DE69232894T2 - Herstellungsverfahren fuer zweischichtenband vom tab-typ - Google Patents

Herstellungsverfahren fuer zweischichtenband vom tab-typ

Info

Publication number
DE69232894T2
DE69232894T2 DE69232894T DE69232894T DE69232894T2 DE 69232894 T2 DE69232894 T2 DE 69232894T2 DE 69232894 T DE69232894 T DE 69232894T DE 69232894 T DE69232894 T DE 69232894T DE 69232894 T2 DE69232894 T2 DE 69232894T2
Authority
DE
Germany
Prior art keywords
film
polyamic acid
tab
layer
imidization
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69232894T
Other languages
German (de)
English (en)
Other versions
DE69232894D1 (de
Inventor
S. Mikami
T. Nakao
E. Takeuchi
T. Tochimoto
Y. Yamamori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP12564791A external-priority patent/JP2633999B2/ja
Priority claimed from JP3125646A external-priority patent/JP2862101B2/ja
Priority claimed from JP3205009A external-priority patent/JP3040545B2/ja
Priority claimed from JP3239723A external-priority patent/JPH0582927A/ja
Priority claimed from JP23972191A external-priority patent/JPH0582925A/ja
Priority claimed from JP03246401A external-priority patent/JP3097927B2/ja
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Publication of DE69232894D1 publication Critical patent/DE69232894D1/de
Application granted granted Critical
Publication of DE69232894T2 publication Critical patent/DE69232894T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1056—Perforating lamina
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1056—Perforating lamina
    • Y10T156/1057—Subsequent to assembly of laminae

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Wire Bonding (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
DE69232894T 1991-03-12 1992-03-11 Herstellungsverfahren fuer zweischichtenband vom tab-typ Expired - Fee Related DE69232894T2 (de)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP12564791A JP2633999B2 (ja) 1991-03-12 1991-03-12 ２層ｔａｂテープの製造方法
JP3125646A JP2862101B2 (ja) 1991-03-12 1991-03-12 ２層ｔａｂテープの製造方法
JP3205009A JP3040545B2 (ja) 1991-05-15 1991-05-15 ２層ｔａｂテープの製造方法
JP3239723A JPH0582927A (ja) 1991-09-19 1991-09-19 ポリアミツク酸フイルム
JP23972191A JPH0582925A (ja) 1991-09-19 1991-09-19 ポリアミツク酸フイルム及びその製造方法
JP03246401A JP3097927B2 (ja) 1991-09-26 1991-09-26 ２層ｔａｂテープの製造方法
PCT/JP1992/000286 WO1992016970A1 (fr) 1991-03-12 1992-03-11 Procede pour la fabrication de bandes bicouches de type tab

Publications (2)

Publication Number Publication Date
DE69232894D1 DE69232894D1 (de) 2003-02-20
DE69232894T2 true DE69232894T2 (de) 2003-11-20

Family

ID=27552677

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69232894T Expired - Fee Related DE69232894T2 (de) 1991-03-12 1992-03-11 Herstellungsverfahren fuer zweischichtenband vom tab-typ

Country Status (5)

Country Link
US (1) US5507903A (https=)
EP (1) EP0529097B1 (https=)
KR (1) KR100229637B1 (https=)
DE (1) DE69232894T2 (https=)
WO (1) WO1992016970A1 (https=)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5561085A (en) * 1994-12-19 1996-10-01 Martin Marietta Corporation Structure for protecting air bridges on semiconductor chips from damage
JP3520186B2 (ja) * 1996-09-30 2004-04-19 東芝マイクロエレクトロニクス株式会社 フィルムキャリアテープの製造方法、フィルムキャリアテープの製造装置
US6432511B1 (en) * 1997-06-06 2002-08-13 International Business Machines Corp. Thermoplastic adhesive preform for heat sink attachment
US6146480A (en) * 1999-03-12 2000-11-14 Ga-Tek Inc. Flexible laminate for flexible circuit
DE19955537B4 (de) * 1999-11-18 2006-04-13 Orga Kartensysteme Gmbh Verfahren zur Herstellung eines Trägerelementes für einen IC-Baustein
JP3854479B2 (ja) * 2001-07-23 2006-12-06 株式会社巴川製紙所 Ｔａｂテープの製造方法およびｔａｂテープ用積層フィルム
JP2003101201A (ja) * 2001-09-27 2003-04-04 Nitto Denko Corp フレキシブル回路基板の製造方法およびフレキシブル回路基板
JP3694286B2 (ja) * 2002-10-08 2005-09-14 日東電工株式会社 Ｔａｂ用テープキャリア
JP4200376B2 (ja) * 2004-02-17 2008-12-24 信越化学工業株式会社 フレキシブル金属箔ポリイミド積層板及びその製造方法
US20090142607A1 (en) * 2005-04-04 2009-06-04 Ube Industries Ltd Copper clad laminate
CN100574562C (zh) * 2007-07-06 2009-12-23 富葵精密组件(深圳)有限公司 镂空印刷电路板的制作方法
DE102012111382A1 (de) 2012-11-23 2014-05-28 GAT Gesellschaft für Antriebstechnik mbH Antennenstruktur zur breitbandigen Übertragung elektrischer Signale
TWI462672B (zh) * 2013-02-08 2014-11-21 Ichia Tech Inc 前驅基板、軟性印刷電路板及其製造方法
TWI535768B (zh) * 2014-07-18 2016-06-01 長興材料工業股份有限公司 含溶劑之乾膜及其用途
CN114286507B (zh) * 2022-01-19 2024-03-29 瑞华高科技电子工业园(厦门)有限公司 一种双面fpc及其制作方法

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5615326A (en) * 1979-07-17 1981-02-14 Mitsubishi Plastics Ind Ltd Manufacture of heat-contracting laminated film
JPS56118421A (en) * 1980-02-25 1981-09-17 Nitto Electric Ind Co Ltd Heat-shrinkable polyimide film and production thereof
JPS56130318A (en) * 1980-03-19 1981-10-13 Ube Ind Ltd Preparation of polyimide film
JPS6116534A (ja) * 1984-07-03 1986-01-24 Hitachi Chem Co Ltd 半導体装置の製造法
EP0471386A3 (en) * 1984-11-02 1993-04-21 Amp-Akzo Corporation Process for the preparation of conductive patterns on thermoplastic polymer base substrates
JPS61111182A (ja) * 1984-11-07 1986-05-29 Nitto Electric Ind Co Ltd ポリイミド−金属箔複合フイルムの製法
JPS61245868A (ja) * 1985-04-24 1986-11-01 Hitachi Chem Co Ltd フレキシブルプリント基板の製造法
JPS61296749A (ja) * 1985-06-25 1986-12-27 Toray Silicone Co Ltd 半導体装置用リードフレームの製造方法
DE3684307D1 (de) * 1985-10-31 1992-04-16 Mitsui Toatsu Chemicals Flexibles laminat fur platine fur gedruckte schaltkreise und verfahren zu seiner herstellung.
JPS62236732A (ja) * 1986-04-08 1987-10-16 住友ベークライト株式会社 可撓性印刷回路用基板の製造方法
JPS6321115A (ja) * 1986-07-15 1988-01-28 Hitachi Chem Co Ltd ポリイミドフイルムの製造方法
JPH0753801B2 (ja) * 1986-12-25 1995-06-07 住友ベークライト株式会社 フレキシブルプリント回路用基板の製造方法
JPS6489389A (en) * 1987-09-29 1989-04-03 Sumitomo Electric Industries Manufacture of flexible printed wiring board
JPH01228833A (ja) * 1988-03-08 1989-09-12 Ube Ind Ltd ポリイミド製ハニカムコア及びその製造方法
US5290814A (en) * 1988-11-21 1994-03-01 Burroughs Wellcome Co. Anti-atherosclerotic diaryl compounds
US4857143A (en) * 1988-12-16 1989-08-15 International Business Machines Corp. Wet etching of cured polyimide
JPH02174242A (ja) * 1988-12-27 1990-07-05 Shinko Electric Ind Co Ltd ２層ｔａｂ用テープキャリアの製造方法
JP2746643B2 (ja) * 1989-04-17 1998-05-06 住友ベークライト株式会社 フレキシブルプリント回路板およびその製造方法
JPH0390348A (ja) * 1989-09-01 1991-04-16 Sumitomo Bakelite Co Ltd フレキシブルプリント回路板の製造方法
US5077382A (en) * 1989-10-26 1991-12-31 Occidental Chemical Corporation Copolyimide odpa/bpda/4,4'-oda or p-pda
DE69108919T2 (de) * 1990-01-23 1995-08-24 Tomoegawa Paper Mfg Co Ltd Filmträger für tab.
JPH03222444A (ja) * 1990-01-29 1991-10-01 Hitachi Chem Co Ltd Ｔａｂ用二層式フイルムキャリヤの製造方法
JP3001061B2 (ja) * 1990-04-20 2000-01-17 住友ベークライト株式会社 低線膨張率耐熱性フィルムおよびその製造方法
US5166308A (en) * 1990-04-30 1992-11-24 E. I. Du Pont De Nemours And Company Copolyimide film with improved properties
JPH0437692A (ja) * 1990-05-31 1992-02-07 Sumitomo Metal Ind Ltd 基板の加熱装置
EP0477539B1 (en) * 1990-08-24 1995-11-08 Kanegafuchi Kagaku Kogyo Kabushiki Kaisha Tetracarboxylic acid dianhydrides
US5175240A (en) * 1990-12-17 1992-12-29 E.I. Du Pont De Nemours And Company Aromatic homopolyimide or copolyimide films having low water absorption and high thermal durability
US5196500A (en) * 1990-12-17 1993-03-23 E. I. Du Pont De Nemours And Company Tetrapolyimide film containing benzophenone tetracarboxylic dianhydride
US5219977A (en) * 1990-12-17 1993-06-15 E. I. Du Pont De Nemours And Company Tetrapolyimide film containing oxydipthalic dianhydride
JPH0752744B2 (ja) * 1991-04-04 1995-06-05 チッソ株式会社 リ−ド強度のすぐれたフィルムキャリアの製造方法
JP3115666B2 (ja) * 1991-11-27 2000-12-11 鐘淵化学工業株式会社 Ｔａｂ用テープ
US5242864A (en) * 1992-06-05 1993-09-07 Intel Corporation Polyimide process for protecting integrated circuits
JPH0673349A (ja) * 1992-08-25 1994-03-15 Toray Ind Inc Ｔａｂ用接着剤付きテープ

Also Published As

Publication number Publication date
EP0529097A1 (en) 1993-03-03
WO1992016970A1 (fr) 1992-10-01
DE69232894D1 (de) 2003-02-20
EP0529097B1 (en) 2003-01-15
US5507903A (en) 1996-04-16
EP0529097A4 (https=) 1994-01-26
KR100229637B1 (ko) 1999-11-15

Similar Documents

Publication Publication Date Title
DE69115171T2 (de) Flexible Polyimid-Mehrschichtlaminate und ihre Herstellung.
DE69519919T2 (de) Mehrschichtfilm aus aromatischen Polyimid ohne Klebstoff
DE69232894T2 (de) Herstellungsverfahren fuer zweischichtenband vom tab-typ
DE69938322T2 (de) Mit Harz beschichtete Verbundfolie, ihre Herstellung und Verwendung
DE68925490T2 (de) Flexible Grundmaterialen für Leiterplatten
DE3650656T2 (de) Polyimide und diese enthaltende hitzebeständige klebemittel
DE69225418T2 (de) Mehrlagen-Leiterplattenstruktur und Verfahren zur Herstellung mehrlagiger Konstruktionen
DE60016217T2 (de) Polyimidharzzusammensetzung mit verbesserter feuchtigkeitsbeständigkeit, leimlösung, mehrlagiger klebefilm und verfahren zu deren herstellung
DE69120379T2 (de) Verfahren zur Herstellung von einer mit einer Deckschicht überzogenen biegsamen Leiterplatte
DE69125694T2 (de) Tetrapolyimid-Film enthaltend Benzophenon Tetracarboxyl Dianhydrid
DE69423726T2 (de) Polyimid-laminat umfassend ein thermoplastisches polyimidpolymer oder einen thermoplastischen polyimidfilm und verfahren zur herstellung des laminats
DE60100329T2 (de) Polyimidfilm sowie Verfahren zu dessen Herstellung und dessen Verwendung als Substrat für Metallverbindungsplatten
DE102016210892A1 (de) Metallkaschiertes Laminat, Herstellungsverfahren davon, und Verfahren zum Herstellen einer flexiblen Leiterplatte unter Verwendung desselben
DE69026158T2 (de) Gedruckte Schaltung auf flexibler Leiterplatte und Verfahren zu ihrer Herstellung
DE4108986A1 (de) Zusammengeschaltete, mehrschichtige platten und verfahren zu ihrer herstellung
DE69920629T2 (de) Verfahren zur Herstellung einer biegsamen Schaltungsplatte
DE19813669A1 (de) Gebondeter Wafer sowie Verfahren zu seiner Herstellung
DE60120300T2 (de) Polyimidfolie, Verfahren zu ihrer Herstellung, und Metalleiterplatte mit einer Polyimidfolien-Unterlage
DE60124321T2 (de) Polyimidzusammensetzung mit verbessertem abschälwiderstand
DE69016477T2 (de) Hitzebeständige Klebstoffzusammensetzungen und Verfahren zur Bindung damit.
DE69925893T2 (de) Verfahren zur Herstellung einer doppelseitigen flexiblen Leiterplatte
DE69414444T2 (de) Warmehärtbare Harzzusammensetzungen und ihre Verwendung zur Herstellung von Kunstharzgegenständen und Dünnschicht Leiterplatten
DE4007558A1 (de) Mehrschicht-schaltungsplatte, methode zur herstellung derselben und ihre anwendungsmoeglichkeit
DE69320498T2 (de) Verfahren zur Herstellung von Dünnfilm-Leiterplatten
EP0194413A2 (de) Gedrucktes Schaltelement mit Polyimid enthaltender Deckschicht

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee