DE69026158T2 - Gedruckte Schaltung auf flexibler Leiterplatte und Verfahren zu ihrer Herstellung - Google Patents
Gedruckte Schaltung auf flexibler Leiterplatte und Verfahren zu ihrer HerstellungInfo
- Publication number
- DE69026158T2 DE69026158T2 DE1990626158 DE69026158T DE69026158T2 DE 69026158 T2 DE69026158 T2 DE 69026158T2 DE 1990626158 DE1990626158 DE 1990626158 DE 69026158 T DE69026158 T DE 69026158T DE 69026158 T2 DE69026158 T2 DE 69026158T2
- Authority
- DE
- Germany
- Prior art keywords
- printed circuit
- manufacture
- circuit board
- flexible printed
- flexible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
- C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
- H01B3/306—Polyimides or polyesterimides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1199130A JPH0362988A (ja) | 1989-07-31 | 1989-07-31 | フレキシブルプリント回路用基板およびその製造法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69026158D1 DE69026158D1 (de) | 1996-05-02 |
DE69026158T2 true DE69026158T2 (de) | 1996-10-02 |
Family
ID=16402640
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE1990626158 Expired - Lifetime DE69026158T2 (de) | 1989-07-31 | 1990-07-09 | Gedruckte Schaltung auf flexibler Leiterplatte und Verfahren zu ihrer Herstellung |
Country Status (4)
Country | Link |
---|---|
US (1) | US5112694A (de) |
EP (1) | EP0411772B1 (de) |
JP (1) | JPH0362988A (de) |
DE (1) | DE69026158T2 (de) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5304626A (en) * | 1988-06-28 | 1994-04-19 | Amoco Corporation | Polyimide copolymers containing 3,3',4,4'-tetracarboxybiphenyl dianhydride (BPDA) moieties |
JPH0513902A (ja) * | 1990-09-04 | 1993-01-22 | Chisso Corp | フレキシブルプリント基板及びその製造法 |
JPH04239637A (ja) * | 1991-01-23 | 1992-08-27 | Chisso Corp | 可撓性両面金属張基板及びその製造方法 |
JPH0752744B2 (ja) * | 1991-04-04 | 1995-06-05 | チッソ株式会社 | リ−ド強度のすぐれたフィルムキャリアの製造方法 |
US5831828A (en) * | 1993-06-03 | 1998-11-03 | International Business Machines Corporation | Flexible circuit board and common heat spreader assembly |
US5362534A (en) * | 1993-08-23 | 1994-11-08 | Parlex Corporation | Multiple layer printed circuit boards and method of manufacture |
US5376232A (en) * | 1993-08-23 | 1994-12-27 | Parlex Corporation | Method of manufacturing a printed circuit board |
JP3565069B2 (ja) | 1998-12-28 | 2004-09-15 | ソニーケミカル株式会社 | 両面フレキシブルプリント基板の製造方法 |
AU4714001A (en) * | 1999-12-23 | 2001-07-03 | Oak-Mitsui Inc. | Method for applying polymer film to a metal foil |
EP1606108B1 (de) | 2003-03-26 | 2015-08-19 | LG Chem Ltd. | Doppelseitiges metalllaminat und herstellungsverfahren dafür |
KR100502177B1 (ko) * | 2003-03-26 | 2005-07-20 | 주식회사 엘지화학 | 양면 금속 적층판 및 그의 제조방법 |
KR100668948B1 (ko) * | 2004-09-21 | 2007-01-12 | 주식회사 엘지화학 | 금속 적층판 및 그의 제조방법 |
