SU1004485A1 - Method for making thin-film resistors on flexible support - Google Patents
Method for making thin-film resistors on flexible support Download PDFInfo
- Publication number
- SU1004485A1 SU1004485A1 SU813294604A SU3294604A SU1004485A1 SU 1004485 A1 SU1004485 A1 SU 1004485A1 SU 813294604 A SU813294604 A SU 813294604A SU 3294604 A SU3294604 A SU 3294604A SU 1004485 A1 SU1004485 A1 SU 1004485A1
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- elements
- resistive
- film resistors
- formation
- conductive elements
- Prior art date
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Description
(54) СПОСОБ ИЗГОТОВЛЕНИЯ ТОНКОПЛЕНОЧНЫХ РЕЗИСТОРОВ НА ГИБКОЙ ПОДЛОЖКЕ(54) METHOD OF MANUFACTURING THIN-FILM RESISTORS ON A FLEXIBLE SUBSTRATE
Изобретение относитс к микроэлектронике и может быть использовано в производстве радиоэлектронной аппаратуры при изготовлении микросхем частного применени , дискретных тонкопленочных резисторов на гибкой подложке из полиимидной пленки..The invention relates to microelectronics and can be used in the manufacture of electronic equipment in the manufacture of private circuits, discrete thin-film resistors on a flexible substrate made of polyimide film ..
Известен способ изготовлени тонкопленочных резисторов на пластмассовой пленке из полиимида или фторопласта , при котором пленка покрываетс с обеих сторон сло ми нихрома толщиной 0,002 мкм, а затем слоем меди толщиной до 20 мкм. Нанесение покрытий осуществл етс электронным лучом, а травлением создаютс резистивные элементы и соединени между ними. Значени поверхностного сопроIтивлени лежат в пределах 20-300 Ом на квадрат (Ом/п) C IЭтот способ не позвол ет получать высокоомные резисторы.A known method of manufacturing thin film resistors on a plastic film of polyimide or fluoroplastic, in which the film is covered on both sides with a layer of nichrome 0.002 µm thick, and then a layer of copper up to 20 µm thick. The coating is carried out with an electron beam, and the resistive elements and the connections between them are created by etching. The surface resistance values are in the range of 20-300 ohms per square (ohm / n). CI This method does not allow to obtain high-resistance resistors.
Из известных технических решений наиболее близким к изобретению по технической сущности вл етс способ изготовлени тонкопленочных резисторов на гибкой подложке, в,ключак ций формирование резйстивных элементов, реперных знаков и провод щих элементов r2LOf the known technical solutions, the closest to the invention in its technical essence is a method of manufacturing thin-film resistors on a flexible substrate, in particular, the formation of resistive elements, reference marks and conducting elements r2L
Недостаток этого способа - большой разброс номиналов резисторов.The disadvantage of this method is a large variation of resistor values.
Цель изобретени - уменыиение разброса номиналов резисторов.The purpose of the invention is to reduce the spread of resistors.
Поставленна цель достигаетс тем, что в способе изготовлени тонкопленочных резисторов на гибкой подложке , включающем формирование резистинных элементов,, реперных знаков и This goal is achieved by the fact that in the method of manufacturing thin film resistors on a flexible substrate, including the formation of resistin elements, reference marks and
10 провод щих элементов, формирование резйстивных элементов и реперных знаков осуществл ют локальным осаждением резистивного материала на подложку, после чего маскируют ре15 перные знаки, а провод щие элементы формируют .методом фотолитографии, причем локальное осаждение резистивного материала на подложку осуществл ют через свободную маску.10 of the conductive elements, the formation of the resistive elements and reference marks is carried out by local deposition of the resistive material on the substrate, after which they are masked by recurring signs, and the conductive elements are formed by the photolithography method, the local deposition of the resistive material on the substrate is carried out through a free mask.
2020
Пример. Через свободную маску на полиимидную подложку нанос т методом вакуумного испарени резистив ные элементы и реперные знаки. Маска в данном случае, кроме своей ос25 новной функции, играет роль теплового экрана, предохран ющего подложку от перегрева при нанесении.тугоплавких материалов. Затем маскируют реперные знаки и нанос т слошной про30 вод щий слой.Example. Through a free mask, resistive elements and reference signs are applied by vacuum evaporation onto a polyimide substrate. In this case, the mask, besides its main function, plays the role of a heat shield, which prevents the substrate from overheating when applying heat-melting materials. Then the reference marks are masked and a layer of the conducting layer is applied.
nocjje чего методом фотолитографии с использованием селективных травителей , формируют контактные площадки , соединенные между соевой перекичками дл обрс139вани ; электрической цепи, защищают реэистивные элементы диэлектрической пленкой, производ т гальваническое оса адение металлов, повышающих проводимость и па емость контактных площадок при сборке ГИС и раздел ют гибкуюподпожку на отдельные элементы.nocjje, using the photolithography method using selective etchants, form contact pads connected between soybean perekidik for education; the electrical circuit, protect the resistive elements with a dielectric film, produce galvanic deposition of metals, which increase the conductivity and capacity of the contact pads during the assembly of the GIS and divide the flexible support into separate elements.
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SU813294604A SU1004485A1 (en) | 1981-05-19 | 1981-05-19 | Method for making thin-film resistors on flexible support |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SU813294604A SU1004485A1 (en) | 1981-05-19 | 1981-05-19 | Method for making thin-film resistors on flexible support |
Publications (1)
Publication Number | Publication Date |
---|---|
SU1004485A1 true SU1004485A1 (en) | 1983-03-15 |
Family
ID=20960485
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SU813294604A SU1004485A1 (en) | 1981-05-19 | 1981-05-19 | Method for making thin-film resistors on flexible support |
Country Status (1)
Country | Link |
---|---|
SU (1) | SU1004485A1 (en) |
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1981
- 1981-05-19 SU SU813294604A patent/SU1004485A1/en active
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