DE69214581D1 - Leiterplatte für gedruckte Schaltungen - Google Patents
Leiterplatte für gedruckte SchaltungenInfo
- Publication number
- DE69214581D1 DE69214581D1 DE69214581T DE69214581T DE69214581D1 DE 69214581 D1 DE69214581 D1 DE 69214581D1 DE 69214581 T DE69214581 T DE 69214581T DE 69214581 T DE69214581 T DE 69214581T DE 69214581 D1 DE69214581 D1 DE 69214581D1
- Authority
- DE
- Germany
- Prior art keywords
- circuit board
- printed circuit
- printed
- board
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/06—Luminescent, e.g. electroluminescent, chemiluminescent materials containing organic luminescent materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/161—Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
- Reinforced Plastic Materials (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24278091 | 1991-08-28 | ||
JP24277991 | 1991-08-28 | ||
JP24278191 | 1991-08-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69214581D1 true DE69214581D1 (de) | 1996-11-21 |
DE69214581T2 DE69214581T2 (de) | 1997-02-27 |
Family
ID=27333076
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69214581T Expired - Fee Related DE69214581T2 (de) | 1991-08-28 | 1992-08-28 | Leiterplatte für gedruckte Schaltungen |
Country Status (5)
Country | Link |
---|---|
US (1) | US5314740A (de) |
EP (1) | EP0530036B1 (de) |
KR (1) | KR100240373B1 (de) |
DE (1) | DE69214581T2 (de) |
TW (1) | TW203675B (de) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW350194B (en) * | 1994-11-30 | 1999-01-11 | Mitsubishi Gas Chemical Co | Metal-foil-clad composite ceramic board and process for the production thereof the invention relates to the metal-foil-clad composite ceramic board and process for the production |
TW389780B (en) * | 1995-09-13 | 2000-05-11 | Hitachi Chemical Co Ltd | Prepreg for printed circuit board |
US5837356A (en) * | 1995-09-22 | 1998-11-17 | Kyocera Corporation | Wiring board and method for manufacturing the same |
EP0989172A1 (de) * | 1998-09-24 | 2000-03-29 | Hitachi Chemical Co., Ltd. | Kleber für metallische Folien, mit diesem Kleber überzogene metallische Folie, mit der metallischen Folie überzogene Schichtplatte und daraus hergestellte Erzeugnisse |
KR100353397B1 (ko) * | 2000-02-01 | 2002-09-18 | 박용선 | 음이온 접착제 및 그의 제조방법 |
US20060019102A1 (en) * | 2004-07-26 | 2006-01-26 | Kuppsuamy Kanakarajan | Flame-retardant halogen-free polyimide films useful as thermal insulation in aircraft applications and methods relating thereto |
KR100594299B1 (ko) * | 2004-10-29 | 2006-06-30 | 삼성전자주식회사 | 유연성 인쇄 회로 및 이것이 구비된 하드 디스크 드라이브 |
KR20060045208A (ko) * | 2004-11-12 | 2006-05-17 | 삼성테크윈 주식회사 | 반도체 팩키지용 회로기판 및 이의 제조방법 |
FR2927077B1 (fr) * | 2008-01-31 | 2012-05-25 | Commissariat Energie Atomique | Derives du 1,8-naphtalimide en tant qu'agents de scintillation notamment pour la discrimination entre les neutrons rapides et les rayons gamma |
US9201015B2 (en) | 2011-07-14 | 2015-12-01 | International Business Machines Corporation | Plated through hole void detection in printed circuit boards by detecting a pH-sensitive component |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4774188A (en) * | 1983-07-29 | 1988-09-27 | American Telephone And Telegraph Company, At&T Bell Laboratories | Control of circuit board quality |
US4965208A (en) * | 1983-07-29 | 1990-10-23 | At&T Bell Laboratories | Inspection of multipattern circuit boards |
US4797508A (en) * | 1986-09-19 | 1989-01-10 | Firan Corporation | Method for producing circuit boards with deposited metal patterns and circuit boards produced thereby |
US5160787A (en) * | 1989-01-12 | 1992-11-03 | Mitsubishi Gas Chemical Company, Inc. | Electrical laminate having ability to absorb ultraviolet rays |
-
1992
- 1992-08-22 TW TW081106652A patent/TW203675B/zh active
- 1992-08-27 US US07/935,245 patent/US5314740A/en not_active Expired - Fee Related
- 1992-08-28 KR KR1019920015605A patent/KR100240373B1/ko not_active IP Right Cessation
- 1992-08-28 DE DE69214581T patent/DE69214581T2/de not_active Expired - Fee Related
- 1992-08-28 EP EP92307856A patent/EP0530036B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0530036B1 (de) | 1996-10-16 |
DE69214581T2 (de) | 1997-02-27 |
KR930005521A (ko) | 1993-03-23 |
EP0530036A1 (de) | 1993-03-03 |
TW203675B (de) | 1993-04-11 |
KR100240373B1 (ko) | 2000-01-15 |
US5314740A (en) | 1994-05-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |