GB1102832A - Improvements in or relating to the manufacture of thin film modules - Google Patents

Abstract

<PICT:1102832/C6-C7/1> In a method of making a thin film module comprising circuit elements and connections therefor deposited on an insulating substrate, an in-contact mask is formed on the substrate delineating the final pattern to be formed, and discrete masks are used in conjunction with the in-contact mask for the deposition of various materials to form different elements of the circuit. the invention is described with reference to the production of the thin film module depicted in Fig. 1, which comprises a capacitor 2, resistors 6, and conductors 7...10 deposited on a substrate 1 of glass or other suitable material. First a layer of copper is deposited on the surface of the substrate, and is etched to expose the substrate over the area which will ultimately be covered with circuitry; the remaining Cu forms the incontact mask Fig. 2 (not shown). A discrete mask Fig. 3 (not shown) having apertures delineating the bottom plate 3 of capacitor 2 and conductors 8, 9, 10 is placed over the in-contact mask on the substrate 1 and gold is evaporated in vacuo through the mask on to the substrate. This discrete mask is then replaced in turn by other masks Figs. 4, 5, 6 (not shown) through which SiO to form the dielectric of the capacitor, Ni-Cr to form resistors 6, and gold to form the upper capacitor plate 4 and conductor 7, are successively evaporated. Finally the Cu mask is removed by etching.