JPS6489389A - Manufacture of flexible printed wiring board - Google Patents

Manufacture of flexible printed wiring board

Info

Publication number
JPS6489389A
JPS6489389A JP24558787A JP24558787A JPS6489389A JP S6489389 A JPS6489389 A JP S6489389A JP 24558787 A JP24558787 A JP 24558787A JP 24558787 A JP24558787 A JP 24558787A JP S6489389 A JPS6489389 A JP S6489389A
Authority
JP
Japan
Prior art keywords
flexible printed
film
printed board
board
applying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP24558787A
Other languages
Japanese (ja)
Inventor
Koji Hara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP24558787A priority Critical patent/JPS6489389A/en
Publication of JPS6489389A publication Critical patent/JPS6489389A/en
Pending legal-status Critical Current

Links

Landscapes

  • Polymerisation Methods In General (AREA)
  • Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

PURPOSE:To obtain a flexible printed board excellent in soldering thermal resistance, electric insulation, and wear resistance by polymerizing by plasma an organic silicon monomer under a certain condition, and covering a predetermined part of a circuit board with a plasma polymerized film. CONSTITUTION:A polyimide layer 2 is formed by applying and then heating an aromatic polyimide organic solvent on a board 3 such as copper film. A conductive circuit 4b is formed by patterning the copper film 3. By setting a substrate 5b thus obtained on an anode 12 of a reaction container 11, applying a high-frequency power to a cathode 16, introducing an organic silicon monomer such as, for example, a tetramethyl disiloxane, and coating a predetermined part of the conductive circuit 4b with a monomer polymerized film 6 by means of glow discharge, a flexible printed board 7b is completed. This film 6 is excellent in electric insulation and wear resistance in addition to soldering thermal resistance, adhesion, bending, and flexibility, whereby an excellent flexible printed board can be obtained.
JP24558787A 1987-09-29 1987-09-29 Manufacture of flexible printed wiring board Pending JPS6489389A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24558787A JPS6489389A (en) 1987-09-29 1987-09-29 Manufacture of flexible printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24558787A JPS6489389A (en) 1987-09-29 1987-09-29 Manufacture of flexible printed wiring board

Publications (1)

Publication Number Publication Date
JPS6489389A true JPS6489389A (en) 1989-04-03

Family

ID=17135949

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24558787A Pending JPS6489389A (en) 1987-09-29 1987-09-29 Manufacture of flexible printed wiring board

Country Status (1)

Country Link
JP (1) JPS6489389A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0529097A1 (en) * 1991-03-12 1993-03-03 Sumitomo Bakelite Company Limited Method of manufacturing two-layer tab tape
FR2726151A1 (en) * 1994-10-25 1996-04-26 Europ Composants Electron METHOD AND DEVICE FOR HERMETIC PROTECTION OF ELECTRONIC CIRCUIT
JP2005272552A (en) * 2004-03-24 2005-10-06 Tadahiro Omi Method for producing polymer and polymer material
WO2011104500A1 (en) * 2010-02-23 2011-09-01 Semblant Global Limited Plasma-polymerized polymer coating
JP2013105786A (en) * 2011-11-10 2013-05-30 Sumitomo Electric Ind Ltd Solar light power generation module, solar light power generation panel, and flexible printed wiring board for solar light power generation module

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0529097A1 (en) * 1991-03-12 1993-03-03 Sumitomo Bakelite Company Limited Method of manufacturing two-layer tab tape
EP0529097A4 (en) * 1991-03-12 1994-01-26 Sumitomo Bakelite Company Limited
US5507903A (en) * 1991-03-12 1996-04-16 Sumitomo Bakelite Company Limited Process for producing two-layered tape for tab
FR2726151A1 (en) * 1994-10-25 1996-04-26 Europ Composants Electron METHOD AND DEVICE FOR HERMETIC PROTECTION OF ELECTRONIC CIRCUIT
EP0710061A1 (en) * 1994-10-25 1996-05-01 Compagnie Europeenne De Composants Electroniques Lcc Method and device for hermetic protection of electronic circuit
JP2005272552A (en) * 2004-03-24 2005-10-06 Tadahiro Omi Method for producing polymer and polymer material
WO2011104500A1 (en) * 2010-02-23 2011-09-01 Semblant Global Limited Plasma-polymerized polymer coating
CN102791779A (en) * 2010-02-23 2012-11-21 赛姆布兰特有限公司 Plasma-polymerized polymer coating
JP2013105786A (en) * 2011-11-10 2013-05-30 Sumitomo Electric Ind Ltd Solar light power generation module, solar light power generation panel, and flexible printed wiring board for solar light power generation module

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