DE69016752D1 - Verfahren zur Herstellung einer flexiblen gedruckten Schaltungsplatte. - Google Patents
Verfahren zur Herstellung einer flexiblen gedruckten Schaltungsplatte.Info
- Publication number
- DE69016752D1 DE69016752D1 DE69016752T DE69016752T DE69016752D1 DE 69016752 D1 DE69016752 D1 DE 69016752D1 DE 69016752 T DE69016752 T DE 69016752T DE 69016752 T DE69016752 T DE 69016752T DE 69016752 D1 DE69016752 D1 DE 69016752D1
- Authority
- DE
- Germany
- Prior art keywords
- making
- circuit board
- printed circuit
- flexible printed
- flexible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
- C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1300639A JP2761655B2 (ja) | 1989-11-17 | 1989-11-17 | フレキシブルプリント基板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69016752D1 true DE69016752D1 (de) | 1995-03-23 |
DE69016752T2 DE69016752T2 (de) | 1995-06-08 |
Family
ID=17887289
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69016752T Expired - Fee Related DE69016752T2 (de) | 1989-11-17 | 1990-11-16 | Verfahren zur Herstellung einer flexiblen gedruckten Schaltungsplatte. |
Country Status (5)
Country | Link |
---|---|
US (1) | US5167985A (de) |
EP (1) | EP0429985B1 (de) |
JP (1) | JP2761655B2 (de) |
CA (1) | CA2030200A1 (de) |
DE (1) | DE69016752T2 (de) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5376209A (en) * | 1991-07-26 | 1994-12-27 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Process for preparing an assembly of an article and a polymide which resists dimensional change, delamination and debonding when exposed to changes in temperature |
JP2000022288A (ja) * | 1998-06-29 | 2000-01-21 | Sony Chem Corp | フレキシブルプリント基板及びその製造方法 |
JP2003008157A (ja) * | 2001-06-26 | 2003-01-10 | Nitto Denko Corp | 配線回路基板用基材および配線回路基板 |
US7943856B2 (en) * | 2007-12-14 | 2011-05-17 | Samsung Electronics Co., Ltd. | Composition for producing printed circuit board and printed circuit board using the same |
JP2010182871A (ja) * | 2009-02-05 | 2010-08-19 | Lintec Corp | 配線回路部材 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1261672B (de) * | 1962-12-04 | 1968-02-22 | Beck & Co G M B H Dr | Verfahren zur Herstellung von Polykondensationsprodukten |
GB1121325A (en) * | 1964-11-11 | 1968-07-24 | Ici Ltd | Aqueous solutions of polyamide acids |
US4189518A (en) * | 1969-05-08 | 1980-02-19 | General Electric Company | Cured polymeric coating material, coated substrate, and process of forming |
JPS5466966A (en) * | 1977-11-07 | 1979-05-29 | Kanegafuchi Chem Ind Co Ltd | Manufacture of composite sheet |
JPS54108272A (en) * | 1978-02-13 | 1979-08-24 | Kanegafuchi Chemical Ind | Flexible printed circuit board |
GB2101137B (en) * | 1981-04-14 | 1984-09-26 | Ube Industries | Producing porous aromatic imide polymer membranes |
JPS58190092A (ja) * | 1982-04-30 | 1983-11-05 | 宇部興産株式会社 | フレキシブル配線基板の製造法 |
JPS58190091A (ja) * | 1982-04-30 | 1983-11-05 | 宇部興産株式会社 | フレキシブル配線基板の製造方法 |
JPS58190093A (ja) * | 1982-04-30 | 1983-11-05 | 宇部興産株式会社 | フレキシブル配線基板の製法 |
JPS5982783A (ja) * | 1982-11-02 | 1984-05-12 | 宇部興産株式会社 | フレキシブル印刷回路用基板 |
EP0116297B1 (de) * | 1983-01-15 | 1987-12-02 | Akzo GmbH | Polyimid-Laminate mit hoher Schälfestigkeit und Verfahren zu deren Herstellung |
US4670325A (en) * | 1983-04-29 | 1987-06-02 | Ibm Corporation | Structure containing a layer consisting of a polyimide and an organic filled and method for producing such a structure |
JPS60206639A (ja) * | 1984-03-31 | 1985-10-18 | 日東電工株式会社 | ポリイミド−金属箔複合フイルムの製造方法 |
JPS6119813A (ja) * | 1984-06-20 | 1986-01-28 | Agency Of Ind Science & Technol | ポリイミド中空糸の製造法 |
