FR1434935A - Inhibiteur des déformations d'une matière thermoplastique - Google Patents

Inhibiteur des déformations d'une matière thermoplastique

Info

Publication number
FR1434935A
FR1434935A FR952593A FR952593A FR1434935A FR 1434935 A FR1434935 A FR 1434935A FR 952593 A FR952593 A FR 952593A FR 952593 A FR952593 A FR 952593A FR 1434935 A FR1434935 A FR 1434935A
Authority
FR
France
Prior art keywords
inhibitor
deformation
thermoplastic material
thermoplastic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR952593A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lockheed Corp
Original Assignee
Sanders Associates Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanders Associates Inc filed Critical Sanders Associates Inc
Priority to FR952593A priority Critical patent/FR1434935A/fr
Application granted granted Critical
Publication of FR1434935A publication Critical patent/FR1434935A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0064—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a polymeric substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
FR952593A 1963-11-04 1963-11-04 Inhibiteur des déformations d'une matière thermoplastique Expired FR1434935A (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR952593A FR1434935A (fr) 1963-11-04 1963-11-04 Inhibiteur des déformations d'une matière thermoplastique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR952593A FR1434935A (fr) 1963-11-04 1963-11-04 Inhibiteur des déformations d'une matière thermoplastique

Publications (1)

Publication Number Publication Date
FR1434935A true FR1434935A (fr) 1966-04-15

Family

ID=8815751

Family Applications (1)

Application Number Title Priority Date Filing Date
FR952593A Expired FR1434935A (fr) 1963-11-04 1963-11-04 Inhibiteur des déformations d'une matière thermoplastique

Country Status (1)

Country Link
FR (1) FR1434935A (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2520964A1 (fr) * 1982-01-30 1983-08-05 Nippon Mektron Kk Plaquette flexible a circuit
EP0489429A1 (fr) * 1990-12-05 1992-06-10 Hitachi Chemical Co., Ltd. Procédé de fabrication d'un plaquette à circuit flexible recouverte d'une couche de recouvrement
EP1335454A1 (fr) * 2002-01-28 2003-08-13 Harting Electro-Optics GmbH & Co. KG. Connecteur avec éléments de contact rétractables

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2520964A1 (fr) * 1982-01-30 1983-08-05 Nippon Mektron Kk Plaquette flexible a circuit
EP0489429A1 (fr) * 1990-12-05 1992-06-10 Hitachi Chemical Co., Ltd. Procédé de fabrication d'un plaquette à circuit flexible recouverte d'une couche de recouvrement
US5234522A (en) * 1990-12-05 1993-08-10 Hitachi Chemical Company, Inc. Method of producing flexible printed-circuit board covered with coverlay
EP1335454A1 (fr) * 2002-01-28 2003-08-13 Harting Electro-Optics GmbH & Co. KG. Connecteur avec éléments de contact rétractables
US6857908B2 (en) 2002-01-28 2005-02-22 Gmbh & Co. Kg Connector with movable contact elements

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