FR2045025A5 - Thick-film circuits on flat substrates - Google Patents

Thick-film circuits on flat substrates

Info

Publication number
FR2045025A5
FR2045025A5 FR6917681A FR6917681A FR2045025A5 FR 2045025 A5 FR2045025 A5 FR 2045025A5 FR 6917681 A FR6917681 A FR 6917681A FR 6917681 A FR6917681 A FR 6917681A FR 2045025 A5 FR2045025 A5 FR 2045025A5
Authority
FR
France
Prior art keywords
thick
flat substrates
film circuits
substrate
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR6917681A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lignes Telegraphiques et Telephoniques LTT SA
Original Assignee
Lignes Telegraphiques et Telephoniques LTT SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lignes Telegraphiques et Telephoniques LTT SA filed Critical Lignes Telegraphiques et Telephoniques LTT SA
Priority to FR6917681A priority Critical patent/FR2045025A5/en
Priority to BE750510D priority patent/BE750510A/en
Priority to DE19702026488 priority patent/DE2026488B2/en
Application granted granted Critical
Publication of FR2045025A5 publication Critical patent/FR2045025A5/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1142—Conversion of conductive material into insulating material or into dissolvable compound
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

A single masking process with two different consecutive layers of photosensitive material is used. First of all a thin film pattern is formed, by etching, to the desired circuit layout. The remaining portion of the substrate is protected during electrolytic thickening of the circuit pattern. An insulating substrate and a first conductive pattern of vacuum deposited Au are used. An intermediate conductive layer may be formed first e.g. of Ta on a ceramic substrate, the unwanted area of the Ta then being oxidised.
FR6917681A 1969-05-30 1969-05-30 Thick-film circuits on flat substrates Expired FR2045025A5 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FR6917681A FR2045025A5 (en) 1969-05-30 1969-05-30 Thick-film circuits on flat substrates
BE750510D BE750510A (en) 1969-05-30 1970-05-15 IMPROVEMENTS IN THE METHODS OF REALIZING CIRCUITS IN THICK PLANS AND CIRCUITS THUS REALIZED
DE19702026488 DE2026488B2 (en) 1969-05-30 1970-05-29 METHOD FOR PRODUCING PLANE THICK FILM CIRCUITS

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR6917681A FR2045025A5 (en) 1969-05-30 1969-05-30 Thick-film circuits on flat substrates

Publications (1)

Publication Number Publication Date
FR2045025A5 true FR2045025A5 (en) 1971-02-26

Family

ID=9034825

Family Applications (1)

Application Number Title Priority Date Filing Date
FR6917681A Expired FR2045025A5 (en) 1969-05-30 1969-05-30 Thick-film circuits on flat substrates

Country Status (3)

Country Link
BE (1) BE750510A (en)
DE (1) DE2026488B2 (en)
FR (1) FR2045025A5 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL183380C (en) * 1979-12-27 1988-10-03 Asahi Chemical Ind PATTERNED AND THICK LAYER CONTAINING CONDUCTOR CONSTRUCTION AND METHOD FOR MANUFACTURING THESE
JP3896285B2 (en) * 2002-01-24 2007-03-22 三菱電機株式会社 Manufacturing method of semiconductor device

Also Published As

Publication number Publication date
DE2026488B2 (en) 1971-12-23
DE2026488A1 (en) 1970-12-10
BE750510A (en) 1970-10-16

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Legal Events

Date Code Title Description
CL Concession to grant licences
ST Notification of lapse