JP2006310574A (ja) * | 2005-04-28 | 2006-11-09 | Nippon Kayaku Co Ltd | 両面フレキシブルプリント基板の製造法及び両面フレキシブルプリント基板。 |
CN101208373B (zh) * | 2005-07-21 | 2010-12-01 | 日本化药株式会社 | 聚酰胺树脂,环氧树脂组合物及其固化物 |
KR101312369B1 (ko) * | 2005-10-31 | 2013-09-27 | 니폰 가야꾸 가부시끼가이샤 | 고무 변성 폴리아미드 수지, 에폭시 수지 조성물 및 그경화물 |
TWI297342B (en) * | 2006-01-17 | 2008-06-01 | Ind Tech Res Inst | Thermoplastic polyimide composition and double-sided flexible copper clad laminate using the same |
JP2008062448A (ja) * | 2006-09-05 | 2008-03-21 | Hitachi Chem Co Ltd | フレキシブル積層板及びその製造方法、並びにフレキシブル印刷配線板 |
JP4884298B2 (ja) * | 2007-05-17 | 2012-02-29 | 日本化薬株式会社 | 樹脂層付き銅箔 |
US20090093608A1 (en) * | 2007-10-04 | 2009-04-09 | Saint-Gobain Performance Plastics Corporation | Polyimide material with improved thermal and mechanical properties |
TWI385198B (zh) * | 2008-08-11 | 2013-02-11 | Ind Tech Res Inst | 雙面金屬箔層積層板及其製法 |
WO2011035920A1 (en) * | 2009-09-24 | 2011-03-31 | Corus Technology Bv | A method of preparing a polyetherimide coating on a metallic substrate |
CN102774077B (zh) * | 2012-08-06 | 2016-02-17 | 广东生益科技股份有限公司 | 二层法双面挠性覆铜板及其制作方法 |
TWI466924B (zh) * | 2013-01-23 | 2015-01-01 | Mortech Corp | 聚醯亞胺膜及其聚醯亞胺積層板 |
ES2706228T3 (es) * | 2013-12-17 | 2019-03-27 | Evonik Fibres Gmbh | Polvo de poliimida con elevada estabilidad termooxidativa |
CN103739842B (zh) * | 2013-12-20 | 2016-08-31 | 深圳瑞华泰薄膜科技有限公司 | 一种热塑性聚酰亚胺及用其制备挠性覆铜板的方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57181857A (en) * | 1981-05-06 | 1982-11-09 | Ube Industries | Polyimide laminated material and its manufacture |
US4609700A (en) * | 1985-06-19 | 1986-09-02 | Chisso Corporation | Soluble imide oligomer and a method for producing the same |
EP0266595A3 (de) * | 1986-11-03 | 1989-03-08 | General Electric Company | Flammfeste Zusammensetzungen auf Basis von Polyätherimid |
JPS6418294A (en) * | 1987-07-14 | 1989-01-23 | Sumitomo Bakelite Co | Flexible printed circuit board |
US4937133A (en) * | 1988-03-28 | 1990-06-26 | Nippon Steel Chemical Co., Ltd. | Flexible base materials for printed circuits |
JPH0710583B2 (ja) * | 1988-06-30 | 1995-02-08 | チッソ株式会社 | 可撓性銅張基板 |
JP2609140B2 (ja) * | 1988-11-21 | 1997-05-14 | チッソ株式会社 | 低弾性率ポリイミドおよびその製造法 |
-
1989
- 1989-07-31 JP JP1199130A patent/JPH0362988A/ja active Granted
-
1990
- 1990-07-09 EP EP19900307481 patent/EP0411772B1/de not_active Expired - Lifetime
- 1990-07-09 DE DE1990626158 patent/DE69026158T2/de not_active Expired - Lifetime
- 1990-07-24 US US07/556,408 patent/US5112694A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0411772A3 (en) | 1993-01-27 |
EP0411772A2 (de) | 1991-02-06 |
DE69026158D1 (de) | 1996-05-02 |
JPH0362988A (ja) | 1991-03-19 |
US5112694A (en) | 1992-05-12 |
EP0411772B1 (de) | 1996-03-27 |
JPH0563107B2 (de) | 1993-09-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |