JPS5760798A - Production of polyimide vibration diaphragm for acoustic apparatus - Google Patents

Production of polyimide vibration diaphragm for acoustic apparatus

Info

Publication number
JPS5760798A
JPS5760798A JP13467080A JP13467080A JPS5760798A JP S5760798 A JPS5760798 A JP S5760798A JP 13467080 A JP13467080 A JP 13467080A JP 13467080 A JP13467080 A JP 13467080A JP S5760798 A JPS5760798 A JP S5760798A
Authority
JP
Japan
Prior art keywords
vibration diaphragm
metallic foil
polyimide
polyamide
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13467080A
Other languages
Japanese (ja)
Other versions
JPS5932960B2 (en
Inventor
Takashi Ishizuka
Yasuhiro Moriyama
Masao Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP13467080A priority Critical patent/JPS5932960B2/en
Publication of JPS5760798A publication Critical patent/JPS5760798A/en
Publication of JPS5932960B2 publication Critical patent/JPS5932960B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Paints Or Removers (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

PURPOSE:To obtain a vibration diaphragm which is superior in acoustic characteristic and can be used in a high power, by forming a polyimide layer on the surface of a metallic foil by coating of a polyamide acid solution and joining the polymide layer and the metallic foil directly. CONSTITUTION:A biphenyl tetracarboxylic dianhydride whose general formula is expressed by formula -1 and an aromatic diamine react in an organic solvent to obtain a polyamide acid solution of >=0.5 intrinsic viscosity. This solution is coated on one side of a metalic foil. Next, this solution is dried by heating to remove the solvent by vaporization, and simultaneously, the polyamide acid is converted to a polyamide to obtain vibration diaphragm material consisting of the metallic foil and a polyamide layer. Next, the metallic foil of obtained diaphragm material is subjected to the etching treatment to form a conductive circuit of a prescribed form. Thus, a thin polyimide layer is formed, and a polyimide vibration diaphragm is obtained which is superior in acoustic and characteristic can be used in a high power.
JP13467080A 1980-09-27 1980-09-27 Manufacturing method of polyimide diaphragm for audio equipment Expired JPS5932960B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13467080A JPS5932960B2 (en) 1980-09-27 1980-09-27 Manufacturing method of polyimide diaphragm for audio equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13467080A JPS5932960B2 (en) 1980-09-27 1980-09-27 Manufacturing method of polyimide diaphragm for audio equipment

Publications (2)

Publication Number Publication Date
JPS5760798A true JPS5760798A (en) 1982-04-12
JPS5932960B2 JPS5932960B2 (en) 1984-08-11

Family

ID=15133809

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13467080A Expired JPS5932960B2 (en) 1980-09-27 1980-09-27 Manufacturing method of polyimide diaphragm for audio equipment

Country Status (1)

Country Link
JP (1) JPS5932960B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109021655A (en) * 2018-07-09 2018-12-18 蒋芳万 A kind of conductive coating and voice coil welding lead technique for voice coil welding lead

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109021655A (en) * 2018-07-09 2018-12-18 蒋芳万 A kind of conductive coating and voice coil welding lead technique for voice coil welding lead

Also Published As

Publication number Publication date
JPS5932960B2 (en) 1984-08-11

Similar Documents

Publication Publication Date Title
US4937133A (en) Flexible base materials for printed circuits
US4508766A (en) Process for producing aromatic imide polymer laminate material
JP4540964B2 (en) Low temperature polyimide adhesive composition
US4411952A (en) Aromatic imide polymer laminate material and method for producing the same
CN107073915A (en) Method for manufacturing flexible substrates
JPH04234191A (en) Soft multilayer polyimide film laminate and their manufacture
JP2005150728A (en) Multilayer substrate having at least two dissimilar polyimide layers and conductive layer, useful for electronics-type applications, and compositions relating thereto
JPS56118421A (en) Heat-shrinkable polyimide film and production thereof
US6852828B2 (en) Poly amic acid system for polyimides
US4746561A (en) Polyimide-containing cover layer for a printed circuit element
JPS5760798A (en) Production of polyimide vibration diaphragm for acoustic apparatus
JPH0152843B2 (en)
JPH06283866A (en) Multilayer circuit board and manufacture thereof
JP2001164006A5 (en)
GB1383985A (en) Film posessing an adhesive coating
JPS6489389A (en) Manufacture of flexible printed wiring board
JPH04266082A (en) Manufacture of flexible wiring substrate
JP2741674B2 (en) Circuit board and method of manufacturing the same
JPH0588850B2 (en)
JPH03129605A (en) Prepreg and application thereof
EP0030641A3 (en) Insulating coating for ceramic substrate and method to form such a coating
JPS63288744A (en) Preparation of metal plate-based laminated plate for printed circuit
SU342423A1 (en)
JPH04267584A (en) Manufacture of flexible printed circuit substrate
JPH0462196B2 (en)