SU1004485A1 - Method for making thin-film resistors on flexible support - Google Patents

Description

(54) METHOD OF MANUFACTURING THIN-FILM RESISTORS ON A FLEXIBLE SUBSTRATE

The invention relates to microelectronics and can be used in the manufacture of electronic equipment in the manufacture of private circuits, discrete thin-film resistors on a flexible substrate made of polyimide film ..

A known method of manufacturing thin film resistors on a plastic film of polyimide or fluoroplastic, in which the film is covered on both sides with a layer of nichrome 0.002 µm thick, and then a layer of copper up to 20 µm thick. The coating is carried out with an electron beam, and the resistive elements and the connections between them are created by etching. The surface resistance values are in the range of 20-300 ohms per square (ohm / n). CI This method does not allow to obtain high-resistance resistors.

Of the known technical solutions, the closest to the invention in its technical essence is a method of manufacturing thin-film resistors on a flexible substrate, in particular, the formation of resistive elements, reference marks and conducting elements r2L

The disadvantage of this method is a large variation of resistor values.

The purpose of the invention is to reduce the spread of resistors.

This goal is achieved by the fact that in the method of manufacturing thin film resistors on a flexible substrate, including the formation of resistin elements, reference marks and

10 of the conductive elements, the formation of the resistive elements and reference marks is carried out by local deposition of the resistive material on the substrate, after which they are masked by recurring signs, and the conductive elements are formed by the photolithography method, the local deposition of the resistive material on the substrate is carried out through a free mask.

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Example. Through a free mask, resistive elements and reference signs are applied by vacuum evaporation onto a polyimide substrate. In this case, the mask, besides its main function, plays the role of a heat shield, which prevents the substrate from overheating when applying heat-melting materials. Then the reference marks are masked and a layer of the conducting layer is applied.

nocjje, using the photolithography method using selective etchants, form contact pads connected between soybean perekidik for education; the electrical circuit, protect the resistive elements with a dielectric film, produce galvanic deposition of metals, which increase the conductivity and capacity of the contact pads during the assembly of the GIS and divide the flexible support into separate elements.

Claims (2)

; The method of manufacturing thin-film resistors increases the percentage of yield of products on flexible priming due to: reducing the thermal effect on the material of the flexible substrate during the alco-temperature process of applying differential elements, making contact pads and conductors using photolithography, which provides an increase in the accuracy of manufacturing and combining the conductive Elements with resistive elements. elements. j claims 1, Method for manufacturing thin-film resistors on a flexible substrate Including the formation of resistive elements, the reference sign of conductive elements, characterized in that, in order to reduce the variation of resistor values, the formation of resistive elements and reference signs is carried out by localizing the resistive material on the BEDS, after which they mask the reference signs, and the conductive elements are formed by photolithography. 2. The method according to claim 1, wherein the local siege. Resistive material is applied to the i substrate through a free mask. Sources of information taken into account in the examination 1.Electronics. M., Mir, v.5.1, No. 15 (541), 1978. 2. Ermolaev Yu.P. and others. Structures and technologists of microcircuits (GIS and VGIS). M., Soviet Radio, 1980, p. 34-38 (prototype).