JPS62140822A (ja) * | 1985-12-17 | 1987-06-24 | Ube Ind Ltd | ポリイミド積層シ−トおよびその製造法 |
US4839217A (en) * | 1986-05-16 | 1989-06-13 | Ube Industries, Ltd. | Aromatic polyimide film |
JPH0632351B2 (ja) * | 1986-05-30 | 1994-04-27 | 日東電工株式会社 | フレキシブルプリント基板 |
JP2847701B2 (ja) * | 1986-11-29 | 1999-01-20 | 鐘淵化学工業株式会社 | 熱的寸法安定性にすぐれたポリアミド酸及びそれからなるポリイミドの製造方法 |
JPH0655491B2 (ja) * | 1987-05-29 | 1994-07-27 | 宇部興産株式会社 | 芳香族ポリイミドフィルムの製造方法 |
US4948400A (en) * | 1988-06-30 | 1990-08-14 | Nippon Steel Chemical Co., Ltd. | Separation membranes and process for preparing the same |
-
1989
- 1989-11-17 JP JP1300639A patent/JP2761655B2/ja not_active Expired - Fee Related
-
1990
- 1990-11-16 EP EP90121951A patent/EP0429985B1/de not_active Expired - Lifetime
- 1990-11-16 US US07/614,483 patent/US5167985A/en not_active Expired - Fee Related
- 1990-11-16 CA CA002030200A patent/CA2030200A1/en not_active Abandoned
- 1990-11-16 DE DE69016752T patent/DE69016752T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE69016752T2 (de) | 1995-06-08 |
US5167985A (en) | 1992-12-01 |
JP2761655B2 (ja) | 1998-06-04 |
CA2030200A1 (en) | 1991-05-18 |
JPH03160780A (ja) | 1991-07-10 |
EP0429985B1 (de) | 1995-02-08 |
EP0429985A3 (en) | 1992-07-29 |
EP0429985A2 (de) | 1991-06-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE3483003D1 (de) | Verfahren zur herstellung einer gedruckten leiterplatte. | |
DE69111890T2 (de) | Verfahren zur Herstellung einer Mehrschichtleiterplatte. | |
DE69027006T2 (de) | Verfahren zur Herstellung einer gedruckten Mehrschichtleiterplatte | |
DE69308241D1 (de) | Verfahren zur Herstellung eines leitenden Endbereichs einer flexiblen Leiterplatte | |
DE3575512D1 (de) | Verfahren zur herstellung einer keramischen leiterplatte. | |
DE69120379D1 (de) | Verfahren zur Herstellung von einer mit einer Deckschicht überzogenen biegsamen Leiterplatte | |
DE69115852T2 (de) | Verfahren zur Herstellung einer Leiterplatte | |
DE3789369T2 (de) | Verfahren zur Herstellung einer keramischen Schaltungsplatte. | |
DE69015879T2 (de) | Verfahren zur Herstellung einer oberflächenmontierbaren Leiterplatte. | |
DE69800219D1 (de) | Verfahren zur Herstellung einer Mehrlagenleiterplatte | |
DE68920383T2 (de) | Verfahren zur Herstellung einer gedruckten Mehrschichtleiterplatte. | |
DE316886T1 (de) | Verfahren zur herstellung einer gedruckten schaltungsplatte. | |
DE69026848D1 (de) | Verfahren zur Herstellung einer biegsamen gedruckten Unterlage | |
DE69015469T2 (de) | Verfahren zur Herstellung einer Abdeckfolie für biegsame Leiterplatten. | |
DE69016752D1 (de) | Verfahren zur Herstellung einer flexiblen gedruckten Schaltungsplatte. | |
DE69431175D1 (de) | Verfahren zur Herstellung einer Leiterplatte | |
DE69522484D1 (de) | Verfahren zur Herstellung einer keramischen Leiterplatte | |
DE69013851T2 (de) | Verfahren zur Herstellung einer keramischen Schaltungsplatte. | |
DE69408542T2 (de) | Verfahren zur herstellung einer leiterplatte | |
DE69123692D1 (de) | Verfahren zur Herstellung einer keramischen Leiterplatte | |
DE68904363D1 (de) | Verfahren zur herstellung einer gedruckten leiterplatte. | |
DE69303684T2 (de) | Verfahren zur Herstellung einer mehrschichtigen Leiterplatte | |
DE69207579T2 (de) | Verfahren zur Herstellung einer Kupfer-durchkontaktierten Leiterplatte | |
DE69115517D1 (de) | Verfahren zur Herstellung einer gedruckten Schaltung mit Loch | |
DE69112181T2 (de) | Verfahren zur Herstellung einer Mehrschichtverdrahtungsplatine. |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |