628767T2 (de) | 2004-02-12 |
Family
ID=26348441
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69628767T Expired - Lifetime DE69628767T2 (de) | 1995-01-30 | 1996-01-30 | Packung einer Halbleitereinheit, Packungsmethode einer Halbleitereinheit und Einkapselungsmasse für eine Packung einer Halbleitereinheit |
Country Status (4)
Country | Link |
---|---|
US (1) | US5641996A (de) |
EP (3) | EP1154470A3 (de) |
KR (1) | KR0181615B1 (de) |
DE (1) | DE69628767T2 (de) |
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1996
- 1996-01-25 KR KR1019960001634A patent/KR0181615B1/ko not_active IP Right Cessation
- 1996-01-29 US US08/593,675 patent/US5641996A/en not_active Expired - Lifetime
- 1996-01-30 EP EP01114366A patent/EP1154470A3/de not_active Ceased
- 1996-01-30 EP EP98113704A patent/EP0878839B1/de not_active Expired - Lifetime
- 1996-01-30 DE DE69628767T patent/DE69628767T2/de not_active Expired - Lifetime
- 1996-01-30 EP EP96101286A patent/EP0724289A3/de not_active Ceased
Also Published As
Publication number | Publication date |
---|---|
EP0878839A1 (de) | 1998-11-18 |
EP1154470A2 (de) | 2001-11-14 |
DE69628767T2 (de) | 2004-02-12 |
EP0724289A2 (de) | 1996-07-31 |
EP1154470A3 (de) | 2001-12-19 |
US5641996A (en) | 1997-06-24 |
EP0878839B1 (de) | 2003-06-18 |
EP0724289A3 (de) | 1996-12-04 |
KR0181615B1 (ko) | 1999-04-15 |
KR960030354A (ko) | 1996-08-17 |
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