KR930024366U - 반도체 패키지용 리드프레임 패들 - Google Patents
반도체 패키지용 리드프레임 패들Info
- Publication number
- KR930024366U KR930024366U KR2019920005848U KR920005848U KR930024366U KR 930024366 U KR930024366 U KR 930024366U KR 2019920005848 U KR2019920005848 U KR 2019920005848U KR 920005848 U KR920005848 U KR 920005848U KR 930024366 U KR930024366 U KR 930024366U
- Authority
- KR
- South Korea
- Prior art keywords
- semiconductor package
- leadframe paddle
- leadframe
- paddle
- package
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR92005848U KR950006232Y1 (ko) | 1992-04-09 | 1992-04-09 | 반도체 패키지용 리드프레임 패들 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR92005848U KR950006232Y1 (ko) | 1992-04-09 | 1992-04-09 | 반도체 패키지용 리드프레임 패들 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR930024366U true KR930024366U (ko) | 1993-11-27 |
| KR950006232Y1 KR950006232Y1 (ko) | 1995-08-04 |
Family
ID=19331536
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR92005848U KR950006232Y1 (ko) | 1992-04-09 | 1992-04-09 | 반도체 패키지용 리드프레임 패들 |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR950006232Y1 (ko) |
-
1992
- 1992-04-09 KR KR92005848U patent/KR950006232Y1/ko not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR950006232Y1 (ko) | 1995-08-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E902 | Notification of reason for refusal | ||
| AMND | Amendment | ||
| E601 | Decision to refuse application | ||
| J2X1 | Appeal (before the patent court) |
Free format text: APPEAL AGAINST DECISION TO DECLINE REFUSAL |
|
| B701 | Decision to grant | ||
| REGI | Registration of establishment | ||
| FPAY | Annual fee payment |
Payment date: 20040719 Year of fee payment: 10 |
|
| LAPS | Lapse due to unpaid annual fee |