DE69123692D1 - Verfahren zur Herstellung einer keramischen Leiterplatte - Google Patents

Verfahren zur Herstellung einer keramischen Leiterplatte

Info

Publication number
DE69123692D1
DE69123692D1 DE69123692T DE69123692T DE69123692D1 DE 69123692 D1 DE69123692 D1 DE 69123692D1 DE 69123692 T DE69123692 T DE 69123692T DE 69123692 T DE69123692 T DE 69123692T DE 69123692 D1 DE69123692 D1 DE 69123692D1
Authority
DE
Germany
Prior art keywords
manufacturing
circuit board
ceramic circuit
ceramic
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69123692T
Other languages
English (en)
Other versions
DE69123692T2 (de
Inventor
Kazuo Matsumura
Tadashi Tanaka
Shoji Tsurutani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2269221A external-priority patent/JP2984350B2/ja
Priority claimed from JP26922290A external-priority patent/JPH04145646A/ja
Application filed by Toshiba Corp filed Critical Toshiba Corp
Publication of DE69123692D1 publication Critical patent/DE69123692D1/de
Application granted granted Critical
Publication of DE69123692T2 publication Critical patent/DE69123692T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0369—Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
DE69123692T 1990-10-05 1991-10-04 Verfahren zur Herstellung einer keramischen Leiterplatte Expired - Fee Related DE69123692T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2269221A JP2984350B2 (ja) 1990-10-05 1990-10-05 セラミックス金属接合体およびその製造方法
JP26922290A JPH04145646A (ja) 1990-10-05 1990-10-05 セラミックス回路基板の製造方法

Publications (2)

Publication Number Publication Date
DE69123692D1 true DE69123692D1 (de) 1997-01-30
DE69123692T2 DE69123692T2 (de) 1997-07-24

Family

ID=26548671

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69123692T Expired - Fee Related DE69123692T2 (de) 1990-10-05 1991-10-04 Verfahren zur Herstellung einer keramischen Leiterplatte

Country Status (3)

Country Link
US (1) US5240551A (de)
EP (1) EP0481308B1 (de)
DE (1) DE69123692T2 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69031039T2 (de) * 1990-04-16 1997-11-06 Denki Kagaku Kogyo Kk Keramische leiterplatte
JPH06120370A (ja) * 1992-10-08 1994-04-28 Toshiba Corp 積層板の製造方法
US5620286A (en) * 1994-11-09 1997-04-15 Rank Taylor Hobson, Ltd. Flycutting machine for manufacturing printed circuit boards
US7069645B2 (en) * 2001-03-29 2006-07-04 Ngk Insulators, Ltd. Method for producing a circuit board
EP4294135A1 (de) * 2022-06-14 2023-12-20 CeramTec GmbH Metallische struktur als vorprodukt für elektrische schaltungen und verfahren zur herstellung einer elektrischen schaltung

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1260804A (fr) * 1960-03-31 1961-05-12 Electronique & Automatisme Sa Procédé de réalisation de circuits imprimés
US3264152A (en) * 1963-03-26 1966-08-02 Tri Tech Method for fabricating electrical circuit components
JPS59150453A (ja) * 1982-12-23 1984-08-28 Toshiba Corp 半導体モジユ−ル用基板の製造方法
DE3306120A1 (de) * 1983-02-19 1984-08-23 Gotthard 1000 Berlin Schulte-Tigges Fertigungsverfahren fuer elektrische schaltungen
JPS644668A (en) * 1987-06-27 1989-01-09 Nippon Oils & Fats Co Ltd Underwater antifouling coating agent

Also Published As

Publication number Publication date
EP0481308B1 (de) 1996-12-18
DE69123692T2 (de) 1997-07-24
US5240551A (en) 1993-08-31
EP0481308A1 (de) 1992-04-22

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)
8328 Change in the person/name/address of the agent

Representative=s name: KRAMER - BARSKE - SCHMIDTCHEN, 81245 MUENCHEN

8339 Ceased/non-payment of the annual fee