JPS6489389A - Manufacture of flexible printed wiring board - Google Patents
Manufacture of flexible printed wiring boardInfo
- Publication number
- JPS6489389A JPS6489389A JP24558787A JP24558787A JPS6489389A JP S6489389 A JPS6489389 A JP S6489389A JP 24558787 A JP24558787 A JP 24558787A JP 24558787 A JP24558787 A JP 24558787A JP S6489389 A JPS6489389 A JP S6489389A
- Authority
- JP
- Japan
- Prior art keywords
- flexible printed
- film
- printed board
- board
- applying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Polymerisation Methods In General (AREA)
- Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
PURPOSE:To obtain a flexible printed board excellent in soldering thermal resistance, electric insulation, and wear resistance by polymerizing by plasma an organic silicon monomer under a certain condition, and covering a predetermined part of a circuit board with a plasma polymerized film. CONSTITUTION:A polyimide layer 2 is formed by applying and then heating an aromatic polyimide organic solvent on a board 3 such as copper film. A conductive circuit 4b is formed by patterning the copper film 3. By setting a substrate 5b thus obtained on an anode 12 of a reaction container 11, applying a high-frequency power to a cathode 16, introducing an organic silicon monomer such as, for example, a tetramethyl disiloxane, and coating a predetermined part of the conductive circuit 4b with a monomer polymerized film 6 by means of glow discharge, a flexible printed board 7b is completed. This film 6 is excellent in electric insulation and wear resistance in addition to soldering thermal resistance, adhesion, bending, and flexibility, whereby an excellent flexible printed board can be obtained.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24558787A JPS6489389A (en) | 1987-09-29 | 1987-09-29 | Manufacture of flexible printed wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24558787A JPS6489389A (en) | 1987-09-29 | 1987-09-29 | Manufacture of flexible printed wiring board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6489389A true JPS6489389A (en) | 1989-04-03 |
Family
ID=17135949
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP24558787A Pending JPS6489389A (en) | 1987-09-29 | 1987-09-29 | Manufacture of flexible printed wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6489389A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0529097A1 (en) * | 1991-03-12 | 1993-03-03 | Sumitomo Bakelite Company Limited | Method of manufacturing two-layer tab tape |
FR2726151A1 (en) * | 1994-10-25 | 1996-04-26 | Europ Composants Electron | METHOD AND DEVICE FOR HERMETIC PROTECTION OF ELECTRONIC CIRCUIT |
JP2005272552A (en) * | 2004-03-24 | 2005-10-06 | Tadahiro Omi | Method for producing polymer and polymer material |
WO2011104500A1 (en) * | 2010-02-23 | 2011-09-01 | Semblant Global Limited | Plasma-polymerized polymer coating |
JP2013105786A (en) * | 2011-11-10 | 2013-05-30 | Sumitomo Electric Ind Ltd | Solar light power generation module, solar light power generation panel, and flexible printed wiring board for solar light power generation module |
-
1987
- 1987-09-29 JP JP24558787A patent/JPS6489389A/en active Pending
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0529097A1 (en) * | 1991-03-12 | 1993-03-03 | Sumitomo Bakelite Company Limited | Method of manufacturing two-layer tab tape |
EP0529097A4 (en) * | 1991-03-12 | 1994-01-26 | Sumitomo Bakelite Company Limited | |
US5507903A (en) * | 1991-03-12 | 1996-04-16 | Sumitomo Bakelite Company Limited | Process for producing two-layered tape for tab |
FR2726151A1 (en) * | 1994-10-25 | 1996-04-26 | Europ Composants Electron | METHOD AND DEVICE FOR HERMETIC PROTECTION OF ELECTRONIC CIRCUIT |
EP0710061A1 (en) * | 1994-10-25 | 1996-05-01 | Compagnie Europeenne De Composants Electroniques Lcc | Method and device for hermetic protection of electronic circuit |
JP2005272552A (en) * | 2004-03-24 | 2005-10-06 | Tadahiro Omi | Method for producing polymer and polymer material |
WO2011104500A1 (en) * | 2010-02-23 | 2011-09-01 | Semblant Global Limited | Plasma-polymerized polymer coating |
CN102791779A (en) * | 2010-02-23 | 2012-11-21 | 赛姆布兰特有限公司 | Plasma-polymerized polymer coating |
JP2013105786A (en) * | 2011-11-10 | 2013-05-30 | Sumitomo Electric Ind Ltd | Solar light power generation module, solar light power generation panel, and flexible printed wiring board for solar light power generation module |
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