DE69120379D1 - Verfahren zur Herstellung von einer mit einer Deckschicht überzogenen biegsamen Leiterplatte - Google Patents
Verfahren zur Herstellung von einer mit einer Deckschicht überzogenen biegsamen LeiterplatteInfo
- Publication number
- DE69120379D1 DE69120379D1 DE69120379T DE69120379T DE69120379D1 DE 69120379 D1 DE69120379 D1 DE 69120379D1 DE 69120379 T DE69120379 T DE 69120379T DE 69120379 T DE69120379 T DE 69120379T DE 69120379 D1 DE69120379 D1 DE 69120379D1
- Authority
- DE
- Germany
- Prior art keywords
- production
- circuit board
- printed circuit
- flexible printed
- covering layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
- C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/0427—Coating with only one layer of a composition containing a polymer binder
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/043—Improving the adhesiveness of the coatings per se, e.g. forming primers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
- C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
- H01B3/306—Polyimides or polyesterimides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2479/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2461/00 - C08J2477/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/09—Treatments involving charged particles
- H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24851—Intermediate layer is discontinuous or differential
- Y10T428/2486—Intermediate layer is discontinuous or differential with outer strippable or release layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31721—Of polyimide
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP40048090 | 1990-12-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69120379D1 true DE69120379D1 (de) | 1996-07-25 |
DE69120379T2 DE69120379T2 (de) | 1997-01-23 |
Family
ID=18510379
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69120379T Expired - Fee Related DE69120379T2 (de) | 1990-12-05 | 1991-12-04 | Verfahren zur Herstellung von einer mit einer Deckschicht überzogenen biegsamen Leiterplatte |
Country Status (4)
Country | Link |
---|---|
US (1) | US5234522A (de) |
EP (1) | EP0489429B1 (de) |
JP (1) | JPH057067A (de) |
DE (1) | DE69120379T2 (de) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5573632A (en) * | 1989-02-23 | 1996-11-12 | Fuji Xerox Co., Ltd. | Multilayer printed-circuit substrate, wiring substrate and process of producing the same |
JPH0722741A (ja) * | 1993-07-01 | 1995-01-24 | Japan Gore Tex Inc | カバーレイフィルム及びカバーレイフィルム被覆回路基板 |
US5843657A (en) * | 1994-03-01 | 1998-12-01 | The United States Of America As Represented By The Department Of Health And Human Services | Isolation of cellular material under microscopic visualization |
KR100426298B1 (ko) | 1994-12-26 | 2004-04-08 | 히다치 가세고교 가부시끼가이샤 | 필름 형상의 유기 다이본딩재의 라미네이트 방법,다이본딩 방법, 라미네이트 장치, 다이본딩 장치, 반도체장치 및 반도체 장치의 제조 방법 |
US5525375A (en) * | 1995-06-05 | 1996-06-11 | Moore Business Forms, Inc. | Process for producing hot melt release coating |
TW310481B (de) * | 1995-07-06 | 1997-07-11 | Hitachi Chemical Co Ltd | |
US7012320B2 (en) * | 1995-07-06 | 2006-03-14 | Hitachi Chemical Company, Ltd. | Semiconductor device and process for fabrication thereof |
US6492031B1 (en) | 1999-03-12 | 2002-12-10 | Dupont-Toray Co. Ltd. | Reflector substrate for illumination device and reflector for illumination device |
US6221176B1 (en) * | 1999-03-17 | 2001-04-24 | Gould Electronics, Inc. | Surface treatment of copper to prevent microcracking in flexible circuits |
US6391220B1 (en) * | 1999-08-18 | 2002-05-21 | Fujitsu Limited, Inc. | Methods for fabricating flexible circuit structures |
US20020130103A1 (en) * | 2001-03-15 | 2002-09-19 | Zimmerman Scott M. | Polyimide adhesion enhancement to polyimide film |
AU2003282894A1 (en) * | 2002-08-13 | 2004-02-25 | Dinesh M. Anam | Friction and release coated polymide film for electrical insulation and the process of manufacturing the same |
WO2005027597A1 (ja) * | 2003-09-10 | 2005-03-24 | Unitika Ltd. | フレキシブルプリント配線板用基板及びその製造方法 |
US7285321B2 (en) * | 2003-11-12 | 2007-10-23 | E.I. Du Pont De Nemours And Company | Multilayer substrates having at least two dissimilar polyimide layers, useful for electronics-type applications, and compositions relating thereto |
JP4661264B2 (ja) * | 2005-02-24 | 2011-03-30 | 住友ベークライト株式会社 | カバーレイフィルムおよびフレキシブル配線板 |
JP4747619B2 (ja) * | 2005-03-17 | 2011-08-17 | 住友ベークライト株式会社 | カバーレイフィルムおよびフレキシブル配線板 |
TWI327521B (en) * | 2005-07-27 | 2010-07-21 | Lg Chemical Ltd | Metallic laminate and method of manufacturing the same |
KR100786956B1 (ko) * | 2005-09-14 | 2007-12-17 | 주식회사 엘지화학 | 신규한 폴리이미드 공중합체, 이를 포함하는 플렉시블인쇄회로기판용 커버레이 및 그 제조방법 |
US20090305046A1 (en) * | 2006-07-20 | 2009-12-10 | Tsuyoshi Bito | Thermocurable Polyimide Resin Composition |
CN101878678A (zh) | 2007-09-28 | 2010-11-03 | 三星层板有限公司 | 用于在印刷电路板中钻孔的改进系统和方法 |
DE102008060797A1 (de) * | 2007-12-07 | 2009-07-09 | Integral Technology, Inc., Lake Forest | Verbesserte Isolierschicht für steife Leiterplatten |
WO2012090733A1 (ja) * | 2010-12-27 | 2012-07-05 | 株式会社クラレ | 回路基板およびその製造方法 |
JP2013151638A (ja) * | 2011-12-27 | 2013-08-08 | Yamaichi Electronics Co Ltd | カバーレイフィルム、フレキシブル配線板およびその製造方法 |
JP6123232B2 (ja) * | 2012-11-01 | 2017-05-10 | 日立化成株式会社 | 離型ポリイミドフィルム及び多層プリント配線板の製造方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1434935A (fr) * | 1963-11-04 | 1966-04-15 | Sanders Associates Inc | Inhibiteur des déformations d'une matière thermoplastique |
US4937133A (en) * | 1988-03-28 | 1990-06-26 | Nippon Steel Chemical Co., Ltd. | Flexible base materials for printed circuits |
US5089346A (en) * | 1989-03-23 | 1992-02-18 | Hitachi Chemical Company, Ltd. | Heat resistant adhesive composition and bonding method using the same |
-
1991
- 1991-11-27 US US07/800,586 patent/US5234522A/en not_active Expired - Fee Related
- 1991-12-02 JP JP3317818A patent/JPH057067A/ja active Pending
- 1991-12-04 EP EP91120854A patent/EP0489429B1/de not_active Expired - Lifetime
- 1991-12-04 DE DE69120379T patent/DE69120379T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0489429A1 (de) | 1992-06-10 |
JPH057067A (ja) | 1993-01-14 |
US5234522A (en) | 1993-08-10 |
EP0489429B1 (de) | 1996-06-19 |
DE69120379T2 (de) | 1997-01-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |